CN109129949A - Multi-wire cutting machine for silicon wafer - Google Patents
Multi-wire cutting machine for silicon wafer Download PDFInfo
- Publication number
- CN109129949A CN109129949A CN201811245167.9A CN201811245167A CN109129949A CN 109129949 A CN109129949 A CN 109129949A CN 201811245167 A CN201811245167 A CN 201811245167A CN 109129949 A CN109129949 A CN 109129949A
- Authority
- CN
- China
- Prior art keywords
- transition wheel
- roller
- wire
- take
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000007921 spray Substances 0.000 claims abstract description 32
- 239000002826 coolant Substances 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 8
- 230000007704 transition Effects 0.000 claims description 103
- 239000012530 fluid Substances 0.000 claims description 28
- 238000001802 infusion Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 10
- 241000606750 Actinobacillus Species 0.000 claims description 6
- 230000009469 supplementation Effects 0.000 claims description 6
- 239000010865 sewage Substances 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 14
- 239000010959 steel Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 238000005299 abrasion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Abstract
The invention discloses a kind of structure is simple, convenient for the arrangement of cutting line, reduce cutting link friction, while coolant liquid being enabled to uniformly to be sprinkled upon the multi-wire cutting machine for silicon wafer on cutting line.The multi-wire cutting machine for silicon wafer includes rack, charging chamber is provided in the rack, it is provided with crystalline substance at the top of the charging chamber and drags connector, vertical telescopic device and coolant liquid storage box are provided with above the charging chamber, the telescopic shaft of the vertical telescopic device drags connector to connect with crystalline substance；There are two the Wire guide roller that axis is parallel to each other, the Wire guide roller and gantry rotations to cooperate for the lower part setting of the rack；Pulp-collecting box is provided between described two Wire guide rollers；Connecton layout is provided with below the pulp-collecting box；Spray equipment is provided with above the Wire guide roller；The side of the rack is arranged and bobbin winder device.The service life of cutting line can effectively be extended using the multi-wire cutting machine for silicon wafer.
Description
Technical field
The present invention relates to silicon wafer cutting, especially a kind of multi-wire cutting machine for silicon wafer.
Background technique
Well-known: silicon wafer is the main production material of semiconductor and photovoltaic art.Multi-wire wafer cutting technique is mesh
More advanced silicon chip process technology on former world, it is different from the cutting modes such as traditional saw blade, grinding wheel, also different from
Advanced laser cutting and inner circle cutting, its principle are to be attached to cutting on steel wire by the steel wire drive of a high-speed motion
It cuts sword material to rub to silicon rod, to reach cutting effect.In the whole process, steel wire passes through drawing for more than ten of guide roller
It leads, forms a bracing cable net in main roller, and workpiece to be processed realizes the feeding of workpiece by the decline of workbench.Multi-wire wafer
Cutting technique has compared with other technologies: high-efficient, the advantages that production capacity is high, and precision is high.Multi-wire wafer cutting technique is to adopt at present
With widest silicon wafer cutting technique.But since steel wire will pass through the guidance of multiple pulleys, the friction of steel wire is increased,
So that steel wire service life is shorter.
Secondly, wherein steel wire is when cutting silicon wafer, due to friction meeting so that the temperature of steel wire increases, in order to
The temperature for reducing steel wire is generally provided with steel wire coolant liquid spray equipment, and existing coolant liquid spray equipment is mostly all using spray
Head；Since the position of spray head is fixed, so that the coolant liquid that every steel wire receives in steel wire net on Wire guide roller is uneven
Therefore the temperature that will cause each position of steel wire is uneven, to reduce the service life of steel wire.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of structure is simple, convenient for the arrangement of cutting line, reduce cutting
Link friction, while coolant liquid being enabled to uniformly to be sprinkled upon the multi-wire cutting machine for silicon wafer on cutting line.
The technical solution adopted by the present invention to solve the technical problems is: multi-wire cutting machine for silicon wafer, including rack, the machine
It is provided with charging chamber on frame, crystalline substance is provided at the top of the charging chamber and drags connector, is provided with above the charging chamber vertical
The telescopic shaft of telescopic device and coolant liquid storage box, the vertical telescopic device drags connector to connect with crystalline substance；The rack
There are two the Wire guide roller that axis is parallel to each other, the Wire guide roller and gantry rotations to cooperate for lower part setting；Described two Wire guide rollers it
Between be provided with pulp-collecting box；Material taking mouth is provided in the rack, the material taking mouth is located at one end of pulp-collecting box；Under the pulp-collecting box
Side is provided with connecton layout；Spray equipment is provided with above the Wire guide roller；The side of the rack is arranged and bobbin winder device；
Second mounting plate of bobbin winder device packet, including rack side lower are provided with actinobacillus device and take-up；It is described
Second mounting plate is parallel with the side of rack, and vertically arranged；The actinobacillus device includes that unwrapping wire roller and the rotation of unwrapping wire roller are driven
Dynamic device, the take-up includes take-up roller and take-up roller device of rotation driving；
The unwrapping wire roller device of rotation driving and take-up roller device of rotation driving are mounted on the side of rack, described to put
Line roller and take-up roller are horizontally disposed；It is provided with above the unwrapping wire roller above unwrapping wire contact roller and take-up roller and is provided with take-up
Contact roller；
Unwrapping wire transition wheel and take-up transition wheel are provided at the top of second mounting plate；The lower part of the side of the rack
And second mounting plate lower part between be provided with horizontal mounting plate；There are two height adjustment mistakes for installation on the horizontal mounting plate
Ferry boat, and two height adjustment transition wheel distributions are located at the underface of unwrapping wire transition wheel and take-up transition wheel；
Two horizontal transition wheels are set on the horizontal mounting plate, and the lower part of the mounting plate is provided with thread passing port；It is described
Horizontal transition wheel is concordant with thread passing port；There are two vertical transition for setting between the horizontal transition wheel and height adjustment transition wheel
Wheel；The horizontal transition wheel, vertical transition wheel and height adjustment transition wheel correspond；
The connecton layout includes wiring plate and two groups of branching wheels, two groups of branching wheel parallelly distribute ons；And every group of branching wheel
Including at least three branching wheels；Each branching wheel in two groups of branching wheels is aligned one by one；Cutting line is provided on the unwrapping wire roller；
The cutting line successively bypass unwrapping wire contact roller, unwrapping wire transition wheel, vertical transition wheel, horizontal transition wheel, two groups of branching wheels and
Two Wire guide rollers, then horizontal transition wheel, vertical transition wheel, take-up transition wheel, wire intaking compacting wheel are successively bypassed, it is eventually returned to take-up
On roller；
The spray equipment includes spray equipment ontology, be provided on the spray equipment ontology lateral fluid infusion slot and
Overflow launder, the overflow launder are located at the side of fluid infusion slot；The open height of the overflow launder is lower than fluid infusion slot；The overflow launder bottom
Portion is provided with the through-hole of connection fluid infusion trench bottom；The opening of the fluid infusion slot is provided with cover board；The cover board interposition installs
It is equipped with the liquid supplementation pipe of connection fluid infusion slot；The side of the opening of the overflow launder is provided with the overflow plate tilted down；The spray
The both ends of device noumenon are provided with mounting plate；The spray equipment ontology is mounted on the rack by mounting plate；The coolant liquid
Storage box is connected to by water pump with liquid supplementation pipe.
Specifically, the crystalline substance, which drags, is provided with dovetail groove on connector, the inner wall of the dovetail groove side is provided with wedge；Institute
It states and is provided with connecting shaft in wedge, the one end of the connecting shaft is connect with wedge, and the other end passes through the inner wall of dovetail groove, and is provided with
Locking nut；The locking nut is threadedly engaged with connecting shaft.
Further, the unwrapping wire contact roller and wire intaking compacting wheel are installed on a mounting board by elastic device, and institute
Unwrapping wire contact roller is stated with mounting base, one end of the mounting base and elastic device is hinged.
Further, the unwrapping wire transition wheel and take-up transition wheel pass through support frame and are mounted on the second mounting plate,
And the mounting base of the unwrapping wire transition wheel and one end of support frame are hinged.
Further, the height adjustment transition wheel is mounted on horizontal mounting plate by vertical lifting device.
Further, the bottom of the fluid infusion slot is provided with sewage draining exit, and the sewage draining exit is in the side of spray equipment ontology
With outlet, the outlet is provided with blocking.
Further, dust cover is provided with above the overflow plate.
Preferably, the unwrapping wire roller device of rotation driving and take-up roller device of rotation driving use motor or hydraulic horse
It reaches.
The beneficial effects of the present invention are: multi-wire cutting machine for silicon wafer of the present invention, since cutting line successively bypasses unwrapping wire
Contact roller, unwrapping wire transition wheel, vertical transition wheel, horizontal transition wheel, two groups of branching wheels, then successively around horizontal transition wheel, vertical
Transition wheel, take-up transition wheel, wire intaking compacting wheel, are eventually returned on take-up roller；Therefore the guide wheel that cutting line passes through is less, thus
Reduce path；The unnecessary abrasion of cutting line is reduced simultaneously, improves the service life of cutting line.Simultaneously because path of navigation compared with
It is short, therefore convenient for the arrangement of cutting thread path, it secondly can reduce the occupied space of equipment.
Again, the spray equipment of multi-wire cutting machine for silicon wafer of the present invention, due to being provided with the fluid infusion slot of connection and overflowing
Chute is provided with overflow plate in the side of overflow launder, therefore by adding coolant liquid into fluid infusion slot, coolant liquid can be by overflow launder
Be open lower side spilling, and the coolant liquid of spilling, to flowing down, forms cascade after being detached from overflow plate on overflow plate, so that
The coolant liquid that cutting line below cascade receives is uniform, so that guarantee is uniform to the heat dissipation of cutting line, avoids cutting line position
Temperature is excessively high, so as to effectively extend the service life of cutting line.
Detailed description of the invention
Fig. 1 is the perspective view of multi-wire cutting machine for silicon wafer in the embodiment of the present invention；
Fig. 2 is the perspective view that multi-wire cutting machine for silicon wafer removes transition wheel in the embodiment of the present invention；
Fig. 3 is the main view of multi-wire cutting machine for silicon wafer in the embodiment of the present invention；
Fig. 4 is the top view of multi-wire cutting machine for silicon wafer in the embodiment of the present invention；
Fig. 5 is the A-A cross-sectional view of Fig. 4；
Fig. 6 is the B-B cross-sectional view of Fig. 3；
Fig. 7 is the structural schematic diagram of connecton layout in the embodiment of the present invention；
Fig. 8 is the perspective view of spray equipment in the embodiment of the present invention；
Fig. 9 is the structural schematic diagram of spray equipment in the embodiment of the present invention；
Indicate in figure: 1- rack, the vertical telescopic device of 2-, 3- telescopic shaft, 4- crystalline substance drag connector, 5- wedge, 6- connecting shaft,
7- locking nut, 8- coolant liquid storage box, 9- spray equipment, 10- pulp-collecting box, 11- Wire guide roller, 12- wiring plate, 13- branching wheel,
14- horizontal transition wheel, the vertical transition wheel of 15-, 16- unwrapping wire roller, 17- unwrapping wire roller device of rotation driving, 18- unwrapping wire contact roller, 19,
30- elastic device, 20- unwrapping wire transition wheel, 21- support frame, 22- cutting line, the second mounting plate of 23-, 24- height adjustment transition
Wheel, 25- vertical lifting device, 26- material taking mouth, 27- take-up roller, 28- take-up roller device of rotation driving, 29- wire intaking compacting wheel,
31- mounting base, 32- take-up transition wheel, 33- horizontal mounting plate.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
As shown in Figures 1 to 9, multi-wire cutting machine for silicon wafer of the present invention, including rack 1 are provided in the rack 1
Charging chamber is provided with crystalline substance at the top of the charging chamber and drags connector 4, vertical telescopic device 2 is provided with above the charging chamber
And coolant liquid storage box 8, the telescopic shaft 3 of the vertical telescopic device 2 drag connector 4 to connect with crystalline substance；The lower part of the rack 1
It is arranged there are two the Wire guide roller 11 that axis is parallel to each other, the Wire guide roller 11 is rotatably assorted with rack 11；Described two Wire guide rollers
Pulp-collecting box 10 is provided between 11；Material taking mouth 26 is provided in the rack 1, the material taking mouth 26 is located at the one of pulp-collecting box 10
End；Connecton layout is provided with below the pulp-collecting box；Spray equipment is provided with above the Wire guide roller 11；The one of the rack 1
Side setting and bobbin winder device；
Second mounting plate of bobbin winder device packet 23,1 side lower of including rack are provided with actinobacillus device and take-up；Institute
It is parallel with the side of rack 1 and vertically arranged to state the second mounting plate 23；The actinobacillus device includes unwrapping wire roller 16 and unwrapping wire roller
Device of rotation driving 17, the take-up include take-up roller 27 and take-up roller device of rotation driving 28；
The unwrapping wire roller device of rotation driving 17 and take-up roller device of rotation driving 28 are mounted on the side of rack 1,
The unwrapping wire roller 16 and take-up roller 27 are horizontally disposed；Unwrapping wire contact roller 18 and take-up roller are provided with above the unwrapping wire roller 16
27 tops are provided with wire intaking compacting wheel 31；
The top of second mounting plate 33 is provided with unwrapping wire transition wheel 20 and take-up transition wheel 32；The side of the rack 1
Horizontal mounting plate 33 is provided between the lower part in face and the lower part of the second mounting plate 23；It is equipped on the horizontal mounting plate 33
Two height adjustment transition wheels 24, and two distributions of height adjustment transition wheel 24 are located at unwrapping wire transition wheel 20 and take-up transition wheel 32
Underface；
Two horizontal transition wheels 14 are set on the horizontal mounting plate 33, and the lower part of the mounting plate 1 is provided with thread passing port
11；The horizontal transition wheel 14 is concordant with thread passing port 11；It is arranged between the horizontal transition wheel 14 and height adjustment transition wheel 24
There are two vertical transition wheels 15；The horizontal transition wheel 14, vertical transition wheel 15 and height adjustment transition wheel 24 correspond；
The connecton layout includes wiring plate 12 and two groups of branching wheels 13, two groups of 13 parallelly distribute ons of branching wheel；And every group
Branching wheel includes at least three branching wheels 13；Each branching wheel in two groups of branching wheels 13 is aligned one by one；On the unwrapping wire roller 16
It is provided with cutting line；The cutting line 22 successively around unwrapping wire contact roller 18, unwrapping wire transition wheel 20, height adjustment transition wheel 24,
Vertical transition wheel 15,14, two groups of branching wheels 13 of horizontal transition wheel and two Wire guide rollers 11, then successively bypass horizontal transition wheel
14, vertical transition wheel 15, height adjustment transition wheel 24, take-up transition wheel 32, wire intaking compacting wheel 31, are eventually returned to take-up roller 27
On；
The spray equipment includes spray equipment ontology 91, and lateral fluid infusion slot is provided on the spray equipment ontology 91
92 and overflow launder 93, the overflow launder 93 be located at the side of fluid infusion slot 92；The open height of the overflow launder 93 is lower than fluid infusion
Slot 92；93 bottom of overflow launder is provided with the through-hole 97 of connection 92 bottom of fluid infusion slot；The opening of the fluid infusion slot 92 is arranged
There is cover board 95；95 middle position of cover board is provided with the liquid supplementation pipe 96 of connection fluid infusion slot 92；The opening of the overflow launder 93
Side is provided with the overflow plate 94 tilted down；The both ends of the spray equipment ontology 91 are provided with mounting plate 98；The spray
Device noumenon 91 is mounted in rack 1 by mounting plate 98；The coolant liquid storage box 8 is connected to by water pump with liquid supplementation pipe 96.
During the work time, the crystalline substance for being equipped with silicon rod is dragged and is mounted on crystalline substance and drags on connector 4；Then starting take-up roller rotation
Driving device 28 and unwrapping wire roller device of rotation driving 17 rotate synchronously take-up roller 28 and unwrapping wire roller 16；Due to cutting line 22
It is issued by unwrapping wire roller 16 and successively bypasses unwrapping wire contact roller 18, unwrapping wire transition wheel 18, height adjustment transition wheel 24, vertical transition wheel
15,14, two groups of branching wheels 13 of horizontal transition wheel and Wire guide roller 11, then successively around horizontal transition wheel 14, vertical transition wheel 15,
Height adjustment transition wheel 24, take-up transition wheel 32, wire intaking compacting wheel 31, are eventually returned on take-up roller 28；Wherein need to illustrate
It is that it is flat that dislocation is formed between branching wheel 13 in the gauze parallel with being formed on Wire guide roller when Wire guide roller 11 around branching wheel 13
Capable gauze, as shown in Figure 7.Therefore last take-up roller 28 recycles the line released in unwrapping wire roller 16；And to cut
Line 22 has certain tension.Start spray equipment simultaneously, coolant liquid is added in fluid infusion slot by liquid supplementation pipe 96, fluid infusion slot 92
When interior cooling-liquid level is higher than the opening of overflow launder 93, the side overflow that coolant liquid is open by overflow launder 93 is then flowed to excessive
In flowing plate 94, laminar flow is formed on overflow plate 94, forms cascade after being detached from overflow plate 94, on the cutting line for then pouring lower section,
To realize uniform sprinkling, so that the coolant liquid that cutting line touches is uniform.
Then starting vertical telescopic device 2 moves down silicon rod；When silicon rod is when by gauze on Wire guide roller 11,
Due to 22 high-speed mobile of cutting line to generate friction between silicon rod, realization obtains silicon wafer to the cutting of silicon rod.
In conclusion multi-wire cutting machine for silicon wafer of the present invention, since cutting line successively bypasses unwrapping wire contact roller, unwrapping wire
Transition wheel, vertical transition wheel, horizontal transition wheel, two groups of branching wheels, then successively bypass horizontal transition wheel, vertical transition wheel, take-up
Transition wheel, wire intaking compacting wheel, are eventually returned on take-up roller；Therefore the guide wheel that cutting line passes through is less, to reduce path；
The unnecessary abrasion of cutting line is reduced simultaneously, improves the service life of cutting line.Simultaneously because path of navigation is shorter, therefore it is convenient for
The arrangement of thread path is cut, the occupied space of equipment secondly can be reduced.
Again, the spray equipment of multi-wire cutting machine for silicon wafer of the present invention, due to being provided with the fluid infusion slot of connection and overflowing
Chute is provided with overflow plate in the side of overflow launder, therefore by adding coolant liquid into fluid infusion slot, coolant liquid can be by overflow launder
Be open lower side spilling, and the coolant liquid of spilling, to flowing down, forms cascade after being detached from overflow plate on overflow plate, so that
The coolant liquid that cutting line below cascade receives is uniform, so that guarantee is uniform to the heat dissipation of cutting line, avoids cutting line position
Temperature is excessively high, so as to effectively extend the service life of cutting line.
For the ease of the installation that crystalline substance drags, further, the crystalline substance drags and is provided with dovetail groove on connector 4, the dovetail groove
The inner wall of side is provided with wedge 5；Connecting shaft 6 is provided in the wedge 5, described 6 one end of connecting shaft is connect with wedge 5, separately
One end passes through the inner wall of dovetail groove, and is provided with locking nut 7；The locking nut 7 is threadedly engaged with connecting shaft 6.
In order to reduce cost, convenient for control, further, the unwrapping wire roller device of rotation driving 17 and the rotation of take-up roller
Driving device 28 uses motor or hydraulic motor.
In order to enable unwrapping wire contact roller 18 and wire intaking compacting wheel 31 have biggish pressing force, specifically, the unwrapping wire
Contact roller 18 and wire intaking compacting wheel 31 are mounted in rack 1 by elastic device 30, and the unwrapping wire contact roller 18 has peace
Seat 31 is filled, the mounting base 31 and one end of elastic device 30 are hinged.The elastic device 30 can be using stretching with spring
Contracting axis or rubber column.
In order to avoid cutting line is when there is certain deviation on path, occur between cutting line and guiding transition wheel biggish
Friction, specifically, the unwrapping wire transition wheel 18 and take-up transition wheel 32 are mounted on the second mounting plate 14 by support frame 21
On, and the mounting base of the unwrapping wire transition wheel 18 and one end of support frame 21 are hinged.
It is adjusted for the ease of the height to cutting line 22 around horizontal transition wheel 14, enables cutting line 22 horizontal
Around horizontal transition wheel 14, further, the height adjustment transition wheel 24 is mounted on horizontal peace by vertical lifting device 25
In loading board 33.Specific vertical lifting device 25 uses hydraulic cylinder.
For the ease of the cleaning to coolant liquid remaining in fluid infusion slot 92, further, the bottom of the fluid infusion slot 92 is arranged
There is sewage draining exit 910, the sewage draining exit 910 has outlet in the side of spray equipment ontology 91, and the outlet is provided with blocking
911.In order to avoid coolant liquid is contaminated, further, the top of the overflow plate 94 is provided with dust cover 99.
Claims (8)
1. multi-wire cutting machine for silicon wafer, it is characterised in that: including rack (1), charging chamber is provided on the rack (1), it is described to add
Crystalline substance is provided at the top of material chamber to drag connector (4), and vertical telescopic device (2) and coolant liquid are provided with above the charging chamber
The telescopic shaft (3) of storage box (8), the vertical telescopic device (2) drags connector (4) to connect with crystalline substance；The lower part of the rack (1)
It is arranged there are two the Wire guide roller (11) that axis is parallel to each other, the Wire guide roller (11) is rotatably assorted with rack (11)；It is described two
Pulp-collecting box (10) are provided between Wire guide roller (11)；It is provided with material taking mouth (26) on the rack (1), material taking mouth (26) position
In one end of pulp-collecting box (10)；Connecton layout is provided with below the pulp-collecting box；Spray is provided with above the Wire guide roller (11)
Device；The side of the rack (1) is arranged and bobbin winder device；
Second mounting plate of bobbin winder device packet (23), including rack (1) side lower are provided with actinobacillus device and take-up；Institute
It states the second mounting plate (23) and the side of rack (1) is parallel and vertically arranged；The actinobacillus device include unwrapping wire roller (16) and
Unwrapping wire roller device of rotation driving (17), the take-up include take-up roller (27) and take-up roller device of rotation driving (28)；
The unwrapping wire roller device of rotation driving (17) and take-up roller device of rotation driving (28) are mounted on the side of rack (1)
On, the unwrapping wire roller (16) and take-up roller (27) are horizontally disposed；Unwrapping wire contact roller is provided with above the unwrapping wire roller (16)
(18) and above take-up roller (27) wire intaking compacting wheel (31) are provided with；
Unwrapping wire transition wheel (20) and take-up transition wheel (32) are provided at the top of second mounting plate (33)；The rack (1)
The lower part of side and the lower part of the second mounting plate (23) between be provided with horizontal mounting plate (33)；The horizontal mounting plate
(33) there are two height adjustment transition wheel (24) for installation on, and two height adjustment transition wheel (24) distributions are located at unwrapping wire transition wheel
(20) and the underface of take-up transition wheel (32)；
Two horizontal transition wheels (14) are set on the horizontal mounting plate (33), and the lower part of the mounting plate (1) was provided with line
Mouth (11)；The horizontal transition wheel (14) is concordant with thread passing port (11)；The horizontal transition wheel (14) and height adjustment transition wheel
(24) there are two vertical transition wheel (15) for setting between；The horizontal transition wheel (14), vertical transition wheel (15) and height are adjusted
Transition wheel (24) are saved to correspond；
The connecton layout includes wiring plate (12) and two groups of branching wheels (13), two groups of branching wheel (13) parallelly distribute ons；And it is every
Group branching wheel includes at least three branching wheels (13)；Each branching wheel in two groups of branching wheels (13) is aligned one by one；The unwrapping wire
Roller is provided with cutting line on (16)；The cutting line (22) is successively around unwrapping wire contact roller (18), unwrapping wire transition wheel (20), height
Adjust transition wheel (24), vertical transition wheel (15), horizontal transition wheel (14), two groups of branching wheels (13) and two Wire guide rollers
(11), horizontal transition wheel (14), vertical transition wheel (15), height adjustment transition wheel (24), take-up transition wheel then are successively bypassed
(32), wire intaking compacting wheel (31) are eventually returned on take-up roller (27)；
The spray equipment includes spray equipment ontology (91), is provided with lateral fluid infusion slot on the spray equipment ontology (91)
(92) and overflow launder (93), the overflow launder (93) are located at the side of fluid infusion slot (92)；The opening of the overflow launder (93) is high
Degree is lower than fluid infusion slot (92)；Overflow launder (93) bottom is provided with the through-hole (97) of connection fluid infusion slot (92) bottom；The benefit
The opening of liquid bath (92) is provided with cover board (95)；Cover board (95) middle position is provided with the fluid infusion of connection fluid infusion slot (92)
It manages (96)；The side of the opening of the overflow launder (93) is provided with the overflow plate (94) tilted down；The spray equipment ontology
(91) both ends are provided with mounting plate (98)；The spray equipment ontology (91) is mounted on rack (1) by mounting plate (98)；
The coolant liquid storage box (8) is connected to by water pump with liquid supplementation pipe (96).
2. multi-wire cutting machine for silicon wafer as described in claim 1, it is characterised in that: the crystalline substance drags and is provided with swallow on connector (4)
Stern notch, the inner wall of the dovetail groove side are provided with wedge (5)；Connecting shaft (6), the connection are provided on the wedge (5)
Axis (6) one end is connect with wedge (5), and the other end passes through the inner wall of dovetail groove, and is provided with locking nut (7)；The locking screw
Female (7) are threadedly engaged with connecting shaft (6).
3. multi-wire cutting machine for silicon wafer as claimed in claim 2, it is characterised in that: the unwrapping wire contact roller (18) and take-up pressure
Bearing up pulley (31) is mounted on mounting plate (1) by elastic device (9), and the unwrapping wire contact roller (18) has mounting base (7), institute
It states mounting base (7) and one end of elastic device (9) is hinged.
4. multi-wire cutting machine for silicon wafer as claimed in claim 3, it is characterised in that: the unwrapping wire transition wheel (20) and take-up
Ferry boat (32) is mounted on the second mounting plate (23) by support frame (17), and the mounting base of the unwrapping wire transition wheel (20) with
One end of support frame (17) is hinged.
5. multi-wire cutting machine for silicon wafer as claimed in claim 4, it is characterised in that: the height adjustment transition wheel (24) passes through perpendicular
It is mounted on horizontal mounting plate (33) to lifting device (25).
6. multi-wire cutting machine for silicon wafer as claimed in claim 5, it is characterised in that: the bottom of the fluid infusion slot (92) is provided with row
Dirty mouth (910), the sewage draining exit (910) have outlet in the side of spray equipment ontology (91), and the outlet is provided with blocking
(911)。
7. multi-wire cutting machine for silicon wafer as claimed in claim 6, it is characterised in that: be provided with above the overflow plate (94) anti-
Dust hood (99).
8. multi-wire cutting machine for silicon wafer as claimed in claim 7, it is characterised in that: the unwrapping wire roller device of rotation driving (17) with
And take-up roller device of rotation driving (28) uses motor or hydraulic motor.
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|---|---|---|---|---|
| CN111098419A (en) * | 2019-12-30 | 2020-05-05 | 杨兆安 | Slicing device for silicon wafer production |
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| CN109129949B (en) | 2024-02-23 |
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