CN101628452A - Method for cutting silicon chips - Google Patents
Method for cutting silicon chips Download PDFInfo
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- CN101628452A CN101628452A CN200910101331A CN200910101331A CN101628452A CN 101628452 A CN101628452 A CN 101628452A CN 200910101331 A CN200910101331 A CN 200910101331A CN 200910101331 A CN200910101331 A CN 200910101331A CN 101628452 A CN101628452 A CN 101628452A
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Abstract
The invention discloses a method for cutting silicon chips, which comprises the following steps: controlling a pay-off spool driving motor, a take-up spool driving motor, a first guide wheel driving motor and a second guide wheel driving motor to rotate synchronously and inversely by a control system after the pay-off spool driving motor drives a pay-off spool to positively pay off wires for 250m-270m; and controlling the four motors to rotate positively again by the control system after the take-up spool driving motor drives a take-up spool to reversely pay off wires for 60m-70m. A silicon rod is cut back and forth in this way repeatedly like a saw blade dragging type, and because a cutting line moves forward for a certain distance and then moves backward for a certain distance, the utilization ratio of the cutting line is efficiently enhanced without breaking the cutting line. Because the silicon rod is cut back and forth, the thickness up and down each silicon chip is uneven when cutting the silicon rod positively, but the direction of each silicon chip can be effectively corrected in reverse cutting, and thus the thickness difference up and down each silicon chip is greatly reduced so as to enhance the quality of the silicon chips.
Description
Technical field
The present invention relates to a kind of silicon chip, especially relate to a kind of silicon chip cutting method.
Background technology
In short supply along with the energy, photovoltaic generation more and more is subjected to people's attention, and the market demand of silicon chip of solar cell is also increasing.Silicon chip of solar cell cuts into thin slice with square silicon single crystal rod and forms, but because silicon wafer material price costliness, especially at home the silicon wafer material is extremely rare, and the cost that therefore how to reduce silicon chip of solar cell is most important to the competitiveness of traditional energy for improving solar energy.
For reducing the cost of silicon chip of solar cell, need make a square silicon single crystal rod can cut more silicon chip, just allow every silicon chip thin as far as possible, but this has proposed very high requirement to the silicon chip cutting technique, also makes traditional blade cuts method be eliminated simultaneously.The multi-thread cutting technique of silicon chip is present more advanced in the world silicon chip process technology, it is different from cutting modes such as traditional knife saw sheet, grinding wheel, also be different from advanced laser cutting and interior circle cutting, its principle is that the steel wire by a high-speed motion drives and rubs attached to the cutting blade material square shaped silicon single crystal rod on the steel wire, thereby reaches cutting effect.Common in the market silicon chip cutter is exactly a kind of process equipment of using multi-thread incision principle, this silicon chip cutter comprises housing, be provided with cutting chamber in the housing, drive unit, bus cable device and control system, the top of cutting chamber is provided with the workbench that can move up and down, workbench is provided with work piece holder, flexibly connect the clamping plate that are useful on the clamping silicon rod on the work piece holder, the below of cutting chamber is provided with first guide wheel and second guide wheel, first guide wheel is provided with a plurality of first wire casings, second guide wheel is provided with and corresponding a plurality of second wire casings of first wire casing, the spacing of each first wire casing is 327 μ m, the spacing of each second wire casing is 327 μ m, the both sides of cutting chamber top are provided with the mortar nozzle that is used to spray mortar, drive unit comprises the workbench drive motors, unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors, unwrapping wire bobbin drive motors is connected with first transmission mechanism, take-up bobbin drive motors is connected with second transmission mechanism, first transmission mechanism comprises first driving bearing, second transmission mechanism comprises second driving bearing, bus cable device comprises the unwrapping wire bobbin, first glass pulley, first wobble wheel, first dynamometry wheel, the take-up bobbin, second glass pulley, second wobble wheel and second dynamometry wheel, the unwrapping wire bobbin is connected on first driving bearing, the take-up bobbin is connected on second driving bearing, be arranged with line of cut on the unwrapping wire bobbin in advance, control system is used to control the speed of each drive motors of whole silicon wafer cutting machine, turn to, control workbench drive motors drives the lifting and the control mortar nozzle operation of workbench.The main process of utilizing this silicon chip cutter to carry out the silicon chip cutting is: the first step, the unwrapping wire bobbin that is arranged with line of cut is installed on first driving bearing, the take-up bobbin is installed on second driving bearing, the end of a thread of line of cut is walked around first glass pulley successively, first wobble wheel and first dynamometry wheel, then from the outside inlet wire of first guide wheel, by each first wire casing and each second wire casing line of cut is repeated to be surrounded on first guide wheel and the enterprising row wiring of second guide wheel, the wiring back is from the outside outlet of second guide wheel, line of cut between first guide wheel and second guide wheel constitutes the parallel nets that distance between centers of tracks is 207 μ m, and the end of a thread of line of cut is walked around second dynamometry wheel more successively, second wobble wheel and second glass pulley are connected with the take-up bobbin; Second step, with an axial sides of silicon rod to be cut stick at one on glass, utilize the clamping plate be movably connected on the work piece holder to clamp glass then, the degree of depth of adjusting the height of work piece holder and clamping plate again make silicon rod be positioned at parallel nets directly over and near parallel nets; The 3rd step, to adjust work piece holder and drive the decrease speed that silicon rod descends, decrease speed is 30mm/min～40mm/min, adjusts the gait of march that line of cut advances, gait of march is 9.5m/s～11.5m/s; The 4th step, control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous forward are rotated, line of cut on the unwrapping wire bobbin advances to the take-up bobbin with the gait of march of 9.5m/s～11.5m/s, simultaneously the mortar nozzle evenly sprays mortar and work piece holder to parallel nets and drives silicon rod and descend to parallel nets with the decrease speed of 30mm/min～40mm/min, and mortar parcel line of cut cuts silicon rod; In the 5th step, when silicon rod is cut into a plurality of thickness when being the silicon chip of 180 μ m, control system is controlled each drive motors and is quit work synchronously, and control mortar nozzle stops to spray mortar to parallel nets, control workbench simultaneously and rise, wait to rise and finish, take out the silicon chip that cutting is finished.Above-mentioned silicon chip cutting technique is compared with other traditional cutting techniques, has the efficient height, the production capacity height, the precision advantages of higher, but because line of cut a little deviation may occur in cutting silicon rod process, adding line of cut is that orientation is advanced in that silicon rod is carried out in the cutting process all the time, and cutting is finished and need be reached about 8 hours, make line of cut produce bigger cumulative departure like this, thereby will cause cutting the phenomenon that there is became uneven in the silicon chip that obtains, situation such as perhaps two surface quality of silicon chip are not ideal enough, finally influenced the yield rate of silicon chip, on the other hand, line of cut is that orientation is advanced to this cutting method all the time in the cutting process in that silicon rod is carried out, impose uniformity without examining individual cases to the end, so relatively waste line of cut, make the unit length silicon chip cutting quantity of line of cut lower.
Summary of the invention
Technical problem to be solved by this invention provides a kind ofly can dwindle the silicon chip that obtains of the cutting difference of thickness up and down, and can effectively improve the silicon chip cutting method of the utilization rate of line of cut.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: a kind of silicon chip cutting method, may further comprise the steps: the unwrapping wire bobbin that 1. will be arranged with line of cut is installed on first driving bearing, the take-up bobbin is installed on second driving bearing, the end of a thread that exposes of line of cut is walked around first glass pulley successively, first wobble wheel and first dynamometry wheel, then from the outside inlet wire of first guide wheel, by first wire casing and second wire casing line of cut is repeated to be surrounded on first guide wheel and the enterprising row wiring of second guide wheel, wiring back line of cut expose the outside outlet of the end of a thread from second guide wheel, line of cut between first guide wheel and second guide wheel constitutes the parallel nets that distance between centers of tracks is 207 μ m, and the end of a thread that exposes of line of cut is walked around second dynamometry wheel more successively, second wobble wheel and second glass pulley are connected with the take-up bobbin; 2. an axial sides of silicon rod to be cut is pasted on one on glass, utilize the clamping plate that are movably connected on the work piece holder to clamp glass then, adjust the degree of depth of clamping plate again, make silicon rod be positioned at parallel nets directly over, last control system control workbench drive motors drives workbench and drops to and make the position of silicon rod near parallel nets; 3. set workbench and drive the decrease speed that silicon rod descends, reach the gait of march that line of cut advances; 4. control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors rotate synchronously, the mortar of control system control simultaneously nozzle evenly sprays mortar to parallel nets, reach control workbench drive motors and drive the decrease speed decline of workbench drive silicon rod to set, mortar parcel line of cut cuts silicon rod; 5. after the silicon chip cutting is finished, control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors quit work synchronously, the mortar of control system control simultaneously nozzle stops to spray mortar to parallel nets, and control workbench drive motors drives the workbench rising, treat that workbench rises in the time of can conveniently taking out the position of the silicon chip that has cut, take out the silicon chip that cutting is finished; The process that silicon rod is cut comprises control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous forward are rotated, unwrapping wire bobbin drive motors drives unwrapping wire bobbin forward unwrapping wire, line of cut on the unwrapping wire bobbin advances to the take-up bobbin with the gait of march of setting, mortar parcel line of cut carries out the forward cutting to silicon rod, behind unwrapping wire bobbin forward unwrapping wire 250m～270m, control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous backward rotate, take-up bobbin drive motors drives the reverse unwrapping wire of take-up bobbin, line of cut on the take-up bobbin advances to the unwrapping wire bobbin with the gait of march of setting, mortar parcel line of cut carries out reverse cut to silicon rod, behind the reverse unwrapping wire 60m～70m of take-up bobbin, back and forth silicon rod is carried out forward cutting and reverse cut again, finish until the silicon chip cutting.
Described decrease speed is 25mm/min～35mm/min, and described gait of march is 9.5m/s～11.5m/s.
Described decrease speed is 28mm/min, and described gait of march is 10m/s.
The line length that described unwrapping wire bobbin drive motors drives described unwrapping wire bobbin forward unwrapping wire is 260m.
The line length that described take-up bobbin drive motors drives the reverse unwrapping wire of described take-up bobbin is 65m.
Described mortar is mixed by cutting liquid and particle cutter, the mixed proportion of described cutting liquid and described particle cutter is 1: 1, described cutting liquid mainly is made up of polyethylene glycol, the mass content of described polyethylene glycol is at least 95%, described particle cutter mainly is made up of carborundum, and the mass content of described carborundum is at least 95%.
Compared with prior art, the invention has the advantages that after unwrapping wire bobbin drive motors drives unwrapping wire bobbin forward unwrapping wire 250m～270m, by control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous backward rotate, again after take-up bobbin drive motors drives the reverse unwrapping wire 60m～70m of take-up bobbin, control four motors forward rotation once more by control system, one have a try and be similar to dragsaw bar formula silicon rod is cut back and forth so repeatedly, because after line of cut has been goed ahead a segment distance, the line of cut segment distance of having gone back again, make a part of line of cut in the line of cut take action like this through three cuttings, under the assurance line of cut is not ruptured situation about influencing, effectively improved the utilization rate of line of cut, and owing to back and forth silicon rod is cut, when forward cutting silicon rod, may make silicon chip produce became uneven because of the offset direction of line of cut, but when reverse cut, can effectively make correction for direction, dwindle the thickness difference of silicon chip greatly, thereby improved the quality of silicon chip.
Description of drawings
Fig. 1 is the structural representation of silicon chip cutter.
The specific embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.
Embodiment one: silicon chip cutting method of the present invention can be used on the existing silicon chip cutter, existing silicon chip cutter as shown in Figure 1, it comprises the housing (not shown), is provided with drive unit 1, bus cable device 2, cutting chamber 3 and control system (not shown) in the housing.The top of cutting chamber 3 is provided with workbench 31, workbench 31 is provided with work piece holder 32, flexibly connect the clamping plate 36 that are useful on clamping silicon rod 7 on the work piece holder, the below of cutting chamber 3 is provided with first guide wheel 33 and second guide wheel 34, radially be provided with a plurality of first wire casing (not shown)s on first guide wheel 33, radially be provided with on second guide wheel 34 and the corresponding a plurality of second wire casing (not shown)s of first wire casing, the spacing of each first wire casing is 327 μ m, the spacing of each second wire casing is 327 μ m, connect up by first wire casing and second wire casing like this and can form a parallel nets, the both sides of cutting chamber 3 tops are provided with the mortar nozzle 9 that is used to spray the mortar (not shown).Drive unit 1 comprises workbench drive motors (not shown), unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, be used to drive the first guide wheel drive motors (not shown) of first guide wheel, 33 rotations and be used to drive the second guide wheel drive motors (not shown) that second guide wheel 34 rotates, unwrapping wire bobbin drive motors 11 is connected with first transmission mechanism 4, take-up bobbin drive motors 12 is connected with second transmission mechanism 5, first transmission mechanism 4 comprises first driving bearing 41, second transmission mechanism 5 comprises second driving bearing 51, bus cable device 2 comprises unwrapping wire bobbin 21, first glass pulley 22, first wobble wheel 23, first dynamometry wheel 24, take-up bobbin 25, second glass pulley 26, second wobble wheel 27 and second dynamometry wheel 28, unwrapping wire bobbin 21 is connected on first driving bearing 41, take-up bobbin 25 is connected on second driving bearing 51, is arranged with line of cut 6 on the unwrapping wire bobbin 41 in advance.Control system is controlled the speed of unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, the first guide wheel drive motors 33, the second guide wheel drive motors 34 and is turned to, and control workbench drive motors drives the lifting and 9 work of mortar nozzle of workbench 31.
Silicon chip cutting method of the present invention specifically may further comprise the steps:
The unwrapping wire bobbin 21 that 1. will be arranged with line of cut 6 is installed on first driving bearing 41, take-up bobbin 25 is installed on second driving bearing 51, the end of a thread that exposes of line of cut 6 is walked around first glass pulley 22 successively, first wobble wheel 23 and first dynamometry wheel 24, then from the outside inlet wire of first guide wheel 33, by second wire casing on first wire casing on first guide wheel 33 and second guide wheel 34 line of cut is repeated to be surrounded on second guide wheel 34 and first guide wheel, 33 enterprising row wirings, wiring back line of cut 6 expose the outside outlet of the end of a thread from second guide wheel 34, line of cut 6 between first guide wheel 33 and second guide wheel 34 constitutes the parallel nets 8 that distance between centers of tracks is 207 μ m, and the end of a thread that exposes of line of cut 6 is walked around second dynamometry wheel 28 more successively, second wobble wheel 27 and second glass pulley 26 are connected with take-up bobbin 25.Line of cut 6 employing lines directly are the steel wire of 0.12mm in the present embodiment.
2. an axial sides with silicon rod to be cut 7 is pasted on the glass 35, utilize the clamping plate 36 that are movably connected on the work piece holder 32 to clamp glass 35 then, make the axis of silicon rod 7 parallel with the axis of first guide wheel 33 and second guide wheel 34, even each section line of cut in the axis of silicon rod 7 and the parallel nets 8 is perpendicular in the space, adjust the degree of depth of clamping plate 36 again, promptly adjust the axial location of clamping plate 36 in work piece holder 32, make silicon rod 7 be positioned at parallel nets 8 directly over, last control system control workbench drive motors drives workbench and descends, to adjust the height of work piece holder 32, make silicon rod 7 near parallel nets 8.
3. set workbench 31 and drive the decrease speed of silicon rod 7 declines and the gait of march that line of cut 6 advances.Decrease speed can be set at 29mm/min at this, gait of march is set at 10m/s.
4. control system is controlled unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, the first guide wheel drive motors and the second guide wheel drive motors synchronous forward are rotated, unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire, take-up bobbin drive motors 12 drives the 25 forward take-ups of take-up bobbin, line of cut 6 on the unwrapping wire bobbin 21 advances to take-up bobbin 25 with the gait of march 10m/s that sets, control system is controlled mortar nozzle 9 and is driven the decrease speed 29mm/min decline of workbench 31 drive silicon rods 7 with setting to parallel nets 8 even injection mortars and control workbench drive motors simultaneously, 6 pairs of silicon rods of mortar parcel line of cut 7 carry out the forward cutting, after unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire 270m, control system control unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, first has led wheel drive motor and the rotation of the second guide wheel drive motors synchronous backward, take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire, unwrapping wire bobbin drive motors 11 drives the 21 reverse take-ups of unwrapping wire bobbin, line of cut 6 on the take-up bobbin 25 advances to unwrapping wire bobbin 21 with the gait of march 10m/s that sets, 6 pairs of silicon rods of mortar parcel line of cut 7 carry out reverse cut, after take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire 70m, again by control system control unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, the first guide wheel drive motors and the second guide wheel drive motors synchronous forward are rotated, silicon rod 7 is carried out the forward cutting, after unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire 270m, again by control system control unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, first has led wheel drive motor and the rotation of the second guide wheel drive motors synchronous backward, silicon rod 7 is carried out reverse cut, after take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire 70m, back and forth silicon rod 7 is carried out forward cutting and reverse cut again, one cutting cutting is finished until the silicon chip cutting with having a try with being similar to dragsaw bar formula.Mortar nozzle 9 evenly sprays mortar to parallel nets 8 always in whole cutting process, and 6 pairs of silicon rods of mortar parcel line of cut cut forward or backwards, and workbench 31 drives silicon rod 7 and descends with the decrease speed of setting always.Mix by cutting liquid and particle cutter at this mortar, the mixed proportion of cutting liquid and particle cutter is 1: 1, cutting liquid mainly is made up of polyethylene glycol, the mass content of polyethylene glycol is at least 95%, the particle cutter mainly is made up of carborundum and iron oxide, and the mass content of carborundum is at least 95%.
5. to be cut into a plurality of thickness through parallel nets 8 be that the silicon chip of 180 μ m approximately needs about 8 hours to silicon rod 7, after the silicon chip cutting is finished, control system control unwrapping wire bobbin drive motors 11, take-up bobbin drive motors 12, the first guide wheel drive motors and the second guide wheel drive motors quit work synchronously, the mortar of control system control simultaneously nozzle 9 stops to spray mortar to parallel nets 8, and control workbench drive motors drives workbench 31 risings, treat that workbench 31 rises in the time of can conveniently taking out the position of the silicon chip that has cut, take out the silicon chip that cutting is finished, finish the silicon chip cutting process.
Said process has been finished the cutting of a silicon rod, cuts next root silicon rod as need, only needs after taking out the silicon chip of well cutting, and repeating step 2.～5..And after the line of cut on the unwrapping wire bobbin 21 exhausts, then need get a new unwrapping wire bobbin again, repeat above-mentioned steps again to realize the cutting of silicon rod.
Embodiment two: this enforcement is basic identical with embodiment one, difference only is in the present embodiment, decrease speed is set at 25mm/min, gait of march is set at 9.5m/s, the line length that unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire is made as 250m, the line length that take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire is made as 60m, like this behind unwrapping wire bobbin drive motors 11 and the about 26.3s of take-up bobbin drive motors 12 forward rotation, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 need backward rotation, the counter-rotational time is approximately about 6.3s, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 forward rotation once more behind unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 backward rotation 6.3s.
Embodiment three: present embodiment and embodiment one and embodiment two are basic identical, difference only is in the present embodiment, decrease speed is set at 28mm/min, gait of march is set at 11.5m/s, the line length that unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire is made as 265m, the line length that take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire is made as 60m, like this behind unwrapping wire bobbin drive motors 11 and the about 23s of take-up bobbin drive motors 12 forward rotation, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 need backward rotation, the counter-rotational time is approximately about 5.2s, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 forward rotation once more behind unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 backward rotation 5.2s.
Embodiment four: present embodiment and embodiment one, embodiment two and embodiment three are basic identical, difference only is in the present embodiment, decrease speed is set at 30mm/min, gait of march is set at 10m/s, the line length that unwrapping wire bobbin drive motors 11 drives unwrapping wire bobbin 21 forward unwrapping wire is made as 260m, the line length that take-up bobbin drive motors 12 drives take-up bobbin 25 reverse unwrapping wire is made as 65m, like this behind unwrapping wire bobbin drive motors 11 and the about 26s of take-up bobbin drive motors 12 forward rotation, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 need backward rotation, the counter-rotational time is approximately about 6.5s, unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 forward rotation once more behind unwrapping wire bobbin drive motors 11 and take-up bobbin drive motors 12 backward rotation 6.5s.
Cutting method of the present invention is just being marched forward to line of cut and the requirement of reverse forward travel distance is comparatively strict, should improve the utilization rate of line of cut, guarantees the quality of silicon chip again, will guarantee that also line of cut is continuous in cutting process.If the distance that line of cut oppositely advances is set to identical with its just progressive distance, like this just become repeatedly utilizing a certain section line of cut, will inevitably cause the fracture of line of cut like this; If the just progressive distance of line of cut is just progressive apart from half less than it with the difference of its distance of oppositely advancing, line of cut will be back and forth to the silicon rod cutting repeatedly like this, though improved the utilization rate of line of cut, but consider that each drive motors rotating needs the process of an acceleration-deceleration, make the average speed of line of cut reduce like this, but consider that lowering speed of platform is constant, may cause line of cut through repeatedly friction like this, the probability of fracture is high, and bigger concavo-convex repetition lines may appear in silicon chip surface simultaneously; If it is minimum that the distance that line of cut oppositely advances is provided with, Qie Ge meaning will not be very big so back and forth; When utilizing the present invention to carry out the silicon chip cutting, just progressive distance is over half all is fine greater than it for the difference of the general just progressive distance of line of cut and its distance of oppositely advancing, and the data that provide in the specific embodiments of the invention all are the empirical values that obtain in actual process.
Use silicon chip cutter as shown in Figure 1 to carry out the silicon chip cutting, the length overall of supposing the line of cut of winding on the unwrapping wire bobbin is 550 kilometers, utilize existing unidirectional advance cutting method and the inventive method to carry out the silicon chip cutting respectively, generally speaking, utilize the existing unidirectional cutting method of advancing, the line of cut one cutter need that a bundle is 550 kilometers are promptly cut a silicon rod for about 270 kilometers and are needed about 270 kilometers, such 550 kilometers line of cut can only be cut two silicon rods, and the situation of became uneven can appear up and down in the silicon chip of well cutting; Utilize the inventive method, line of cut one cutter that a bundle is 550 kilometers only need is promptly cut about 135 kilometers of silicon rod need for about 135 kilometers, such 550 kilometers line of cut can be cut four silicon rods, and thickness is more even up and down for the silicon chip of well cutting, from the data contrast as can be known, the inventive method has improved the utilization rate of line of cut greatly, and has improved the quality and the performance of silicon chip.
Claims (6)
1, a kind of silicon chip cutting method, may further comprise the steps: the unwrapping wire bobbin that 1. will be arranged with line of cut is installed on first driving bearing, the take-up bobbin is installed on second driving bearing, the end of a thread that exposes of line of cut is walked around first glass pulley successively, first wobble wheel and first dynamometry wheel, then from the outside inlet wire of first guide wheel, by first wire casing and second wire casing line of cut is repeated to be surrounded on first guide wheel and the enterprising row wiring of second guide wheel, wiring back line of cut expose the outside outlet of the end of a thread from second guide wheel, line of cut between first guide wheel and second guide wheel constitutes the parallel nets that distance between centers of tracks is 207 μ m, and the end of a thread that exposes of line of cut is walked around second dynamometry wheel more successively, second wobble wheel and second glass pulley are connected with the take-up bobbin; 2. an axial sides of silicon rod to be cut is pasted on one on glass, utilize the clamping plate that are movably connected on the work piece holder to clamp glass then, adjust the degree of depth of clamping plate again, make silicon rod be positioned at parallel nets directly over, last control system control workbench drive motors drives workbench and drops to and make the position of silicon rod near parallel nets; 3. set workbench and drive the decrease speed that silicon rod descends, reach the gait of march that line of cut advances; 4. control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors rotate synchronously, the mortar of control system control simultaneously nozzle evenly sprays mortar to parallel nets, reach control workbench drive motors and drive the decrease speed decline of workbench drive silicon rod to set, mortar parcel line of cut cuts silicon rod; 5. after the silicon chip cutting is finished, control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors quit work synchronously, the mortar of control system control simultaneously nozzle stops to spray mortar to parallel nets, and control workbench drive motors drives the workbench rising, treat that workbench rises in the time of can conveniently taking out the position of the silicon chip that has cut, take out the silicon chip that cutting is finished; It is characterized in that the process that silicon rod cuts is comprised control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous forward are rotated, unwrapping wire bobbin drive motors drives unwrapping wire bobbin forward unwrapping wire, line of cut on the unwrapping wire bobbin advances to the take-up bobbin with the gait of march of setting, mortar parcel line of cut carries out the forward cutting to silicon rod, behind unwrapping wire bobbin forward unwrapping wire 250m～270m, control system control unwrapping wire bobbin drive motors, take-up bobbin drive motors, the first guide wheel drive motors and the second guide wheel drive motors synchronous backward rotate, take-up bobbin drive motors drives the reverse unwrapping wire of take-up bobbin, line of cut on the take-up bobbin advances to the unwrapping wire bobbin with the gait of march of setting, mortar parcel line of cut carries out reverse cut to silicon rod, behind the reverse unwrapping wire 60m～70m of take-up bobbin, back and forth silicon rod is carried out forward cutting and reverse cut again, finish until the silicon chip cutting.
2, a kind of silicon chip cutting method according to claim 1 is characterized in that described decrease speed is 25mm/min～35mm/min, and described gait of march is 9.5m/s～11.5m/s.
3, a kind of silicon chip cutting method according to claim 2 is characterized in that described decrease speed is 28mm/min, and described gait of march is 10m/s.
4,, it is characterized in that the line length that described unwrapping wire bobbin drive motors drives described unwrapping wire bobbin forward unwrapping wire is 260m according to each described a kind of silicon chip cutting method in the claim 1 to 3.
5,, it is characterized in that the line length that described take-up bobbin drive motors drives the reverse unwrapping wire of described take-up bobbin is 65m according to each described a kind of silicon chip cutting method in the claim 1 to 3.
6, a kind of silicon chip cutting method according to claim 1, it is characterized in that described mortar is mixed by cutting liquid and particle cutter, the mixed proportion of described cutting liquid and described particle cutter is 1: 1, described cutting liquid mainly is made up of polyethylene glycol, the mass content of described polyethylene glycol is at least 95%, described particle cutter mainly is made up of carborundum, and the mass content of described carborundum is at least 95%.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN102152419A (en) * | 2011-03-18 | 2011-08-17 | 浙江荣马电子科技有限公司 | Process for carrying out multiline cutting on silicon slices |
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Families Citing this family (1)
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| CN102581969A (en) * | 2012-02-28 | 2012-07-18 | 浙江上城科技有限公司 | Single-line cutting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2891187B2 (en) * | 1995-06-22 | 1999-05-17 | 信越半導体株式会社 | Wire saw device and cutting method |
| CN1957878A (en) * | 2006-10-17 | 2007-05-09 | 颜怀伟 | Beautification articles of composition between oleic acid and glycerol |
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| CN101444934B (en) * | 2008-12-31 | 2012-06-20 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
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| CN101817209B (en) * | 2010-04-01 | 2012-09-12 | 大连理工大学 | Real-time deviation correcting method for precise cutting process of diamond wire saw |
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| CN109291268A (en) * | 2018-11-08 | 2019-02-01 | 上海申和热磁电子有限公司 | A kind of three axis changes the slicer cutting method of two axis |
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| CN112936623A (en) * | 2019-12-10 | 2021-06-11 | 阿特斯光伏电力(洛阳)有限公司 | Cutting method of diamond wire cutting device |
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