CN102152419A - Process for carrying out multiline cutting on silicon slices - Google Patents
Process for carrying out multiline cutting on silicon slices Download PDFInfo
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- CN102152419A CN102152419A CN2011100667581A CN201110066758A CN102152419A CN 102152419 A CN102152419 A CN 102152419A CN 2011100667581 A CN2011100667581 A CN 2011100667581A CN 201110066758 A CN201110066758 A CN 201110066758A CN 102152419 A CN102152419 A CN 102152419A
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- steel wire
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- pulley
- multiline
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Abstract
The invention relates to a process for carrying out multiline cutting on silicon slices. The process comprises the following steps that firstly a steel wire is arranged on a multiline cutting machine; then the steel wire cuts the silicon slices by a bidirectional routing method at certain routing speed; when the steel wire completes routing and retracts on a take-up reel, a pay-off wheel and the take-up reel are interchanged, the diameter of the steel wire is measured, and a main roll which meets the thickness requirement of the steel wire and has a corresponding slot pitch is arranged on the multiline cutting machine again; and then the steel wire cuts the silicon slices by a unidirectional routing method at the routing speed which is 1.5 to 2.5 times of the original bidirectional routing speed. Due to the adoption of the method, in the process of carrying out multiline cutting on the silicon slices, the using amount of the used steel wire is reduced by one third and the utilization rate of the steel wire is improved. Moreover, after the bidirectional routing method is changed into the unidirectional routing method, cutting is carried out continuously. The steel wire is thinner. The slot pitch is smaller. The slice outlet number of the silicon slices can also be increased.
Description
Technical field
The present invention relates to a kind of technology of multiline cut silicon chips, particularly utilize the diamond dust in the steel wire drive mortar, silicon rod is cut into the technology of silicon chip.
Background technology
At present, cut in the process of silicon chip at silicon rod, generally will roll up the steel wire of pulling out on the actinobacillus wheel (also claiming Wire Wheel) of steel wire is installed on the multi-line cutting machine through guide wheel group one, home roll one, home roll two, the guide wheel group two that comprises several guide wheels, the take-up pulley (also claiming the loop line wheel) that comprises several guide wheels, and steel wire repeatedly twines on home roll one and home roll two and forms gauze, press certain speed then, take the method cutting silicon chip of two-way cabling, it is just useless with this coil report from a liner just to walk (just being cutting silicon rod 4 a cuttves at present) back from the beginning to the end at whole steel wires.This processing step, the steel wire consumption is very big, has increased bigger production cost.
Summary of the invention
The technology that the purpose of this invention is to provide a kind of multiline cut silicon chips of the utilization rate that can improve steel wire.
The technical scheme that the present invention takes is: a kind of technology of multiline cut silicon chips, it is characterized in that will rolling up earlier the steel wire of pulling out on the actinobacillus wheel of steel wire successively through the guide wheel group one, home roll one, the home roll two that comprise several guide wheels, comprise that guide wheel group two, the take-up pulley of several guide wheels are installed on the multi-line cutting machine, and steel wire repeatedly twine to form gauze on home roll one and home roll two, allows steel wire take the method for two-way cabling then and keeps certain Trace speed cutting silicon chip; Afterwards, when the steel wire cabling finishes and furl on take-up pulley, location swap with actinobacillus wheel and take-up pulley, with rolling up the steel wire of pulling out on the take-up pulley of steel wire again successively through the guide wheel group one, home roll one, the home roll two that comprise several guide wheels, comprise that guide wheel group two, the actinobacillus wheel of several guide wheels are installed on the multi-line cutting machine, and steel wire repeatedly twines on home roll one and home roll two and forms gauze again, then steel wire is taked the method for unidirectional cabling and kept Trace speed to cut silicon chip between 1.5～2.5 times of former two-way Trace speed to get final product.
The technology of described a kind of multiline cut silicon chips behind the location swap of actinobacillus wheel and take-up pulley, also should be measured the diameter of steel wire, and home roll one and home roll two are replaced with the home roll with respective grooves distance that meets the requirement of steel wire thickness.
Adopt the inventive method, can in the process of multiline cut silicon chips, the steel wire consumption that uses be reduced by 1/3rd, improved the utilization rate of steel wire, simultaneously, made into to continue cutting behind the unidirectional cabling by two-way cabling, steel wire is thinner, and slot pitch is littler, also can increase the slice number of silicon chip.
The specific embodiment
Below the invention will be further described.
The technology of this multiline cut silicon chips is taked following steps:
One, gets an actinobacillus wheel (also claiming Wire Wheel) of rolling up steel wire, the steel wire diameter is at 0.120mm, pull out steel wire, it is installed on the multi-line cutting machine through guide wheel group one, home roll one, home roll two, the guide wheel group two that comprises several guide wheels, the take-up pulley (also claiming the loop line wheel) that comprises several guide wheels successively, and steel wire repeatedly twines on home roll one and home roll two and forms gauze, and the home roll one wherein and the slot pitch of home roll two are 0.330mm～0.340mm.
Two, multi-line cutting machine is arranged to two-way cabling, start relief steel wire Trace speed remains between 240m～270m/min and cuts.
Three, finish and furl after on the take-up pulley when the steel wire cabling, the location swap of actinobacillus wheel and take-up pulley.
Four, measurement uses the diameter of steel wire later to be 0.112mm, and the home roll one and the home roll two that are 0.330mm～0.340mm with above-mentioned used slot pitch are replaced with the home roll that slot pitch is 0.320mm～0.330mm.
Five, above-mentioned used steel wire is pulled out from take-up pulley, successively through the guide wheel group one, home roll one, the home roll two that comprise several guide wheels, comprise that guide wheel group two, the actinobacillus wheel of several guide wheels are installed on the multi-line cutting machine, and steel wire repeatedly twine to form gauze on home roll one and home roll two.
Six, multi-line cutting machine is arranged to unidirectional cabling, start relief steel wire Trace speed is brought up to 360m～675m/min by original 240m～270m/min and is cut.
Seven, after the whole cablings of steel wire finish, it is scrapped.
Like this, by above-mentioned, the result shows after tested, can in the process of multiline cut silicon chips the steel wire consumption that uses be reduced by 1/3rd, improved the utilization rate of steel wire, simultaneously, made into to continue cutting behind the unidirectional cabling by two-way cabling, steel wire is thinner, slot pitch is littler, also can increase the slice number of silicon chip.
Claims (2)
1. the technology of a multiline cut silicon chips, it is characterized in that will rolling up earlier the steel wire of pulling out on the actinobacillus wheel of steel wire successively through the guide wheel group one, home roll one, the home roll two that comprise several guide wheels, comprise that guide wheel group two, the take-up pulley of several guide wheels are installed on the multi-line cutting machine, and steel wire repeatedly twine to form gauze on home roll one and home roll two, allows steel wire take the method for two-way cabling then and keeps certain Trace speed cutting silicon chip; Afterwards, when the steel wire cabling finishes and furl on take-up pulley, location swap with actinobacillus wheel and take-up pulley, with rolling up the steel wire of pulling out on the take-up pulley of steel wire again successively through the guide wheel group one, home roll one, the home roll two that comprise several guide wheels, comprise that guide wheel group two, the actinobacillus wheel of several guide wheels are installed on the multi-line cutting machine, and steel wire repeatedly twines on home roll one and home roll two and forms gauze again, then steel wire is taked the method for unidirectional cabling and kept Trace speed to cut silicon chip between 1.5～2.5 times of former two-way Trace speed to get final product.
2. according to the technology of the described a kind of multiline cut silicon chips of claim 1, it is characterized in that behind the location swap of actinobacillus wheel and take-up pulley, also should measure the diameter of steel wire, and home roll one and home roll two are replaced with the home roll with respective grooves distance that meets the requirement of steel wire thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100667581A CN102152419A (en) | 2011-03-18 | 2011-03-18 | Process for carrying out multiline cutting on silicon slices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100667581A CN102152419A (en) | 2011-03-18 | 2011-03-18 | Process for carrying out multiline cutting on silicon slices |
Publications (1)
| Publication Number | Publication Date |
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| CN102152419A true CN102152419A (en) | 2011-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100667581A Pending CN102152419A (en) | 2011-03-18 | 2011-03-18 | Process for carrying out multiline cutting on silicon slices |
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| CN (1) | CN102152419A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419290A (en) * | 2012-05-23 | 2013-12-04 | 浙江锦锋光伏科技有限公司 | Tool feeding method for multi-wire sawing of silicon wafers |
| CN103950119A (en) * | 2014-04-16 | 2014-07-30 | 唐山晶玉科技有限公司 | Multi-wire cutter wire breakage continuously cutting method |
| CN109732796A (en) * | 2019-01-30 | 2019-05-10 | 无锡中环应用材料有限公司 | A kind of cutting method of monocrystalline silicon piece |
| CN112164534A (en) * | 2020-09-28 | 2021-01-01 | 重庆泰山电缆有限公司 | Automatic wire stripping device and method for wires |
| CN112936623A (en) * | 2019-12-10 | 2021-06-11 | 阿特斯光伏电力(洛阳)有限公司 | Cutting method of diamond wire cutting device |
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| CH677895A5 (en) * | 1988-11-08 | 1991-07-15 | Charles Hauser | Wire cutting appts. for silicon - has steel wires passing around cylinders and through abrasive liquid mixture to slice silicon for electronic components |
| JPH09155857A (en) * | 1995-12-05 | 1997-06-17 | Yasunaga:Kk | Wire saw |
| US6234159B1 (en) * | 1997-09-11 | 2001-05-22 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Wire saw and process for cutting off shaped articles |
| JP2004082283A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Wire saw |
| CN101444934A (en) * | 2008-12-31 | 2009-06-03 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
| CN101628452A (en) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | Method for cutting silicon chips |
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2011
- 2011-03-18 CN CN2011100667581A patent/CN102152419A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH677895A5 (en) * | 1988-11-08 | 1991-07-15 | Charles Hauser | Wire cutting appts. for silicon - has steel wires passing around cylinders and through abrasive liquid mixture to slice silicon for electronic components |
| JPH09155857A (en) * | 1995-12-05 | 1997-06-17 | Yasunaga:Kk | Wire saw |
| US6234159B1 (en) * | 1997-09-11 | 2001-05-22 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Wire saw and process for cutting off shaped articles |
| JP2004082283A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Wire saw |
| CN101444934A (en) * | 2008-12-31 | 2009-06-03 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
| CN101628452A (en) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | Method for cutting silicon chips |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419290A (en) * | 2012-05-23 | 2013-12-04 | 浙江锦锋光伏科技有限公司 | Tool feeding method for multi-wire sawing of silicon wafers |
| CN103950119A (en) * | 2014-04-16 | 2014-07-30 | 唐山晶玉科技有限公司 | Multi-wire cutter wire breakage continuously cutting method |
| CN109732796A (en) * | 2019-01-30 | 2019-05-10 | 无锡中环应用材料有限公司 | A kind of cutting method of monocrystalline silicon piece |
| CN112936623A (en) * | 2019-12-10 | 2021-06-11 | 阿特斯光伏电力(洛阳)有限公司 | Cutting method of diamond wire cutting device |
| CN112164534A (en) * | 2020-09-28 | 2021-01-01 | 重庆泰山电缆有限公司 | Automatic wire stripping device and method for wires |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110817 |