CN102825669A - HCT slicer precision adjusting method - Google Patents
HCT slicer precision adjusting method Download PDFInfo
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- CN102825669A CN102825669A CN201210296318XA CN201210296318A CN102825669A CN 102825669 A CN102825669 A CN 102825669A CN 201210296318X A CN201210296318X A CN 201210296318XA CN 201210296318 A CN201210296318 A CN 201210296318A CN 102825669 A CN102825669 A CN 102825669A
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Abstract
The invention discloses an HCT slicer precision adjusting method, and relates to the technical field of slicing of solar silicon wafers. The HCT slicer precision adjusting method includes reversing the movement direction of a wire net when the proportion of rejects with uneven thicknesses and notches is higher than 2.5%. Particularly, the process of reversing the movement direction of the wire net includes adjusting the original wire inlet end as a wire outlet end and adjusting the original wire outlet end as a wire inlet end, so that affection to thicknesses of the wafers due to steel wire abrasion is consistent with a compensation value of the guide pulley groove pitch. The HCT slicer precision adjusting method has the advantages that since wire inlet and wire outlet directions of steel wires are adjusted by changing the original wire inlet end into the wire outlet end and changing the original wire outlet end into the wire inlet end, the steel wires with high sand carrying capacity and optimal sand carrying quantity are placed on a front bearing box (with slightly poor precision), and the abraded steel wires are placed on a back bearing box (with high precision), accumulative effects caused by various adverse factors are balanced, the slicing yield is increased, the proportion of reject silicon wafers with the uneven thicknesses and the notches can be reduced effectively, and the reject rate is decreased by 0.3-0.7% integrally.
Description
Technical field
The present invention relates to solar silicon wafers cutting technique field; Especially improve the HCT slicer because guide wheel both sides (fore bearing case side and after the bearing box side) equipment precision difference and the problem that the different accumulation factor of steel wire wearing and tearing causes bad silicon chip ratio to rise relate to the method that the section yields improves.
Background technology
In the silicon chip manufacture process, the lifting of section yields is the key factor that promotes self-core competitiveness.The bearing housing of HCT scroll saw is divided into the fore bearing case: Front Bearing Box (free bearing box) and after the bearing box: Rear Bearing Box (fix bearing box).The HCT slicer needs in changing the guide wheel process the dismounting of fore bearing case at every turn, and after the bearing box is fixed.In slicing processes, mortar is participated in cutting under the gauze of high-speed motion drives, these effect wearing and tearing down of steel wire simultaneously in mortar, and at the gauze near leading-out terminal (being fore bearing case side), the steel wire wearing and tearing are for maximum, and its band sand ability is minimum minimum with band sand amount.
For long equipment service time, the precision of fore bearing case is difficult to guarantee, and the after the bearing box precision changes not quite.Become big near the poor slightly front bearing box side guide wheel circular runout of precision, add steel wire wearing and tearing (fore bearing case side steel wire band sand ability is minimum minimum with band sand amount), each item combined factors is got up and will be caused the rising of bad silicon chip ratios such as ultra thick, ultra-thin, TTV.
Summary of the invention
The purpose of this invention is to provide a kind of HCT slicer precision regulation method; Be used to improve the HCT slicer because guide wheel both sides (fore bearing case side and after the bearing box side) equipment precision difference causes the problem of bad silicon chip ratio rising with the different accumulation factor of steel wire wearing and tearing, thereby improve the slicer yields.
The objective of the invention is to realize through following scheme:
Through change HCT slicer local devices structure, and then the installation direction of adjustment gauze inlet wire and leading-out terminal direction and guide wheel, improve unusually because of what composite factors such as HCT slicer bearing housing precision difference caused the most at last.
Specifically:
HCT slicer precision regulation method is characterized in that: when the thickness sheet, when the stria defective products surpasses 2.5%, and then counter-rotating gauze travel direction.Thereby steel wire wearing and tearing are consistent to the thick influence of sheet and the offset of guided wheel slot distance.
Further:
As required, also can work as thickness sheet, stria defective products when surpassing 3.0%, and then counter-rotating gauze travel direction.
As required, also can work as the thickness sheet, when the stria defective products reaches 3.5%, and then counter-rotating gauze travel direction.
Described counter-rotating gauze travel direction is meant: original end of incoming cables is adjusted into leading-out terminal, and leading-out terminal originally is adjusted into the end of incoming cables.
Said original end of incoming cables is adjusted into leading-out terminal, leading-out terminal originally is adjusted into the end of incoming cables, through adorning realization with guide wheel is counter.
The present invention has following beneficial effect: the inlet wire and the outlet direction of adjustment steel wire, original end of incoming cables is adjusted into leading-out terminal, and leading-out terminal originally is adjusted into the end of incoming cables.To be with the sand ability strong, band sand amount best steel wire is placed on fore bearing case side (precision is poor slightly), and the steel wire of experience wear is placed on after the bearing box side (precision is better), the cumulative effect that the various undesirable elements of balance bring, and then promote the section yields.Can reduce silicon chip thickness sheet ratio, stria ratio defective products effectively, the defective products rate 0.3-0.7% that comprehensively descends.
The specific embodiment
In order to make those skilled in the art person understand the present invention program better, and make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, below in conjunction with embodiment the present invention done further detailed explanation.
Embodiment:
Way: the inlet wire and the outlet direction of adjustment steel wire, original end of incoming cables is adjusted into leading-out terminal, leading-out terminal originally is adjusted into the end of incoming cables.Mainly be that band sand ability is strong, band sand amount best steel wire is placed on fore bearing case side (the poor slightly Default Value of precision), and the steel wire of experience wear is placed on after the bearing box side (the better Default Value of precision).
Adorn guide wheel is counter, before the improvement: pulley A is the end of incoming cables pulley, and pulley B is the leading-out terminal pulley.
Improve the back: pulley B is the end of incoming cables pulley, and pulley A is the leading-out terminal pulley.
The above; Be merely the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (5)
1.HCT the slicer precision regulation method is characterized in that: when the thickness sheet, when the stria defective products surpasses 2.5%, and then counter-rotating gauze travel direction.
2. HCT slicer precision regulation method according to claim 1 is characterized in that: when the thickness sheet, when the stria defective products surpasses 3.0%, and then counter-rotating gauze travel direction.
3. HCT slicer precision regulation method according to claim 1 is characterized in that: when the thickness sheet, when the stria defective products reaches 3.5%, and then counter-rotating gauze travel direction.
4. according to claim 1 or 2 or 3 described HCT slicer precision regulation methods, it is characterized in that: described counter-rotating gauze travel direction is meant: original end of incoming cables is adjusted into leading-out terminal, and leading-out terminal originally is adjusted into the end of incoming cables.
5. HCT slicer precision regulation method according to claim 4 is characterized in that: said original end of incoming cables is adjusted into leading-out terminal, leading-out terminal originally is adjusted into the end of incoming cables, through adorning realization with guide wheel is counter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210296318XA CN102825669A (en) | 2012-08-20 | 2012-08-20 | HCT slicer precision adjusting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210296318XA CN102825669A (en) | 2012-08-20 | 2012-08-20 | HCT slicer precision adjusting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102825669A true CN102825669A (en) | 2012-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210296318XA Pending CN102825669A (en) | 2012-08-20 | 2012-08-20 | HCT slicer precision adjusting method |
Country Status (1)
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| CN (1) | CN102825669A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810643A (en) * | 1995-06-22 | 1998-09-22 | Shin-Etsu Handotai Co., Ltd. | Wire saw cutting method synchronizing workpiece feed speed with wire speed |
| CN101444934A (en) * | 2008-12-31 | 2009-06-03 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
| CN101628452A (en) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | Method for cutting silicon chips |
| CN102267197A (en) * | 2011-08-25 | 2011-12-07 | 湖州金科光伏科技有限公司 | Method for cutting silicon materials |
-
2012
- 2012-08-20 CN CN201210296318XA patent/CN102825669A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810643A (en) * | 1995-06-22 | 1998-09-22 | Shin-Etsu Handotai Co., Ltd. | Wire saw cutting method synchronizing workpiece feed speed with wire speed |
| CN101444934A (en) * | 2008-12-31 | 2009-06-03 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
| CN101628452A (en) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | Method for cutting silicon chips |
| CN102267197A (en) * | 2011-08-25 | 2011-12-07 | 湖州金科光伏科技有限公司 | Method for cutting silicon materials |
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Application publication date: 20121219 |