CN102267197A - Method for cutting silicon materials - Google Patents
Method for cutting silicon materials Download PDFInfo
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- CN102267197A CN102267197A CN2011102458078A CN201110245807A CN102267197A CN 102267197 A CN102267197 A CN 102267197A CN 2011102458078 A CN2011102458078 A CN 2011102458078A CN 201110245807 A CN201110245807 A CN 201110245807A CN 102267197 A CN102267197 A CN 102267197A
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- wire saw
- cutting
- guide wheel
- wire
- silico briquette
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Abstract
The invention discloses a method for cutting silicon materials, and the method is characterized in that when a silicon block is contacted with a linear saw, the operation for cutting the silicon block starts, firstly, after the linear saw carries out forward cutting on the silicon block for a certain distance, a guide roller drives the linear saw to carry out reversing, so that the linear saw carries out backward cutting on the silicon block along the opposite direction; and after the linear saw carries out backward cutting on the silicon block for a certain distance, the guide roller drives the linear saw to carry out reversing again, then the linear saw continues to carry out forward cutting on the silicon block. By using the method disclosed by the invention, the abrasion caused by cutting a steel wire each time is less, and the steel wire can be cut a plurality of times, thereby greatly reducing the application amount of the steel wire, and reducing the production cost.
Description
Technical field
The present invention relates to a kind of silicon crystal processing method, relate in particular to a kind of silicon material cutting method.
Background technology
In recent years since, solar battery sheet production is subjected to the extensive welcome of various circles of society as the emerging industry of environmental protection new forms of energy, and the photovoltaic industry has obtained develop rapidly.
Silicon cell is used widely as the solar battery sheet that a kind of technology is ripe relatively, quality is more stable relatively, and the quality of cutting crystal technique as the core link of silion cell production, and quality, the cost of silicon cell all played considerable influence.The relatively ripe at present crystal technique of cutting is to adopt superfine steel wire high-speed motion, drives mortar friction silico briquette, to reach the purpose of cutting.But in this technology, steel wire is as a kind of running stores, and loss is exceedingly fast, and often can only use once, and cost is very high.
Also some cuts brilliant technology on the market, steel wire is used twice, but to use φ 0.12mm steel wire cutting twice 8 〞 polysilicon chips to be example in the polycrystalline cutting machine of selling on the market at present, steel wire is just having bigger wearing and tearing in the cutting for the first time, the generation rate of a series of problems such as cut interrupt line rate height for the second time, the silicon chip stria is many, TTV is big improves greatly, causes to cut that yield rate is low, cutting effect is poor the second time.
Summary of the invention
The present invention provides a kind of silicon material cutting method that reduces cutting cost on the basis that does not reduce cutting quality and yield rate substantially greatly for solving the prior art problem.
Technical scheme of the present invention is: a kind of silicon material cutting method may further comprise the steps:
A) silico briquette is fixed on the work piece platform of slicer, the tension force of wire saw with 19.5 ~ 20.5N is around on the guide wheel of slicer;
B) start slicer, work piece platform moves the speed of silico briquette with 350 ~ 385mm/min to wire saw, start guide wheel simultaneously, wire saw under the driving of guide wheel with the speed of 700 ~ 740m/min high-speed motion forward;
C) the wire saw setting in motion time, the nozzle by slicer sprays mortar with the flow of 178 ~ 182L/Min to wire saw;
D) when silico briquette contacts with wire saw, the cutting beginning, after at first wire saw cut certain distance forward, guide wheel drove the wire saw commutation, and wire saw is cutting backward in opposite direction; After wire saw cut certain distance backward, guide wheel drove wire saw and commutates once more, and wire saw continues cutting forward;
E) wire saw set by step d cut repeatedly, when silico briquette was completely severed, cutting finished.
In cutting process, reduce as the steel wire of the wire saw tension force on guide wheel around the home, reduced the outage of wire saw in the cutting process effectively; Reduced the feed speed as the silico briquette of workpiece simultaneously, the reduction silico briquette to the pressure of steel wire, reduces the deformation of steel wire in cutting process, makes not reduce cutting effect in the assurance cutting process by the neat of cutting seam; Reduce the movement velocity of steel wire, reduced the stress that steel wire bears in the cutting process, improved the band slurry ability of steel wire, strengthened the flow of mortar simultaneously, reduced the wear extent of steel wire in the cutting process.Through the improvement of above technology, cutting back wear extent is less for the first time in process for steel wire, and when cutting through the second time, parameters such as outage, silicon chip stria and TTV all remain on reduced levels.
As preferably, in the steps d, after at first wire saw cut 100 ~ 120m forward, guide wheel drove the wire saw commutation, and wire saw cuts 20 ~ 25m in opposite direction backward, and guide wheel drives wire saw and commutates once more, and wire saw continues to cut forward 100 ~ 120m.Only use a part of steel wire repeatedly to cut, the steel wire after further reducing to wear and tear improves the quality of product to the influence of cutting effect, reduces the outage of steel wire simultaneously.
As preferably, described mortar comprises cutting liquid and cutting sand, and described cutting liquid comprises 40 ~ 60% new liquid, and all the other are recovery liquid; Described cutting sand comprises 70 ~ 90% fresh sands, and all the other are for reclaiming sand.New liquid i.e. the cutting liquid through using not as yet, reclaims liquid and promptly used once cutting liquid, fresh sand promptly still to show through the cutting sand that uses, and reclaims sand and promptly used once cutting sand; The mortar of nozzle ejection only has sub-fraction to be attached to be used for cutting on the steel wire and is depleted in the cutting process, and the impurity such as silicon material debris that produce in the cutting process are sneaked into mortar, though therefore used a mortar effective ingredient still more, but purity is lower, inferior quality, not directly recycling, reclaim the mortar of nozzle ejection in the cutting process,, obtain and reclaim liquid and reclaim sand by Separation of Solid and Liquid, and mix with new liquid and fresh sand, reduce impurity content, improve the purity and the quality of mortar, guarantee result of use, reduce simultaneously the cost of mortar greatly, reduce disposal of pollutants.
As preferably, described wire saw is horizontally disposed with, and described silico briquette is arranged at the top of described wire saw, and described work piece platform is arranged at the top of described silico briquette.
As preferably, described guide pulley surface is provided with many wire casings, and adjacent wire casing is parallel to each other.
As preferably, the width of described wire casing is 0.3 ~ 0.4mm.
In sum, the present invention has the following advantages:
1, it is less to cut the wearing and tearing of steel wire each time, makes steel wire repeatedly to cut, and the use amount of the steel wire of Jiang Diing has reduced production cost greatly;
2, adopt the mortar that reclaims to mix use, on the basis that does not reduce product quality, greatly reduce the consumption of mortar, further reduced production cost with new mortar;
3, since in the cutting process wearing and tearing of steel wire less, therefore through parameters such as product silicon chip stria after the cutting repeatedly and TTV all with differed less in the past, product quality does not have reduction.
The specific embodiment
The invention will be further described with embodiment below.
Embodiment one:
A kind of silicon material cutting method may further comprise the steps:
A) silico briquette is fixed on the work piece platform of slicer, the tension force of wire saw with 20N is around on the guide wheel of slicer;
B) start slicer, work piece platform moves the speed of silico briquette with 380mm/min to wire saw, start guide wheel simultaneously, wire saw under the driving of guide wheel with the speed of 730m/min high-speed motion forward;
C) the wire saw setting in motion time, the nozzle by slicer sprays mortar with the flow of 180L/Min to wire saw, and mortar comprises that the new liquid of 50 ﹪+50 ﹪ reclaim liquid+80 ﹪ fresh sands+20% and reclaim sand;
D) when silico briquette contacts with wire saw, the cutting beginning, after at first wire saw cut 100m forward, guide wheel drove the wire saw commutation, and wire saw is cutting backward in opposite direction; After wire saw cut 20m backward, guide wheel drove wire saw and commutates once more, and wire saw continues to cut forward 100m;
E) wire saw set by step d cut repeatedly, when silico briquette was completely severed, cutting finished.
Wherein, in the steps d, wire saw is considered as travelling forward with the either direction motion, and its rightabout is considered as moving backward.
Through test, before the tension adjustment of wire saw, in the cutting process, the outage of wire saw is 3.61%, and after the tension adjustment, the outage of wire saw is 2.78%; Before the flow of mortar is adjusted, after each cutting, wear extent average out to 8 UM of wire saw, after flow is adjusted, the wear extent average out to 6UM of wire saw; After cutting is finished, finished product is measured, before technology is adjusted, every cutter can cut 2260, by the existing market valency, the market price is 54251 yuan, and the application's technology, every cutter can cut 2253, the market price is 54061 yuan, but before technology is adjusted, every cutter need consume wire saw 330KM, and cost is 3531 yuan, and the application's technology, every cutter consumes wire saw 220KM, 2354 yuan of costs, in sum, through the technology after the application's improvement, every cutter totle drilling cost has reduced by 987 yuan, product differ parameter:
| Catalogue | The stria rate | TTV leads |
| The application's technology | 0.91% | 0.53% |
| Before technology is adjusted | 0.86% | 0.46% |
Can get thus, the quality of product and technology are basic identical before adjusting.
Embodiment two:
A) silico briquette is fixed on the work piece platform of slicer, the tension force of wire saw with 19.5N is around on the guide wheel of slicer;
B) start slicer, work piece platform moves the speed of silico briquette with 350mm/min to wire saw, start guide wheel simultaneously, wire saw under the driving of guide wheel with the speed of 700m/min high-speed motion forward;
C) the wire saw setting in motion time, the nozzle by slicer sprays mortar with the flow of 178L/Min to wire saw, and mortar comprises that 40% new liquid+60% reclaims liquid+70 ﹪ fresh sands+30% and reclaims sand;
D) when silico briquette contacts with wire saw, the cutting beginning, after at first wire saw cut 110m forward, guide wheel drove the wire saw commutation, and wire saw is cutting backward in opposite direction; After wire saw cut 23m backward, guide wheel drove wire saw and commutates once more, and wire saw continues to cut forward 110m;
E) wire saw set by step d cut repeatedly, when silico briquette was completely severed, cutting finished.
Embodiment three:
A) silico briquette is fixed on the work piece platform of slicer, the tension force of wire saw with 20.5N is around on the guide wheel of slicer;
B) start slicer, work piece platform moves the speed of silico briquette with 385mm/min to wire saw, start guide wheel simultaneously, wire saw under the driving of guide wheel with the speed of 740m/min high-speed motion forward;
C) the wire saw setting in motion time, the nozzle by slicer sprays mortar with the flow of 182L/Min to wire saw, and mortar comprises that 60% new liquid+40% reclaims liquid+90 ﹪ fresh sands+10% and reclaims sand;
D) when silico briquette contacts with wire saw, the cutting beginning, after at first wire saw cut 120m forward, guide wheel drove the wire saw commutation, and wire saw is cutting backward in opposite direction; After wire saw cut 25m backward, guide wheel drove wire saw and commutates once more, and wire saw continues to cut forward 120m;
Wire saw d set by step cuts repeatedly, and when silico briquette was completely severed, cutting finished.
Claims (6)
1. silicon material cutting method is characterized in that: may further comprise the steps:
A) silico briquette is fixed on the work piece platform of slicer, the tension force of wire saw with 19.5 ~ 20.5N is around on the guide wheel of slicer;
B) start slicer, work piece platform moves the speed of silico briquette with 350 ~ 385mm/min to wire saw, start guide wheel simultaneously, wire saw under the driving of guide wheel with the speed of 700 ~ 740m/min high-speed motion forward;
C) the wire saw setting in motion time, the nozzle by slicer sprays mortar with the flow of 178 ~ 182L/Min to wire saw;
D) when silico briquette contacts with wire saw, the cutting beginning, after at first wire saw cut certain distance forward, guide wheel drove the wire saw commutation, and wire saw is cutting backward in opposite direction; After wire saw cut certain distance backward, guide wheel drove wire saw and commutates once more, and wire saw continues cutting forward;
E) wire saw set by step d cut repeatedly, when silico briquette was completely severed, cutting finished.
2. according to the described silicon material of claim 1 cutting method, it is characterized in that: in the steps d, after at first wire saw cuts 100 ~ 120m forward, guide wheel drives the wire saw commutation, wire saw cuts 20 ~ 25m in opposite direction backward, guide wheel drives wire saw and commutates once more, and wire saw continues to cut forward 100 ~ 120m.
3. according to the described silicon material of claim 1 cutting method, it is characterized in that: described mortar comprises cutting liquid and cutting sand, and described cutting liquid comprises 40 ~ 60% new liquid, and all the other are for reclaiming liquid; Described cutting sand comprises 70 ~ 90% fresh sands, and all the other are for reclaiming sand.
4. according to the described silicon material of claim 1 cutting method, it is characterized in that: described wire saw is horizontally disposed with, and described silico briquette is arranged at the top of described wire saw, and described work piece platform is arranged at the top of described silico briquette.
5. according to the described silicon material of claim 4 cutting method, it is characterized in that: described guide pulley surface is provided with many wire casings, and adjacent wire casing is parallel to each other.
6. according to the described silicon material of claim 5 cutting method, it is characterized in that: the width of described wire casing is 0.3 ~ 0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102458078A CN102267197A (en) | 2011-08-25 | 2011-08-25 | Method for cutting silicon materials |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102458078A CN102267197A (en) | 2011-08-25 | 2011-08-25 | Method for cutting silicon materials |
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| CN102267197A true CN102267197A (en) | 2011-12-07 |
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| CN2011102458078A Pending CN102267197A (en) | 2011-08-25 | 2011-08-25 | Method for cutting silicon materials |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825669A (en) * | 2012-08-20 | 2012-12-19 | 安阳市凤凰光伏科技有限公司 | HCT slicer precision adjusting method |
| CN103288382A (en) * | 2013-05-23 | 2013-09-11 | 无锡荣能半导体材料有限公司 | Mixed mortar and preparation method thereof |
| CN103722624A (en) * | 2013-12-19 | 2014-04-16 | 上海汉虹精密机械有限公司 | Diamond wire cutting process for squaring machine |
| CN106079124A (en) * | 2016-06-30 | 2016-11-09 | 苏州恒嘉晶体材料有限公司 | A kind of wire cutting method |
| CN107199643A (en) * | 2017-06-28 | 2017-09-26 | 苏州阿特斯阳光电力科技有限公司 | A kind of method of diamond wire cutting silicon rod |
| CN107214869A (en) * | 2017-07-20 | 2017-09-29 | 阜宁协鑫光伏科技有限公司 | Method for cutting silicon chips |
| CN107379294A (en) * | 2017-07-20 | 2017-11-24 | 阜宁协鑫光伏科技有限公司 | The method of diamond wire recycling cutting silicon chip |
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| CN2638900Y (en) * | 2003-09-08 | 2004-09-08 | 徐成金 | Wire-moving device |
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
| CN101444934A (en) * | 2008-12-31 | 2009-06-03 | 嘉兴嘉晶电子有限公司 | Multi-wire sawing reciprocating cutting method and device thereof |
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2011
- 2011-08-25 CN CN2011102458078A patent/CN102267197A/en active Pending
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| JPH10166353A (en) * | 1996-12-11 | 1998-06-23 | Nippei Toyama Corp | Equipment and method for reducing tensile force in wire saw |
| JP2000351112A (en) * | 1999-06-11 | 2000-12-19 | Ishikawajima Hanyoki Service Co Ltd | Method and apparatus for controlling preparation/ regeneration of cutting liquid for wire saw |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825669A (en) * | 2012-08-20 | 2012-12-19 | 安阳市凤凰光伏科技有限公司 | HCT slicer precision adjusting method |
| CN103288382A (en) * | 2013-05-23 | 2013-09-11 | 无锡荣能半导体材料有限公司 | Mixed mortar and preparation method thereof |
| CN103722624A (en) * | 2013-12-19 | 2014-04-16 | 上海汉虹精密机械有限公司 | Diamond wire cutting process for squaring machine |
| CN106079124A (en) * | 2016-06-30 | 2016-11-09 | 苏州恒嘉晶体材料有限公司 | A kind of wire cutting method |
| CN107199643A (en) * | 2017-06-28 | 2017-09-26 | 苏州阿特斯阳光电力科技有限公司 | A kind of method of diamond wire cutting silicon rod |
| CN107199643B (en) * | 2017-06-28 | 2019-10-01 | 苏州阿特斯阳光电力科技有限公司 | A kind of method of diamond wire cutting silicon rod |
| CN107214869A (en) * | 2017-07-20 | 2017-09-29 | 阜宁协鑫光伏科技有限公司 | Method for cutting silicon chips |
| CN107379294A (en) * | 2017-07-20 | 2017-11-24 | 阜宁协鑫光伏科技有限公司 | The method of diamond wire recycling cutting silicon chip |
| CN107214869B (en) * | 2017-07-20 | 2019-11-29 | 阜宁协鑫光伏科技有限公司 | Method for cutting silicon chips |
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Address after: 313000 Cao village, eight Li Town, Wuxing District, Zhejiang, Huzhou Applicant after: Huzhou Jinke Technology Co., Ltd. Address before: 313000 No. 10 standard factory building, eight mile town, Huzhou District, Wuxing District, Zhejiang, China Applicant before: Huzhou Jinke PV Technology Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: HUZHOU JINKE PHOTOVOLTAIC TECHNOLOGY CO., LTD. TO: HUZHOU JINKE TECHNOLOGY CO., LTD. |
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Application publication date: 20111207 |