CN102275232A - Method for cutting silicon block - Google Patents
Method for cutting silicon block Download PDFInfo
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- CN102275232A CN102275232A CN2011102458044A CN201110245804A CN102275232A CN 102275232 A CN102275232 A CN 102275232A CN 2011102458044 A CN2011102458044 A CN 2011102458044A CN 201110245804 A CN201110245804 A CN 201110245804A CN 102275232 A CN102275232 A CN 102275232A
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- cutting
- mortar
- silico briquette
- saw
- wire saw
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Abstract
The invention relates to a method for cutting a silicon block. The method comprises the following steps of: recovering mortar which is cut; and mixing the recovered mortar with new mortar in the ratio of 1/1.7 to 1/2 to obtain mixed mortar. The influence of impurities in the mixed mortar on silicon wafers is reduced to the minimum extent by adjusting the density, the flow and the viscosity of the mixed mortar, the mortar carrying capability of a linear saw is maintained, the influence on the cutting quality of the silicon wafers is extremely low, the conventional cutting yield is maintained, and the cutting cost of the silicon block is greatly lowered.
Description
Technical field
The present invention relates to a kind of silicon crystal processing method, relate in particular to a kind of silico briquette cutting method.
Background technology
In recent years since, solar battery sheet production is subjected to the extensive welcome of various circles of society as the emerging industry of environmental protection new forms of energy, and the photovoltaic industry has obtained develop rapidly.
Silicon cell is used widely as the solar battery sheet that a kind of technology is ripe relatively, quality is more stable relatively, and the quality of cutting crystal technique as the core link of silion cell production, and quality, the cost of silicon cell all played considerable influence.The relatively ripe at present crystal technique of cutting is to adopt superfine steel wire high-speed motion, drives mortar friction silico briquette, to reach the purpose of cutting.
The mortar consumption that uses in this technology is very big, and in cutting process, the experiment proved that, 3% mortar actual participation cutting is only arranged, and remaining 97% all runs off in vain, and waste is serious.Also there is the mortar after small part technology will be used to carry out recycling in the industry, but has following two kinds of bad phenomenon:
1, owing to the influence of impurity in the mortar, silicon chip surface easily is scratched during cutting, causes the silicon chip surface out-of-flatness, influence cutting quality;
2, the band mortar ability of the impurity effect wire saw in the mortar, and during wire saw band mortar quantity not sufficient, very easily damage silicon chip, also cause broken string simultaneously easily.
Summary of the invention
The present invention is for solving the prior art problem, and a kind of quality better, safe and reliable silico briquette cutting method of cutting is provided.
Technical scheme of the present invention is: a kind of silico briquette cutting method may further comprise the steps:
A) silico briquette is fixed on the work piece platform of cutting machine, the lines saw is wound on the guide wheel of cutting machine;
B) start cutting machine, it is close to the lines saw that work piece platform drives silico briquette, and the guide wheel high speed rotating drives the lines saw and walks about at a high speed simultaneously;
C) at silico briquette during near wire saw, the nozzle of cutting machine sprays mortar to wire saw, and the flow of sprinkling is 173 ~ 176L/Min, and the density of mortar is 1.6455 ~ 1.6470KG/L;
D) when silico briquette contacts with wire saw, cutting begins, and starts the cooling system of cutting machine simultaneously, and the mortar in wire saw and the cutting is cooled off, and makes mortar remain on 20 ~ 24 ℃;
E) mortar after recovery participates in cutting will reclaim mortar and mix mutually with 1/1.7 ~ 1/2 ratio with new mortar, make mixed mortar, mixed mortar will be delivered to the nozzle of cutting machine;
F) when wire saw cut off silico briquette fully, cutting was finished.
During cutting, wire saw is walked about at a high speed, and carries the mortar of nozzles spray, rubs by mortar and silico briquette, reaches the cutting purpose; In the whole cutting process, what the quality of silicon chip and yield rate were played a decisive role is the viscosity of cutting liquid, the grain type and the granularity of particulate in the mortar, the viscosity of mortar, flow and density, the speed of wire saw, tension force, the feed speed of workpiece etc., among the application, the speed that keeps wire saw, tension force, the feed speed of workpiece is constant, reclaims the mortar after using, add new mortar, make mixed mortar, owing to have the impurity such as silico briquette powder that produce in the cutting process in the mortar after using, mixed mortar still remains with these impurity, for reducing of the influence of these impurity to cutting, by the density of diluent adjustment mixed mortar, by regulating nozzle to adjust the mortar flow, the temperature when cutting by regulating is with the viscosity of adjustment mortar, adjusted mixed mortar is reduced to minimum to the influence of silicon chip impurity in the mortar, kept the band slurry ability of wire saw simultaneously, minimum to the cutting quality influence of silicon chip, keep original cutting yield rate.
As preferably, in the steps d,, cool off to some extent according to the degree of depth difference of wire saw cutting silico briquette, when depth of cut increased to 7% by 0%, the temperature of cutting rose to 24 ℃ by 23 ℃, and be 50 ~ 60min clipping time; When depth of cut increased to 80% by 7%, the temperature of cutting was reduced to 23 ℃ by 24 ℃, and be 300 ~ 350min clipping time; When depth of cut increased to 100% by 80%, the temperature of cutting was reduced to 20 ℃ by 23 ℃, and be 50 ~ 100min clipping time.Under the constant prerequisite of other conditions, temperature is low more, and the viscosity of mortar is high more, otherwise then viscosity is low more; In the cutting process, when wire saw was in the silico briquette edge, the resistance that wire saw is subjected to silico briquette was big more, and mortar is difficult for being retained on the wire saw, and for improving the band slurry ability of wire saw, the temperature that must reduce mortar is to improve the viscosity of mortar.
As preferably, described guide pulley surface is provided with many wire casings, and adjacent wire casing is parallel to each other.
As preferably, the width of described wire casing is 0.3 ~ 0.4mm.
In sum, the present invention has the following advantages:
1, the online recycling of used mortar greatly reduces the technology cost on the basis that does not reduce the cutting quality;
2, by adjusting density, flow and the viscosity of mixed mortar, wire saw keeps original band slurry ability, makes in the silico briquette cutting process, is not subjected to the influence of impurity in the mortar substantially.
The specific embodiment
The invention will be further described with embodiment below.
Embodiment one:
A kind of silico briquette cutting method is characterized in that: may further comprise the steps:
A) silico briquette is fixed on the work piece platform of cutting machine, the lines saw is wound on the guide wheel of cutting machine;
B) start cutting machine, it is close to the lines saw that work piece platform drives silico briquette, and the guide wheel high speed rotating drives the lines saw and walks about at a high speed simultaneously;
C) at silico briquette during near wire saw, the nozzle of cutting machine sprays mortar to wire saw, and the flow of sprinkling is 175L/Min, and the density of mortar is 1.646KG/L;
D) when silico briquette contacts with wire saw, cutting begins, and starts the cooling system of cutting machine simultaneously, mortar in wire saw and the cutting is cooled off, when depth of cut increased to 80% by 7%, the temperature of cutting was reduced to 23 ℃ by 24 ℃, and be 330min clipping time; When depth of cut increased to 100% by 80%, the temperature of cutting was reduced to 20 ℃ by 23 ℃, and be 90min clipping time;
E) mortar after recovery participates in cutting will reclaim mortar and mix mutually with new mortar, and every 100L reclaims the new mortar of mortar adding 180L, makes mixed mortar, mixed mortar is delivered to the nozzle of cutting machine;
F) when wire saw cut off silico briquette fully, cutting was finished.
Wherein, guide pulley surface is provided with many wire casings that 0.348mm is wide, and adjacent wire casing is parallel to each other.
Through actual test, adopt brand-new mortar to finish whole technologies after, the stria rate of silico briquette cutting is 1.76%, the cutting yield rate is 92.35%, every cutter output sheet number is 2282; After adopting the recovery mortar to finish whole technologies, the stria rate of silico briquette cutting is 1.92%, and the cutting yield rate is 91.75%, and every cutter output sheet number is 2267, stria rate and yield rate obviously do not descend, every cutter output sheet number only reduces 15, and by the existing market valency, total sales volume only reduces 360 yuan, but in technical process, reduce the mortar consumption, promptly reduce cost 2714 yuan, reality is each cutter only, and totle drilling cost reduces by 2354 yuan.
Embodiment two:
A kind of silico briquette cutting method is characterized in that: may further comprise the steps:
A) silico briquette is fixed on the work piece platform of cutting machine, the lines saw is wound on the guide wheel of cutting machine;
B) start cutting machine, it is close to the lines saw that work piece platform drives silico briquette, and the guide wheel high speed rotating drives the lines saw and walks about at a high speed simultaneously;
C) at silico briquette during near wire saw, the nozzle of cutting machine sprays mortar to wire saw, and the flow of sprinkling is 173L/Min, and the density of mortar is 1.6455KG/L;
D) when silico briquette contacts with wire saw, cutting begins, and starts the cooling system of cutting machine simultaneously, mortar in wire saw and the cutting is cooled off, when depth of cut increased to 80% by 7%, the temperature of cutting was reduced to 23 ℃ by 24 ℃, and be 300min clipping time; When depth of cut increased to 100% by 80%, the temperature of cutting was reduced to 20 ℃ by 23 ℃, and be 50min clipping time;
E) mortar after recovery participates in cutting will reclaim mortar and mix mutually with new mortar, and every 100L reclaims the new mortar of mortar adding 170L, makes mixed mortar, mixed mortar is delivered to the nozzle of cutting machine;
F) when wire saw cut off silico briquette fully, cutting was finished.
Wherein, guide pulley surface is provided with many wire casings that 0.3mm is wide, and adjacent wire casing is parallel to each other.
Embodiment three:
A kind of silico briquette cutting method is characterized in that: may further comprise the steps:
A) silico briquette is fixed on the work piece platform of cutting machine, the lines saw is wound on the guide wheel of cutting machine;
B) start cutting machine, it is close to the lines saw that work piece platform drives silico briquette, and the guide wheel high speed rotating drives the lines saw and walks about at a high speed simultaneously;
C) at silico briquette during near wire saw, the nozzle of cutting machine sprays mortar to wire saw, and the flow of sprinkling is 176L/Min, and the density of mortar is 1.647KG/L;
D) when silico briquette contacts with wire saw, cutting begins, and starts the cooling system of cutting machine simultaneously, mortar in wire saw and the cutting is cooled off, when depth of cut increased to 80% by 7%, the temperature of cutting was reduced to 23 ℃ by 24 ℃, and be 350min clipping time; When depth of cut increased to 100% by 80%, the temperature of cutting was reduced to 20 ℃ by 23 ℃, and be 100min clipping time;
E) mortar after recovery participates in cutting will reclaim mortar and mix mutually with new mortar, and every 100L reclaims the new mortar of mortar adding 200L, makes mixed mortar, mixed mortar is delivered to the nozzle of cutting machine;
F) when wire saw cut off silico briquette fully, cutting was finished.
Wherein, guide pulley surface is provided with many wire casings that 0.4mm is wide, and adjacent wire casing is parallel to each other.
Claims (4)
1. silico briquette cutting method is characterized in that: may further comprise the steps:
A) silico briquette is fixed on the work piece platform of cutting machine, the lines saw is wound on the guide wheel of cutting machine;
B) start cutting machine, it is close to the lines saw that work piece platform drives silico briquette, and the guide wheel high speed rotating drives the lines saw and walks about at a high speed simultaneously;
C) at silico briquette during near wire saw, the nozzle of cutting machine sprays mortar to wire saw, and the flow of sprinkling is 173 ~ 176L/Min, and the density of mortar is 1.6455 ~ 1.6470KG/L;
D) when silico briquette contacts with wire saw, cutting begins, and starts the cooling system of cutting machine simultaneously, and the mortar in wire saw and the cutting is cooled off, and makes mortar remain on 20 ~ 24 ℃;
E) mortar after recovery participates in cutting will reclaim mortar and mix mutually with 1/1.7 ~ 1/2 ratio with new mortar, make mixed mortar, mixed mortar will be delivered to the nozzle of cutting machine;
F) when wire saw cut off silico briquette fully, cutting was finished.
2. the described silico briquette cutting method of claim 1 is characterized in that: in the steps d, according to the degree of depth difference of wire saw cutting silico briquette, cool off to some extent, when depth of cut increased to 7% by 0%, the temperature of cutting rose to 24 ℃ by 23 ℃, and be 50 ~ 60min clipping time; When depth of cut increased to 80% by 7%, the temperature of cutting was reduced to 23 ℃ by 24 ℃, and be 300 ~ 350min clipping time; When depth of cut increased to 100% by 80%, the temperature of cutting was reduced to 20 ℃ by 23 ℃, and be 50 ~ 100min clipping time.
3. the described silico briquette cutting method of claim 1, it is characterized in that: described guide pulley surface is provided with many wire casings, and adjacent wire casing is parallel to each other.
4. according to the described silicon material of claim 3 cutting method, it is characterized in that: the width of described wire casing is 0.3 ~ 0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102458044A CN102275232A (en) | 2011-08-25 | 2011-08-25 | Method for cutting silicon block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102458044A CN102275232A (en) | 2011-08-25 | 2011-08-25 | Method for cutting silicon block |
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| CN102275232A true CN102275232A (en) | 2011-12-14 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09254142A (en) * | 1996-03-26 | 1997-09-30 | Shin Etsu Handotai Co Ltd | Wire saw and cylindrical work-cutting method |
| EP1287958A1 (en) * | 1996-03-26 | 2003-03-05 | Shin-Etsu Handotai Co., Ltd | Wire saw and method of slicing a cylindrical workpiece |
| CN101474830A (en) * | 2008-12-11 | 2009-07-08 | 江苏海尚新能源材料有限公司 | Technological process for slicing solar energy grade six-cun monocrystalline silicon wafer |
| CN101855045A (en) * | 2007-12-19 | 2010-10-06 | 信越半导体股份有限公司 | Method for cutting work by wire saw and wire saw |
| US20100284885A1 (en) * | 2009-05-11 | 2010-11-11 | National Taiwan University | Recovery Of Silicon And Silicon Carbide Powder From Kerf Loss Slurry Using Particle Phase-Transfer Method |
| WO2010137228A1 (en) * | 2009-05-29 | 2010-12-02 | 信越半導体株式会社 | Method for cutting silicon ingot |
-
2011
- 2011-08-25 CN CN2011102458044A patent/CN102275232A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09254142A (en) * | 1996-03-26 | 1997-09-30 | Shin Etsu Handotai Co Ltd | Wire saw and cylindrical work-cutting method |
| EP1287958A1 (en) * | 1996-03-26 | 2003-03-05 | Shin-Etsu Handotai Co., Ltd | Wire saw and method of slicing a cylindrical workpiece |
| CN101855045A (en) * | 2007-12-19 | 2010-10-06 | 信越半导体股份有限公司 | Method for cutting work by wire saw and wire saw |
| CN101474830A (en) * | 2008-12-11 | 2009-07-08 | 江苏海尚新能源材料有限公司 | Technological process for slicing solar energy grade six-cun monocrystalline silicon wafer |
| US20100284885A1 (en) * | 2009-05-11 | 2010-11-11 | National Taiwan University | Recovery Of Silicon And Silicon Carbide Powder From Kerf Loss Slurry Using Particle Phase-Transfer Method |
| WO2010137228A1 (en) * | 2009-05-29 | 2010-12-02 | 信越半導体株式会社 | Method for cutting silicon ingot |
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Address after: 313000 Cao village, eight Li Town, Wuxing District, Zhejiang, Huzhou Applicant after: Huzhou Jinke Technology Co., Ltd. Address before: 313000 No. 10 standard factory building, eight mile town, Huzhou District, Wuxing District, Zhejiang, China Applicant before: Huzhou Jinke PV Technology Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: HUZHOU JINKE PHOTOVOLTAIC TECHNOLOGY CO., LTD. TO: HUZHOU JINKE TECHNOLOGY CO., LTD. |
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Application publication date: 20111214 |