CN103722624A - Diamond wire cutting process for squaring machine - Google Patents
Diamond wire cutting process for squaring machine Download PDFInfo
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- CN103722624A CN103722624A CN201310703186.2A CN201310703186A CN103722624A CN 103722624 A CN103722624 A CN 103722624A CN 201310703186 A CN201310703186 A CN 201310703186A CN 103722624 A CN103722624 A CN 103722624A
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- diamond wire
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Abstract
The invention provides a diamond wire cutting process for a squaring machine. The diamond wire cutting process includes firstly, placing a crystal bar to be processed, on a crystal support and fixing magnetically; secondly, turning on the squaring machine to cut with sands; thirdly, separating the crystal bar from the crystal support and detecting. The flow of mortar is not less than 180 liters / minute, the wire speed of diamond wire cutting is 900 meters / minute, circulating time is 90 seconds, new wire feeding capacity is 6 meters / minute, and feeding speed is 2.0 millimeter / minute. According to the diamond wire cutting process for the squaring machine, by the aid of high wire speed, more than doubled effect on cutting and feeding as compared with cutting by a conventional steel wire and silicon carbide powder is achieved; on the condition of increasing the speed, the size accuracy of finished products meets the detecting standard (squaring size is controlled in 156.35 to 157.35 millimeters), and stability of the finished products can be well guaranteed.
Description
Technical field
The invention belongs to monocrystalline silicon, polysilicon technology manufacture field, particularly a kind of butting machine adopts diamond wire cutting technique.
Background technology
Along with the development of the high-precision end industries such as photovoltaic industry, semiconductor, hard brittle material, as the cutting processing of the materials such as monocrystalline silicon, polysilicon, jewel, glass, pottery seems still for important.In recent years, its cutting equipment is researched and developed in countries in the world, new technology, and new equipment continues to bring out.Diamond wire is replaced to the cutting of mortar line, and diamond fretsaw cutting equipment becomes the main flow trend of research and development.
Early stage scroll saw process technology is to adopt exposed metal wire and free abrasive material, in process, abrasive material is joined between metal wire and workpiece and produces shear action with the third party.This technology is successfully used to the processing to silicon and carborundum.In order further to shorten process time, and to other hard material and unmanageable sapphire, carborundum is processed, people are fixed to diamond abrasive on metal wire in some way, thereby produced fixed diamond jigsaw device and related to a kind of diamond line, be that a kind of baseline is steel wire, steel wire surface is wrapped in steel wire surface by plating form by diamond particles, reaches the object of certain cutting power.
But stability fluctuation ratio is larger in process of production for current butting machine, the cut lengths error between batch is larger, and qualification rate only only has 50% left and right, need be through reconditioning could be qualified again, and the underground while of operating efficiency has also brought great loss to company.
Summary of the invention
The object of the present invention is to provide the diamond wire cutting technique for butting machine that a kind of cutting accuracy is high, defect rate is low.
For solving the problems of the technologies described above, the present invention, for the diamond wire cutting technique of butting machine, comprising: the first step, is placed on brilliant holder by crystal bar to be processed and goes up and add magnetic and fix; Second step, starts butting machine and is with sand cutting; Wherein, the flow >=18O liter/min of mortar, the linear speed of diamond wire cutting is 900 ms/min, and be 90 seconds circulation timei, and new line line sending amount is 6 ms/min, and feed speed is 2.0 mm/min; The 3rd step, separates and checks from crystalline substance holder.
The maximum tension of described diamond wire line wheel is 80 newton.The diameter of described diamond wire line wheel is 260 millimeters.The material of described diamond wire line wheel is aluminium.
The present invention is for the linear speed by high speed of the diamond wire cutting technique of butting machine, reach cutting feed speed than the effect with more than common steel wire+carborundum powder cutting twice, and in the situation that improving speed, the dimensional accuracy of finished product reaches test stone (butt size Control: 156.35 millimeters～157.35 millimeters), and the stability of finished product is well guaranteed.
The specific embodiment
The present invention, for the diamond wire cutting technique of butting machine, comprising: the first step, is placed on brilliant holder by crystal bar to be processed and goes up and add magnetic and fix; Second step, starts butting machine and is with sand cutting; Wherein, the flow >=18O liter/min of mortar, the linear speed of diamond wire cutting is 900 ms/min, and be 90 seconds circulation timei, and new line line sending amount is 6 ms/min, and feed speed is 2.0 mm/min; Because diamond wire needs high-speed cutting (900 ms/min), this just requires tension system control sensitiveer, and tension fluctuation is more steady, and the maximum tension of diamond wire line wheel is adjusted into 80 newton.And due to the quickening of extrusion speed of cutting, just require linear velocity to improve, in order to reduce reel inertia torque, diamond wire line wheel changes to aluminium wheel by iron tyre; In order to meet the requirements of linear velocity, adopt the diameter adding, the diameter of diamond wire line wheel changes 260 millimeters into simultaneously.The 3rd step, separates and checks from crystalline substance holder.Complete processing.
The present invention is for the linear speed by high speed of the diamond wire cutting technique of butting machine, reach cutting feed speed than the effect with more than common steel wire+carborundum powder cutting twice, and in the situation that improving speed, the dimensional accuracy of finished product reaches test stone (butt size Control: 156.35 millimeters～157.35 millimeters), and the stability of finished product is well guaranteed.
Below the preferred embodiment of the invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all modification being equal to or replacement under the prerequisite without prejudice to the invention spirit, and the modification that these are equal to or replacement are all included in the application's claim limited range.
Claims (4)
1. for the diamond wire cutting technique of butting machine, it is characterized in that, comprising:
The first step, is placed on brilliant holder by crystal bar to be processed and goes up and add magnetic and fix;
Second step, starts butting machine and is with sand cutting; Wherein, the flow >=18O liter/min of mortar, the linear speed of diamond wire cutting is 900 ms/min, and be 90 seconds circulation timei, and new line line sending amount is 6 ms/min, and feed speed is 2.0 mm/min;
The 3rd step, separates and checks from crystalline substance holder.
2. the diamond wire cutting technique for butting machine according to claim 1, is characterized in that, the maximum tension of described diamond wire line wheel is 80 newton.
3. the diamond wire cutting technique for butting machine according to claim 2, is characterized in that, the diameter of described diamond wire line wheel is 260 millimeters.
4. according to the diamond wire cutting technique for butting machine described in claim 2 or 3, it is characterized in that, the material of described diamond wire line wheel is aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310703186.2A CN103722624A (en) | 2013-12-19 | 2013-12-19 | Diamond wire cutting process for squaring machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310703186.2A CN103722624A (en) | 2013-12-19 | 2013-12-19 | Diamond wire cutting process for squaring machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103722624A true CN103722624A (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310703186.2A Pending CN103722624A (en) | 2013-12-19 | 2013-12-19 | Diamond wire cutting process for squaring machine |
Country Status (1)
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| CN (1) | CN103722624A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100163010A1 (en) * | 2007-06-08 | 2010-07-01 | Shin-Etsu Handotai Co., Ltd. | Slicing method and a wire saw apparatus |
| CN101913210A (en) * | 2010-08-19 | 2010-12-15 | 英利能源（中国）有限公司 | Polycrystalline silicon ingot ripping method |
| JP4605237B2 (en) * | 2008-03-27 | 2011-01-05 | 日立金属株式会社 | Cutting method of high hardness material using fixed abrasive wire saw |
| CN102267197A (en) * | 2011-08-25 | 2011-12-07 | 湖州金科光伏科技有限公司 | Method for cutting silicon materials |
| CN102350741A (en) * | 2011-09-22 | 2012-02-15 | 英利能源（中国）有限公司 | Silicon block cutting method |
| CN102632555A (en) * | 2012-02-07 | 2012-08-15 | 徐州协鑫光电科技有限公司 | Cutting method of crystal blank |
| EP2647458A1 (en) * | 2012-04-04 | 2013-10-09 | Applied Materials Switzerland Sàrl | Wire for semiconductor wire saw and wire saw |
-
2013
- 2013-12-19 CN CN201310703186.2A patent/CN103722624A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100163010A1 (en) * | 2007-06-08 | 2010-07-01 | Shin-Etsu Handotai Co., Ltd. | Slicing method and a wire saw apparatus |
| JP4605237B2 (en) * | 2008-03-27 | 2011-01-05 | 日立金属株式会社 | Cutting method of high hardness material using fixed abrasive wire saw |
| CN101913210A (en) * | 2010-08-19 | 2010-12-15 | 英利能源（中国）有限公司 | Polycrystalline silicon ingot ripping method |
| CN102267197A (en) * | 2011-08-25 | 2011-12-07 | 湖州金科光伏科技有限公司 | Method for cutting silicon materials |
| CN102350741A (en) * | 2011-09-22 | 2012-02-15 | 英利能源（中国）有限公司 | Silicon block cutting method |
| CN102632555A (en) * | 2012-02-07 | 2012-08-15 | 徐州协鑫光电科技有限公司 | Cutting method of crystal blank |
| EP2647458A1 (en) * | 2012-04-04 | 2013-10-09 | Applied Materials Switzerland Sàrl | Wire for semiconductor wire saw and wire saw |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140416 |