CN210616985U - Automatic circulating spraying silicon wafer cutting machine - Google Patents
Automatic circulating spraying silicon wafer cutting machine Download PDFInfo
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- CN210616985U CN210616985U CN201821741793.2U CN201821741793U CN210616985U CN 210616985 U CN210616985 U CN 210616985U CN 201821741793 U CN201821741793 U CN 201821741793U CN 210616985 U CN210616985 U CN 210616985U
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Abstract
The utility model discloses a can circulate to the cutting fluid and spray, can make the cutting fluid evenly spill the automatic cycle on the line of cut simultaneously and spray silicon chip cutting machine. The automatic circulating spraying silicon wafer cutting machine comprises a rack, wherein a feeding cavity is arranged on the rack, and a wafer dragging connector is arranged at the top of the feeding cavity; the lower part of the frame is provided with two wire guide rollers with mutually parallel axes; a material receiving box is arranged between the two wire rollers; a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller; a winding device is arranged on one side of the rack; a filter screen is arranged in the material box; a water pump is arranged on one side of the rack; the bottom of the inner cavity of the material box is communicated with the water pump through a conduit; the water pump is communicated with the cutting fluid storage tank; the cutting fluid storage box is communicated with the spraying device through a fluid supply pump; the automatic circulating spraying silicon wafer cutting machine can prolong the service life of a cutting line, reduce the consumption of cutting fluid and reduce the cost.
Description
Technical Field
The utility model relates to a silicon chip cutting, especially an automatic circulation sprays silicon chip cutting machine.
Background
It is well known that: silicon wafers are the main production materials in the semiconductor and photovoltaic fields. The multi-wire cutting technology for silicon wafers is an advanced silicon wafer processing technology in the world at present, is different from the traditional cutting modes of a knife saw blade, a grinding wheel blade and the like, and is also different from the advanced laser cutting and inner circle cutting. In the whole process, the steel wire is guided by dozens of guide wheels to form a wire net on the main wire roller, and the workpiece to be processed is lowered by the workbench to realize the feeding of the workpiece. Compared with other technologies, the multi-wire cutting technology for the silicon wafer comprises the following steps: high efficiency, high productivity, high precision and the like. The silicon wafer multi-wire cutting technology is the most widely adopted silicon wafer cutting technology at present. But the steel wire is guided by a plurality of pulleys, so that the friction of the steel wire is increased, and the service life of the steel wire is short.
Secondly, the existing spraying device can not realize the recycling of the cutting fluid, so the cutting fluid consumption is large, and the cutting cost is high.
Thirdly, when the steel wire cuts the silicon wafer, the temperature of the steel wire is increased due to friction, so a steel wire cutting fluid spraying device is generally arranged for reducing the temperature of the steel wire, and most of the existing cutting fluid spraying devices adopt spray heads; because the position of the spray head is fixed, the cutting fluid received by each steel wire in the steel wire net on the wire guide roller is uneven, so that the temperature of each part of the steel wire is uneven, and the service life of the steel wire is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a can circulate cutting fluid and spray is provided, can make the cutting fluid evenly spill the automatic cycle on the line of cut simultaneously and spray silicon chip cutting machine.
The utility model provides a technical scheme that its technical problem adopted is: the automatic spraying silicon wafer cutting machine comprises a rack, wherein a feeding cavity is formed in the rack, a wafer dragging connector is arranged at the top of the feeding cavity, a vertical telescopic device and a cutting fluid storage box are arranged above the feeding cavity, and a telescopic shaft of the vertical telescopic device is connected with the wafer dragging connector; the lower part of the rack is provided with two wire guide rollers with mutually parallel axes, and the wire guide rollers are in running fit with the rack; a material receiving box is arranged between the two wire rollers; a material taking port is arranged on the frame and is positioned at one end of the material receiving box; a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller; a winding device is arranged on one side of the rack;
a filter screen is arranged in the material box; a water pump is arranged on one side of the rack; the bottom of the inner cavity of the material box is communicated with the water pump through a conduit;
the water pump is communicated with the cutting fluid storage tank; the cutting fluid storage box is communicated with the spraying device through a fluid supply pump;
the spraying device comprises a mounting plate; the lower surface of one end of the mounting plate is provided with a liquid supplementing box, and the lower surface of the other end of the mounting plate is provided with a liquid distributing plate; a liquid replenishing pipe is arranged on the liquid replenishing box; spray head mounting seats which are transversely and uniformly distributed are arranged between the liquid distribution plate and the liquid supplementing box; a first rotating shaft is arranged on the spray head mounting seat; the first rotating shaft is fixedly provided with a spray head rotating seat; one end of the first rotating shaft penetrates through the spray head mounting seat, and the other end of the first rotating shaft is provided with a driving motor; the spray head rotating seat is provided with a spray head; the spray head is communicated with the liquid supplementing tank through a hose; the cutting fluid storage box is communicated with the fluid infusion pipe through a fluid supply pump; the spraying direction of the spray head points to the liquid distribution plate;
the liquid distribution plate is hinged with the mounting plate through a second rotating shaft; one end of the second rotating shaft is provided with a rotating rod; one end of the rotating rod is fixedly connected with the second rotating shaft, and the other end of the rotating rod is an arc-shaped end surface; an inverted U-shaped mounting groove is formed above the mounting plate, and one end of the rotating rod with an arc-shaped end face extends into the inverted U-shaped mounting groove; the two sides of the rotating rod are provided with wedges; the wedge block is positioned in the inverted U-shaped mounting groove, and two locking bolts are arranged at the top of the inverted U-shaped mounting groove; one end of the locking bolt is inserted into the inverted U-shaped mounting groove and is in contact with the wedge block; the wedge blocks correspond to the locking bolts one to one;
the winding device comprises a second mounting plate and a paying-off device and a winding-up device are arranged on the lower portion of the side surface of the frame; the second mounting plate is parallel to the side face of the rack and is vertically arranged; the pay-off device comprises a pay-off roller and a pay-off roller rotation driving device, and the take-up device comprises a take-up roller and a take-up roller rotation driving device;
the pay-off roller rotation driving device and the take-up roller rotation driving device are arranged on the side face of the rack, and the pay-off roller and the take-up roller are horizontally arranged; a paying-off pressing wheel is arranged above the paying-off roller, and a taking-up pressing wheel is arranged above the taking-up roller;
a paying-off transition wheel and a taking-up transition wheel are arranged at the top of the second mounting plate; a horizontal mounting plate is arranged between the lower part of the side surface of the rack and the lower part of the second mounting plate; two height adjusting transition wheels are arranged on the horizontal mounting plate, and the two height adjusting transition wheels are distributed right below the paying-off transition wheel and the taking-up transition wheel;
two horizontal transition wheels are arranged on the horizontal mounting plate, and a wire passing port is formed in the lower part of the rack; the horizontal transition wheel is flush with the wire passing port; two vertical transition wheels are arranged between the horizontal transition wheel and the height adjusting transition wheel; the horizontal transition wheels, the vertical transition wheels and the height adjusting transition wheels correspond to one another one to one;
the wiring device comprises a wiring board and two component wire wheels, wherein the two component wire wheels are distributed in parallel; each group of branching wheels comprises at least three branching wheels; each wire distributing wheel in the two groups of wire distributing wheels is aligned one by one; a cutting line is arranged on the pay-off roller; the cutting line sequentially bypasses the paying-off pressing wheel, the paying-off transition wheel, the height adjusting transition wheel, the vertical transition wheel, the horizontal transition wheel, the two groups of wire distributing wheels and the two wire rollers, sequentially bypasses the horizontal transition wheel, the vertical transition wheel, the height adjusting transition wheel, the wire winding transition wheel and the wire winding pressing wheel, and finally returns to the wire winding roller.
Preferably, the pay-off roller rotation driving device and the take-up roller rotation driving device adopt motors or hydraulic motors.
Furthermore, baffle plates are arranged on two sides of the liquid distribution plate.
Furthermore, bosses which are uniformly distributed are arranged between the baffle plates on the two sides of the liquid distribution plate, and the heights of the bosses are gradually reduced from one end, hinged with the mounting plate, of the liquid distribution plate to the other end of the liquid distribution plate.
Further, a dovetail groove is formed in the crystal puller connecting head, and a second wedge block is arranged on the inner wall of one side of the dovetail groove; the second wedge block is provided with a connecting shaft, one end of the connecting shaft is connected with the second wedge block, and the other end of the connecting shaft penetrates through the inner wall of the dovetail groove and is provided with a locking nut; and the locking nut is in threaded fit with the connecting shaft.
Furthermore, the paying-off pressing wheel and the taking-up pressing wheel are mounted on the rack through an elastic device, the paying-off pressing wheel is provided with a mounting seat, and the mounting seat is hinged to one end of the elastic device.
Furthermore, the paying-off transition wheel and the taking-up transition wheel are both mounted on the second mounting plate through the support frame, and the mounting seat of the paying-off transition wheel is hinged to one end of the support frame.
Further, the height adjusting transition wheel is installed on the horizontal installation plate through a vertical lifting device.
The utility model has the advantages that: the automatic circulating spraying silicon wafer cutting machine of the utility model has the advantages that the cutting lines sequentially pass around the paying-off pressing wheel, the paying-off transition wheel, the vertical transition wheel, the horizontal transition wheel and the two groups of wire separating wheels, then sequentially pass around the horizontal transition wheel, the vertical transition wheel, the take-up transition wheel and the take-up pressing wheel, and finally return to the take-up roller; the cutting line therefore passes through fewer guide wheels, thus reducing the path; meanwhile, unnecessary abrasion of the cutting line is reduced, and the service life of the cutting line is prolonged. Meanwhile, the guide path is short, so that the cutting line path is convenient to arrange, and the occupied space of the equipment can be reduced.
Thirdly, automatic cycle sprays spray set of silicon chip cutting machine owing to be provided with shower nozzle and cloth liquid board, spray the cutting fluid to cloth liquid board through the shower nozzle, the cutting fluid forms laminar flow on cloth liquid board, the cutting fluid takes off and forms the cascade behind the cloth liquid board to make the cutting fluid can be even spill on the cutting wire of wire roller, the cutting fluid that adopts the shower nozzle to spray simultaneously forms laminar flow on cloth liquid board, consequently a small amount of cutting fluid can be realized, thereby the use amount of cutting fluid has been reduced. Meanwhile, the cutting fluid is collected through the material box below the fluid distribution plate, and then the cutting fluid storage box is pumped back through the water pump, so that the cutting fluid can be recycled, the consumption of the cutting fluid can be reduced, and the cost is reduced.
Drawings
FIG. 1 is a perspective view of an automatic cycle spray silicon wafer cutting machine according to an embodiment of the present invention;
FIG. 2 is a perspective view of an automatic cycle spray silicon wafer cutting machine with a transition wheel removed according to an embodiment of the present invention;
FIG. 3 is a front view of an automatic circulating spray silicon wafer cutting machine according to an embodiment of the present invention;
FIG. 4 is a top view of an automatic cycle spray silicon wafer cutting machine according to an embodiment of the present invention;
3 FIG. 35 3 is 3 a 3 sectional 3 view 3 A 3- 3 A 3 of 3 FIG. 34 3; 3
FIG. 6 is a cross-sectional view B-B of FIG. 3;
fig. 7 is a schematic structural diagram of a wiring device according to an embodiment of the present invention;
fig. 8 is a perspective view of a spray device in an embodiment of the present invention;
fig. 9 is a front view of a spray device in an embodiment of the present invention;
fig. 10 is a rear view of a spray device in an embodiment of the present invention;
fig. 11 is a bottom view of the sprinkler device in an embodiment of the present invention;
FIG. 12 is a schematic structural view of a liquid distribution plate according to an embodiment of the present invention;
the following are marked in the figure: 1-a frame, 2-a vertical telescopic device, 3-a telescopic shaft, 4-a crystal pulling connector, 5-a second wedge block, 6-a connecting shaft, 7-a locking nut, 8-a cutting fluid storage box, 9-a spraying device, 10-a material receiving box, 11-a wire guide roller, 12-a wiring board, 13-a wire distributing wheel, 14-a horizontal transition wheel, 15-a vertical transition wheel, 16-a wire releasing roller, 17-a wire releasing roller rotation driving device, 18-a wire releasing pressing wheel, 19-an elastic device, 20-a wire releasing transition wheel, 21-a support frame, 22-a cutting wire, 23-a second mounting plate, 24-a height adjusting transition wheel, 25-a vertical lifting device, 26-a material taking port, 27-a wire collecting roller and 28-a wire collecting roller rotation driving device, 29-take-up pressing wheel, 31-mounting seat, 32-take-up transition wheel, 33-horizontal mounting plate, 34-water pump and 35-filter screen.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 to 12, the automatic circulating spraying silicon wafer cutting machine of the present invention is an automatic spraying silicon wafer cutting machine, and is characterized in that: the cooling device comprises a rack 1, wherein a feeding cavity is arranged on the rack 1, a crystal pulling connector 4 is arranged at the top of the feeding cavity, a vertical telescopic device 2 and a cooling liquid storage box 8 are arranged above the feeding cavity, and a telescopic shaft 3 of the vertical telescopic device 2 is connected with the crystal pulling connector 4; the lower part of the frame 1 is provided with two wire guiding rollers 11 with mutually parallel axes, and the wire guiding rollers 11 are in running fit with the frame 1; a material receiving box 10 is arranged between the two wire rollers 11; a material taking port 26 is arranged on the frame 1, and the material taking port 26 is positioned at one end of the material receiving box 10; a wiring device is arranged below the material receiving box; a spraying device 9 is arranged above the wire guide roller 11; a winding device is arranged on one side of the rack 1;
a filter screen 33 is arranged in the material receiving box 10; a water pump 34 is arranged on one side of the frame 1; the bottom of the inner cavity of the material receiving box 10 is communicated with a water pump 34 through a conduit;
the water pump 34 is communicated with the cooling liquid storage tank 8; the cooling liquid storage box 8 is communicated with the spraying device 9 through a liquid supply pump;
the spraying device 9 comprises a mounting plate 91; the lower surface of one end of the mounting plate 91 is provided with a liquid supplementing box 92, and the lower surface of the other end is provided with a liquid distributing plate 93; a liquid supplementing pipe 914 is arranged on the liquid supplementing box 92; spray head mounting seats 98 which are transversely and uniformly distributed are arranged between the liquid distribution plate 93 and the liquid supplementing box 92; a first rotating shaft 99 is arranged on the spray head mounting seat 98; a nozzle rotating seat 911 is fixedly installed on the first rotating shaft 99; one end of the first rotating shaft 99 penetrates through the spray head mounting seat 98, and the other end is provided with a driving motor 910; the spray head rotating seat 911 is provided with a spray head 912; the spray head 912 is communicated with the fluid infusion tank 92 through a hose 913; the cooling liquid storage box 8 is communicated with a liquid supplementing pipe 914 through a liquid supply pump; the spraying direction of the spray head 912 points to the liquid distribution plate 93;
the liquid distribution plate 93 is hinged with the mounting plate 91 through a second rotating shaft 915; one end of the second rotating shaft 915 is provided with a rotating rod 97; one end of the rotating rod 97 is fixedly connected with the second rotating shaft 915, and the other end of the rotating rod is an arc-shaped end surface; an inverted U-shaped mounting groove 94 is formed above the mounting plate 91, and one end of the rotating rod 97 with an arc-shaped end surface extends into the inverted U-shaped mounting groove 94; wedges 95 are arranged on both sides of the rotating rod 97; the wedge blocks 95 are positioned in the inverted U-shaped mounting groove 94, and two locking bolts 96 are arranged at the top of the inverted U-shaped mounting groove 94; one end of the locking bolt 96 is inserted into the inverted U-shaped mounting groove 94 and contacts the wedge 95; the wedges 95 correspond to the locking bolts 96 one to one;
the winding device comprises a second mounting plate 23, and a paying-off device and a winding-up device are arranged at the lower part of the side surface of the frame 1; the second mounting plate 23 is parallel to the side surface of the rack 1 and is vertically arranged; the paying-off device comprises a paying-off roller 16 and a paying-off roller rotation driving device 17, and the take-up device comprises a take-up roller 27 and a take-up roller rotation driving device 28;
the pay-off roller rotation driving device 17 and the take-up roller rotation driving device 28 are installed on the side face of the rack 1, and the pay-off roller 16 and the take-up roller 27 are horizontally arranged; a paying-off pinch roller 18 is arranged above the paying-off roller 16, and a taking-up pinch roller 29 is arranged above the taking-up roller 27;
the top of the second mounting plate 23 is provided with a paying-off transition wheel 20 and a taking-up transition wheel 32; a horizontal mounting plate 33 is arranged between the lower part of the side surface of the rack 1 and the lower part of the second mounting plate 23; the horizontal mounting plate 33 is provided with two height adjusting transition wheels 24, and the two height adjusting transition wheels 24 are distributed right below the paying-off transition wheel 20 and the taking-up transition wheel 32;
two horizontal transition wheels 14 are arranged on the horizontal mounting plate 33, and a wire passing port is arranged at the lower part of the rack 1; the horizontal transition wheel 14 is flush with the wire passing port; two vertical transition wheels 15 are arranged between the horizontal transition wheel 14 and the height adjusting transition wheel 24; the horizontal transition wheels 14, the vertical transition wheels 15 and the height adjusting transition wheels 24 are in one-to-one correspondence;
the wiring device comprises a wiring board 12 and two component wire wheels 13, wherein the two component wire wheels 13 are distributed in parallel; each group of branching wheels comprises at least three branching wheels 13; each branching wheel in the two groups of component wheels 13 is aligned one by one; a cutting line is arranged on the pay-off roller 16; the cutting line 22 sequentially bypasses the paying-off pressing wheel 18, the paying-off transition wheel 20, the height adjusting transition wheel 24, the vertical transition wheel 15, the horizontal transition wheel 14, the two groups of wire wheels 13 and the two wire guide rollers 11, sequentially bypasses the horizontal transition wheel 14, the vertical transition wheel 15, the height adjusting transition wheel 24, the take-up transition wheel 32 and the take-up pressing wheel 29, and finally returns to the take-up roller 27.
In the working process, the crystal puller provided with the silicon rod is arranged on the crystal puller connector 4; then starting the take-up roller rotation driving device 28 and the pay-off roller rotation driving device 17 to enable the take-up roller 28 and the pay-off roller 16 to synchronously rotate; the cutting line 22 is sent by the pay-off roller 16 to sequentially bypass the pay-off pinch roller 18, the pay-off transition wheel 20, the height adjusting transition wheel 24, the vertical transition wheel 15, the horizontal transition wheel 14, the two-component wire wheel 13 and the wire guide roller 11, then sequentially bypass the horizontal transition wheel 14, the vertical transition wheel 15, the height adjusting transition wheel 24, the take-up transition wheel 32 and the take-up pinch roller 29, and finally return to the take-up roller 28; here, parallel wire meshes are formed on the guide rollers while bypassing the distribution roller 13 and the guide roller 11, and parallel wire meshes are formed with a shift between the distribution rollers 13, as shown in fig. 7. So that the final take-up roller 28 recovers the thread paid out from the pay-off roller 16; and to give the cutting line 22 a certain tension. Start spray set 9 simultaneously, at first start the liquid feed pump, the liquid feed pump replenishes the coolant liquid for fluid infusion case 92, the coolant liquid flows into shower nozzle 912 by fluid infusion case 92, make shower nozzle 912 hydrojet, the coolant liquid that shower nozzle 912 sprays spouts on cloth liquid board 93, thereby form the laminar flow of coolant liquid on cloth liquid board 93, the coolant liquid forms the cascade in the below of cloth liquid board 93 behind the cloth liquid board 93 that flows through, thereby even spray on the cutting line on the wire roller, make all cutting lines homoenergetic receive the coolant liquid, thereby can guarantee the cooling effect of line of cut, the life of extension line of cut.
Then, the cooling liquid falls into the material receiving box 10, is filtered by the filter screen 35 in the material receiving box 10, is collected and is pumped back into the cooling liquid storage box 8 by the water pump 34, so that the recycling of the cooling liquid is realized.
During operation, the two locking bolts 96 can be screwed to adjust the inclination angle of the liquid distribution plate 93, so as to adjust the falling angle of the cooling liquid water curtain. Meanwhile, the spraying angle of the spraying head 912 can be adjusted by starting the motor 910, so as to ensure the formation of the water curtain.
Then starting the vertical telescopic device 2 to enable the silicon rod to move downwards; when the silicon rod passes through the wire mesh on the guide roller 11, the cutting line 22 moves at a high speed to generate friction with the silicon rod, so that the silicon wafer can be cut from the silicon rod.
To sum up, the automatic circulating spray silicon wafer cutting machine of the utility model has the advantages that the cutting lines sequentially pass around the paying-off pressing wheel, the paying-off transition wheel, the vertical transition wheel, the horizontal transition wheel and the two groups of wire separating wheels, then sequentially pass around the horizontal transition wheel, the vertical transition wheel, the wire collecting transition wheel and the wire collecting pressing wheel, and finally return to the wire collecting roller; the cutting line therefore passes through fewer guide wheels, thus reducing the path; meanwhile, unnecessary abrasion of the cutting line is reduced, and the service life of the cutting line is prolonged. Meanwhile, the guide path is short, so that the cutting line path is convenient to arrange, and the occupied space of the equipment can be reduced.
Thirdly, automatic cycle sprays spray set of silicon chip cutting machine owing to be provided with shower nozzle and cloth liquid board, spray the cutting fluid to cloth liquid board through the shower nozzle, the cutting fluid forms laminar flow on cloth liquid board, the cutting fluid takes off and forms the cascade behind the cloth liquid board to make the cutting fluid can be even spill on the cutting wire of wire roller, the cutting fluid that adopts the shower nozzle to spray simultaneously forms laminar flow on cloth liquid board, consequently a small amount of cutting fluid can be realized, thereby the use amount of cutting fluid has been reduced. Meanwhile, the cutting fluid is collected through the material box below the fluid distribution plate, and then the cutting fluid storage box is pumped back through the water pump, so that the cutting fluid can be recycled, the consumption of the cutting fluid can be reduced, and the cost is reduced.
In order to reduce the cost and facilitate the control, further, the paying-off roller rotation driving device 17 and the take-up roller rotation driving device 28 adopt motors or hydraulic motors.
In order to prevent the coolant from spilling on both sides of the liquid distribution plate 93, further, baffles 932 are provided on both sides of the liquid distribution plate 93.
In order to enable the cooling liquid to form a uniform water curtain after passing through the liquid distribution plate 93, further, uniformly distributed bosses 931 are arranged between the baffles 932 on two sides of the liquid distribution plate 93, and the heights of the bosses 931 are gradually reduced from one end of the liquid distribution plate 93 hinged to the mounting plate 91 to the other end.
In order to facilitate the installation of the crystal puller, a dovetail groove is formed in the crystal puller connector 4, and a second wedge block 5 is arranged on the inner wall of one side of the dovetail groove; a connecting shaft 6 is arranged on the second wedge block 5, one end of the connecting shaft 6 is connected with the second wedge block 5, and the other end of the connecting shaft passes through the inner wall of the dovetail groove and is provided with a locking nut 7; the locking nut 7 is in threaded fit with the connecting shaft 6.
In order to enable the pay-off pinch roller 18 and the take-up pinch roller 29 to have a large pressing force, specifically, the pay-off pinch roller 18 and the take-up pinch roller 29 are mounted on the frame 1 through an elastic device 19, and the pay-off pinch roller 18 is provided with a mounting seat 31, and the mounting seat 31 is hinged with one end of the elastic device 19. The elastic means 19 may be a telescopic shaft with a spring, or a rubber column.
In order to avoid the situation that when a certain deviation of the cutting line occurs on the path, a large friction occurs between the cutting line and the guiding transition wheel, specifically, the paying-off transition wheel 20 and the taking-up transition wheel 32 are both mounted on the second mounting plate 14 through the support frame 21, and the mounting seat of the paying-off transition wheel 20 is hinged to one end of the support frame 21.
In order to facilitate the adjustment of the height of the cutting line 22 around the horizontal transition wheel 14 so that the cutting line 22 can horizontally pass around the horizontal transition wheel 14, further, the height-adjusting transition wheel 24 is mounted on the horizontal mounting plate 23 by a vertical lifting device 25. The vertical lifting device 25 is a hydraulic cylinder.
Claims (8)
1. Automatic circulation sprays silicon chip cutting machine which characterized in that: the cooling device comprises a rack (1), wherein a feeding cavity is arranged on the rack (1), a crystal pulling connector (4) is arranged at the top of the feeding cavity, a vertical telescopic device (2) and a cooling liquid storage box (8) are arranged above the feeding cavity, and a telescopic shaft (3) of the vertical telescopic device (2) is connected with the crystal pulling connector (4); the lower part of the rack (1) is provided with two wire guide rollers (11) with mutually parallel axes, and the wire guide rollers (11) are in running fit with the rack (1); a material receiving box (10) is arranged between the two wire rollers (11); a material taking port (26) is formed in the rack (1), and the material taking port (26) is located at one end of the material receiving box (10); a wiring device is arranged below the material receiving box; a spraying device (9) is arranged above the wire guide roller (11); a winding device is arranged on one side of the rack (1);
a filter screen (35) is arranged in the material receiving box (10); a water pump (34) is arranged on one side of the rack (1); the bottom of the inner cavity of the material receiving box (10) is communicated with a water pump (34) through a conduit;
the water pump (34) is communicated with the cooling liquid storage tank (8); the cooling liquid storage box (8) is communicated with the spraying device (9) through a liquid supply pump;
the spraying device (9) comprises a mounting plate (91); the lower surface of one end of the mounting plate (91) is provided with a liquid supplementing box (92), and the lower surface of the other end of the mounting plate is provided with a liquid distributing plate (93); a liquid supplementing pipe (914) is arranged on the liquid supplementing box (92); spray head mounting seats (98) which are transversely and uniformly distributed are arranged between the liquid distribution plate (93) and the liquid supplementing box (92); a first rotating shaft (99) is arranged on the spray head mounting seat (98); a spray head rotating seat (911) is fixedly arranged on the first rotating shaft (99); one end of the first rotating shaft (99) penetrates through the spray head mounting seat (98), and the other end of the first rotating shaft is provided with a driving motor (910); the spray head rotating seat (911) is provided with a spray head (912); the spray head (912) is communicated with the liquid supplementing tank (92) through a hose (913); the cooling liquid storage tank (8) is communicated with a liquid supplementing pipe (914) through a liquid supply pump; the spraying direction of the spray head (912) points to the liquid distribution plate (93);
the liquid distribution plate (93) is hinged with the mounting plate (91) through a second rotating shaft (915); one end of the second rotating shaft (915) is provided with a rotating rod (97); one end of the rotating rod (97) is fixedly connected with the second rotating shaft (915), and the other end of the rotating rod is an arc-shaped end face; an inverted U-shaped mounting groove (94) is formed above the mounting plate (91), and one end, provided with an arc-shaped end face, of the rotating rod (97) extends into the inverted U-shaped mounting groove (94); wedge blocks (95) are arranged on the two sides of the rotating rod (97); the wedge block (95) is positioned in the inverted U-shaped mounting groove (94), and two locking bolts (96) are arranged at the top of the inverted U-shaped mounting groove (94); one end of the locking bolt (96) is inserted into the inverted U-shaped mounting groove (94) and is in contact with the wedge block (95); the wedges (95) correspond to the locking bolts (96) one by one;
the winding device comprises a second mounting plate (23), and a paying-off device and a wire-collecting device are arranged on the lower portion of the side surface of the frame (1); the second mounting plate (23) is parallel to the side face of the rack (1) and is vertically arranged; the paying-off device comprises a paying-off roller (16) and a paying-off roller rotation driving device (17), and the take-up device comprises a take-up roller (27) and a take-up roller rotation driving device (28);
the pay-off roller rotation driving device (17) and the take-up roller rotation driving device (28) are arranged on the side face of the rack (1), and the pay-off roller (16) and the take-up roller (27) are horizontally arranged; a paying-off pressing wheel (18) is arranged above the paying-off roller (16), and a taking-up pressing wheel (29) is arranged above the taking-up roller (27);
a paying-off transition wheel (20) and a taking-up transition wheel (32) are arranged at the top of the second mounting plate (23); a horizontal mounting plate (33) is arranged between the lower part of the side surface of the rack (1) and the lower part of the second mounting plate (23); the horizontal mounting plate (33) is provided with two height adjusting transition wheels (24), and the two height adjusting transition wheels (24) are distributed right below the paying-off transition wheel (20) and the taking-up transition wheel (32);
two horizontal transition wheels (14) are arranged on the horizontal mounting plate (33), and a wire passing port is arranged at the lower part of the rack (1); the horizontal transition wheel (14) is flush with the wire passing port; two vertical transition wheels (15) are arranged between the horizontal transition wheel (14) and the height adjusting transition wheel (24); the horizontal transition wheels (14), the vertical transition wheels (15) and the height adjusting transition wheels (24) are in one-to-one correspondence;
the wiring device comprises a wiring board (12) and two component wire wheels (13), wherein the two component wire wheels (13) are distributed in parallel; each group of branching wheels comprises at least three branching wheels (13); each branching wheel in the two groups of branching wheels (13) is aligned one by one; a cutting line is arranged on the pay-off roller (16); the cutting line (22) sequentially bypasses the paying-off pressing wheel (18), the paying-off transition wheel (20), the height adjusting transition wheel (24), the vertical transition wheel (15), the horizontal transition wheel (14), the two groups of wire wheels (13) and the two wire rollers (11), sequentially bypasses the horizontal transition wheel (14), the vertical transition wheel (15), the height adjusting transition wheel (24), the take-up transition wheel (32) and the take-up pressing wheel (29), and finally returns to the take-up roller (27).
2. The automatic circulating spray silicon wafer cutting machine according to claim 1, wherein: and the pay-off roller rotation driving device (17) and the take-up roller rotation driving device (28) adopt motors or hydraulic motors.
3. The automatic circulating spray silicon wafer cutting machine according to claim 2, wherein: and baffles (932) are arranged on two sides of the liquid distribution plate (93).
4. The automatic circulating spray silicon wafer cutting machine according to claim 3, wherein: be provided with evenly distributed's boss (931) between baffle (932) of cloth liquid board (93) both sides, the height of boss (931) is decremented in proper order to the other end by cloth liquid board (93) and mounting panel (91) articulated one end.
5. The automatic circulating shower silicon wafer cutting machine according to claim 4, wherein: a dovetail groove is formed in the crystal puller connector (4), and a second wedge block (5) is arranged on the inner wall of one side of the dovetail groove; a connecting shaft (6) is arranged on the second wedge block (5), one end of the connecting shaft (6) is connected with the second wedge block (5), and the other end of the connecting shaft penetrates through the inner wall of the dovetail groove and is provided with a locking nut (7); and the locking nut (7) is in threaded fit with the connecting shaft (6).
6. The automatic circulating shower silicon wafer cutting machine according to claim 5, wherein: the paying-off pressing wheel (18) and the taking-up pressing wheel (29) are mounted on the rack (1) through elastic devices (19), the paying-off pressing wheel (18) is provided with a mounting seat (31), and the mounting seat (31) is hinged to one end of each elastic device (19).
7. The automatic circulating shower silicon wafer cutting machine according to claim 6, wherein: the paying-off transition wheel (20) and the taking-up transition wheel (32) are both mounted on the second mounting plate (23) through the support frame (21), and the mounting seat of the paying-off transition wheel (20) is hinged to one end of the support frame (21).
8. The automatic circulating shower silicon wafer cutting machine according to claim 7, wherein: the height adjusting transition wheel (24) is installed on the horizontal installation plate (33) through a vertical lifting device (25).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821741793.2U CN210616985U (en) | 2018-10-24 | 2018-10-24 | Automatic circulating spraying silicon wafer cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821741793.2U CN210616985U (en) | 2018-10-24 | 2018-10-24 | Automatic circulating spraying silicon wafer cutting machine |
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| CN210616985U true CN210616985U (en) | 2020-05-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109129948A (en) * | 2018-10-24 | 2019-01-04 | 乐山新天源太阳能科技有限公司 | Automatic cycle sprays silicon chip cutter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109129948A (en) * | 2018-10-24 | 2019-01-04 | 乐山新天源太阳能科技有限公司 | Automatic cycle sprays silicon chip cutter |
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