CN109076718A - 热传导片和热传导片的制造方法 - Google Patents

热传导片和热传导片的制造方法 Download PDF

Info

Publication number
CN109076718A
CN109076718A CN201780023314.5A CN201780023314A CN109076718A CN 109076718 A CN109076718 A CN 109076718A CN 201780023314 A CN201780023314 A CN 201780023314A CN 109076718 A CN109076718 A CN 109076718A
Authority
CN
China
Prior art keywords
weight
parts
heat exchange
methyl
exchange sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780023314.5A
Other languages
English (en)
Other versions
CN109076718B (zh
Inventor
水野峻志
川口康弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Publication of CN109076718A publication Critical patent/CN109076718A/zh
Application granted granted Critical
Publication of CN109076718B publication Critical patent/CN109076718B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C43/06—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds continuously movable in one direction, e.g. mounted on chains, belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/44—Compression means for making articles of indefinite length
    • B29C43/46—Rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/18—Plasticising macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
    • B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
    • B29K2033/04—Polymers of esters
    • B29K2033/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
    • B29K2033/04—Polymers of esters
    • B29K2033/12—Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
    • B29K2509/02—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/746—Slipping, anti-blocking, low friction
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2333/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

一种热传导片，其含有丙烯酸类聚合物、高碱氧化铝70～75体积％和粒径小于所述高碱氧化铝且被高级脂肪酸包覆的氢氧化镁2.7～5.3体积％，压缩率20％以下的变形所需要的压缩力为200N以下，并且热阻为0.45℃/W以下。

Description

热传导片和热传导片的制造方法
技术领域
本发明涉及热传导片和热传导片的制造方法。
背景技术
作为用于将从电子设备或元件等产生的热传热至散热器的热传导片，以往提出了在丙烯酸类树脂中填充有热传导性高的氧化铝(alumina)等热传导填料的热传导片(参见专利文献1)。
现有技术文献
专利文献
专利文献1：日本特开2010-111757号公报
发明所要解决的问题
对于这种热传导片，为了提高热传导性，优选使基于热传导填料的传热路径尽可能地连续并且确保较多。换言之，优选提高热传导填料的填充密度。但是，填充密度变高时，片的硬度变高，难以无间隙地密合于作为发热体的电子设备或元件等。
另外，对于这种热传导片，在其制造方法方面，在片的表面形成薄的树脂层。但是，这样的片表面的树脂层妨碍片中的热传导填料与电子设备或元件的直接接触，因此，存在导致热传导性降低的问题。
发明内容
本发明是基于上述情况而完成的，其目的在于提供压缩力低、热传导性优良的热传导片和热传导片的制造方法。
用于解决问题的方法
为了解决上述问题而完成的本发明是一种热传导片，其含有丙烯酸类聚合物、高碱氧化铝70～75体积％和粒径小于上述高碱氧化铝且被高级脂肪酸包覆的氢氧化镁2.7～5.3体积％，压缩率20％以下的变形所需要的压缩力为200N以下，并且热阻为0.45℃/W以下。
根据这样的热传导片，通过使用高碱氧化铝，与使用低碱氧化铝的情况相比，能够使热阻降低、并且能够将压缩力抑制得较低。
另外，通过使被高级脂肪酸包覆的氢氧化镁覆盖高碱氧化铝的表面，在挤压热传导片的力发挥作用的情况下，在热传导片中相邻接的高碱氧化铝彼此容易相互滑移。即，片的硬度降低并且粘性提高，能够容易地发生变形(压缩力降低)。
上述热传导片的高碱氧化铝可以是将平均粒径2μm～10μm的小粒径氧化铝与平均粒径50μm～100μm的大粒径氧化铝以2：3～2：5的体积比混合而成的高碱氧化铝。
如果形成这样的构成，则在大粒径氧化铝彼此之间的间隙分散有小粒径氧化铝，由此填充密度变高，能确保更多的热传导路径，因此热传导性进一步提高。需要说明的是，小粒径氧化铝与大粒径氧化铝的体积比优选设定为2：3～2：5。小粒径氧化铝的比例过度增加时，粒子彼此的摩擦力增大，因此片的粘性和硬度变高。另外，大粒径氧化铝的比例过度增加时，难以进行构成材料的混炼。
另外，本发明是一种热传导片的制造方法，其实施如下工序：混合工序，将丙烯酸类树脂20～25重量份、高碱氧化铝250～300重量份、粒径小于上述高碱氧化铝且被高级脂肪酸包覆的氢氧化镁4～13重量份、多官能单体0.005～0.05重量份、聚合引发剂0.1～0.3重量份、增塑剂1.2～2.8重量份和抗氧化剂0.02～0.2重量份混合，所述丙烯酸类树脂含有使含有(甲基)丙烯酸酯的单体聚合而成的聚合物和含有(甲基)丙烯酸酯的；成形工序，将上述混合工序中得到的混合物经由模头向相互面对的一对塑料片之间挤出而成形为片状；和固化工序，对通过上述成形工序成形出的成形物进行加热而使其固化。
根据这样的制造方法，能利用增塑剂对片赋予柔软性，并且能利用抗氧化剂一定程度地抑制丙烯酸类树脂的(共)聚合反应，能抑制片的硬度变高。这样，能对片赋予柔软性并且降低硬度，由此能够使热传导片容易密合于被粘物。
另外，在这样以低硬度且具有柔软性的丙烯酸类聚合物作为粘合剂树脂并向一对塑料片之间挤出而成形出片的情况下，能够使形成在热传导片的表面的树脂表层非常薄地形成。因此，能够形成使热传导片中的作为热传导填料的高碱氧化铝等与被粘物非常接近的状态、或者在片表面露出而与被粘物直接接触的状态，热传导性提高(热阻降低)。
发明效果
根据本发明，可以提供压缩力低、热传导性优良的热传导片和热传导片的制造方法。
附图说明
图1是示意性地示出涂布机的图。
具体实施方式
本发明的热传导片含有丙烯酸类聚合物、高碱氧化铝70～75体积％和粒径小于高碱氧化铝且被高级脂肪酸包覆的氢氧化镁2.7～5.3体积％。
在本发明中，丙烯酸类聚合物是指使丙烯酸类树脂聚合或共聚而成的物质，所述丙烯酸类树脂含有使含有(甲基)丙烯酸酯的单体聚合而成的聚合物和(甲基)丙烯酸酯。
作为(甲基)丙烯酸酯，例如可以列举(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸-2-乙基已酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸异戊酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸异辛酯、(甲基)丙烯酸异肉豆蔻酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸异壬酯、(甲基)丙烯酸异癸酯、(甲基)丙烯酸十三烷酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸异硬脂酯等。它们在(共)聚合时可以单独使用，也可以组合使用两种以上。
丙烯酸类聚合物通过在上述丙烯酸类树脂中添加多官能单体、聚合引发剂、增塑剂、抗氧化剂等添加剂并使其加热固化而得到。
作为多官能单体，例如可以列举在分子内具有两个以上的(甲基)丙烯酰基的单体等。作为在分子内具有两个(甲基)丙烯酰基的二官能(甲基)丙烯酸酯单体，例如可以列举1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二(甲基)丙烯酸二环戊酯、2-乙基-2-丁基-丙二醇(甲基)丙烯酸酯、新戊二醇改性三羟甲基丙烷二(甲基)丙烯酸酯、硬脂酸改性季戊四醇二丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、2,2-双[4-(甲基)丙烯酰氧基二乙氧基苯基]丙烷、2,2-双[4-(甲基)丙烯酰氧基丙氧基苯基]丙烷、2,2-双[4-(甲基)丙烯酰氧基四乙氧基苯基]丙烷等。
作为三官能(甲基)丙烯酸酯单体，例如可以列举三羟甲基丙烷三(甲基)丙烯酸酯、三[(甲基)丙烯酰氧基乙基]异氰脲酸酯等，作为四官能以上的(甲基)丙烯酸酯单体，例如可以列举二羟甲基丙烷四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇乙氧基四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等。
这些多官能单体中，优选1,6-己二醇二(甲基)丙烯酸酯等。
上述多官能单体优选以相对于丙烯酸类树脂20～25重量份为0.005～0.05重量份的比例配合。
作为聚合引发剂，可以列举二(4-叔丁基环己基)过氧化二碳酸酯、过氧化月桂酰、过氧化-2-乙基己酸叔戊酯、过氧化苯甲酰、过氧化-2-乙基己酸叔丁酯等有机过氧化物。这些聚合引发剂中，优选二(4-叔丁基环己基)过氧化二碳酸酯。
聚合引发剂优选以相对于丙烯酸类树脂20～25重量份为0.1～0.3重量份的比例配合。
增塑剂可以使用通用的增塑剂，例如，邻苯二甲酸类、己二酸类、磷酸类、偏苯三酸类、聚酯类等是适合的。这些增塑剂可以单独使用任一种，也可以混合使用两种以上。通过配合增塑剂，能对热传导片赋予柔软性。
增塑剂优选以相对于丙烯酸类树脂20～25重量份为1.2～2.8重量份的比例配合。增塑剂的配合比例少时，添加增塑剂所带来的效果变弱，热传导片的硬度变高。另外，增塑剂的配合比例过多时，具有增塑剂从热传导片的表面渗出(bleed)的倾向。
作为抗氧化剂，例如可以使用具有自由基捕捉作用的酚类抗氧化剂。配合这样的抗氧化剂时，能够抑制片制造时的丙烯酸类树脂的聚合反应，因而能够将片的硬度抑制得较低。
抗氧化剂优选以相对于丙烯酸类树脂20～25重量份为0.02～0.2重量份的比例配合。抗氧化剂的配合比例少时，丙烯酸类树脂的聚合反应进行，片的硬度变高。另外，抗氧化剂的配合比例多时，具有妨碍树脂的固化的倾向。
另一方面，作为热传导填料的高碱氧化铝为大致球形，以相对于丙烯酸类树脂20～25重量份为250～300重量份的比例配合。另外，相对于热传导片整体的体积的配合比例为70～75体积％。
需要说明的是，高碱氧化铝是指可溶性钠量为100ppm以上的高碱氧化铝，在本发明中，更优选使用可溶性钠量为120ppm以上的高碱氧化铝。可溶性钠量是指使高碱氧化铝与水接触时溶解在水中的钠离子(Na+)量。
上述高碱氧化铝可以是将平均粒径2μm～10μm的小粒径氧化铝与平均粒径50μm～100μm的大粒径氧化铝以2：3～2：5的体积比配合而成的高碱氧化铝。这些氧化铝均为大致球形，粒径以利用激光衍射法等求出的平均粒径D50表示。
将高碱氧化铝的粒径设定为这样的配合时，能够提高热传导片中的高碱氧化铝的填充密度。
作为被高级脂肪酸包覆的氢氧化镁，优选平均粒径0.5μm～1.5μm的被高级脂肪酸包覆的氢氧化镁。需要说明的是，粒径以利用激光衍射法等求出的平均粒径D50表示。
另外，作为包覆氢氧化镁的高级脂肪酸，可以列举棕榈酸、硬脂酸、油酸、亚油酸等。
氢氧化镁以相对于丙烯酸类树脂20～25重量份为4～13重量份的比例配合。另外，相对于热传导片整体的体积的配合比例为2.7～5.3体积％。
这样的本实施方式的热传导片通过实施下述工序而得到，所述工序为：混合工序，将上述的丙烯酸类树脂、高碱氧化铝、粒径小于高碱氧化铝且被高级脂肪酸包覆的氢氧化镁、多官能单体、聚合引发剂、增塑剂和抗氧化剂混合；成形工序，将混合工序中得到的混合物向相互面对的一对塑料片之间挤出而成形为片状；和固化工序，对通过成形工序成形出的成形物进行加热使其固化。
其中，成形工序可以使用涂布机。如图1所示，涂布机10具备沿上下方向对向配置的一对辊13、13，料斗11的下端朝向一对辊13、13之间开口。另外，在一对辊13、13上分别卷绕有高分子膜14、14，随着辊13、13的旋转，一对高分子膜14、14被朝向相同方向(料斗11的相反方向)隔着规定的距离送出。
混合工序中得到的混合物C被挤出到一对高分子膜14、14之间而成形为片状(成形工序)。然后，在加热装置15内被加热而固化(固化工序)。这样，制作出热传导片。
<试验例>
以下，通过试验例对本发明更详细地进行说明。
1.高碱氧化铝与低碱氧化铝的比较研究
(热传导片的制作)
以表1所示的配合比例将各种材料混炼(混合工序)，进行真空脱泡而除去气泡后，利用涂布机10进行成形(成形工序)，在加热装置15中于105℃使其加热固化后，实施切削等加工，制作出长度25mm×宽度25mm×厚度2mm(试验片尺寸A)和长度10mm×宽度10mm×厚度1mm(试验片尺寸B)这两种片状的试样。
对于作为热传导填料的氧化铝，针对平均粒径2μm～10μm的小粒径氧化铝和平均粒径50μm～100μm的大粒径氧化铝这两种粒径分别准备高碱品和低碱品。然后，作为实施例1，制作出以使高碱品的小粒径氧化铝为23.7体积％、高碱品的大粒径氧化铝为47.3体积％的方式配合而成的氧化铝。另外，作为比较例1，制作出以使低碱品的小粒径氧化铝为23.7体积％、低碱品的大粒径氧化铝为47.3体积％的方式配合而成的氧化铝。
对于所得到的试验片尺寸A的各试样，使用依据ASTMD5470标准的测定装置，测定热阻。另外，对于试验片尺寸B的各试样，使用测定装置(Tensilon万能试验机RTC-1210A、A&D株式会社制造)，测定压缩率20％的变形所需要的压缩力。将结果一并示于表1中。
根据表1所示的结果确认到，在使用相同配合比例的两种粒径的氧化铝的情况下，使用高碱品的情况与使用低碱品的情况相比，热阻和压缩力都减小。
2.小粒径氧化铝和大粒径氧化铝的配合比例的研究
以表2所示的配合比例对各种材料进行混炼，制作出与上述同样的片状的试样。
关于作为热传导填料的氧化铝，制作出针对平均粒径3μm的小粒径氧化铝(高碱品)和平均粒径75μm的大粒径氧化铝(高碱品)使配合比例为小粒径：大粒径＝1：1(比较例2)、2：3(参考例1)、1：2(参考例2、实施例2)、2：5(参考例3)、1：3(比较例3)的试样。
使用混合工序中得到的材料，通过布鲁克菲尔德法，使用测定装置(产品名“旋转粘度计”、英弘精机株式会社制造)，测定粘性。另外，对于长度20mm×宽度50mm×厚度10mm(试验片尺寸C)的试样，使用硬度计(产品名“ASKER C硬度计”、高分子计器株式会社制造)测定ASKER C硬度。将结果一并示于表2中。
根据表2所示的结果可知，在小粒径的配合比例与大粒径同等的比较例2中，ASKER硬度为62，过高。另外，在小粒径的配合比例为大粒径的1/3以下的比较例3中，大粒径过多，不能混炼。由此确认到小粒径氧化铝(高碱品)与大粒径氧化铝(高碱品)的配合比例优选为2：3～2：5的范围内。
3.抗氧化剂的添加量的研究
相对于丙烯酸类树脂20.98重量份，使抗氧化剂的添加量以表3所示的配合比例变为0重量份(比较例4)、0.025重量份(实施例3)、0.05重量份(实施例4)、0.075重量份(实施例5)、0.1重量份(实施例6)、0.3重量份(比较例5)，配合各种材料，制作出与上述同样的片状的试样。
对于所得到的各试样，与上述同样地，测定热阻(试验片尺寸A)和压缩率20％的变形所需要的压缩力(试验片尺寸B)。进一步，将试验片尺寸20×20mm×1mm(试验片尺寸D)的试样静置于包药用纸，放入加热装置内，在40℃的温度条件下放置约168小时，进行耐热试验处理。然后，观察油渗出的程度。将结果一并示于表3中。
根据表3所示的结果确认到，在将抗氧化剂设定为0.025～0.1重量份的配合比例的情况下，热阻和压缩力减小。在不含抗氧化剂的情况下，压缩力增大至200N以上。另外，抗氧化剂多于0.3重量份时，材料不发生固化。认为这是因为，利用抗氧化剂抑制了丙烯酸类树脂的聚合。
4.增塑剂的添加量的研究
相对于丙烯酸类树脂20.98重量份，使增塑剂的添加量以表4所示的配合比例变为0重量份(比较例6)、1.0重量份(比较例7)、1.5重量份(实施例7)、2.0重量份(实施例8)、2.5重量份(实施例9)、3.0重量份(比较例8)，配合各种材料，制作出与上述同样的片状的试样。
对于所得到的各试样，与上述同样地，测定热阻(试验片尺寸A)、压缩率20％的变形所需要的压缩力(试验片尺寸B)。进一步，与上述同样地进行耐热试验，观察油渗出的程度(试验片尺寸D)。将结果一并示于表4中。
根据表4所示的结果确认到，在将增塑剂设定为1.5重量份～2.5重量份的配合比例的情况下，热阻和压缩力两者都减小。增塑剂少于1.0重量份时，压缩力变得大于200N。另外，增塑剂多于3.0重量份时，热阻变高，并且观察到油渗出，因此不优选。
5.氢氧化镁的添加量的研究
以表5所示的配合比例使被高级脂肪酸包覆的氢氧化镁的添加量变为1.4体积％(比较例9)、2.7体积％(参考例4)、4.0体积％(参考例5)、5.3体积％(参考例6)、6.6体积％(比较例10)，配合各种材料，制作出与上述同样的片状的试样。
对于混合工序中所得到的材料，与上述同样地测定粘度，并且观察触变性。另外，对于所得到的试验片尺寸C的试样，测定ASKER C硬度。将结果一并示于表5中。
根据表5所示的结果确认到，在将被高级脂肪酸包覆的氢氧化镁设定为2.7～5.3体积％的配合比例时，粘性小、且触变性良好、并且ASKER硬度降低。氢氧化镁的添加量过少至1.4体积％时(比较例9)，粘性变高、并且ASKER硬度变高。另外，添加量大于5.3体积％(比较例10)时，难以进行脱泡、硬度变高。认为这是因为，氢氧化镁有助于热传导填料彼此的滑动性。
<其它实施方式>
本发明并不限定于由上述记载和附图所说明的实施方式，例如如下所述的实施方式也包括在本发明的技术范围内。
在上述实施方式中，作为热传导填料，均是由大致球形的平均粒径2μm～10μm的小粒径氧化铝和平均粒径50μm～100μm的大粒径氧化铝这两种的混合物构成，但作为参考例，可以为进一步含有多边形且平均粒径范围50μm～100μm的碳化硅等的构成。将此时的材料的配合比例和试验结果的一例示于表6中。
符号说明
10：涂布机
11：料斗
13：辊
14：高分子膜
15：加热装置

Claims (3)

1.一种热传导片，其含有丙烯酸类聚合物、高碱氧化铝70～75体积％和粒径小于所述高碱氧化铝且被高级脂肪酸包覆的氢氧化镁2.7～5.3体积％，
压缩率20％以下的变形所需要的压缩力为200N以下，并且热阻为0.45℃/W以下。
2.如权利要求1所述的热传导片，其中，所述高碱氧化铝是将平均粒径2μm～10μm的小粒径氧化铝与平均粒径50μm～100μm的大粒径氧化铝以2：3～2：5的体积比混合而成的。
3.权利要求1或权利要求2所述的热传导片的制造方法，其中，实施如下工序：
混合工序，将丙烯酸类树脂20～25重量份、高碱氧化铝250～300重量份、粒径小于所述高碱氧化铝且被高级脂肪酸包覆的氢氧化镁4～13重量份、多官能单体0.005～0.05重量份、聚合引发剂0.1～0.3重量份、增塑剂1.2～2.8重量份％和抗氧化剂0.02～0.2重量份混合，所述丙烯酸类树脂含有使含有(甲基)丙烯酸酯的单体聚合而成的聚合物和(甲基)丙烯酸酯；
成形工序，将所述混合工序中得到的混合物向相互面对的一对塑料片之间挤出而成形为片状；和
固化工序，对通过所述成形工序成形出的成形物进行加热而使其固化。
CN201780023314.5A 2016-04-27 2017-03-29 热传导片和热传导片的制造方法 Active CN109076718B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-088912 2016-04-27
JP2016088912A JP2017199776A (ja) 2016-04-27 2016-04-27 熱伝導シート、および、熱伝導シートの製造方法
PCT/JP2017/012862 WO2017187870A1 (ja) 2016-04-27 2017-03-29 熱伝導シート、および、熱伝導シートの製造方法

Publications (2)

Publication Number Publication Date
CN109076718A true CN109076718A (zh) 2018-12-21
CN109076718B CN109076718B (zh) 2020-05-26

Family

ID=60161483

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780023314.5A Active CN109076718B (zh) 2016-04-27 2017-03-29 热传导片和热传导片的制造方法

Country Status (4)

Country Link
US (1) US10995196B2 (zh)
JP (2) JP2017199776A (zh)
CN (1) CN109076718B (zh)
WO (1) WO2017187870A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017199776A (ja) * 2016-04-27 2017-11-02 北川工業株式会社 熱伝導シート、および、熱伝導シートの製造方法
JP7255966B2 (ja) 2017-10-13 2023-04-11 株式会社シマノ 自転車用ドライブユニット
JP7148965B2 (ja) * 2018-11-08 2022-10-06 北川工業株式会社 低誘電熱伝導材用組成物、及び低誘電熱伝導材

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101120023A (zh) * 2004-07-09 2008-02-06 3M创新有限公司 导热片
CN101296976A (zh) * 2005-10-28 2008-10-29 3M创新有限公司 制备导热片的方法和利用该方法制备的导热片
CN102272209A (zh) * 2009-01-09 2011-12-07 Js电缆有限公司 阻燃膨胀橡胶及其制造方法,利用阻燃膨胀橡胶的防火垫及其制造方法
CN102980910A (zh) * 2012-11-30 2013-03-20 深圳市博恩实业有限公司 导热材料性能测试设备
CN103119079A (zh) * 2010-09-29 2013-05-22 日本电石工业株式会社 三聚氰胺环氧树脂单体及树脂组合物
CN103987790A (zh) * 2011-12-27 2014-08-13 松下电器产业株式会社 导热性树脂组合物
CN104829218A (zh) * 2015-04-20 2015-08-12 浙江自立氧化铝材料科技有限公司 一种双峰活性氧化铝微粉及其制备方法
CN105001646A (zh) * 2015-07-06 2015-10-28 安徽创宇电力设备有限公司 一种耐热导热绝缘护罩

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5128882B2 (ja) 2007-09-05 2013-01-23 関東電化工業株式会社 水酸化マグネシウム微粒子及びその製造方法
JP5363066B2 (ja) 2008-11-06 2013-12-11 電気化学工業株式会社 難燃性アクリル系熱伝導材料及びその用途
JP6015419B2 (ja) 2012-12-20 2016-10-26 トヨタ自動車株式会社 リアクトルとその製造方法
JP6152595B2 (ja) 2013-06-27 2017-06-28 北川工業株式会社 熱伝導材
JP5779693B2 (ja) 2013-06-27 2015-09-16 デクセリアルズ株式会社 熱伝導性シート、及びその製造方法、並びに半導体装置
JP6344951B2 (ja) 2014-03-31 2018-06-20 デクセリアルズ株式会社 熱伝導性シート、及び熱伝導性シートの製造方法
JP6710828B2 (ja) * 2016-04-06 2020-06-17 北川工業株式会社 熱伝導シート、および、熱伝導シートの製造方法
JP2017199776A (ja) * 2016-04-27 2017-11-02 北川工業株式会社 熱伝導シート、および、熱伝導シートの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101120023A (zh) * 2004-07-09 2008-02-06 3M创新有限公司 导热片
CN101296976A (zh) * 2005-10-28 2008-10-29 3M创新有限公司 制备导热片的方法和利用该方法制备的导热片
CN102272209A (zh) * 2009-01-09 2011-12-07 Js电缆有限公司 阻燃膨胀橡胶及其制造方法,利用阻燃膨胀橡胶的防火垫及其制造方法
CN103119079A (zh) * 2010-09-29 2013-05-22 日本电石工业株式会社 三聚氰胺环氧树脂单体及树脂组合物
CN103987790A (zh) * 2011-12-27 2014-08-13 松下电器产业株式会社 导热性树脂组合物
CN102980910A (zh) * 2012-11-30 2013-03-20 深圳市博恩实业有限公司 导热材料性能测试设备
CN104829218A (zh) * 2015-04-20 2015-08-12 浙江自立氧化铝材料科技有限公司 一种双峰活性氧化铝微粉及其制备方法
CN105001646A (zh) * 2015-07-06 2015-10-28 安徽创宇电力设备有限公司 一种耐热导热绝缘护罩

Also Published As

Publication number Publication date
US10995196B2 (en) 2021-05-04
JP2021182625A (ja) 2021-11-25
CN109076718B (zh) 2020-05-26
US20190127550A1 (en) 2019-05-02
JP2017199776A (ja) 2017-11-02
WO2017187870A1 (ja) 2017-11-02

Similar Documents

Publication Publication Date Title
CN109076718A (zh) 热传导片和热传导片的制造方法
CN104024315B (zh) 阻燃性及导电性优越的聚丙烯系树脂发泡颗粒及聚丙烯系树脂模内发泡成形体
KR102351901B1 (ko) 카복실기 함유 중합체 조성물
EP2676977B1 (en) Hydrophilic thickening agent and method of producing same
UA84038C2 (ru) композиция для теплоизоляционного слоя, способ ее приготовления и способ образования теплоизоляционного слоя на подложке
KR20180032579A (ko) 겔형상 조성물
CN108884290A (zh) 含羧基聚合物组合物的制造方法
TW201420559A (zh) 無膠體劑之有機過氧化物組合物
EP3789105A1 (en) Porous membrane for water treatment and preparation method therefor
TW201534343A (zh) 親水性增稠劑及化妝料組合物
WO2014007370A1 (ja) ジェル状組成物
KR20170010980A (ko) 친환경성, 내수성 및 내유성을 갖는 제지 코팅제 및 이를 이용한 제지의 제조방법
CN103108845A (zh) 陶瓷成型用添加剂
KR101737004B1 (ko) 재활용성, 내수성 및 내유성을 갖는 제지 코팅제의 제조방법
EP4092057A1 (en) Thermosensitive fine particles
EP1847581A1 (en) Solid adhesive agent and raw material composition for the same
CA2806827C (en) Process for producing carboxyl-containing polymer composition, and carboxyl-containing polymer composition
CN110559696A (zh) 一种消泡速度快的消泡剂及其制备方法
WO1997003128A1 (fr) Composition de polymere carboxylee
KR20170008211A (ko) n－파라핀계 잠열 축열재 조성물의 제조 방법 및 마이크로 캡슐 축열재
WO2022014546A1 (ja) 樹脂分散組成物
CN103379890A (zh) 含有非水溶性两亲共聚物作为增稠剂的化妆品制剂
WO2014069571A1 (ja) ビニルアミン単位含有重合体溶液の製造方法
JP2008255342A (ja) オキシアルキレン基含有ビニルエステル系樹脂の液性組成物及びその製造方法
JP4615843B2 (ja) 固形状接着剤およびその原料組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant