CN108834331B - A kind of method of Pin-through-hole reflow soldering - Google Patents
A kind of method of Pin-through-hole reflow soldering Download PDFInfo
- Publication number
- CN108834331B CN108834331B CN201810745937.XA CN201810745937A CN108834331B CN 108834331 B CN108834331 B CN 108834331B CN 201810745937 A CN201810745937 A CN 201810745937A CN 108834331 B CN108834331 B CN 108834331B
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- Prior art keywords
- hole
- pcb board
- welding
- pin
- connector
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Abstract
A kind of method that the present invention proposes Pin-through-hole reflow soldering, it mainly solves pin length and is less than Welding Problems of the non-high-temperature resistant connector of pcb board thickness in corresponding PCB plate through hole, this method is that the through-hole of pcb board corresponding with connector pin is first carried out to spot welding on the welding surface of pcb board to seal through-hole, tin cream is pushed in corresponding through-hole from the component side of pcb board using pusher, after the pin insertion of connector is full of in the through-hole of tin cream again, connector is fixed on pcb board using High temperature-resistanadhesive adhesive tape, single-side heating reflow welding is carried out to the corresponding through-hole of pcb board welding surface finally by heating equipment.Welding method of the invention ensure that the integrity of non-high-temperature resistant connector, have the advantages that simple and convenient operating process, welding quality and high reliablity.
Description
Technical field
The present invention relates to a kind of welding method of through-hole connector, in particular to a kind of pin when non-high-temperature resistant connector
When length is less than the thickness of pcb board, Pin-through-hole reflow soldering method of the non-high-temperature resistant connector on pcb board.
Background technique
The mode that existing connector generallys use manual welding, wave-soldering or Through-hole reflow is welded.Wave therein
Peak weldering has the protrution of connector and compares strict requirements, when the foot out of connector is long to guarantee good welding effect
When degree is unsatisfactory for requiring (the case where not going out foot mainly for connector), it is necessary to take the mode of manual repair welding to carry out this and patch
The welding of part；It is exactly when connector is a kind of component of non-high-temperature resistant there are also a kind of situation, which can only also take
The mode of manual welding is welded, and is deposited for the connector of both of these case although manual welding can be completed to weld reluctantly
In many deficiencies:
1, lead to not meet the defects of climbing tin requirement for height and easily causing cold welding, rosin joint because connector does not go out foot；
2, the saturating tin amount on pcb board in through-hole is inadequate, causes the poor welding quality of pin in hole wall, and weld strength cannot expire
Foot requires；
3, the problem of manual welding is there are low efficiency, poor reliability；
4, when there is the case where manual welding is also unable to complete welding, type selecting again is generally required, influences product function reality
It is existing.
In view of the above technical problems, Chinese invention patent application " a kind of method that Through-hole reflow connects " (application number
Do not go out foot for plug-in components 201110229361.X) or foot not enough proposes a kind of plug-in components and is welded on PCB out
Through-hole reflow on plate connects method.This method is that the plug-in unit hole site that foot is unsatisfactory for wave-soldering requirement out on pcb board is printed tin,
The pin of corresponding plug-in components is inserted into insert hole, pin brings the tin cream of a part into plug-in unit hole wall, then carries out Reflow Soldering
The method connect.The above method is that print tin is completed by a steel mesh, and the pin of Yin Xihou plug-in element will when being inserted into through-hole
Partial tin cream brings hole wall into, however this method still remains shortcoming, is compared by the tin cream amount that pin brings hole wall into
It is few, it is difficult to meet the loading requirement of scolding tin in hole, welding quality cannot be guaranteed.
Summary of the invention
It is main the object of the invention is to provide a kind of method of Pin-through-hole reflow soldering in order to make up for the deficiencies of the prior art
It solves pin length and is less than through-hole Welding Problems of the non-high-temperature resistant connector of pcb board thickness on pcb board.
It should be noted that reflow welding of the present invention also recalls fluid welding, it is the appearance with miniaturized electronic product
And the welding technique to grow up, it is mainly used in the welding of all kinds of surface-assembled components.The solder of this welding technique is
Solder(ing) paste coats appropriate and appropriate form solder(ing) paste on the pad of circuit board in advance, then SMT component is placed with corresponding
Position；Solder(ing) paste has certain viscosity, fixes component；Then it allows the circuit board for having mounted component to enter reflow welding to set
It is standby.Conveyer system drives circuit board by the temperature region of each setting in equipment, and solder(ing) paste is by dry, preheating, fusing, profit
It is wet, cooling, component is welded in printed board.
In view of existing reflow welding, the specific technical solution that the present invention uses to solve above-mentioned technical problem is:
A kind of method of Pin-through-hole reflow soldering, this method are that first the through-hole of pcb board corresponding with connector pin exists
Spot welding is carried out on the welding surface of pcb board to seal through-hole, is pushed to tin cream accordingly from the component side of pcb board using pusher
In through-hole, then connector is fixed on PCB using High temperature-resistanadhesive adhesive tape full of after in the through-hole of tin cream by the insertion of the pin of connector
On plate, single-side heating reflow welding is carried out to the corresponding through-hole of pcb board welding surface finally by heating equipment.
Preferably, the connector is the non-high-temperature resistant connector that pin length is less than corresponding pcb board thickness.
Preferably, the welding method specifically comprises the following steps:
S1 determines the through-hole on connector and corresponding pcb board；
S2 takes the mode of manual welding that the corresponding through-hole of pcb board welding surface is carried out spot welding and seals；
Tin cream is pushed to tin paste temperature returning in the through-hole of step S2 point postwelding by S3 using pusher after mixing evenly；
The connector pin of step S1 is inserted into the corresponding through-hole after step S3 fills full tin cream by S4；
The connector that through-hole is inserted into step S4 is fixed on pcb board by S5 with High temperature-resistanadhesive adhesive tape；
Pcb board in S6, overturning step S5, keeps the welding of pcb board face-up, the welding by heating equipment to pcb board
Face through-hole carries out single-side heating, and High temperature-resistanadhesive adhesive tape is torn after cooling and completes to weld.
Preferably, when pushing tin cream in through-hole using pusher in the step S3, spilling plane and through-hole when tin cream
The pcb board component side at place can stop pushing when reaching horizontality.
Preferably, the pusher in the step S3 is syringe with a scale, and the syringe needle of the syringe is also
With graduated.
Preferably, the syringe needle outer diameter of the syringe with a scale is less than the diameter of through-hole on pcb board.
Preferably, the High temperature-resistanadhesive adhesive tape in the step S5 is with strongly adherent tinfoil paper adhesive tape.
Preferably, the heating equipment in the step S6 is chip repairing station.
The beneficial effects of the present invention are:
A kind of method of Pin-through-hole reflow soldering provided by the invention efficiently solves pin length less than pcb board thickness
Welding requirements of the non-high-temperature resistant connector on pcb board, while also ensuring the integrity of non-high-temperature resistant connector, operating process
It is simple and convenient, welding quality and high reliablity, while while also solving product type selection, encounters and this must select but be unsatisfactory for
The reliability connectivity problem for the non-high-temperature resistant connector that normal welding requires, is in particular in the following aspects:
1, welding method of the invention is first to incite somebody to action the through-hole on the corresponding pcb board of connector by the way of manual spot welding
The side that through-hole is located at welding surface seals, and can guarantee that tin cream can be filled well in through-holes without leaking outside in this way；
2, welding method of the invention is used with graduated syringe, and the syringe needle of the syringe is with scale,
It is convenient that the tin cream being filled into through-hole is measured；
3, the tin cream loading of welding method of the invention is the spilling plane of tin cream and the pcb board component side where through-hole is in
Horizontality ensure that the loading of tin cream meets IPC610D (electronics industry solder joint test stone), and then guarantee welding matter
Amount；
4, connector is fixed on PCB by welding method of the invention using High temperature-resistanadhesive adhesive tape, then passes through heating equipment pair
The through-hole of pcb board welding surface carries out single-side heating, can utmostly reduce high temperature damage caused by connector in this way；
5, welding method of the invention also has operating process simple, the advantage of welding quality and high reliablity.
Detailed description of the invention
Fig. 1 is a kind of work flow diagram of Pin-through-hole reflow soldering method of the present invention.
Fig. 2 is the connector and pcb board structural schematic diagram in the specific embodiment of the invention.
Fig. 3 is schematic diagram of the pcb board in the specific embodiment of the invention in postwelding.
Fig. 4 is the schematic diagram that the syringe with a scale of tin cream is placed in the specific embodiment of the invention.
Fig. 5 is schematic diagram when filling tin cream in the specific embodiment of the invention into through-hole using syringe.
Fig. 6 is that the pin of connector is inserted into the schematic diagram in through-hole in the specific embodiment of the invention.
Fig. 7 is in the specific embodiment of the invention using the schematic diagram of the fixed connector of tinfoil paper adhesive tape.
Fig. 8 is the schematic diagram heated in the specific embodiment of the invention using through-hole of the heating equipment to pcb board.
It is as shown in the figure: 1- connector, 2-PCB plate, 3- pin, 4- through-hole, 5- syringe, 6- tin cream, 7- tinfoil paper adhesive tape, 8-
Heating equipment.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawing and specific implementation
The present invention is described in more detail for example.It is understood that described herein, specific examples are only used to explain the present invention,
It is not intended to limit the present invention.
As shown in Figure 1, the present invention provides a kind of method of Pin-through-hole reflow soldering, carry out in accordance with the following steps:
S1 determines the through-hole on connector and corresponding pcb board；
S2 takes the mode of manual welding that the corresponding through-hole of pcb board welding surface is carried out spot welding and seals；
Tin cream is pushed to tin paste temperature returning in the through-hole of step S2 point postwelding by S3 using pusher after mixing evenly；
The connector pin of step S1 is inserted into the corresponding through-hole after step S3 fills full tin cream by S4；
The connector that through-hole is inserted into step S4 is fixed on pcb board by S5 with High temperature-resistanadhesive adhesive tape；
Pcb board in S6, overturning step S5, keeps the welding of pcb board face-up, the welding by heating equipment to pcb board
Face through-hole carries out single-side heating, and High temperature-resistanadhesive adhesive tape is torn after stablizing and completes to weld.
There is provided a kind of preferred embodiment according to above-mentioned welding method, as shown in Fig. 2, the embodiment be related to connector 1 and
Pcb board 2 is set on the connector 1 there are three pin 3, and the pcb board is equipped with through-hole 4 corresponding with pin 3, the pin 3
Length be 1.9mm, the pcb board 2 with a thickness of 3.17mm, the diameter of the through-hole 4 is 0.7mm, it can be seen that, it is described to draw
The length of foot 3 is less than the thickness of pcb board 2, and the connector 1 is non-high-temperature resistant connector, it is desirable to be welded on above-mentioned connector 1
It cannot obviously be met the requirements using existing Reflow Soldering on pcb board 2.
Specifically, the welding method of above-described embodiment through the invention is completed to welding of the connector 1 on pcb board 2,
Its specific step are as follows:
The first step determines the through-hole 4 on connector 1 and corresponding pcb board 2, as shown in Figure 2；
Second step is taken the mode of manual welding that the corresponding through-hole 4 of welding surface on pcb board 2 is carried out spot welding and is sealed, after sealing
Through-hole 4 it is as shown in Figure 3；
Third step stirs evenly in merging syringe 5 as shown in figure 4, tin cream 5 is risen again, then as shown in figure 5, by pcb board
2 turn over, using syringe 5 by tin cream 6 out of, the component side of pcb board 2 pushes to passing point postwelding through-hole 4:
Specifically, syringe used in this step is syringe with a scale, syringe needle can be measured with scale
It is filled in the amount of tin cream 6 in through-hole 4；The syringe needle overall diameter of the syringe is that 0.33mm can less than the diameter 0.7mm of through-hole 4
Tin cream 6 is pushed to be smoothly inserted into through-hole, the syringe needle of syringe 5 is protruded into through-hole 4 and starts to push at the position of 0.5mm depth
Tin cream 6 can stop pushing until the spilling plane of tin cream 6 and the component side of through-hole 4 are horizontal；
The pin 3 of connector 1 is inserted into component side on corresponding pcb board 2 after tin cream 6 is full of through-hole 4 by the 4th step
In through-hole 4, as shown in Figure 6；
5th step, as shown in fig. 7, the connector 1 of above-mentioned insertion through-hole 4 is fixed on pcb board 2 with tinfoil paper adhesive tape 7 again；
6th step, then by the overturning of pcb board 2 to welding surface, carried out by welding surface through-hole 4 of the heating equipment 8 to pcb board 2
Tinfoil paper adhesive tape 7 is torn after cooling and completes to weld, as shown in Figure 8 by single-side heating；Specifically, the heating equipment 8 in this step
For chip repairing station.
Specifically, the connector 1 and corresponding pcb board 2 in above scheme are that pin length is less than the non-resistance to of pcb board thickness
High-temperature connector, for this connector, the present invention provides a kind of Pin-through-hole reflow soldering methods, after this welding method,
It efficiently solves pin length and is less than welding needs of the non-high-temperature resistant connector of pcb board thickness on pcb board, while also guaranteeing
The integrity of non-high-temperature resistant connector, operating process is simple and convenient, welding quality and high reliablity, while also solving product
The reliability connectivity problem of this non-high-temperature resistant connector that must be selected but be unsatisfactory for normal welding requirement is encountered when type selecting.
Although it should be noted that a kind of Pin-through-hole reflow soldering method provided by the invention mainly for object be pin
Length is less than the non-high-temperature resistant connector of pcb board thickness, but is also that weldering of the invention can be used for common connector
What the method for connecing was welded, welding effect is also that can guarantee.
It should be understood that the part not illustrated in specification is the prior art or common knowledge.The present embodiment is only used
It in the explanation invention, rather than limits the scope of the invention, the equivalent replacement that those skilled in the art are the present invention
Equal modifications are deemed to fall in invention claims institute protection scope.
Claims (7)
1. a kind of method of Pin-through-hole reflow soldering, it is characterised in that: this method is first will pcb board corresponding with connector pin
Through-hole carry out spot welding on the welding surface of pcb board to seal through-hole, tin cream is pushed from the component side of pcb board using pusher
To corresponding through-hole, then by the insertion of the pin of connector full of after in the through-hole of tin cream, using High temperature-resistanadhesive adhesive tape by connector
It is fixed on pcb board, single-side heating reflow welding is carried out to the corresponding through-hole of pcb board welding surface finally by heating equipment, it is described
Connector be pin length be less than corresponding pcb board thickness non-high-temperature resistant connector.
2. a kind of method of Pin-through-hole reflow soldering according to claim 1, it is characterised in that: the welding method is specific
Include the following steps:
S1 determines the through-hole on connector and corresponding pcb board；
S2 takes the mode of manual welding that the corresponding through-hole of pcb board welding surface is carried out spot welding and seals；
Tin cream is pushed to tin paste temperature returning in the through-hole of step S2 point postwelding by S3 using pusher after mixing evenly；
The connector pin of step S1 is inserted into the corresponding through-hole after step S3 fills full tin cream by S4；
The connector that through-hole is inserted into step S4 is fixed on pcb board by S5 with High temperature-resistanadhesive adhesive tape；
Pcb board in S6, overturning step S5, keeps the welding of pcb board face-up, logical by welding surface of the heating equipment to pcb board
Hole carries out single-side heating, and High temperature-resistanadhesive adhesive tape is torn after cooling and completes to weld.
3. a kind of method of Pin-through-hole reflow soldering according to claim 2, it is characterised in that: using pushing away in the step S3
When device being sent to push tin cream in through-hole, when the pcb board component side where the spilling plane of tin cream and through-hole reaches horizontality
Stop push.
4. a kind of method of Pin-through-hole reflow soldering according to claim 3, it is characterised in that: the push in the step S3
Device is syringe with a scale.
5. a kind of method of Pin-through-hole reflow soldering according to claim 4, it is characterised in that: the syringe with a scale
Syringe needle outer diameter be less than pcb board on through-hole diameter.
6. a kind of method of Pin-through-hole reflow soldering according to claim 2, it is characterised in that: the resistance to height in the step S5
Warm adhesive tape is with strongly adherent tinfoil paper adhesive tape.
7. a kind of method of Pin-through-hole reflow soldering according to claim 2, it is characterised in that: the heating in the step S6
Equipment is chip repairing station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810745937.XA CN108834331B (en) | 2018-07-09 | 2018-07-09 | A kind of method of Pin-through-hole reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810745937.XA CN108834331B (en) | 2018-07-09 | 2018-07-09 | A kind of method of Pin-through-hole reflow soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108834331A CN108834331A (en) | 2018-11-16 |
| CN108834331B true CN108834331B (en) | 2019-09-24 |
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| CN201810745937.XA Active CN108834331B (en) | 2018-07-09 | 2018-07-09 | A kind of method of Pin-through-hole reflow soldering |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112153826A (en) * | 2019-06-28 | 2020-12-29 | 株洲中车时代电气股份有限公司 | Contact pin welding method |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
| CN112911826B (en) * | 2021-01-14 | 2022-05-24 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563352A (en) * | 1991-09-02 | 1993-03-12 | Fujitsu Ltd | Mounting method of electronic parts |
| CN101827501B (en) * | 2010-03-31 | 2012-01-04 | 伟创力电子科技（上海）有限公司 | Through-hole backflow welding technology and relevant template and jig |
| CN202907341U (en) * | 2012-07-06 | 2013-04-24 | 华为终端有限公司 | Welding structure of through-hole reflow welding device |
| CN103152996B (en) * | 2013-02-06 | 2016-03-16 | 南京同创电子信息设备制造有限公司 | A kind of through hole reflux technique of close the gold-plated contact pin of distance |
| CN107371322A (en) * | 2017-07-25 | 2017-11-21 | 维沃移动通信有限公司 | A kind of preparation method of stiffening plate, stiffening plate and electronic equipment |
| CN108112190A (en) * | 2018-01-17 | 2018-06-01 | 郑州云海信息技术有限公司 | A kind of method for the multiple rows of connector through hole welding of high-layer super thick wiring board |
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