CN207573735U - A kind of through-hole tin cream fills chromatography tooling - Google Patents
A kind of through-hole tin cream fills chromatography tooling Download PDFInfo
- Publication number
- CN207573735U CN207573735U CN201721418256.XU CN201721418256U CN207573735U CN 207573735 U CN207573735 U CN 207573735U CN 201721418256 U CN201721418256 U CN 201721418256U CN 207573735 U CN207573735 U CN 207573735U
- Authority
- CN
- China
- Prior art keywords
- hole
- chromatography
- web plate
- component
- size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004587 chromatography analysis Methods 0.000 title claims abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000006071 cream Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000007639 printing Methods 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model belongs to electronic product surface mounting technology field, and in particular to through-hole component is carried out at the same time reflow ovens welding with Surface Mount Component, it is therefore an objective to solve the problems, such as that ventilating hole element can not be carried out at the same time reflow soldering with Surface Mount component.A kind of through-hole tin cream filling chromatography tooling of the utility model includes chromatography web plate, and multiple holes and groove are provided on chromatography web plate, wherein, size and through-hole component (6) pin size in hole on PCB in chromatography web plate hole are ratios 2:1 relationship, gap is greater than or equal to 0.2mm between adjacent holes；The size of groove and Surface Mount component (5) it is in the same size.The utility model realizes a procedure and completes production, improves welding quality, suitable for the situation of element complexity, reduces process.
Description
Technical field
The utility model belongs to electronic product surface mounting technology field, and in particular to through-hole component and surface mount member
Device is carried out at the same time reflow ovens welding.
Background technology
In PCB assemblings at present, element pasted on surface accounts for about 80%, cost 60%, and ventilating hole element accounts for about 20%, into
This is 40%.This mixed plate is that cannot be welded using conventional backflow welding technology, need to use Reflow Soldering and wave-soldering twice
Process.However Wave soldering is applied to the welding of ventilating hole element printed board assembly that there are many shortcomings：Be not suitable for height
Density, the welding of thin space element；Bridge joint, solder skip are more；Scaling powder need to be sprayed；Printed board is by larger thermal shock buckling deformation.
If Surface Mount component 5 is allowed to be carried out at the same time reflow soldering with through-hole component 6, ventilating hole element tin cream loading just must satisfy
It is required that the loading of tin cream determines the success or failure of 6 reflow soldering of through-hole component, and because the element body of ventilating hole element compares
Greatly, the amount of solder paste of solder joint is than Surface Mount component more than 5, all necessary in the welding surfaces of placing components, component side and plug-in opening
Tin cream is filled up, so the successful key of 6 Reflow Soldering of through-hole component is the loading of tin cream amount.Therefore chromatography web plate meets logical
The loading of hole tin cream solves the problems, such as that ventilating hole element can not be carried out at the same time reflow soldering with Surface Mount component 5, realizes one
Procedure completes production, improves welding quality, reduces process.
Invention content
The technology of the utility model solves the problems, such as：
The problem of ventilating hole element is carried out at the same time reflow soldering with Surface Mount Component.
The technical solution of the utility model is：
1. the larger material of chromatography web plate selection friction coefficient：POM.Compared with common web plate material plate, when work, increases
The frictional force that big scraper 1 is contacted with web plate, can more fully fill tin cream.
2. increasing the thickness of web plate, 5mm is increased to by original 2mm, the more tin creams of addition in through-hole can be made in this way.
3. pair web plate carries out reaming, web plate bore size is by 100% reaming to 200%.The opening size of web plate should compare PCB
Plate pad amplifies, and the requirement of the amount of amplification adjacent is opened according to determining to the accurate calculating of 6 solder paste amounts of through-hole component
Gap is greater than or equal to 0.2mm between mouthful, prevents from causing during welding bad, and finally determining web plate bore size is by 100% reaming
To 200%.
4. chromatography web plate adds man-hour requirement that the web plate bottom at 5 soldering paste figure of Surface Mount component is thinned, it is not open, as
It covers and uses, window only is outputed to the pad of through-hole component 6.
The utility model has the beneficial effect that compared with prior art：
1. it is applicable to the Surface Mount component 5 of relatively thin template.
2. require big multiple row abnormity, ventilating hole element complex situations suitable for amount of solder paste.
3. solder paste amounts can be controlled accurately, soldering reliability is improved.
4. solve ventilating hole element is carried out at the same time Reflow Soldering with Surface Mount Component.
5. simple for process, welding quality is good, at low cost, pcb board face is clean.
Description of the drawings
Fig. 1 uses chromatography web plate front elevation for the utility model.
Fig. 2 uses chromatography web plate reverse side figure for the utility model.
Fig. 3 is the utility model implementation process schematic diagram.
In figure：1. scraper, 2. printing PCB reverse side, 3.PCB printed boards, 4. printing PCB fronts, 5. Surface Mount components, 6. is logical
Hole component.
Specific embodiment
A kind of through-hole tin cream of the utility model filling chromatography tooling is carried out in the following with reference to the drawings and specific embodiments detailed
Thin description：
As shown in Figure 1 and Figure 2, a kind of through-hole tin cream filling chromatography tooling, including chromatography web plate, is provided with more on chromatography web plate
A hole and groove, wherein, size and 6 pin of the through-hole component size in hole on PCB in chromatography web plate hole are ratios 2:1
Relationship, gap is greater than or equal to 0.2mm between adjacent holes；The size of groove and Surface Mount component 5 it is in the same size.
As shown in figure 3, the printing object of chromatography web plate includes：Print PCB fronts 4, Surface Mount component 5, through-hole component
6.PCB printed boards 3 include：Print PCB reverse side 2, printing PCB fronts 4；Surface Mount component 5 is mounted on printing PCB fronts 4；It is logical
The welding foot of hole component 6 passes through the through-hole of PCB printed boards 3, is welded on printing PCB reverse side 2 and in PCB through hole.
During work, chromatography web plate needs to combine common web plate completion overprinting process.First with common reverse side screen printing PCB
2 tin cream of reverse side, in order to increase solder paste amounts, using 45 degree of two-way round-trip print solder paste and 1 angle of scraper, print pass 2 times, patch
Reflow ovens welding is crossed after filling Surface Mount component 5；Then again with positive 4 tin creams of common front screen printing PCB, 1 angle 45 of scraper
Degree, print pass 2 times carry out reflow soldering；Then 2 tin cream of chromatography web plate back face printing PCB reverse side is used, chromatography web plate needs energy
The Surface Mount component 5 of PCB reverse side 2 is enough blocked, therefore, web plate adds man-hour requirement to subtract the template bottom at Surface Mount component 5
It is thin, it can be bonded with 3 reverse side of PCB printed boards, web plate can block the Surface Mount component 5 of PCB reverse side 2, only to through-hole component 6
Pad output window, 6 lead of through-hole component is passed through PCB by 45 degree of 1 angle of scraper, print pass 3 times from PCB fronts,
Ensure that 6 lead surrounding of through-hole component has tin cream, and mounts Surface Mount component 5 in PCB fronts, then will mount what is completed
PCB printed boards 3 are sent into reflow ovens and are welded.
Solder after printing should soak the surface of whole welding positions, and form weld seam around solder joint surrounding.Through-hole welds,
Through-hole should fill solder, and more than 90% cladding element surface and face of weld, and solder allows in recessed retraction hole, and recessed contracting amount is
Solder is recessed to be up to 25% plate thickness.
Using above-mentioned chromatography web plate, solve the problems, such as ventilating hole element can not reflow soldering, and can realize table
Face paste fills component 5 and is carried out at the same time Reflow Soldering with through-hole component 6, improves welding quality, reduces process.
Claims (4)
1. a kind of through-hole tin cream fills chromatography tooling, including chromatography web plate, it is characterised in that：Be provided on chromatography web plate multiple holes and
Groove, wherein, the size in the hole of the size and through-hole component (6) pin in chromatography web plate hole on PCB is ratio 2:1 pass
System；The size of groove and Surface Mount component (5) it is in the same size.
2. through-hole tin cream as described in claim 1 fills chromatography tooling, it is characterised in that：Gap is more than or waits between adjacent holes
In 0.2mm.
3. through-hole tin cream as described in claim 1 fills chromatography tooling, it is characterised in that：The thickness of chromatography web plate is 5mm.
4. through-hole tin cream as described in claim 1 fills chromatography tooling, it is characterised in that：Chromatography web plate material is POM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721418256.XU CN207573735U (en) | 2017-10-30 | 2017-10-30 | A kind of through-hole tin cream fills chromatography tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721418256.XU CN207573735U (en) | 2017-10-30 | 2017-10-30 | A kind of through-hole tin cream fills chromatography tooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573735U true CN207573735U (en) | 2018-07-03 |
Family
ID=62693475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721418256.XU Expired - Fee Related CN207573735U (en) | 2017-10-30 | 2017-10-30 | A kind of through-hole tin cream fills chromatography tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207573735U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747679A (en) * | 2021-09-06 | 2021-12-03 | 天津津航计算技术研究所 | Reflow soldering method for through hole plug-in device of military lead-free mixed printed board assembly |
-
2017
- 2017-10-30 CN CN201721418256.XU patent/CN207573735U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747679A (en) * | 2021-09-06 | 2021-12-03 | 天津津航计算技术研究所 | Reflow soldering method for through hole plug-in device of military lead-free mixed printed board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180703 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |