CN206077850U - A kind of steel mesh - Google Patents

A kind of steel mesh Download PDF

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Publication number
CN206077850U
CN206077850U CN201620936125.XU CN201620936125U CN206077850U CN 206077850 U CN206077850 U CN 206077850U CN 201620936125 U CN201620936125 U CN 201620936125U CN 206077850 U CN206077850 U CN 206077850U
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CN
China
Prior art keywords
steel mesh
circuit board
perforate
stepped region
fpcb
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620936125.XU
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Chinese (zh)
Inventor
梁昌明
欧志国
朱全文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Mingmei new energy Co., Ltd
Original Assignee
Guangzhou Liangshi Communication Appliance Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201620936125.XU priority Critical patent/CN206077850U/en
Application granted granted Critical
Publication of CN206077850U publication Critical patent/CN206077850U/en
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Abstract

The utility model discloses a kind of steel mesh, including at least one perforate unit;Each perforate unit is two-sided stairstepping, and each perforate unit includes the first stepped region and the second stepped region, the position empty avoiding of second stepped region bottom;Second stepped region is provided with least one perforate, and the perforate is corresponded to.The structure design of the perforate unit can be applied to the overall structure of two circuit boards after laminating, the paste solder printing of circuit board joint place pad can be realized by steel mesh, the problems such as be advantageously implemented the lifting of quality of circuit board, the tin sweat(ing) solved in existing welding procedure, rosin joint.

Description

A kind of steel mesh
Technical field
This utility model is related to surface mounting technology (SMT, Surface Mounted Technology) field, particularly It is related to a kind of printed steel mesh for realizing the welding between circuit board.
Background technology
With developing rapidly for electron trade, electronic product is various in style, precise electronic components and parts be widely used with Industry-by-industry, while the quality and yields requirement to precise electronic components and parts is higher.The surface mounting technology of circuit board it is good The bad working (machining) efficiency for directly affecting its production, yields, and the quality of surface mounting technology is closely bound up with steel mesh, so printing The structure design of steel mesh is extremely important.
Steel mesh is the mould for print solder paste, is taped against in board pads by steel mesh opening leakage, i.e., during print solder paste Printed in board pads by steel mesh perforate, then cross stove.
Circuit board is divided into PCB and FPCB;Current PC B and the existing two types of FPCB bond patterns:
Class1:PCB and FPCB passes through tin soldering machine or both are weldingly connected by hot press:
Shortcoming:1) in welding process, because of rapid heating-cooling, its solder easily produces tin sweat(ing), so as to cause functional shunting with And the protecting film on FPCB surfaces is easily scalded;2) solder joint concordance is poor, and quality is unstable;3) after the completion of the welding of PCB mount components Weld with FPCB offline again, two procedures operation, therefore production efficiency bottom need to be divided, manufacturing cost is high;4) investment buying is needed to weld Stannum machine or hot press device.
Type 2:Then FPCB is mounted on tin cream reflow soldering together by the print solder paste on PCB pads:
Shortcoming:1) tin cream molding is easily destroyed during mounting FPCB, produce tin sweat(ing), so as to cause functional shunting;2) Only FPCB bottom lands are eaten stannum and are easily stripped so as to easily form rosin joint and single-sided welding its solder joint.
Welding and circuit board between circuit board and circuit board need to separate multiple working procedure with the welding of components and parts and can just complete, The steel mesh for being wherein applied to the adopted print solder paste of welding between circuit board and circuit board cannot realize unit on circuit board simultaneously The paste solder printing of device, and circuit board and the pad paste solder printing at welding circuit board, complex procedures.
Utility model content
The purpose of this utility model is to provide one kind to adopt steel mesh, can solve the problem that what is welded between circuit board and circuit board Occur the problem of tin sweat(ing) and rosin joint in prior art, make firm welding, welding after product it is more safe and reliable.
For achieving the above object, this utility model provides a kind of steel mesh, a kind of steel mesh, it is characterised in that the steel mesh bag Include at least one perforate unit;Each perforate unit is two-sided stairstepping, and each perforate unit includes the first rank Terraced area and the second stepped region, the position empty avoiding of second stepped region bottom;Second stepped region is provided with least one and opens Hole, the perforate correspond to.
Compared with prior art, this utility model is used in SMT techniques, by the perforate unit of steel mesh is designed as rank Ladder, while perforate unit is provided with the perforate corresponding to the common pad for being used for laminating on first circuit board and second circuit board. By the perforate unit, the pad paste solder printing at the place that can realize fitting between first circuit board and second circuit board is solved existing The bad quality problem such as tin sweat(ing), rosin joint in welding procedure.
Further, the entirety after each perforate unit can be fitted with the first circuit board and second circuit board Overlap.
Further, at least one remaining pad for corresponding to the second circuit board is additionally provided with second stepped region The perforate of setting.
Further, first stepped region is provided with least one and corresponding with remaining pad of the first circuit board sets The perforate put.
Compared with prior art, this utility model is additionally provided with perforate correspondence first circuit board and/or the on perforate unit Remaining pad on two circuit boards, is realizing the paste solder printing of first circuit board and second circuit board for pad bonded to each other While can realize first circuit board and/or the electronic devices and components on second circuit board attachment paste solder printing, simplify operation Greatly promote production efficiency, save production cost and equipment investment.
Further, the spacing between first stepped region and second stepped region is more than or equal to the second circuit The thickness of plate.
Further, first stepped region and second stepped region are of uniform thickness.
Further, the steel mesh also includes steel mesh body, and each perforate unit is in the steel mesh body Between region.
Further, the steel mesh also includes posting, and the posting is located on the side of the steel mesh body, the steel The excessively described posting positioning of Netcom.
Further, the first circuit board is PCB, and the second circuit board is FPCB;Or, the first circuit board is FPCB, the second circuit board are PCB.
Description of the drawings
Fig. 1 is a kind of steel mesh top view of the preferred embodiment of steel mesh of this utility model;
Fig. 2 is a kind of steel mesh upward view of the preferred embodiment of steel mesh of this utility model;
Fig. 3 is a kind of steel mesh front view of the preferred embodiment of steel mesh of this utility model;
Fig. 4 is a kind of structural representation of the perforate unit of the preferred embodiment of steel mesh of this utility model;
Fig. 5 is a kind of steel mesh pictorial diagram being placed in solder printing machine of preferred embodiment of steel mesh of this utility model.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only this utility model a part of embodiment, rather than whole Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment for being obtained, belongs to the scope of this utility model protection.
Referring to Fig. 1, Fig. 2 and Fig. 3, Fig. 1, Fig. 2 and Fig. 3 are a kind of steel of the preferred embodiment of steel mesh of this utility model respectively Net top view, upward view and front view.In figure, a kind of steel mesh that this utility model embodiment is provided, including some perforate units 1;The steel mesh also includes steel mesh body 2 and posting 3.Specifically, some perforate units 1 are located at the zone line of steel mesh body 2, On the side of steel mesh body 2, posting 3 is used to position steel mesh in the position of stencil printer posting 3.
Fig. 4 is a kind of structural representation of the perforate unit of the preferred embodiment of steel mesh of this utility model, referring to Fig. 1, is opened The shape of hole unit 1 is designed as two-sided stairstepping;According to the shape, perforate unit 1 includes the first stepped region 11 and second-order Terraced area 12.Do corresponding empty avoiding in the position of 12 bottom of the second stepped region correspondence first circuit board and second circuit board joint place.
The present embodiment, second circuit board are provided with through hole, first circuit board and for the pad fitted with first circuit board When two circuit boards are fitted, second circuit board is overlayed on first circuit board;The perforate of the steel mesh provided by the present embodiment will Paste solder printing is used for the pad for fitting on the second circuit board so that being printed on second circuit board is used for and first circuit board On the pad of the first circuit board that the tin cream on the pad of laminating penetrates into bottom in welding by through hole, first circuit board is made Together with being closely attached by tin cream with second circuit board.
Or, first circuit board is provided with through hole for the pad fitted with second circuit board, when first circuit board and second electric When road plate is fitted, first circuit board is stacked on the second circuit board, and the first circuit board and second circuit board can also be by these The steel mesh print solder paste that embodiment is provided realizes corresponding welding effect.
Here with first circuit board as PCB, second circuit board is FPCB, and FPCB be used to the fitting pads of PCB are provided with logical The present embodiment is further illustrated as a example by hole:The laminating of PCB and FPCB before being welded, refers to by other instruments Auxiliary, make PCB and FPCB need pad bonded to each other to be superimposed and adduct together, but welded between pad.
Do corresponding empty avoiding in the position of 12 bottom of the second stepped region correspondence PCB and FPCB joint places.Perforate unit 1 can be with Overall coincidence after PCB and FPCB laminatings.
Wherein, thickness of the spacing between the first stepped region 11 and the second stepped region 12 more than or equal to FPCB.First ladder Area 11 and the second stepped region 12 are of uniform thickness.
First stepped region 11 is provided with several perforates 101;Perforate 101 is corresponded to Pad arrange;
Second stepped region 12 is provided with several perforates 102;Perforate 102 is used for bonded to each other corresponding to PCB and FPCB Pad is arranged.Herein, perforation is equipped with for the pad bonded to each other with PCB on FPCB, FPCB is superimposed upon on PCB, Liang Zheshi After now bonded to each other, perforate 102 can correspond to FPCB for the pad fitted with PCB, and by being used for pasting on perforation and PCB Close the pad correspondence of FPCB.
Referring to Fig. 5, the opening area on 1 constituted steel mesh of some perforate units can be with some PCB and some FPCB points Not Tie He after the integrated circuit plate that formed overlap.Steel mesh can be placed in stencil printer by the positioning of posting 3.
When being embodied as, the steel mesh provided by the present embodiment is placed on stencil printer by the positioning of posting 3 of itself In, in specific print solder paste operation:The PCB and FPCB after other instruments auxiliary are fitted is placed on into tin cream first In printer;Then, the PCB and FPCB after laminating is sent to the bottom of steel mesh and by paste solder printing by automatically delivering track Position of opening of the optical alignment of machine by the pad locations of PCB and FPCB after laminating with steel mesh is corresponded:
Specifically, the PCB and FPCB after each laminating is completely superposed with each perforate unit 1 of steel mesh;PCB and FPCB is folded At corresponding empty avoiding at conjunction corresponding to the ladder bottom of the second stepped region 12;PCB and FPCB after laminating fits the pad at place Corresponding with the perforate 102 of the second stepped region 12, remaining pad of PCB is corresponding with the first stepped region 11 perforate 101.
Finally, by the automatic printing of stencil printer scraper, tin cream is printed on after laminating by the perforate of steel mesh Above PCB and FPCB pads, while the first device of attachment on the pad paste solder printing and PCB at the place that realizes fitting between PCB and FPCB The solder printing of the pad of part.
The present embodiment simplifies operation to be greatly promoted production efficiency, has saved production cost and equipment investment;On the other hand, Welding between the PCB realized by the steel mesh print solder paste of the present embodiment and FPCB, solder joint effect are good, solve existing Welder Tin sweat(ing), rosin joint in skill etc. are bad, so as to improve the quality of electronic product.
The above is preferred implementation of the present utility model, it is noted that for the ordinary skill of the art For personnel, on the premise of without departing from this utility model principle, some improvement and deformation can also be made, these improve and become Shape is also considered as protection domain of the present utility model.

Claims (9)

1. a kind of steel mesh, it is characterised in that the steel mesh includes at least one perforate unit;Each perforate unit is two-sided Stairstepping, each perforate unit include the first stepped region and the second stepped region, the position of second stepped region bottom Empty avoiding;Second stepped region is provided with least one perforate, and the perforate is corresponding on first circuit board and second circuit board Arrange for pad bonded to each other.
2. steel mesh as claimed in claim 1, it is characterised in that each perforate unit can with the first circuit board and Overall coincidence after second circuit board laminating.
3. steel mesh as claimed in claim 1, it is characterised in that at least one is additionally provided with second stepped region corresponding to institute State the perforate that remaining pad of second circuit board is arranged.
4. steel mesh as claimed in claim 1, it is characterised in that first stepped region is provided with least one with described first The perforate that remaining pad of circuit board is correspondingly arranged.
5. steel mesh as claimed in claim 1, it is characterised in that between first stepped region and second stepped region Away from the thickness more than or equal to the second circuit board.
6. steel mesh as claimed in claim 1, it is characterised in that the thickness one of first stepped region and second stepped region Sample.
7. steel mesh as claimed in claim 1, it is characterised in that the steel mesh also includes steel mesh body, each perforate list Zone line of the unit located at the steel mesh body.
8. steel mesh as claimed in claim 1, it is characterised in that the steel mesh also includes posting, the posting is located at institute State on the side of steel mesh body, the steel mesh is positioned by the posting.
9. the steel mesh as described in any one of claim 1~8, it is characterised in that the first circuit board is PCB, described second Circuit board is FPCB;Or, the first circuit board is FPCB, the second circuit board is PCB.
CN201620936125.XU 2016-08-24 2016-08-24 A kind of steel mesh Active CN206077850U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620936125.XU CN206077850U (en) 2016-08-24 2016-08-24 A kind of steel mesh

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620936125.XU CN206077850U (en) 2016-08-24 2016-08-24 A kind of steel mesh

Publications (1)

Publication Number Publication Date
CN206077850U true CN206077850U (en) 2017-04-05

Family

ID=58431755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620936125.XU Active CN206077850U (en) 2016-08-24 2016-08-24 A kind of steel mesh

Country Status (1)

Country Link
CN (1) CN206077850U (en)

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GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 510670 Guangzhou Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, the first, second and third floors of No. 39 (1) South Cloud Road

Patentee after: Guangzhou new energy Co. Ltd.

Address before: 510663 No. 39 (1), South Yun three road, science and Technology City, Guangzhou high tech Industrial Development Zone, Guangdong

Patentee before: GUANGZHOU LIANGSHI COMMUNICATION APPLIANCE CO., LTD.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 510000 the first floor, second floor and third floor of Building 1, No.39, Yunsan Road, Science City, Guangzhou high tech Industrial Development Zone, Guangdong Province

Patentee after: Guangzhou Mingmei new energy Co., Ltd

Address before: 510670 Guangzhou Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, the first, second and third floors of No. 39 (1) South Cloud Road

Patentee before: GUANGZHOU TWS NEW ENERGY Co.,Ltd.