A kind of steel mesh
Technical field
This utility model is related to surface mounting technology (SMT, Surface Mounted Technology) field, particularly
It is related to a kind of printed steel mesh for realizing the welding between circuit board.
Background technology
With developing rapidly for electron trade, electronic product is various in style, precise electronic components and parts be widely used with
Industry-by-industry, while the quality and yields requirement to precise electronic components and parts is higher.The surface mounting technology of circuit board it is good
The bad working (machining) efficiency for directly affecting its production, yields, and the quality of surface mounting technology is closely bound up with steel mesh, so printing
The structure design of steel mesh is extremely important.
Steel mesh is the mould for print solder paste, is taped against in board pads by steel mesh opening leakage, i.e., during print solder paste
Printed in board pads by steel mesh perforate, then cross stove.
Circuit board is divided into PCB and FPCB;Current PC B and the existing two types of FPCB bond patterns:
Class1:PCB and FPCB passes through tin soldering machine or both are weldingly connected by hot press:
Shortcoming:1) in welding process, because of rapid heating-cooling, its solder easily produces tin sweat(ing), so as to cause functional shunting with
And the protecting film on FPCB surfaces is easily scalded;2) solder joint concordance is poor, and quality is unstable;3) after the completion of the welding of PCB mount components
Weld with FPCB offline again, two procedures operation, therefore production efficiency bottom need to be divided, manufacturing cost is high;4) investment buying is needed to weld
Stannum machine or hot press device.
Type 2:Then FPCB is mounted on tin cream reflow soldering together by the print solder paste on PCB pads:
Shortcoming:1) tin cream molding is easily destroyed during mounting FPCB, produce tin sweat(ing), so as to cause functional shunting;2)
Only FPCB bottom lands are eaten stannum and are easily stripped so as to easily form rosin joint and single-sided welding its solder joint.
Welding and circuit board between circuit board and circuit board need to separate multiple working procedure with the welding of components and parts and can just complete,
The steel mesh for being wherein applied to the adopted print solder paste of welding between circuit board and circuit board cannot realize unit on circuit board simultaneously
The paste solder printing of device, and circuit board and the pad paste solder printing at welding circuit board, complex procedures.
Utility model content
The purpose of this utility model is to provide one kind to adopt steel mesh, can solve the problem that what is welded between circuit board and circuit board
Occur the problem of tin sweat(ing) and rosin joint in prior art, make firm welding, welding after product it is more safe and reliable.
For achieving the above object, this utility model provides a kind of steel mesh, a kind of steel mesh, it is characterised in that the steel mesh bag
Include at least one perforate unit;Each perforate unit is two-sided stairstepping, and each perforate unit includes the first rank
Terraced area and the second stepped region, the position empty avoiding of second stepped region bottom;Second stepped region is provided with least one and opens
Hole, the perforate correspond to.
Compared with prior art, this utility model is used in SMT techniques, by the perforate unit of steel mesh is designed as rank
Ladder, while perforate unit is provided with the perforate corresponding to the common pad for being used for laminating on first circuit board and second circuit board.
By the perforate unit, the pad paste solder printing at the place that can realize fitting between first circuit board and second circuit board is solved existing
The bad quality problem such as tin sweat(ing), rosin joint in welding procedure.
Further, the entirety after each perforate unit can be fitted with the first circuit board and second circuit board
Overlap.
Further, at least one remaining pad for corresponding to the second circuit board is additionally provided with second stepped region
The perforate of setting.
Further, first stepped region is provided with least one and corresponding with remaining pad of the first circuit board sets
The perforate put.
Compared with prior art, this utility model is additionally provided with perforate correspondence first circuit board and/or the on perforate unit
Remaining pad on two circuit boards, is realizing the paste solder printing of first circuit board and second circuit board for pad bonded to each other
While can realize first circuit board and/or the electronic devices and components on second circuit board attachment paste solder printing, simplify operation
Greatly promote production efficiency, save production cost and equipment investment.
Further, the spacing between first stepped region and second stepped region is more than or equal to the second circuit
The thickness of plate.
Further, first stepped region and second stepped region are of uniform thickness.
Further, the steel mesh also includes steel mesh body, and each perforate unit is in the steel mesh body
Between region.
Further, the steel mesh also includes posting, and the posting is located on the side of the steel mesh body, the steel
The excessively described posting positioning of Netcom.
Further, the first circuit board is PCB, and the second circuit board is FPCB;Or, the first circuit board is
FPCB, the second circuit board are PCB.
Description of the drawings
Fig. 1 is a kind of steel mesh top view of the preferred embodiment of steel mesh of this utility model;
Fig. 2 is a kind of steel mesh upward view of the preferred embodiment of steel mesh of this utility model;
Fig. 3 is a kind of steel mesh front view of the preferred embodiment of steel mesh of this utility model;
Fig. 4 is a kind of structural representation of the perforate unit of the preferred embodiment of steel mesh of this utility model;
Fig. 5 is a kind of steel mesh pictorial diagram being placed in solder printing machine of preferred embodiment of steel mesh of this utility model.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only this utility model a part of embodiment, rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of this utility model protection.
Referring to Fig. 1, Fig. 2 and Fig. 3, Fig. 1, Fig. 2 and Fig. 3 are a kind of steel of the preferred embodiment of steel mesh of this utility model respectively
Net top view, upward view and front view.In figure, a kind of steel mesh that this utility model embodiment is provided, including some perforate units
1;The steel mesh also includes steel mesh body 2 and posting 3.Specifically, some perforate units 1 are located at the zone line of steel mesh body 2,
On the side of steel mesh body 2, posting 3 is used to position steel mesh in the position of stencil printer posting 3.
Fig. 4 is a kind of structural representation of the perforate unit of the preferred embodiment of steel mesh of this utility model, referring to Fig. 1, is opened
The shape of hole unit 1 is designed as two-sided stairstepping;According to the shape, perforate unit 1 includes the first stepped region 11 and second-order
Terraced area 12.Do corresponding empty avoiding in the position of 12 bottom of the second stepped region correspondence first circuit board and second circuit board joint place.
The present embodiment, second circuit board are provided with through hole, first circuit board and for the pad fitted with first circuit board
When two circuit boards are fitted, second circuit board is overlayed on first circuit board;The perforate of the steel mesh provided by the present embodiment will
Paste solder printing is used for the pad for fitting on the second circuit board so that being printed on second circuit board is used for and first circuit board
On the pad of the first circuit board that the tin cream on the pad of laminating penetrates into bottom in welding by through hole, first circuit board is made
Together with being closely attached by tin cream with second circuit board.
Or, first circuit board is provided with through hole for the pad fitted with second circuit board, when first circuit board and second electric
When road plate is fitted, first circuit board is stacked on the second circuit board, and the first circuit board and second circuit board can also be by these
The steel mesh print solder paste that embodiment is provided realizes corresponding welding effect.
Here with first circuit board as PCB, second circuit board is FPCB, and FPCB be used to the fitting pads of PCB are provided with logical
The present embodiment is further illustrated as a example by hole:The laminating of PCB and FPCB before being welded, refers to by other instruments
Auxiliary, make PCB and FPCB need pad bonded to each other to be superimposed and adduct together, but welded between pad.
Do corresponding empty avoiding in the position of 12 bottom of the second stepped region correspondence PCB and FPCB joint places.Perforate unit 1 can be with
Overall coincidence after PCB and FPCB laminatings.
Wherein, thickness of the spacing between the first stepped region 11 and the second stepped region 12 more than or equal to FPCB.First ladder
Area 11 and the second stepped region 12 are of uniform thickness.
First stepped region 11 is provided with several perforates 101;Perforate 101 is corresponded to
Pad arrange;
Second stepped region 12 is provided with several perforates 102;Perforate 102 is used for bonded to each other corresponding to PCB and FPCB
Pad is arranged.Herein, perforation is equipped with for the pad bonded to each other with PCB on FPCB, FPCB is superimposed upon on PCB, Liang Zheshi
After now bonded to each other, perforate 102 can correspond to FPCB for the pad fitted with PCB, and by being used for pasting on perforation and PCB
Close the pad correspondence of FPCB.
Referring to Fig. 5, the opening area on 1 constituted steel mesh of some perforate units can be with some PCB and some FPCB points
Not Tie He after the integrated circuit plate that formed overlap.Steel mesh can be placed in stencil printer by the positioning of posting 3.
When being embodied as, the steel mesh provided by the present embodiment is placed on stencil printer by the positioning of posting 3 of itself
In, in specific print solder paste operation:The PCB and FPCB after other instruments auxiliary are fitted is placed on into tin cream first
In printer;Then, the PCB and FPCB after laminating is sent to the bottom of steel mesh and by paste solder printing by automatically delivering track
Position of opening of the optical alignment of machine by the pad locations of PCB and FPCB after laminating with steel mesh is corresponded:
Specifically, the PCB and FPCB after each laminating is completely superposed with each perforate unit 1 of steel mesh;PCB and FPCB is folded
At corresponding empty avoiding at conjunction corresponding to the ladder bottom of the second stepped region 12;PCB and FPCB after laminating fits the pad at place
Corresponding with the perforate 102 of the second stepped region 12, remaining pad of PCB is corresponding with the first stepped region 11 perforate 101.
Finally, by the automatic printing of stencil printer scraper, tin cream is printed on after laminating by the perforate of steel mesh
Above PCB and FPCB pads, while the first device of attachment on the pad paste solder printing and PCB at the place that realizes fitting between PCB and FPCB
The solder printing of the pad of part.
The present embodiment simplifies operation to be greatly promoted production efficiency, has saved production cost and equipment investment;On the other hand,
Welding between the PCB realized by the steel mesh print solder paste of the present embodiment and FPCB, solder joint effect are good, solve existing Welder
Tin sweat(ing), rosin joint in skill etc. are bad, so as to improve the quality of electronic product.
The above is preferred implementation of the present utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of without departing from this utility model principle, some improvement and deformation can also be made, these improve and become
Shape is also considered as protection domain of the present utility model.