CN108807187B - 印刷方法 - Google Patents

印刷方法 Download PDF

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Publication number
CN108807187B
CN108807187B CN201810394147.1A CN201810394147A CN108807187B CN 108807187 B CN108807187 B CN 108807187B CN 201810394147 A CN201810394147 A CN 201810394147A CN 108807187 B CN108807187 B CN 108807187B
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CN
China
Prior art keywords
droplets
printing
different sizes
droplet
unit
Prior art date
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Active
Application number
CN201810394147.1A
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English (en)
Chinese (zh)
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CN108807187A (zh
Inventor
金哲佑
吴凡政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
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Semes Co Ltd
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Publication date
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Publication of CN108807187A publication Critical patent/CN108807187A/zh
Application granted granted Critical
Publication of CN108807187B publication Critical patent/CN108807187B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
CN201810394147.1A 2017-05-02 2018-04-27 印刷方法 Active CN108807187B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0056017 2017-05-02
KR1020170056017A KR101960273B1 (ko) 2017-05-02 2017-05-02 인쇄 방법

Publications (2)

Publication Number Publication Date
CN108807187A CN108807187A (zh) 2018-11-13
CN108807187B true CN108807187B (zh) 2021-12-28

Family

ID=64094028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810394147.1A Active CN108807187B (zh) 2017-05-02 2018-04-27 印刷方法

Country Status (2)

Country Link
KR (1) KR101960273B1 (ko)
CN (1) CN108807187B (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000177153A (ja) * 1998-12-17 2000-06-27 Canon Inc インクジェット印刷方法
JP2007029830A (ja) * 2005-07-25 2007-02-08 Toppan Printing Co Ltd インクジェット塗工方法および装置
JP2010224248A (ja) * 2009-03-24 2010-10-07 Toppan Printing Co Ltd 吐出パターンの生成方法、生成装置、カラーフィルタ及び有機エレクトロルミネッセンス素子
CN104128292A (zh) * 2013-04-30 2014-11-05 细美事有限公司 基板处理装置以及基板处理方法
CN104827770A (zh) * 2014-02-07 2015-08-12 株式会社村田制作所 印刷方法及印刷装置
CN106024589A (zh) * 2016-07-22 2016-10-12 华南理工大学 一种薄膜的喷墨印刷制备方法及薄膜晶体管的制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140130003A (ko) * 2013-04-30 2014-11-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000177153A (ja) * 1998-12-17 2000-06-27 Canon Inc インクジェット印刷方法
JP2007029830A (ja) * 2005-07-25 2007-02-08 Toppan Printing Co Ltd インクジェット塗工方法および装置
JP2010224248A (ja) * 2009-03-24 2010-10-07 Toppan Printing Co Ltd 吐出パターンの生成方法、生成装置、カラーフィルタ及び有機エレクトロルミネッセンス素子
CN104128292A (zh) * 2013-04-30 2014-11-05 细美事有限公司 基板处理装置以及基板处理方法
CN104827770A (zh) * 2014-02-07 2015-08-12 株式会社村田制作所 印刷方法及印刷装置
CN106024589A (zh) * 2016-07-22 2016-10-12 华南理工大学 一种薄膜的喷墨印刷制备方法及薄膜晶体管的制备方法

Also Published As

Publication number Publication date
KR101960273B1 (ko) 2019-03-20
CN108807187A (zh) 2018-11-13
KR20180122063A (ko) 2018-11-12

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