CN108753059A - 一种导电胶带底涂及其制备工艺 - Google Patents
一种导电胶带底涂及其制备工艺 Download PDFInfo
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Abstract
本发明公开了一种导电胶带底涂及其制备工艺,底涂组分按重量份数包括聚四氟乙烯乳液10‑20份、聚苯硫醚5‑15份、碳纤维2‑6份、导电粉4‑12份、固化剂3‑9份、β‑壳聚糖1‑3份、偶联剂4‑10份,本发明制备工艺简单,制得的底涂附着能力强,不易刮伤,抗冲击性能强,而且导电性能好。
Description
技术领域
本发明涉及底涂制备技术领域,具体为一种导电胶带底涂及其制备工艺。
背景技术
传统的底涂是采用与铝箔附着较好的树脂作为连接料,树脂由于其自身的软化点和机械性能的因素会给后道工序例如流平、再涂性、相容性等带来一定的影响。
发明内容
本发明的目的在于提供一种导电胶带底涂及其制备工艺,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种导电胶带底涂,底涂组分按重量份数包括聚四氟乙烯乳液10-20份、聚苯硫醚5-15份、碳纤维2-6份、导电粉4-12份、固化剂3-9份、β-壳聚糖1-3份、偶联剂4-10份。
优选的,底涂组分优选的成分配比包括聚四氟乙烯乳液15份、聚苯硫醚10份、碳纤维4份、导电粉8份、固化剂6份、β-壳聚糖2份、偶联剂7份。
优选的,所述导电粉为颗粒状导电碳黑和片状导电石墨或颗粒状导电碳黑和石墨烯按质量比为2:1混合而成。
优选的,所述偶联剂由20%聚二甲基硅氧烷、30%聚乙烯石蜡、30%硅藻土、20%过氧化二异丙苯复配而成。
优选的,其制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为200-400转/分,时间为4min-10min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为80℃-100℃,时间为5min-8min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置4h-8h,即得到底涂。
与现有技术相比,本发明的有益效果是:
(1)本发明制备工艺简单,制得的底涂附着能力强,不易刮伤,抗冲击性能强,而且导电性能好。
(2)本发明采用的偶联剂性能优良,能够增强底涂与基材表面的粘合力,进一步提高了底涂的机械性能。
具体实施方式
下面对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明提供如下技术方案:一种导电胶带底涂,底涂组分按重量份数包括聚四氟乙烯乳液10-20份、聚苯硫醚5-15份、碳纤维2-6份、导电粉4-12份、固化剂3-9份、β-壳聚糖1-3份、偶联剂4-10份;其中,导电粉为颗粒状导电碳黑和片状导电石墨或颗粒状导电碳黑和石墨烯按质量比为2:1混合而成;偶联剂由20%聚二甲基硅氧烷、30%聚乙烯石蜡、30%硅藻土、20%过氧化二异丙苯复配而成。
实施例一:
底涂组分按重量份数包括聚四氟乙烯乳液10份、聚苯硫醚5份、碳纤维2份、导电粉4份、固化剂3份、β-壳聚糖1份、偶联剂4份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为200转/分,时间为4min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为80℃,时间为5min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置4h,即得到底涂。
实施例二:
底涂组分按重量份数包括聚四氟乙烯乳液20份、聚苯硫醚15份、碳纤维6份、导电粉12份、固化剂9份、β-壳聚糖3份、偶联剂10份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为400转/分,时间为10min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为100℃,时间为8min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置8h,即得到底涂。
实施例三:
底涂组分按重量份数包括聚四氟乙烯乳液12份、聚苯硫醚6份、碳纤维3份、导电粉6份、固化剂4份、β-壳聚糖1份、偶联剂5份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为250转/分,时间为5min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为85℃,时间为6min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置5h,即得到底涂。
实施例四:
底涂组分按重量份数包括聚四氟乙烯乳液18份、聚苯硫醚13份、碳纤维6份、导电粉10份、固化剂8份、β-壳聚糖3份、偶联剂9份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为350转/分,时间为9min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为95℃,时间为7min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置7h,即得到底涂。
实施例五:
底涂组分按重量份数包括聚四氟乙烯乳液16份、聚苯硫醚12份、碳纤维3份、导电粉9份、固化剂5份、β-壳聚糖3份、偶联剂6份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为280转/分,时间为6min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为92℃,时间为6min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置6.5h,即得到底涂。
实施例六:
底涂组分按重量份数包括聚四氟乙烯乳液15份、聚苯硫醚10份、碳纤维4份、导电粉8份、固化剂6份、β-壳聚糖2份、偶联剂7份。
本实施例的制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为300转/分,时间为7min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为90℃,时间为6min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置6h,即得到底涂。
本发明采用的偶联剂性能优良,能够增强底涂与基材表面的粘合力,进一步提高了底涂的机械性能。
实验例:
采用本发明各实施例制得的底涂进行性能测试,得到数据如下表:
抗冲击力(Kg/cm) | 导电率(%IACS) | |
实施例一 | 288 | 32 |
实施例二 | 295 | 31 |
实施例三 | 292 | 31 |
实施例四 | 285 | 30 |
实施例五 | 290 | 31 |
实施例六 | 298 | 33 |
本发明制备工艺简单,制得的底涂附着能力强,不易刮伤,抗冲击性能强,而且导电性能好。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (5)
1.一种导电胶带底涂,其特征在于:底涂组分按重量份数包括聚四氟乙烯乳液10-20份、聚苯硫醚5-15份、碳纤维2-6份、导电粉4-12份、固化剂3-9份、β-壳聚糖1-3份、偶联剂4-10份。
2.根据权利要求1所述的一种导电胶带底涂,其特征在于:底涂组分优选的成分配比包括聚四氟乙烯乳液15份、聚苯硫醚10份、碳纤维4份、导电粉8份、固化剂6份、β-壳聚糖2份、偶联剂7份。
3.根据权利要求1所述的一种导电胶带底涂,其特征在于:所述导电粉为颗粒状导电碳黑和片状导电石墨或颗粒状导电碳黑和石墨烯按质量比为2:1混合而成。
4.根据权利要求1所述的一种导电胶带底涂,其特征在于:所述偶联剂由20%聚二甲基硅氧烷、30%聚乙烯石蜡、30%硅藻土、20%过氧化二异丙苯复配而成。
5.实现权利要求1所述的一种导电胶带底涂的制备工艺,其特征在于:其制备工艺包括以下步骤:
A、将聚四氟乙烯乳液、聚苯硫醚、碳纤维、导电粉混合后加入搅拌罐中低速搅拌,搅拌速率为200-400转/分,时间为4min-10min,得到混合物A;
B、在混合物A中依次加入β-壳聚糖、偶联剂,充分混合后加入加热罐中加热反应,加热温度为80℃-100℃,时间为5min-8min,之后缓慢冷却至室温后,得到混合物B;
C、在混合物B中加入固化剂,在常温下充分搅拌后,静置4h-8h,即得到底涂。
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