CN108735918B - 柔性器件的制造装置及制造方法 - Google Patents
柔性器件的制造装置及制造方法 Download PDFInfo
- Publication number
- CN108735918B CN108735918B CN201810361332.0A CN201810361332A CN108735918B CN 108735918 B CN108735918 B CN 108735918B CN 201810361332 A CN201810361332 A CN 201810361332A CN 108735918 B CN108735918 B CN 108735918B
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- support substrate
- layered structure
- flexible
- vacuum chuck
- porous vacuum
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 163
- 238000012545 processing Methods 0.000 claims abstract description 49
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 230000001678 irradiating effect Effects 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000003463 adsorbent Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 claims 26
- 239000010409 thin film Substances 0.000 claims 1
- 238000011084 recovery Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 238000003825 pressing Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-084729 | 2017-04-21 | ||
| JP2017084729A JP6888812B2 (ja) | 2017-04-21 | 2017-04-21 | フレキシブルデバイスの製造装置及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108735918A CN108735918A (zh) | 2018-11-02 |
| CN108735918B true CN108735918B (zh) | 2023-07-28 |
Family
ID=63939192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810361332.0A Active CN108735918B (zh) | 2017-04-21 | 2018-04-20 | 柔性器件的制造装置及制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6888812B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102499047B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN108735918B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI744517B (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250130438A (ko) * | 2018-12-21 | 2025-09-01 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
| CN112026331B (zh) * | 2019-06-03 | 2022-05-13 | 万向一二三股份公司 | 一种泡棉离型纸剥离机构及其剥离方法 |
| CN114334779A (zh) * | 2021-12-28 | 2022-04-12 | 深圳市华星光电半导体显示技术有限公司 | 激光剥离设备以及激光剥离方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004306191A (ja) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | テーブル装置、成膜装置、光学素子、半導体素子及び電子機器 |
| KR101149433B1 (ko) | 2009-08-28 | 2012-05-22 | 삼성모바일디스플레이주식회사 | 플렉서블 표시 장치 및 그 제조 방법 |
| KR101097344B1 (ko) * | 2010-03-09 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 플렉서블 디스플레이 장치의 제조 방법 |
| JP2011233426A (ja) * | 2010-04-28 | 2011-11-17 | Tazmo Co Ltd | 有機膜の焼成装置及び該装置によって焼成された有機膜を有する有機素子 |
| JP2012069557A (ja) * | 2010-09-21 | 2012-04-05 | Covalent Materials Corp | ポーラスチャック及びその製造方法 |
| JP2013191746A (ja) * | 2012-03-14 | 2013-09-26 | Toshiba Corp | 半導体装置の製造方法、半導体製造装置 |
| JP2013251191A (ja) * | 2012-06-01 | 2013-12-12 | Dainippon Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
| JP2014048619A (ja) * | 2012-09-04 | 2014-03-17 | Panasonic Corp | フレキシブルデバイスの製造方法 |
| KR102025704B1 (ko) * | 2012-09-14 | 2019-09-27 | 삼성디스플레이 주식회사 | 필름 검사 장치 |
| KR20140062368A (ko) * | 2012-11-14 | 2014-05-23 | 엘지디스플레이 주식회사 | 플렉서블 표시장치의 제조방법 |
| KR102158971B1 (ko) * | 2013-03-11 | 2020-09-24 | 삼성디스플레이 주식회사 | 기판 박리 장치, 기판 박리 방법 및 플렉서블 표시 장치 제조 방법 |
| KR102113174B1 (ko) * | 2013-04-30 | 2020-05-21 | 삼성디스플레이 주식회사 | 플렉시블 디스플레이 장치의 제조방법 |
| KR102135933B1 (ko) * | 2013-12-31 | 2020-07-21 | 엘지디스플레이 주식회사 | 플렉서블 유기발광다이오드 표시장치의 제조방법 |
| US9437839B2 (en) * | 2014-06-19 | 2016-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing electronic device and electronic device manufactured thereby |
| JP5954549B2 (ja) * | 2014-08-01 | 2016-07-20 | 日東電工株式会社 | 可撓性薄膜構造の表示セルを取り扱う方法 |
-
2017
- 2017-04-21 JP JP2017084729A patent/JP6888812B2/ja active Active
-
2018
- 2018-04-13 TW TW107112748A patent/TWI744517B/zh active
- 2018-04-20 KR KR1020180046170A patent/KR102499047B1/ko active Active
- 2018-04-20 CN CN201810361332.0A patent/CN108735918B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102499047B1 (ko) | 2023-02-13 |
| TWI744517B (zh) | 2021-11-01 |
| TW201843861A (zh) | 2018-12-16 |
| JP6888812B2 (ja) | 2021-06-16 |
| KR20180118556A (ko) | 2018-10-31 |
| JP2018181815A (ja) | 2018-11-15 |
| CN108735918A (zh) | 2018-11-02 |
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