CN108735630B - 基片处理装置和基片处理方法 - Google Patents

基片处理装置和基片处理方法 Download PDF

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Publication number
CN108735630B
CN108735630B CN201810365860.3A CN201810365860A CN108735630B CN 108735630 B CN108735630 B CN 108735630B CN 201810365860 A CN201810365860 A CN 201810365860A CN 108735630 B CN108735630 B CN 108735630B
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CN
China
Prior art keywords
sensor
nozzle
wafer
distance
substrate
Prior art date
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Active
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CN201810365860.3A
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English (en)
Chinese (zh)
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CN108735630A (zh
Inventor
川原幸三
饭田成昭
下川大辅
大村和久
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN108735630A publication Critical patent/CN108735630A/zh
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Publication of CN108735630B publication Critical patent/CN108735630B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201810365860.3A 2017-04-24 2018-04-23 基片处理装置和基片处理方法 Active CN108735630B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017085362A JP7220975B2 (ja) 2017-04-24 2017-04-24 基板処理装置及び基板処理方法
JP2017-085362 2017-04-24

Publications (2)

Publication Number Publication Date
CN108735630A CN108735630A (zh) 2018-11-02
CN108735630B true CN108735630B (zh) 2023-05-09

Family

ID=63939149

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810365860.3A Active CN108735630B (zh) 2017-04-24 2018-04-23 基片处理装置和基片处理方法

Country Status (4)

Country Link
JP (1) JP7220975B2 (ko)
KR (1) KR102493144B1 (ko)
CN (1) CN108735630B (ko)
TW (1) TWI768028B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831849B (zh) 2018-12-07 2024-02-11 日商索尼股份有限公司 圖像顯示裝置及投射光學系統
US11227778B2 (en) * 2019-08-12 2022-01-18 Nanya Technology Corporation Wafer cleaning apparatus and operation method of the same
CN113628986B (zh) * 2020-05-06 2024-03-26 长鑫存储技术有限公司 湿法处理设备及其的控制方法、存储介质和电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1949079A (zh) * 2005-10-13 2007-04-18 东京毅力科创株式会社 涂敷装置以及涂敷方法

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Publication number Priority date Publication date Assignee Title
AU2219299A (en) * 1998-01-09 1999-07-26 Fastar, Ltd. Moving head, coating apparatus and method
JP3782279B2 (ja) * 1999-04-08 2006-06-07 東京エレクトロン株式会社 膜形成方法及び膜形成装置
KR100585448B1 (ko) * 1999-04-08 2006-06-02 동경 엘렉트론 주식회사 막 형성방법 및 막 형성장치
JP4447331B2 (ja) * 2004-01-08 2010-04-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4490797B2 (ja) * 2004-01-23 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP2005211767A (ja) * 2004-01-28 2005-08-11 Seiko Epson Corp スリットコート式塗布装置及びスリットコート式塗布方法
EP1961492B1 (en) * 2005-11-30 2022-04-13 Musashi Engineering, Inc. Method of adjusting nozzle clearance of liquid coater and liquid coater
JP2008034746A (ja) * 2006-07-31 2008-02-14 Tokyo Electron Ltd 塗布、現像装置、その方法及び記憶媒体
JP4982527B2 (ja) * 2009-06-08 2012-07-25 株式会社東芝 成膜装置及び成膜方法
JP5398785B2 (ja) * 2011-06-20 2014-01-29 株式会社東芝 スパイラル塗布装置及びスパイラル塗布方法
JP5789569B2 (ja) * 2012-06-27 2015-10-07 東京エレクトロン株式会社 塗布装置およびノズル
JP6333065B2 (ja) * 2013-07-09 2018-05-30 東京エレクトロン株式会社 塗布装置
JP6272138B2 (ja) * 2014-05-22 2018-01-31 東京エレクトロン株式会社 塗布処理装置
JP6267141B2 (ja) * 2014-06-04 2018-01-24 東京エレクトロン株式会社 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体
CN104607368B (zh) * 2014-12-29 2017-03-08 深圳市轴心自控技术有限公司 一种对点胶位置进行高度补偿的方法
JP6531831B2 (ja) * 2015-10-06 2019-06-19 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1949079A (zh) * 2005-10-13 2007-04-18 东京毅力科创株式会社 涂敷装置以及涂敷方法

Also Published As

Publication number Publication date
KR102493144B1 (ko) 2023-01-27
CN108735630A (zh) 2018-11-02
TWI768028B (zh) 2022-06-21
JP2018186120A (ja) 2018-11-22
KR20180119139A (ko) 2018-11-01
TW201902588A (zh) 2019-01-16
JP7220975B2 (ja) 2023-02-13

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