CN1087198C - 基体涂漆或涂膜用的装置和方法 - Google Patents
基体涂漆或涂膜用的装置和方法 Download PDFInfo
- Publication number
- CN1087198C CN1087198C CN95197003A CN95197003A CN1087198C CN 1087198 C CN1087198 C CN 1087198C CN 95197003 A CN95197003 A CN 95197003A CN 95197003 A CN95197003 A CN 95197003A CN 1087198 C CN1087198 C CN 1087198C
- Authority
- CN
- China
- Prior art keywords
- liquid
- container
- parts
- capillary slit
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4445985.8 | 1994-12-22 | ||
DE4445985A DE4445985A1 (de) | 1994-12-22 | 1994-12-22 | Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1172443A CN1172443A (zh) | 1998-02-04 |
CN1087198C true CN1087198C (zh) | 2002-07-10 |
Family
ID=6536721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95197003A Expired - Lifetime CN1087198C (zh) | 1994-12-22 | 1995-03-11 | 基体涂漆或涂膜用的装置和方法 |
Country Status (10)
Country | Link |
---|---|
EP (3) | EP1210984B1 (zh) |
KR (1) | KR100209117B1 (zh) |
CN (1) | CN1087198C (zh) |
AT (3) | ATE228395T1 (zh) |
AU (1) | AU701991B2 (zh) |
DE (3) | DE59510915D1 (zh) |
DK (2) | DK0972575T3 (zh) |
ES (2) | ES2189333T3 (zh) |
GR (1) | GR3036846T3 (zh) |
TW (1) | TW397709B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1296145C (zh) * | 2003-04-10 | 2007-01-24 | Hoya株式会社 | 基板处理装置、涂敷装置及涂敷方法 |
CN1305586C (zh) * | 2003-05-07 | 2007-03-21 | Hoya株式会社 | 基板涂覆装置和基板涂覆方法 |
TWI458562B (zh) * | 2009-11-27 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | 液體回收方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4169719B2 (ja) * | 2004-03-30 | 2008-10-22 | Hoya株式会社 | レジスト膜付基板の製造方法 |
JP2008168254A (ja) * | 2007-01-15 | 2008-07-24 | Hoya Corp | 塗布方法及び塗布装置、並びにフォトマスクブランクの製造方法 |
JP5086708B2 (ja) * | 2007-06-29 | 2012-11-28 | Hoya株式会社 | マスクブランクの製造方法及び塗布装置 |
DE102011081980B4 (de) * | 2011-09-01 | 2023-07-06 | Gebr. Schmid Gmbh & Co. | Vorrichtung zum Benetzen von flachen Substraten und Anlage mit einer solchen Vorrichtung |
KR20140069677A (ko) * | 2012-11-29 | 2014-06-10 | 삼성디스플레이 주식회사 | 기판 프린팅 장치 및 기판 프린팅 방법 |
CN105080789B (zh) * | 2015-08-10 | 2017-11-07 | 深圳市华星光电技术有限公司 | 涂布装置及涂布器 |
CN109594056B (zh) * | 2018-12-18 | 2021-02-12 | 国家电投集团科学技术研究院有限公司 | 基板及制备方法、封孔系统、包壳管 |
CN111804504B (zh) * | 2020-05-29 | 2021-12-31 | 中国船舶重工集团公司第七0七研究所 | 一种基于毛细作用的光纤环圈制作用在线施胶装置 |
CN112024283A (zh) * | 2020-08-20 | 2020-12-04 | 深圳市裕展精密科技有限公司 | 导入装置、导入方法及产品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2046596A (en) * | 1932-01-13 | 1936-07-07 | Patent Button Co | Apparatus for uniformly coating flat surfaces |
DE2204625A1 (de) * | 1972-02-01 | 1973-08-09 | Schildkroet Spielwaren | Benetzungsvorrichtung |
DE9103494U1 (zh) | 1991-03-21 | 1992-07-16 | Hamatech Halbleiter-Maschinenbau Und Technologie Gmbh, 7137 Sternenfels, De | |
DE9300777U1 (de) | 1993-01-21 | 1994-05-19 | Siemens Ag | Elektrische Durchführung mit Spannungsabgriff |
ATE173657T1 (de) * | 1993-05-05 | 1998-12-15 | Steag Micro Tech Gmbh | Vorrichtung zur belackung oder beschichtung von platten oder scheiben |
JP2798503B2 (ja) * | 1993-05-27 | 1998-09-17 | 大日本印刷株式会社 | 液塗布方法および塗布装置 |
-
1995
- 1995-03-11 AT AT99120202T patent/ATE228395T1/de not_active IP Right Cessation
- 1995-03-11 KR KR1019960704172A patent/KR100209117B1/ko not_active IP Right Cessation
- 1995-03-11 DK DK99120202T patent/DK0972575T3/da active
- 1995-03-11 AU AU20686/95A patent/AU701991B2/en not_active Ceased
- 1995-03-11 EP EP02003487A patent/EP1210984B1/de not_active Expired - Lifetime
- 1995-03-11 DK DK95913085T patent/DK0799096T3/da active
- 1995-03-11 DE DE59510915T patent/DE59510915D1/de not_active Expired - Lifetime
- 1995-03-11 DE DE59509410T patent/DE59509410D1/de not_active Expired - Lifetime
- 1995-03-11 ES ES99120202T patent/ES2189333T3/es not_active Expired - Lifetime
- 1995-03-11 DE DE59510480T patent/DE59510480D1/de not_active Expired - Lifetime
- 1995-03-11 EP EP95913085A patent/EP0799096B1/de not_active Expired - Lifetime
- 1995-03-11 EP EP99120202A patent/EP0972575B1/de not_active Expired - Lifetime
- 1995-03-11 AT AT95913085T patent/ATE202954T1/de not_active IP Right Cessation
- 1995-03-11 ES ES95913085T patent/ES2161285T3/es not_active Expired - Lifetime
- 1995-03-11 CN CN95197003A patent/CN1087198C/zh not_active Expired - Lifetime
- 1995-03-11 AT AT02003487T patent/ATE269168T1/de not_active IP Right Cessation
- 1995-06-09 TW TW084105865A patent/TW397709B/zh not_active IP Right Cessation
-
2001
- 2001-10-09 GR GR20010401710T patent/GR3036846T3/el not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1296145C (zh) * | 2003-04-10 | 2007-01-24 | Hoya株式会社 | 基板处理装置、涂敷装置及涂敷方法 |
CN1305586C (zh) * | 2003-05-07 | 2007-03-21 | Hoya株式会社 | 基板涂覆装置和基板涂覆方法 |
TWI458562B (zh) * | 2009-11-27 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | 液體回收方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE228395T1 (de) | 2002-12-15 |
EP0972575A3 (de) | 2000-11-15 |
EP0972575B1 (de) | 2002-11-27 |
AU701991B2 (en) | 1999-02-11 |
GR3036846T3 (en) | 2002-01-31 |
ES2161285T3 (es) | 2001-12-01 |
EP0799096B1 (de) | 2001-07-11 |
EP0799096A1 (de) | 1997-10-08 |
EP1210984A3 (de) | 2002-08-21 |
TW397709B (en) | 2000-07-11 |
CN1172443A (zh) | 1998-02-04 |
ES2189333T3 (es) | 2003-07-01 |
DE59509410D1 (de) | 2001-08-16 |
DE59510915D1 (de) | 2004-07-22 |
ATE269168T1 (de) | 2004-07-15 |
AU2068695A (en) | 1996-07-10 |
EP1210984A2 (de) | 2002-06-05 |
DK0972575T3 (da) | 2003-03-24 |
EP1210984B1 (de) | 2004-06-16 |
EP0972575A2 (de) | 2000-01-19 |
ATE202954T1 (de) | 2001-07-15 |
KR100209117B1 (ko) | 1999-07-15 |
DK0799096T3 (da) | 2001-11-05 |
DE59510480D1 (de) | 2003-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: STEAG MICRO/TECH GMBH STERNENFELS TO: STEGGE HAAM TECHNOLOGY STOCK CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Don Fels, Germany Applicant after: STEAG HAMATECH AG Address before: German prietz Schoenberg Applicant before: STEAG MICROTECH GmbH |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HAMATECH APE GMBH + CO. KG Free format text: FORMER OWNER: SINGULUS TECHNOLOGIES AG Effective date: 20120828 Owner name: SINGULUS TECHNOLOGIES AG Free format text: FORMER OWNER: HAMATECH AG Effective date: 20120828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: HAMATECH AG Free format text: FORMER NAME: STEAG HAMATECH GMBH MACHINES |
|
CP01 | Change in the name or title of a patent holder |
Address after: Don Fels, Germany Patentee after: HAMA Technologies AG Address before: Don Fels, Germany Patentee before: STEAG HAMATECH AG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120828 Address after: Don Fels, Germany Patentee after: Hama Technology APE Lianghe Address before: German Messe Carle Patentee before: Singulus Technologies AG Effective date of registration: 20120828 Address after: German Messe Carle Patentee after: SINGULUS TECHNOLOGIES AG Address before: Don Fels, Germany Patentee before: HAMA Technologies AG |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20150311 Granted publication date: 20020710 |