CN108695245A - 加工方法 - Google Patents
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- CN108695245A CN108695245A CN201810224516.2A CN201810224516A CN108695245A CN 108695245 A CN108695245 A CN 108695245A CN 201810224516 A CN201810224516 A CN 201810224516A CN 108695245 A CN108695245 A CN 108695245A
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
- B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
- B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
- B23D59/025—Devices for lubricating or cooling circular saw blades the lubricating or cooling medium being applied through the mounting means of the tool, e.g. the tool spindle or hub
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/025—Details of saw blade body
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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Abstract
本发明提供一种加工方法,该加工方法在对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工时,能够在维持加工品质的同时提高加工速度。该加工方法对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工,该加工方法具备下述步骤:保持步骤,利用保持工作台对被加工物进行保持;和切削步骤,在实施保持步骤后,利用环状的切削刀具沿着切断预定线对被加工物进行切削,分割层叠体;切削刀具具有两个以上的贯通孔,该两个以上的贯通孔从在切削步骤中切入被加工物的、该切削刀具的外周部的表面贯通到背面并且在外周缘不开口,在切削步骤中,一边对被加工物供给包含有机酸和氧化剂的切削液,一边执行切削。
Description
技术领域
本发明涉及用于对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工的加工方法。
背景技术
在以移动电话、个人计算机为代表的电子设备中,具备电子电路等器件的器件芯片成为了必要的构成要素。器件芯片例如如下得到:利用两条以上的切断预定线(间隔道)对由硅等半导体材料形成的晶片的表面进行划分,在各区域形成器件后,沿着该切断预定线将晶片切断,由此得到器件芯片。
近年来,大多在上述那样的晶片的切断预定线上形成被称为TEG(Test ElementsGroup,测试元件组)的评价用元件(参见例如专利文献1、2等),用于评价器件的电特性。通过在切断预定线上形成TEG,能够最大限度地确保器件芯片的取得数,并且能够与晶片的切断同时除去评价后不需要的TEG。
上述那样的器件芯片通常在安装至基板等之前用树脂进行密封。例如,用树脂密封两个以上的器件芯片而形成封装基板,沿着与各器件芯片对应的切断预定线对该封装基板进行切断,由此得到器件芯片被树脂密封的状态的封装器件。
然而,在封装基板的切断预定线上设置有包含金属的两个以上的层叠体,若将封装基板切断,则该层叠体也一起被切断。各层叠体通过金属线等而与器件芯片的电极连接,通过与封装基板一起被切断而成为封装器件的电极。
现有技术文献
专利文献
专利文献1:日本特开平6-349926号公报
专利文献2:日本特开2005-21940号公报
发明内容
发明所要解决的课题
但是,若要使用磨粒分散于结合材料中而成的切削刀具对作为TEG或电极等发挥功能的包含金属的层叠体进行切削、除去,则层叠体所含的金属在切削时伸长,容易产生被称为毛刺的突起。并且,若利用切削刀具进行的加工的速度提高,则放热量增加,毛刺也变大。因此,在该方法中,为了不使加工品质降低,需要将加工速度抑制得较低。
本发明是鉴于上述问题而完成的,其目的在于提供一种加工方法,该加工方法在对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工时,能够在维持加工品质的同时提高加工速度。
用于解决课题的手段
根据本发明的一个方式,提供一种加工方法,该加工方法对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工,该加工方法具备下述步骤:保持步骤,利用保持工作台对被加工物进行保持;和切削步骤,在实施该保持步骤后,利用环状的切削刀具沿着该切断预定线对被加工物进行切削,分割该层叠体;该切削刀具具有两个以上的贯通孔,该两个以上的贯通孔从在该切削步骤中切入被加工物的、该切削刀具的外周部的表面贯通到背面并且在外周缘不开口,在该切削步骤中,一边对被加工物供给包含有机酸和氧化剂的切削液,一边进行切削。
发明效果
在本发明的一个方式的加工方法中,利用切削刀具分割包含金属的层叠体时,供给包含有机酸和氧化剂的切削液,因此能够一边利用有机酸和氧化剂对金属进行改性而使其延展性降低,一边执行切削。由此,即便提高加工的速度,也能抑制毛刺的产生。
另外,在本发明的一个方式的加工方法中,使用具有从外周部的表面贯通到背面、并且在外周缘不开口的两个以上的贯通孔的切削刀具,因此能够通过该贯通孔将上述切削液高效地供给至层叠体,能够在将金属充分改性而使其延展性降低的同时执行切削。由此,即便进一步提高加工的速度,也能抑制毛刺的产生。即,能够在维持加工品质的同时提高加工速度。
附图说明
图1的(A)是示意性地示出被加工物的结构例的俯视图,图1的(B)是示意性地示出被加工物的结构例的仰视图。
图2的(A)是用于说明保持步骤的截面图,图2的(B)是用于说明切削步骤的局部截面侧视图。
图3是示意性地示出切削刀具的结构例的主视图。
图4是示出用于供给切削液的其它方式的喷嘴的主视图。
具体实施方式
参照附图,对本发明的一个方式的实施方式进行说明。本实施方式的加工方法是用于对与切断预定线(间隔道)重叠地形成有包含金属的层叠体的板状的被加工物进行加工的加工方法,该加工方法包括保持步骤(参照图2的(A))和切削步骤(参照图2的(B)、图3)。
在保持步骤中,利用切削装置的治具工作台(保持工作台)对被加工物进行保持。在切削步骤中,一边供给包含有机酸和氧化剂的切削液,一边利用环状的切削刀具沿着切断预定线对被加工物进行切削,将被加工物与层叠体一起切断(分割),该环状的切削刀具两个以上的贯通孔,该两个以上的贯通孔从在该切削步骤中切入被加工物的、该切削刀具的外周部的表面贯通到背面并且在外周缘不开口。下面,对本实施方式的加工方法进行详细说明。
图1的(A)是示意性地示出本实施方式中被加工的被加工物11的结构例的俯视图,图1的(B)是示意性地示出被加工物11的结构例的仰视图。如图1的(A)和图1的(B)所示,被加工物11例如为将两个以上的器件芯片(未图示)密封而成的封装基板,包含俯视时形成为矩形状的金属的框体13。
框体13例如由42合金(铁与镍的合金)、铜等金属构成,其表面13a侧被分成两个以上(本实施方式中为三个)的器件区域15、和包围各器件区域15的外周剩余区域17。各器件区域15被交叉的两条以上的切断预定线(间隔道)19进一步划分成两个以上的区域,在各区域形成有载台21。
在各载台21的背面侧(框体13的背面13b侧)配置有包含IC(Integrated Circuit,集成电路)、LED(Light Emitting Diode,发光二极管)、MEMS(Micro Electro MechanicalSystems,微电子机械系统)等器件的器件芯片(未图示)。在框体13的背面13b侧的与各器件区域15对应的区域形成有密封树脂层23,配置于各载台21的背面侧的器件芯片被该密封树脂层23覆盖。
在各载台21的周围,与切断预定线19重叠地形成有包含金属的两个以上的层叠体25。该层叠体25在框体13的表面13a侧露出,并且通过金属线(未图示)等而与器件芯片的电极连接。在一个层叠体25连接有分别配置于夹着该层叠体25而相邻的两个载台21的器件芯片的电极。
例如,沿着切断预定线19将被加工物11切断,形成器件芯片被密封的封装器件时,该层叠体25也被分割。分割后的层叠体25成为各封装器件的电极。需要说明的是,在框体13的外周剩余区域17(表面13a)形成有用于示出切断预定线19的位置的标记物27。
需要说明的是,在本实施方式中,将两个以上的器件芯片被密封树脂层23密封而成的封装基板作为被加工物11,但对于被加工物11的材质、形状、结构、尺寸等没有限制。同样地,对于器件芯片(器件)或层叠体25的种类、数量、形状、结构、尺寸、配置等也没有限制。
例如,也可以使用下述晶片等作为被加工物11:与切断预定线19重叠地形成有作为TEG(Test Elements Group,测试元件组)发挥功能的层叠体的晶片;在背面侧形成有作为电极发挥功能的包含钛(Ti)、镍(Ni)、金(Au)等金属的层叠体的晶片。
在本实施方式的加工方法中,首先进行保持步骤:利用切削装置的治具工作台(保持工作台)对上述被加工物11进行保持。图2的(A)是用于说明保持步骤的截面图。保持步骤例如使用图2的(A)等所示的切削装置2来进行。需要说明的是,在图2的(A)中,为了便于说明,仅示出层叠体25作为被加工物11的构成要素。
如图2的(A)等所示,切削装置2具备用于吸引、保持被加工物11的治具工作台(保持工作台)4。在治具工作台4的下方配置有与吸引源(未图示)连接的治具基座(未图示)。该治具基座与电动机等旋转驱动源(未图示)连结,绕与铅垂方向大致平行的旋转轴旋转。另外,在治具基座的更下方设置有加工进给机构(未图示),治具基座通过该加工进给机构在加工进给方向上移动。
在治具基座的上表面侧例如以可拆卸的方式安装有与被加工物11对应的治具工作台4。治具工作台4例如在俯视时为矩形状的平板,其上表面的一部分成为用于吸引、保持被加工物11的保持面4a。在治具工作台4的保持面4a侧形成有与被加工物11的切断预定线19对应的退刀槽4b。退刀槽4b的上端在保持面4a开口。通过该退刀槽4b,保持面4a被划分成与切断后的被加工物11对应的两个以上的区域。
在由退刀槽4b划分的各区域形成有吸引孔4c,该吸引孔4c上下贯通治具工作台4并在保持面4a开口。若将治具工作台4安装至上述治具基座的上表面侧,则各吸引孔4c通过形成于治具基座的内部的流路等而与吸引源连接。
在保持步骤中,例如,按照背面11b侧(密封树脂层23侧、框体13的背面13b侧)朝向下方的方式将被加工物11与治具工作台4的保持面4a重叠,使切断预定线19的位置与退刀槽4b的位置对齐。另外,通过各吸引孔4c对被加工物11作用吸引源的负压。由此,被加工物11以表面11a侧(框体13的表面13a侧)向上方露出的状态被保持于治具工作台4。
在保持步骤之后,进行切削步骤:沿着切断预定线19对被加工物11进行切削,将被加工物11与层叠体25一起切断(分割)。图2的(B)是用于说明切削步骤的局部截面侧视图。切削步骤继续使用切削装置2来进行。如图2的(B)所示,切削装置2进一步具备配置于治具工作台4的上方的切削单元6。
切削单元6具备与加工进给方向大致垂直的作为旋转轴的主轴(未图示)。在主轴的一端侧安装有磨粒分散于结合材料中而成的环状的切削刀具8。在主轴的另一端侧连结有电动机等旋转驱动源(未图示),安装于主轴的一端侧的切削刀具8通过从该旋转驱动源传递的力而旋转。
另外,主轴由移动机构(未图示)支承。切削刀具8通过该移动机构在与加工进给方向垂直的分度进给方向以及铅垂方向上移动。在切削刀具8的表面8a侧和背面8b侧以夹持切削刀具8的方式配置有一对喷嘴10。喷嘴10构成为能够对切削刀具8、被加工物11供给切削液12。
需要说明的是,退刀槽4b的宽度例如比切削刀具8的宽度(表面8a与背面8b的间隔)宽,退刀槽4b的深度例如比切削刀具8的最大的切入深度深。因此,在沿着切断预定线19对被加工物11进行切削时,即便使切削刀具8切入得足够深,治具工作台4与切削刀具8也不接触。
在本实施方式中,使用切削刀具8,其具有两个以上的贯通孔,该两个以上的贯通孔从切入被加工物11的、该切削刀具的外周部的表面贯通到背面并且在外周缘不开口。图3是示意性地示出切削刀具8的结构例的主视图。如图3所示,在切削刀具8的外周部设置有从表面8a贯通到背面8b、并且在外周缘8c不开口的两个以上的贯通孔8d。贯通孔8d在与作为旋转轴的主轴大致平行的方向上延伸。切削液12通过该贯通孔8d被高效地供给至层叠体25。
在切削步骤中,首先使治具工作台4旋转,使作为对象的切断预定线19的延伸方向与切削装置2的加工进给方向对齐。并且,使治具工作台4和切削单元6相对地移动,使切削刀具8的位置在作为对象的切断预定线19的延长线上对齐。然后,使切削刀具8的下端移动至低于被加工物11的背面11b的位置。
然后,一边使切削刀具8旋转一边使治具工作台4在加工进给方向上移动。并且,从喷嘴10对切削刀具8和被加工物11供给包含有机酸和氧化剂的切削液12。由此,能够使切削刀具8沿着对象的切断预定线19切入,形成在厚度方向上切断(分割)层叠体25以及被加工物11的切口(切缝)11c。
如本实施方式那样,通过使切削液12包含有机酸,能够对层叠体25中的金属进行改性而抑制其延展性。另外,通过使切削液12包含氧化剂,层叠体25中的金属的表面容易发生氧化。其结果是,可充分降低层叠体25中的金属的延展性,提高加工性。
作为切削液12所含的有机酸,可以使用例如在分子内具有至少1个羧基和至少1个氨基的化合物。这种情况下,优选氨基中的至少1个为仲氨基或叔氨基。另外,作为有机酸使用的化合物可以具有取代基。
作为可用作有机酸的氨基酸,可以举出甘氨酸、二羟基乙基甘氨酸、双甘氨肽、羟基乙基甘氨酸、N-甲基甘氨酸、β-丙氨酸、L-丙氨酸、L-2-氨基丁酸、L-正缬氨酸、L-缬氨酸、L-亮氨酸、L-正亮氨酸、L-别异亮氨酸、L-异亮氨酸、L-苯丙氨酸、L-脯氨酸、肌氨酸、L-鸟氨酸、L-赖氨酸、牛磺酸、L-丝氨酸、L-苏氨酸、L-别苏氨酸、L-高丝氨酸、L-甲状腺素、L-酪氨酸、3,5-二碘-L-酪氨酸、β-(3,4-二羟基苯基)-L-丙氨酸、4-羟基-L-脯氨酸、L-半胱氨酸、L-甲硫氨酸、L-乙硫氨酸、L-羊毛硫氨酸、L-胱硫醚、L-胱氨酸、L-磺基丙氨酸、L-谷氨酸、L-天冬氨酸、S-(羧甲基)-L-半胱氨酸、4-氨基丁酸、L-天冬酰胺、L-谷氨酰胺、氮杂丝氨酸、L-刀豆氨酸、L-瓜氨酸、L-精氨酸、δ-羟基-L-赖氨酸、甲胍基乙酸、L-犬尿氨素、L-组氨酸、1-甲基-L-组氨酸、3-甲基-L-组氨酸、L-色氨酸、放线菌素C1、麦角硫因、蜂毒明肽、血管紧张素I、血管紧张素II和抗痛素等。其中,优选甘氨酸、L-丙氨酸、L-脯氨酸、L-组氨酸、L-赖氨酸、二羟基乙基甘氨酸。
另外,作为可用作有机酸的氨基多元酸,可以举出亚氨基二乙酸、次氮基三乙酸、二亚乙基三胺五乙酸、乙二胺四乙酸、羟基乙基亚氨基二乙酸、次氮基三亚甲基膦酸、乙二胺-N,N,N’,N’-四亚甲基磺酸、1,2-二氨基丙烷四乙酸、乙二醇醚二胺四乙酸、反式环己烷二胺四乙酸、乙二胺邻羟基苯基乙酸、乙二胺二琥珀酸(SS体)、β-丙氨酸二乙酸、N-(2-羧酸乙基)-L-天冬氨酸、N,N’-双(2-羟基苄基)乙二胺-N,N’-二乙酸等。
此外,作为可用作有机酸的羧酸,可以举出甲酸、乙醇酸、丙酸、乙酸、丁酸、戊酸、己酸、草酸、丙二酸、戊二酸、己二酸、苹果酸、琥珀酸、庚二酸、巯基乙酸、乙醛酸、氯乙酸、乙酰甲酸、乙酰乙酸、戊二酸等饱和羧酸;丙烯酸、甲基丙烯酸、丁烯酸、富马酸、马来酸、中康酸、柠康酸、乌头酸等不饱和羧酸;苯甲酸类、甲基苯甲酸、邻苯二甲酸类、萘甲酸类、均苯四甲酸、萘二酸等环状不饱和羧酸等。
作为切削液12所含的氧化剂,可以使用例如过氧化氢、过氧化物、硝酸盐、碘酸盐、高碘酸盐、次氯酸盐、亚氯酸盐、氯酸盐、高氯酸盐、过硫酸盐、重铬酸盐、高锰酸盐、铈酸盐、钒酸盐、臭氧水和银(II)盐、铁(III)盐及其有机络盐等。
另外,可以在切削液12中混合防蚀剂。通过混合防蚀剂,能够防止被加工物11所含的金属的腐蚀(溶出)。作为防蚀剂,优选使用例如在分子内具有3个以上氮原子且具有稠环结构的芳杂环化合物、或者在分子内具有4个以上氮原子的芳杂环化合物。此外,芳香环化合物优选包含羧基、磺基、羟基、烷氧基。具体而言,优选为四唑衍生物、1,2,3-三唑衍生物以及1,2,4-三唑衍生物。
作为可用作防蚀剂的四唑衍生物,可以举出:在形成四唑环的氮原子上不具有取代基并且在四唑的5位上导入有选自由磺基、氨基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基的物质。
另外,作为可用作防蚀剂的1,2,3-三唑衍生物,可以举出在形成1,2,3-三唑环的氮原子上不具有取代基并且在1,2,3-三唑的4位和/或5位上导入有选自由羟基、羧基、磺基、氨基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基或芳基的物质。
另外,作为可用作防蚀剂的1,2,4-三唑衍生物,可以举出在形成1,2,4-三唑环的氮原子上不具有取代基并且在1,2,4-三唑的2位和/或5位上导入有选自由磺基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基或芳基的物质。
重复上述步骤,例如,若沿着全部切断预定线19形成切口11c,则切削步骤终止。在本实施方式中,利用切削刀具8对包含金属的层叠体25进行分割时,供给包含有机酸和氧化剂的切削液12,因此能够一边利用有机酸和氧化剂对金属进行改性而使其延展性降低,一边执行切削。由此,即便提高加工的速度,也能抑制毛刺的产生。
另外,在本实施方式的加工方法中,使用切削刀具8,其具有从外周部的表面8a贯通到背面8b并且在外周缘8c不开口的两个以上的贯通孔8d,因此能够通过该贯通孔8d将上述切削液12高效地供给至层叠体25,能够在将金属充分改性而使其延展性降低的同时执行切削。由此,即便进一步提高加工的速度,也能抑制毛刺的产生。即,能够在维持加工品质的同时提高加工速度。
需要说明的是,本发明不限于上述实施方式的记载,可以进行各种变更来实施。例如,在上述实施方式中,使表面11a侧向上方露出,使切削刀具8从该表面11a侧切入被加工物11,但也可以使背面11b侧向上方露出,使切削刀具8从该背面11b侧切入被加工物11。
另外,在上述实施方式的切削步骤中,将被加工物11与层叠体25一起切断(分割)了,但在切削步骤中只要至少能够分割层叠体25即可。即,在切削步骤中也可以不切断被加工物11。
另外,在上述实施方式的切削步骤中使用了切削刀具8,该切削刀具8具有从外周部的表面8a贯通到背面8b的两个以上的贯通孔8d,但对于贯通孔8d的配置、数量、形状、尺寸等没有特别限制。
另外,在上述切削步骤中,从夹持切削刀具8的一对喷嘴10供给切削液12,但对于用于供给切削液12的喷嘴的方式没有特别限制。图4是示出用于供给切削液12的其它方式的喷嘴的主视图。如图4所示,变形例的切削单元6除了具有切削刀具8和一对喷嘴10以外,还具有配置于切削刀具8的侧方(进行加工的方向的前方)的喷嘴(喷淋喷嘴)14。
通过从该喷嘴14供给切削液12,容易将切削液12供给到切口(切缝)11c,能够更有效地对层叠体25中的金属进行改性。特别是,如图4所示,若使喷嘴14的喷射口朝向斜下方(例如,切削刀具8的加工点附近),则能够向切口11c供给、填充大量的切削液12,能够更有效地对层叠体25中的金属进行改性,因而是优选的。需要说明的是,图4中使用了一对喷嘴10以及喷嘴14,但也可以仅单独使用喷嘴14。
此外,上述实施方式的结构、方法等可以在不脱离本发明目的的范围内适当变更并实施。
符号说明
11被加工物
11a表面
11b背面
11c切口(切缝)
13框体
13a表面
13b背面
15器件区域
17外周剩余区域
19切断预定线(间隔道)
21载台
23密封树脂层
25层叠体
27标记物
2切削装置
4治具工作台(保持工作台)
4a保持面
4b退刀槽
4c吸引孔
6切削单元
8切削刀具
8a表面
8b背面
8c外周缘
8d贯通孔
10喷嘴
12切削液
14喷嘴(喷淋喷嘴)
Claims (1)
1.一种加工方法,该加工方法对与切断预定线重叠地形成有包含金属的层叠体的板状的被加工物进行加工,其特征在于,
该加工方法具备下述步骤:
保持步骤,利用保持工作台对被加工物进行保持;和
切削步骤,在实施该保持步骤后,利用环状的切削刀具沿着该切断预定线对被加工物进行切削,分割该层叠体,
该切削刀具具有两个以上的贯通孔,该两个以上的贯通孔从在该切削步骤中切入被加工物的、该切削刀具的外周部的表面贯通到背面并且在外周缘不开口,
在该切削步骤中,一边对被加工物供给包含有机酸和氧化剂的切削液,一边执行切削。
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JP2017-074467 | 2017-04-04 | ||
JP2017074467A JP2018181907A (ja) | 2017-04-04 | 2017-04-04 | 加工方法 |
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CN108695245A true CN108695245A (zh) | 2018-10-23 |
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CN201810224516.2A Pending CN108695245A (zh) | 2017-04-04 | 2018-03-19 | 加工方法 |
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US (1) | US20180286753A1 (zh) |
JP (1) | JP2018181907A (zh) |
KR (1) | KR20180112685A (zh) |
CN (1) | CN108695245A (zh) |
DE (1) | DE102018205023A1 (zh) |
SG (1) | SG10201802548WA (zh) |
TW (1) | TW201839832A (zh) |
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- 2018-03-07 TW TW107107582A patent/TW201839832A/zh unknown
- 2018-03-19 CN CN201810224516.2A patent/CN108695245A/zh active Pending
- 2018-03-27 US US15/936,622 patent/US20180286753A1/en not_active Abandoned
- 2018-03-27 SG SG10201802548WA patent/SG10201802548WA/en unknown
- 2018-03-28 KR KR1020180035947A patent/KR20180112685A/ko not_active Application Discontinuation
- 2018-04-04 DE DE102018205023.6A patent/DE102018205023A1/de not_active Withdrawn
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SG10201802548WA (en) | 2018-11-29 |
KR20180112685A (ko) | 2018-10-12 |
US20180286753A1 (en) | 2018-10-04 |
DE102018205023A1 (de) | 2018-10-04 |
JP2018181907A (ja) | 2018-11-15 |
TW201839832A (zh) | 2018-11-01 |
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