CN108603303B - 表面处理铜箔及使用其制造而成的覆铜层叠板 - Google Patents

表面处理铜箔及使用其制造而成的覆铜层叠板 Download PDF

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Publication number
CN108603303B
CN108603303B CN201780008477.6A CN201780008477A CN108603303B CN 108603303 B CN108603303 B CN 108603303B CN 201780008477 A CN201780008477 A CN 201780008477A CN 108603303 B CN108603303 B CN 108603303B
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China
Prior art keywords
copper foil
layer
silane
insulating substrate
treated
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CN201780008477.6A
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English (en)
Chinese (zh)
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CN108603303A (zh
Inventor
佐藤章
宇野岳夫
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of CN108603303A publication Critical patent/CN108603303A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CN201780008477.6A 2016-02-10 2017-01-23 表面处理铜箔及使用其制造而成的覆铜层叠板 Active CN108603303B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016024121 2016-02-10
JP2016-024121 2016-02-10
JP2016-095049 2016-05-11
JP2016095049 2016-05-11
PCT/JP2017/002145 WO2017138338A1 (ja) 2016-02-10 2017-01-23 表面処理銅箔及びこれを用いて製造される銅張積層板

Publications (2)

Publication Number Publication Date
CN108603303A CN108603303A (zh) 2018-09-28
CN108603303B true CN108603303B (zh) 2020-11-13

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Country Link
JP (1) JP6248231B1 (ja)
KR (1) KR102230999B1 (ja)
CN (1) CN108603303B (ja)
TW (1) TWI704048B (ja)
WO (1) WO2017138338A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019188712A1 (ja) * 2018-03-27 2019-10-03 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
TWI668333B (zh) * 2018-09-17 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
TWI669032B (zh) * 2018-09-26 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
CN112054308A (zh) * 2019-06-05 2020-12-08 广州方邦电子股份有限公司 一种电磁散射膜及包含电磁散射膜的电子装置
TWI764170B (zh) * 2019-06-19 2022-05-11 金居開發股份有限公司 微粗糙電解銅箔以及銅箔基板
US11408087B2 (en) 2019-06-19 2022-08-09 Co-Tech Development Corp. Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same
TWI776168B (zh) * 2019-06-19 2022-09-01 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
CN110838408A (zh) * 2019-10-10 2020-02-25 深圳市峰泳科技有限公司 高剥离力高介电常数的平面电容及其制备方法
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板
CN114199806B (zh) * 2021-12-10 2024-04-09 南京大学 用afm-ir检测微纳米粗糙的铜箔表面有机物分布的方法

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KR100654737B1 (ko) * 2004-07-16 2006-12-08 일진소재산업주식회사 미세회로기판용 표면처리동박의 제조방법 및 그 동박
CN101194045A (zh) * 2005-06-13 2008-06-04 三井金属矿业株式会社 表面处理铜箔及其制造方法、以及带有极薄底漆树脂层的表面处理铜箔
CN102471913A (zh) * 2009-07-14 2012-05-23 古河电气工业株式会社 带电阻层铜箔及其制备方法、以及层叠基板
CN102482795A (zh) * 2009-08-14 2012-05-30 古河电气工业株式会社 耐热性铜箔及其制备方法、电路板、覆铜箔层压板及其制备方法
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CN101194045A (zh) * 2005-06-13 2008-06-04 三井金属矿业株式会社 表面处理铜箔及其制造方法、以及带有极薄底漆树脂层的表面处理铜箔
CN102471913A (zh) * 2009-07-14 2012-05-23 古河电气工业株式会社 带电阻层铜箔及其制备方法、以及层叠基板
CN102482795A (zh) * 2009-08-14 2012-05-30 古河电气工业株式会社 耐热性铜箔及其制备方法、电路板、覆铜箔层压板及其制备方法
CN102803576A (zh) * 2010-01-22 2012-11-28 古河电气工业株式会社 粗化处理铜箔及其制造方法、覆铜层压板及印刷电路板
US10212814B2 (en) * 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
CN104120471A (zh) * 2013-04-26 2014-10-29 Jx日矿日石金属株式会社 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
CN105002496A (zh) * 2015-07-28 2015-10-28 灵宝华鑫铜箔有限责任公司 一种电解铜箔黑色表面处理方法

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Publication number Publication date
KR102230999B1 (ko) 2021-03-22
CN108603303A (zh) 2018-09-28
KR20180112769A (ko) 2018-10-12
WO2017138338A1 (ja) 2017-08-17
JPWO2017138338A1 (ja) 2018-02-22
JP6248231B1 (ja) 2017-12-13
TWI704048B (zh) 2020-09-11
TW201800242A (zh) 2018-01-01

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