CN108602984B - 用于密封半导体器件的环氧树脂组合物及通过使用其密封的半导体器件 - Google Patents

用于密封半导体器件的环氧树脂组合物及通过使用其密封的半导体器件 Download PDF

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Publication number
CN108602984B
CN108602984B CN201780007822.4A CN201780007822A CN108602984B CN 108602984 B CN108602984 B CN 108602984B CN 201780007822 A CN201780007822 A CN 201780007822A CN 108602984 B CN108602984 B CN 108602984B
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China
Prior art keywords
epoxy resin
resin composition
formula
semiconductor device
group
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CN201780007822.4A
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Chinese (zh)
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CN108602984A (zh
Inventor
赵芝允
裴庆徹
尹祉儿
李英俊
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Samsung SDI Co Ltd
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Samsung SDI Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201780007822.4A 2016-01-29 2017-01-19 用于密封半导体器件的环氧树脂组合物及通过使用其密封的半导体器件 Active CN108602984B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020160012005A KR101943698B1 (ko) 2016-01-29 2016-01-29 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
KR10-2016-0012005 2016-01-29
PCT/KR2017/000669 WO2017131390A1 (ko) 2016-01-29 2017-01-19 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자

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CN108602984A CN108602984A (zh) 2018-09-28
CN108602984B true CN108602984B (zh) 2021-01-29

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KR (1) KR101943698B1 (ko)
CN (1) CN108602984B (ko)
WO (1) WO2017131390A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400988A (zh) * 2000-02-15 2003-03-05 荷兰解决方案研究有限公司 热固性树脂组合物
JP2005132890A (ja) * 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN101029166A (zh) * 2006-02-27 2007-09-05 田村化研株式会社 热固性树脂组合物、b阶化树脂膜以及多层积层基板
CN104119643A (zh) * 2013-04-24 2014-10-29 三星电机株式会社 一种印刷电路板用绝缘树脂组合物以及使用其的半固化片、覆铜层压板和印刷电路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038439A (ja) * 1998-07-23 2000-02-08 Dainippon Ink & Chem Inc エポキシ樹脂組成物
JP4869721B2 (ja) * 2006-02-03 2012-02-08 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびその製法ならびにそれを用いて得られる半導体装置
KR100797967B1 (ko) * 2006-12-31 2008-01-24 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물　및 이를 이용한반도체 소자

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400988A (zh) * 2000-02-15 2003-03-05 荷兰解决方案研究有限公司 热固性树脂组合物
JP2005132890A (ja) * 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN101029166A (zh) * 2006-02-27 2007-09-05 田村化研株式会社 热固性树脂组合物、b阶化树脂膜以及多层积层基板
CN104119643A (zh) * 2013-04-24 2014-10-29 三星电机株式会社 一种印刷电路板用绝缘树脂组合物以及使用其的半固化片、覆铜层压板和印刷电路板

Also Published As

Publication number Publication date
CN108602984A (zh) 2018-09-28
KR101943698B1 (ko) 2019-01-29
KR20170090962A (ko) 2017-08-08
WO2017131390A1 (ko) 2017-08-03

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