KR100797967B1 - 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 - Google Patents
반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 Download PDFInfo
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- KR100797967B1 KR100797967B1 KR1020060139241A KR20060139241A KR100797967B1 KR 100797967 B1 KR100797967 B1 KR 100797967B1 KR 1020060139241 A KR1020060139241 A KR 1020060139241A KR 20060139241 A KR20060139241 A KR 20060139241A KR 100797967 B1 KR100797967 B1 KR 100797967B1
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- epoxy resin
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- resin composition
- triazine
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 59
- 239000000203 mixture Substances 0.000 title claims abstract description 46
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 239000007822 coupling agent Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 13
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 13
- 125000003277 amino group Chemical group 0.000 claims abstract description 11
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 8
- OWMNWOXJAXJCJI-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1OC1COCC1CO1 OWMNWOXJAXJCJI-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims abstract description 6
- 125000005641 methacryl group Chemical group 0.000 claims abstract description 6
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims abstract description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 5
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 16
- -1 triazine isocyanate imidazole compound Chemical class 0.000 claims description 16
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 9
- 229930003836 cresol Natural products 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052794 bromium Inorganic materials 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000003426 co-catalyst Substances 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 150000002334 glycols Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 2
- 150000001638 boron Chemical class 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 abstract 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- 239000008393 encapsulating agent Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000003721 gunpowder Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- IXDGHAZCSMVIFX-UHFFFAOYSA-N 6-(dibutylamino)-1h-1,3,5-triazine-2,4-dithione Chemical compound CCCCN(CCCC)C1=NC(=S)NC(=S)N1 IXDGHAZCSMVIFX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- ZHSXANMFVCDUJW-UHFFFAOYSA-N prop-1-ene trimethoxysilane Chemical compound CO[SiH](OC)OC.C=CC ZHSXANMFVCDUJW-UHFFFAOYSA-N 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- MDCWDBMBZLORER-UHFFFAOYSA-N triphenyl borate Chemical compound C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 MDCWDBMBZLORER-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3209—Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
또한, 상기 조성물 전체에 대하여 상기 올소 크레졸 노볼락 에폭시 수지 3~12중량%, 디글리시딜 이써 비스페놀 변성 에폭시 수지 1~8중량%, 커플링제 0.1~2.0 중량%, 상기 트리아진계수지 0.01~1.5 중량%, 무기충진제 70~90 중량%를 포함하는 것을 특징으로 한다.
(상기 식에서 R은 사이클로에폭시기, 아미노기, 메타크릴기, 머캅토기, 또는 비닐기이며, 상기 복수의 X는 독립적으로 메톡시기 또는 에톡시기이다.)
또한, 상기 트리아진계 수지는 2-디부틸아미노-4,6-디머컵토-S-트리아진, 2-디부틸 아미노-머컵토-트리아진, 2-아닐리노-4,6-디머컵토-S-트리아진 및 2,4,6트리머컵토-S-트리아진으로 이루어진 그룹에서 선택되는 1종인 것을 특징으로 한다.
구 성 성 분 | 실시예 1 | 실시예 2 | 실시예3 | |
에폭시수지 | 1)올소 크레졸 노블락 에폭시 수지 2)디글리시딜 이써 비스페놀 변성 에폭시수지 | 11.46 2.77 | 8.57 4.48 | 3.91 5.69 |
3)브롬화에폭시수지 | 0.90 | 0.90 | 0.65 | |
삼산화 안티몬 | 1.00 | 1.00 | 0.50 | |
페놀 노블락 경화제 | 6.97 | 6.95 | 3.63 | |
4)잠재성 경화 촉매 | 0.05 | 0.05 | 0.03 | |
트리페닐포스핀 | 0.19 | 0.19 | 0.10 | |
무기 충진재 | 75.00 | 76.00 | 83.50 | |
카본블랙 | 0.27 | 0.27 | 0.27 | |
5)커플링제 1 | 0.38 | 0.38 | 0.43 | |
6)카플링제 2 | 0.06 | 0.06 | 0.06 | |
피이 왁스 | 0.10 | 0.10 | 0.10 | |
7)접착력 증가제 | 0.05 | 0.25 | 0.50 | |
카르나우바왁스 | 0.20 | 0.20 | 0.20 | |
8)기타 | 0.60 | 0.60 | 0.43 |
구 성 성 분 | 비교예 1 | 비교예 2 | 비교예3 | |
에폭시수지 | 1)올소크레졸 노블락 에폭시 수지 비스페놀 에폭시 수지 | 11.63 2.91 | 7.47 4.98 | 4.08 6.12 |
3)브롬화에폭시수지 | 0.93 | 0.80 | 0.65 | |
삼산화 안티몬 | 1.00 | 1.00 | 0.50 | |
페놀 노볼락 경화제 | 6.76 | 5.05 | 3.54 | |
트리페닐포스핀 | 0.20 | 0.17 | 0.14 | |
4)잠재성 경화 촉매 | 0.05 | 0.04 | 0.03 | |
무기 충진재 | 75.00 | 79.00 | 83.50 | |
γ-글리시톡시프로필트리메톡시실란 | 0.38 | 0.40 | 0.43 | |
카본블랙 | 0.27 | 0.27 | 0.27 | |
카르나우바왁스 | 0.20 | 0.20 | 0.20 | |
피이 왁스 | 0.10 | 0.10 | 0.10 | |
8)기타 | 0.57 | 0.52 | 0.44 |
8) 실리콘 오일(SF-8421EG)
평 가 항 목 | 실시예1 | 실시예2 | 실시예3 | 비교예1 | 비교예2 | 비교예3 |
스파이럴 플로우(inch) | 36 | 33 | 29 | 38 | 34 | 29 |
유리전이온도 Tg(℃) | 173 | 156 | 149 | 164 | 155 | 141 |
부착력 (Kgf) | 69 | 73 | 80 | 59 | 55 | 60 |
난연성 (V-0 1.6mm) | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
평 가 항 목 | 실시예1 | 실시예2 | 실시예3 | 비교예1 | 비교예2 | 비교예3 | |
크랙 | IR REFLOW 전 | 0/128 | 0/128 | 0/128 | 2/128 | 0/128 | 0/128 |
IR REFLOW 후 | 0/128 | 0/128 | 0/128 | 30/128 | 18/128 | 0/128 | |
박리 | 100 Cycle | 0/128 | 0/128 | 0/128 | 14/128 | 0/128 | 0/128 |
200 Cycle | 0/128 | 0/128 | 0/128 | - | 7/100 | 0/128 | |
500 Cycle | 0/128 | 0/128 | 0/128 | - | - | 4/128 | |
칩, 패드 박리 10% 이상 발생 수 | |||||||
성형성 | VOID | 0/256 | 0/256 | 0/256 | 3/256 | 1/256 | 0/256 |
Claims (11)
- 하기 화학식 1로 표시되는 올소 크레졸 노볼락 에폭시 수지 3 ~ 12 중량%, 하기 화학식 2로 표시되는 디글리시딜 이써 비스페놀 변성 에폭시 수지 1 ~ 8 중량%, 경화제 1 ~ 8 중량%, 하기 화학식 4로 표시되는 화합물을 포함하는 커플링제 0.11 ~ 2.1 중량%, 하기 화학식 5로 표시되는 트리아진계 수지 0.01 ~ 1.5 중량%, 경화촉진제 0.02 ~ 0.4 중량% 및 무기충전제 70 ~ 90 중량%를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물.[화학식 1](상기 식에서 R은 히드록시기 또는 메틸기이고, G는 글리시딜기이며, n은 0 내지 3의 정수이다.)[화학식 2](상기 식에서 R은 수소원자 또는 메틸기이고, G는 글리시딜기이며, n은 0 내지 3의 정수이다.)[화학식 4](상기 식에서 R은 사이클로에폭시기, 아미노기, 메타크릴기, 머캅토기, 또는 비닐기이며, 상기 복수의 X는 독립적으로 메톡시기 또는 에톡시기이다.)[화학식 5](상기 식에서, R1과 R2는 서로 독립적으로 머캅토기, 탄소수 1 내지 10의 알킬기, 및 아미노기에서 선택되는 적어도 하나 이상의 작용기를 포함한다.)
- 삭제
- 제 1 항에 있어서,상기 트리아진계 수지는 2-디부틸아미노-4,6-디머컵토-S-트리아진, 2-디부틸 아미노-머컵토-트리아진, 2-아닐리노-4,6-디머컵토-S-트리아진 및 2,4,6트리머컵토-S-트리아진으로 이루어진 그룹에서 선택되는 1종인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1 항에 있어서,상기 경화촉진제는 트리아진 이소시아네이트 이미다졸 화합물; 테트라페닐포스포니움 테트라페닐보레이트, 트리페닐포스핀 테트라페닐보레이트, 테트라페닐보론염에서 선택되는 1종 이상인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 5 항에 있어서, 상기 경화촉진제로 이소시아네이트형 잠재성 경화촉매 및 아민형 또는 포스핀형 화합물의 보조촉매를 전체 에폭시 수지 조성물에 대하여 0.02∼0.25 중량%로 사용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1 항에 있어서, 상기 조성물은 브롬화 에폭시 수지를 포함하며, 브롬화 에폭시 수지는 에폭시 당량 250∼300이고, 브롬 함량 35∼40%인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1항에 있어서, 상기 무기충전제로 평균입자크기가 0.1∼35.0㎛인 용융 또는 합성실리카를 조성물 전체에 대해 70∼90중량% 범위인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1항 내지 제 8항 중 어느 한 항 기재의 반도체 소자 밀봉용 에폭시 수지 조성물을 헨셀믹서 또는 뢰디게 믹서를 이용하여 혼합한 뒤, 롤밀 또는 니이더로 용융혼련한 후, 냉각, 분쇄과정을 거쳐 얻은 최종 분말 제품으로 밀봉한 반도체 소자.
- 제 9항에 있어서, 상기 최종 분말 제품을 저압 트랜스퍼 성형법, 인젝션(Injection) 성형법 또는 캐스팅(Casting) 성형법으로 밀봉한 반도체 소자.
- 제 10항에 있어서, 상기 반도체 소자가 커퍼, 니켈, 에이지, 파라듐으로 이루어진 그룹에서 선택된 1종 이상의 물질을 포함하는 리드프레임을 포함하는 것을 특징으로 하는 반도체 소자.
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WO2017131390A1 (ko) * | 2016-01-29 | 2017-08-03 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
KR101927631B1 (ko) * | 2017-07-27 | 2018-12-10 | 주식회사 케이씨씨 | 에폭시 수지 조성물 및 이를 포함하는 반도체 장치 |
CN109694519A (zh) * | 2018-12-28 | 2019-04-30 | 肖彬 | 一种耐拉伸抗菌pp纤维板用剑麻纤维改性料粒 |
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CN117603641A (zh) * | 2024-01-19 | 2024-02-27 | 天津德高化成新材料股份有限公司 | 高温下对镍高粘接力环氧树脂组合物及其制备方法和应用 |
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WO2017131390A1 (ko) * | 2016-01-29 | 2017-08-03 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
KR101927631B1 (ko) * | 2017-07-27 | 2018-12-10 | 주식회사 케이씨씨 | 에폭시 수지 조성물 및 이를 포함하는 반도체 장치 |
WO2019022390A1 (ko) * | 2017-07-27 | 2019-01-31 | 주식회사 케이씨씨 | 에폭시 수지 조성물 및 이를 포함하는 반도체 장치 |
CN109694519A (zh) * | 2018-12-28 | 2019-04-30 | 肖彬 | 一种耐拉伸抗菌pp纤维板用剑麻纤维改性料粒 |
WO2020189879A1 (ko) * | 2019-03-18 | 2020-09-24 | 주식회사 케이씨씨 | 에폭시 수지 조성물 |
CN117603641A (zh) * | 2024-01-19 | 2024-02-27 | 天津德高化成新材料股份有限公司 | 高温下对镍高粘接力环氧树脂组合物及其制备方法和应用 |
CN117603641B (zh) * | 2024-01-19 | 2024-04-19 | 天津德高化成新材料股份有限公司 | 高温下对镍高粘接力环氧树脂组合物及其制备方法和应用 |
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