CN108601294B - Heat dissipation system and heat dissipation method - Google Patents
Heat dissipation system and heat dissipation method Download PDFInfo
- Publication number
- CN108601294B CN108601294B CN201810353393.2A CN201810353393A CN108601294B CN 108601294 B CN108601294 B CN 108601294B CN 201810353393 A CN201810353393 A CN 201810353393A CN 108601294 B CN108601294 B CN 108601294B
- Authority
- CN
- China
- Prior art keywords
- heat
- type semiconductor
- heat dissipation
- fan
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of heat dissipation of electronic products, and particularly relates to a heat dissipation system and a heat dissipation method. The heat dissipation system includes: a heat sink unit including a first P-type semiconductor and a first N-type semiconductor connected in pair; the heat release unit is of a fan structure, and fan blades of the fan structure comprise a second P-type semiconductor and a second N-type semiconductor which are connected in pairs; the power supply is electrically connected with the heat absorption unit and the heat release unit to form a circulation loop, so that the current of the heat absorption unit flows to the corresponding first P-type semiconductor from the first N-type semiconductor to absorb the heat generated by the heat dissipation piece to be dissipated, and the current of the heat release unit flows to the corresponding second N-type semiconductor from the second P-type semiconductor to dissipate the heat; the heat releasing unit also dissipates heat by a fan. The heat dissipation system integrates thermoelectric refrigeration and fan heat dissipation, improves the heat dissipation efficiency, can avoid high-speed operation of the fan to achieve a better heat dissipation effect, and avoids noise interference and electromagnetic interference generated by high-speed operation of the fan.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of electronic products, and particularly relates to a heat dissipation system and a heat dissipation method.
Background
With the development of electronic technology, the application of micro-electromechanical systems mainly including integrated circuits and chips in the fields of information, industry, automobiles, consumer electronics and the like is more and more extensive, the trends of high power, miniaturization and high-density centralization of components are rapidly popularized, the characteristic size of electronic components is continuously reduced, the frequency is continuously improved, the integration level is improved, the volume power density or the area power density of the electronic components and devices formed by the electronic components is inevitably increased, and the heat cannot be effectively dissipated, so that the damage of the electronic components is easily caused, even the safety problems of fire and the like can be caused, and the quality of the heat dissipation performance becomes an important assessment index of the stability and the reliability of products.
Generally speaking, the working reliability of electronic components is extremely sensitive to temperature, the failure rate of the electronic components increases exponentially along with the increase of junction temperature, and the failure rate of the electronic components increases by about one time when the working temperature of the electronic components increases by 10 ℃; particularly, on the basis of the working temperature level of 70-80 ℃, the reliability of the electronic component is reduced by 5% when the working temperature is increased by 1%; in addition, the average expected life of the electronic components is sharply reduced in an exponential relationship with the increase of the junction temperature, mainly because the reliability of the electronic products is seriously influenced by thermal stress, change of physical properties and damage of semiconductor characteristics caused by overhigh temperature of the electronic components. Researches show that in order to effectively avoid logic errors, component damage and reduction of the running speed, the temperature of the surface of the VISI chip must be maintained at 50-100 ℃; based on this, thermal control schemes become a key technical problem that needs to be fully considered in the research and development process of electronic products.
In the prior art, a heat dissipation technology is usually adopted to effectively reduce the operating temperature of an electronic core component, and the heat dissipation technology mainly includes two heat dissipation methods: the thermoelectric refrigerator carries out refrigeration heat dissipation and fan forced air cooling heat dissipation. Thermoelectric cooler tec (thermoelectric cooler), a cooler made by Peltier effect (Peltier effect), generally using semiconductor as material, and applying a low dc voltage across the thermoelectric cooler, heat will flow from one end of the element to the other; at this time, the temperature of one end (cold end) of the refrigerator is reduced, and the temperature of the other end (hot end) of the refrigerator is increased; the purpose of cooling can be achieved by attaching the cold end to the surface of the heating element. The most common thermoelectric refrigeration material in practical application is Bismuth Telluride (Bismuth Telluride). In addition, the hot end of the TEC is generally attached to a heat sink, and the heat absorbed by the TEC is transferred to the hot end, then further transferred to the heat sink, and then dissipated to the surrounding environment through the heat sink. However, the heat at the heat dissipation end in this heat dissipation method is still cooled only by natural convection, and the heat taken away in this method is very limited, which limits the heat dissipation capability of the thermoelectric refrigerator.
The other heat dissipation mode is a heat dissipation mode with a good heat dissipation effect, wherein the fan is used for forcibly cooling and dissipating heat, and the heat dissipation capacity of the heat dissipation mode is in direct proportion to the intensity of external applied energy. However, high speed operation of the fan tends to generate noise interference and electromagnetic interference. In addition, the overall size of some products also limits the maximum heat dissipation capability of the air-cooled heat sink.
Therefore, it is necessary to develop a new heat dissipation system.
Disclosure of Invention
Based on the above-mentioned shortcomings in the prior art, the present invention provides a heat dissipation system and a heat dissipation method.
In order to achieve the purpose, the invention adopts the following technical scheme:
a heat dissipation system, comprising:
a heat sink unit including a first P-type semiconductor and a first N-type semiconductor connected in pair;
the heat release unit is of a fan structure, and fan blades of the fan structure comprise a second P-type semiconductor and a second N-type semiconductor which are connected in pairs;
the power supply is electrically connected with the heat absorption unit and the heat release unit to form a circulation loop, so that the current of the heat absorption unit flows to the corresponding first P-type semiconductor from the first N-type semiconductor to absorb the heat generated by the heat dissipation piece to be dissipated, and the current of the heat release unit flows to the corresponding second N-type semiconductor from the second P-type semiconductor to dissipate the heat;
the heat release unit also dissipates heat by the fan.
The heat dissipation system integrates thermoelectric refrigeration and fan heat dissipation, improves the heat dissipation efficiency, can avoid high-speed operation of the fan to achieve a better heat dissipation effect, and avoids noise interference and electromagnetic interference generated by high-speed operation of the fan.
Preferably, the heat sink unit includes a plurality of pairs of first P-type semiconductors and first N-type semiconductors connected in pairs, all of the first N-type semiconductors are electrically connected to the second N-type semiconductors, and all of the first P-type semiconductors are electrically connected to the second P-type semiconductors.
Preferably, the heat absorption unit is a double-ring structure and is formed by arranging pairs of first P-type semiconductors and first N-type semiconductors which are connected in pairs along the inner ring and the outer ring respectively. The heat absorption area is enlarged, and the rapid cooling of the heat dissipation piece to be cooled is facilitated.
Preferably, each pair of the first P-type semiconductor and the first N-type semiconductor is connected through a first metal electrode. And ensuring the connectivity between each pair of the first P-type semiconductor and the first N-type semiconductor.
Preferably, each fan blade of the fan structure is composed of a pair of second P-type semiconductors and second N-type semiconductors which are connected, all the second N-type semiconductors are electrically connected with the first N-type semiconductors, and all the second P-type semiconductors are electrically connected with the first P-type semiconductors. The second P-type semiconductor and the second N-type semiconductor are all fused on the fan blades of the fan, namely the thermoelectric refrigeration and the fan refrigeration are fused, the heat dissipation area is enlarged, the structure of a heat dissipation system is simplified, and the size space is saved.
Preferably, the second P-type semiconductor of each fan blade is connected with a first coil, the first coil is connected with a first electric brush in a sliding manner, and the first electric brush is electrically connected with all the first P-type semiconductors; the second N-type semiconductor of each fan blade is connected with a second coil, the second coil is connected with a second electric brush in a sliding mode, and the second electric brush is electrically connected with all the first N-type semiconductors. The second P-type semiconductor of each fan blade is electrically connected with the first P-type semiconductor of the heat absorption unit through the sliding connection of the first coil and the first electric brush; and the second N-type semiconductor of each fan blade is electrically connected with the first N-type semiconductor of the heat absorption unit through the sliding connection of the second coil and the second electric brush.
Preferably, the exothermic unit is provided in plurality. The heat dissipation efficiency of the heat dissipation system is improved.
Preferably, each pair of the second P-type semiconductor and the second N-type semiconductor is connected through a second metal electrode. And ensuring the connectivity between each pair of the second P-type semiconductor and the second N-type semiconductor.
Preferably, the fan is electrically connected with a power supply unit. So as to realize the starting of the fan and the mutual independence of the power supply of the fan and the heat dissipation system.
The invention also discloses a heat dissipation system, comprising:
a heat sink unit including a first P-type semiconductor and a first N-type semiconductor connected in pair;
a heat emitting unit including a second P-type semiconductor and a second N-type semiconductor connected in pair;
the power supply is electrically connected with the heat absorption unit and the heat release unit to form a circulation loop, so that the current of the heat absorption unit flows to the corresponding first P-type semiconductor from the first N-type semiconductor to absorb the heat generated by the heat dissipation piece to be dissipated, and the current of the heat release unit flows to the corresponding second N-type semiconductor from the second P-type semiconductor to dissipate the heat;
the heat releasing unit further includes a fan for dissipating heat. The thermoelectric refrigeration and the fan heat dissipation are simply combined, so that the manufacturing process of the heat dissipation system is simplified, and the heat dissipation system is suitable for occasions with low requirements on space structures.
The invention also discloses a heat dissipation method, which is applied to the heat dissipation system assembled in a to-be-dissipated part, and comprises the following steps:
s1, detecting the temperature of the heat-dissipating piece, and judging whether the temperature of the heat-dissipating piece is greater than a temperature threshold value; if yes, go to step S2;
and S2, starting the fan, and adjusting the rotating speed of the fan according to the temperature of the heat dissipation piece to be dissipated.
Compared with the prior art, the invention has the beneficial effects that:
the heat dissipation system integrates thermoelectric refrigeration and fan heat dissipation, improves the heat dissipation efficiency, can avoid high-speed operation of the fan to achieve a better heat dissipation effect, and avoids noise interference and electromagnetic interference generated by high-speed operation of the fan.
According to the heat dissipation method, different heat dissipation modes are executed according to the temperature of the heat dissipation piece to be dissipated and the judgment result of the temperature threshold value, optimization of resource allocation is facilitated, the rotating speed of the fan is adjusted according to the temperature of the heat dissipation piece to be dissipated, and the heat dissipation effect is better.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation system applied to a PCB board according to an embodiment of the present invention;
FIG. 2 is an exploded view of a portion of a heat dissipation system applied to a PCB board according to an embodiment of the present invention;
fig. 3 is a schematic structural view illustrating a heat absorption unit of a heat dissipation system disposed on a PCB according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of another state in which a heat dissipation system of an embodiment of the present invention is applied to a PCB;
FIG. 5 is a schematic view of a fan structure in a heat-releasing unit of a heat-dissipating system according to an embodiment of the present invention;
FIG. 6 is another schematic view of a fan structure in a heat-releasing unit of a heat-dissipating system according to an embodiment of the present invention;
FIG. 7 is an enlarged view of portion A of FIG. 6;
fig. 8 is a schematic circuit diagram of a heat dissipation system according to an embodiment of the invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, the following description will explain the embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort. In addition, directional terms referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
The first embodiment is as follows:
as shown in fig. 1 to 8, the heat dissipation system of the present embodiment is applied to a PCB board 1. The heat dissipation system includes a power supply, a heat absorption unit 2, and four heat release units 3. The power supply is arranged on the PCB board 1 and is electrically connected with the heat absorption unit 2 and the heat release unit 3 to form a circulation loop.
The heat absorption unit 2 is used for being attached to a heating surface of the PCB and comprises a plurality of pairs of first P-type semiconductors and first N-type semiconductors which are connected in pairs and are perpendicular to the PCB; each first P-type semiconductor and each first N-type semiconductor are of a vertical structure, the bottom of each first P-type semiconductor and each first N-type semiconductor are attached to a heating surface of the to-be-cooled piece, and the top of each first P-type semiconductor and each first N-type semiconductor are flush to form a supporting platform of the heat releasing unit. The pairs of first P-type semiconductors and first N-type semiconductors connected in pairs are divided into two groups, and arranged along the inner ring and the outer ring respectively to form a concentric double-ring structure, wherein the first N-type semiconductor on the same ring is located on the inner ring, and the first P-type semiconductor is located on the outer ring, as shown in fig. 3. Wherein, each pair of the first P-type semiconductor and the first N-type semiconductor are connected through the first metal electrode 21, so as to ensure the connectivity between the paired first P-type semiconductor and the paired first N-type semiconductor; all the first N-type semiconductors on the same ring are connected through second wires to achieve electric connection among the first N-type semiconductors, and all the first P-type semiconductors on the same ring are connected through first wires to achieve electric connection among the first P-type semiconductors.
As shown in fig. 4, four heat releasing units 3 are symmetrically arranged on a supporting platform on the top of the concentric double ring structure in pairs. As shown in fig. 5 and 6, the heat releasing unit 3 is a fan structure including a base 311 and eight fan blades 312 mounted on the base 311, each fan blade being formed of a pair of connected second P-type semiconductor and second N-type semiconductor; wherein, each pair of the second P-type semiconductor and the second N-type semiconductor is connected through the second metal electrode 3121; the base 311 of the fan structure has four mounting holes, and correspondingly, the PCB board has a corresponding number of threaded fixing posts, which are fixedly engaged with the four mounting holes and the threaded fixing posts by bolts or screws, so as to fix the heat absorbing unit 2 and the heat releasing unit 3 on the PCB board 1. As shown in fig. 7 and 8, the second P-type semiconductor of each fan blade is electrically connected to the first coil 32, the second N-type semiconductor of each fan blade is electrically connected to the second coil 33, and the first coil 32 and the second coil 33 rotate synchronously with the fan blades; the first coil 32 is slidably connected to the first brush 34, that is, the first coil 32 always keeps contact with the first brush 34 in the rotation process of the first coil 32, so as to realize the electrical connection between the first coil 32 and the first brush 34, and the first brush 34 is fixed on the base 311 of the fan structure; correspondingly, the second coil 33 is slidably connected with the second brush 35, that is, the second coil 33 is always kept in contact with the second brush 35 during the rotation process, so as to realize the electrical connection between the second coil 33 and the second brush 35, and the second brush 35 is fixed on the base 311 of the fan structure; therefore, the electric connectivity between the second P-type semiconductors of the fan blades and the electric connectivity between the second N-type semiconductors of the fan blades are always kept in the rotating process of the fan. In addition, the first brush 34 is also electrically connected with the first conducting wire, so that the electric connectivity between all the first P-type semiconductors and the second P-type semiconductors is realized; the second brush 35 is also electrically connected to a second wire, achieving electrical connectivity between all of the first N-type semiconductor and the second N-type semiconductor.
In addition, the starting of the fan is controlled by a power supply unit and is independent from the power supply of the heat dissipation system.
As shown in fig. 8, after the power supply 1 is turned on the heat absorbing unit 2 and the heat releasing unit 3, the current of the heat absorbing unit flows from the first N-type semiconductor to the corresponding first P-type semiconductor, and absorbs the heat generated on the PCB; the current of the heat release unit flows to the corresponding second N-type semiconductor from the second P-type semiconductor to dissipate heat; namely, when the fan does not rotate, heat can still be dissipated through thermoelectric refrigeration; when the power supply unit is connected with the fan, the heat dissipation of the fan is combined with the thermoelectric refrigeration, so that the heat dissipation efficiency is improved.
The cooling system of this embodiment integrates thermoelectric refrigeration and fan heat dissipation, has both improved the radiating efficiency, can avoid the high-speed operation of fan again to reach better radiating effect, has avoided noise interference and the electromagnetic interference of the high-speed operation production of fan.
Example two:
the difference between the heat dissipation system of the present embodiment and the first embodiment is:
specifically, the fan structure of the heat release unit only serves as a fan for heat dissipation, that is, the fan blades of the fan structure are made of common fan blade materials; the heat release unit comprises a plurality of pairs of second P-type semiconductors and second N-type semiconductors which are connected in pairs, and the heat release unit and the heat absorption unit form a thermoelectric refrigeration structure; the fan structure is independently used as a fan for heat dissipation; the heat dissipation form and structure of the heat dissipation system are diversified.
Other structures of this embodiment can refer to the first embodiment.
Example three:
the difference between the heat dissipation system of the present embodiment and the first embodiment is:
specifically, the structure of the heat absorption unit can be regular structures such as a circular ring structure, a three-ring structure, a four-ring structure and the like, or irregular structures, and only the electrical connection between all the first P-type semiconductors and the electrical connection between all the second N-type semiconductors are required to be ensured, so that the specific structure can be adjusted and designed according to actual conditions; in addition, the number of the fan structures of the heat release unit can be adjusted according to actual conditions, and can also be one, three, five, six and the like. The structure of the heat absorption unit and the heat release unit is diversified, and the heat dissipation system can adapt to different application occasions.
Other structures of this embodiment can refer to the first embodiment.
Example four:
the difference between the heat dissipation system of the present embodiment and the first embodiment is:
specifically, the power supply unit of the fan and the power supply of the heat dissipation system can be the same power supply module, namely, the fan is started to dissipate heat while thermoelectric cooling is performed, and the fan is suitable for occasions needing quick heat dissipation.
Other structures of this embodiment can refer to the first embodiment.
Example five:
the difference between the heat dissipation system of the present embodiment and the first embodiment is:
specifically, the heat dissipation system of the present embodiment further includes a control unit, where the control unit is connected to the power supply and the power supply unit to control the power supply to supply power to the first P-type semiconductor and the first N-type semiconductor in the heat absorption unit and the second P-type semiconductor and the second N-type semiconductor in the heat release unit, and control the power supply unit to supply power to the fan, so as to implement automatic control of the heat dissipation system.
Other structures of this embodiment can refer to the first embodiment.
Example six:
the heat dissipation method of the embodiment is applied to the heat dissipation system of the first embodiment, and includes the following steps:
s1, switching on the power supply; detecting the temperature of the PCB, and judging whether the temperature of the PCB is greater than a first temperature threshold value or not; if yes, go to step S2; if not, go to step S3;
s2, switching on the power supply unit, starting the fan, and adjusting the rotating speed of the fan according to the temperature of the PCB; specifically, a reference table of the temperature of the PCB and the rotating speed of the fan is set, and the rotating speed of the fan is directly adjusted to a target rotating speed by contrasting the corresponding rotating speed of the fan in the reference table based on the measured temperature of the PCB; through the dual heat dissipation of thermoelectric refrigeration and fan refrigeration, the heat dissipation efficiency is improved by about 50 percent compared with the heat dissipation efficiency of single thermoelectric refrigeration.
And S3, the fan is not started, and heat dissipation is performed only through thermoelectric cooling.
The heat dissipation method of the embodiment divides the heat dissipation mode into heat dissipation only through thermoelectric refrigeration and dual heat dissipation of thermoelectric refrigeration and fan refrigeration through setting a temperature threshold; the method is simple and effective.
Example seven:
the heat dissipation method of the embodiment is applied to the heat dissipation system of the first embodiment, and includes the following steps:
s11, detecting the temperature of the PCB and judging whether the temperature of the PCB is greater than a second temperature threshold value; if yes, go to step S21; if not, continuously detecting the temperature of the PCB after a preset time;
s21, switching on a power supply, and performing heat dissipation through thermoelectric refrigeration; continuously detecting the temperature of the PCB, judging whether the temperature of the PCB is greater than a third temperature threshold value, and if so, turning to the step S31; if not, continuously detecting the temperature of the PCB after a preset time;
s31, switching on the power supply unit, starting the fan, and adjusting the rotating speed of the fan according to the temperature of the PCB; specifically, a reference table of the temperature of the PCB and the rotating speed of the fan is set, and the rotating speed of the fan is directly adjusted to a target rotating speed by contrasting the corresponding rotating speed of the fan in the reference table based on the measured temperature of the PCB; through the dual heat dissipation of thermoelectric refrigeration and fan refrigeration, the heat dissipation efficiency is improved by about 50 percent compared with the heat dissipation efficiency of single thermoelectric refrigeration.
In the heat dissipation method of the embodiment, the two temperature thresholds are set as the judgment criteria for starting the dual heat dissipation of the thermoelectric refrigeration heat dissipation, the thermoelectric refrigeration and the fan refrigeration, so that the optimal configuration of the power resources is realized, and the waste of the power resources caused by always starting the thermoelectric refrigeration or the fan heat dissipation is avoided.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing has outlined rather broadly the preferred embodiments and principles of the present invention and it will be appreciated that those skilled in the art may devise variations of the present invention that are within the spirit and scope of the appended claims.
Claims (8)
1. A heat dissipation system, comprising:
a heat sink unit including a first P-type semiconductor and a first N-type semiconductor connected in pair;
the heat release unit is of a fan structure, and fan blades of the fan structure comprise a second P-type semiconductor and a second N-type semiconductor which are connected in pairs;
the power supply is electrically connected with the heat absorption unit and the heat release unit to form a circulation loop, so that the current of the heat absorption unit flows to the corresponding first P-type semiconductor from the first N-type semiconductor to absorb the heat generated by the heat dissipation piece to be dissipated, and the current of the heat release unit flows to the corresponding second N-type semiconductor from the second P-type semiconductor to dissipate the heat;
the heat release unit also dissipates heat through the fan;
each fan blade of the fan structure is composed of a pair of second P-type semiconductors and second N-type semiconductors which are connected, all the second N-type semiconductors are electrically connected with the first N-type semiconductors, and all the second P-type semiconductors are electrically connected with the first P-type semiconductors.
2. The heat dissipating system of claim 1, wherein the heat sink comprises a plurality of pairs of first P-type semiconductors and first N-type semiconductors connected in pairs, all of the first N-type semiconductors being electrically connected to the second N-type semiconductors, and all of the first P-type semiconductors being electrically connected to the second P-type semiconductors.
3. The heat dissipating system of claim 2, wherein the heat sink unit has a double-ring structure, and each pair of the first P-type semiconductor and the first N-type semiconductor connected in pairs is arranged along the inner ring and the outer ring.
4. A heat dissipating system according to any of claims 1 to 3, wherein each pair of the first P-type semiconductor and the first N-type semiconductor is connected to each other through a first metal electrode.
5. The heat dissipation system of claim 1, wherein the second P-type semiconductor of each fan blade is connected to a first coil, the first coil is slidably connected to a first brush, and the first brush is electrically connected to all the first P-type semiconductors; the second N-type semiconductor of each fan blade is connected with a second coil, the second coil is connected with a second electric brush in a sliding mode, and the second electric brush is electrically connected with all the first N-type semiconductors.
6. A heat dissipating system according to any one of claims 1 to 3, wherein there are a plurality of the heat releasing units.
7. A heat dissipating system according to any one of claims 1 to 3, wherein the fan is electrically connected to a power supply unit.
8. A heat dissipation method applied to the heat dissipation system according to any one of claims 1 to 7, and assembled to a member to be dissipated, wherein the heat dissipation method comprises the following steps:
s1, detecting the temperature of the heat-dissipating piece, and judging whether the temperature of the heat-dissipating piece is greater than a temperature threshold value; if yes, go to step S2;
and S2, starting the fan, and adjusting the rotating speed of the fan according to the temperature of the heat dissipation piece to be dissipated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810353393.2A CN108601294B (en) | 2018-04-19 | 2018-04-19 | Heat dissipation system and heat dissipation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810353393.2A CN108601294B (en) | 2018-04-19 | 2018-04-19 | Heat dissipation system and heat dissipation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108601294A CN108601294A (en) | 2018-09-28 |
| CN108601294B true CN108601294B (en) | 2020-10-20 |
Family
ID=63613859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810353393.2A Active CN108601294B (en) | 2018-04-19 | 2018-04-19 | Heat dissipation system and heat dissipation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601294B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101272672A (en) * | 2007-03-22 | 2008-09-24 | 王青直 | Point static state radiator implementing method |
| CN101860329A (en) * | 2010-06-19 | 2010-10-13 | 叶真 | High-power professional audio power amplifier based on Peltier effect radiation technology |
| JP2014093338A (en) * | 2012-11-01 | 2014-05-19 | Nitto Kogyo Co Ltd | Cooling fin |
-
2018
- 2018-04-19 CN CN201810353393.2A patent/CN108601294B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101272672A (en) * | 2007-03-22 | 2008-09-24 | 王青直 | Point static state radiator implementing method |
| CN101860329A (en) * | 2010-06-19 | 2010-10-13 | 叶真 | High-power professional audio power amplifier based on Peltier effect radiation technology |
| JP2014093338A (en) * | 2012-11-01 | 2014-05-19 | Nitto Kogyo Co Ltd | Cooling fin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108601294A (en) | 2018-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100836305B1 (en) | Thermoelectric module | |
| US7795711B2 (en) | Microelectronic cooling apparatus and associated method | |
| CN112714601B (en) | A heat radiation structure and intelligent terminal for intelligent terminal | |
| US7779638B2 (en) | Localized microelectronic cooling apparatuses and associated methods and systems | |
| US7430870B2 (en) | Localized microelectronic cooling | |
| CN108601294B (en) | Heat dissipation system and heat dissipation method | |
| US20050072563A1 (en) | Heat sink structure | |
| CN212085847U (en) | Wireless charging device | |
| CN211044149U (en) | Sealed heat dissipation box | |
| CN210429787U (en) | Heat dissipation assembly, frequency converter and air conditioning unit | |
| CN113783085A (en) | Built-in circulating passive cooling module and method for air-cooled low-power solid laser of all-in-one machine | |
| CN213340350U (en) | Accurate temperature control structure of high-power chip | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| JPH10303348A (en) | Heat-conductor and thermal energy release assembly | |
| CN220475551U (en) | Sealing heat dissipation device of military small-power servo motor | |
| CN209232776U (en) | A kind of deviding device frame structure | |
| CN216413045U (en) | Dual in-line package tube shell for communication electronic device | |
| CN220964044U (en) | Heat dissipation system and photoelectric device | |
| CN219421152U (en) | Novel combined universal integrated circuit board | |
| CN221652849U (en) | Mainboard heat radiation structure | |
| CN216873449U (en) | TEC temperature control assembly | |
| CN112556235B (en) | Multi-loop miniature semiconductor refrigeration chip | |
| KR101432378B1 (en) | Heat dissipation system for power module | |
| CN219892176U (en) | Heat energy recovery structure, chip and electronic equipment | |
| CN218851204U (en) | Heat dissipation module and refrigerating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190417 Address after: 201616 No. 3666 Sixian Road, Songjiang District, Shanghai Applicant after: Shanghai Feixun Data Communication Technology Co., Ltd. Address before: 610100 125 Longquan Street Park Road, Longquanyi District, Chengdu, Sichuan. Applicant before: Sichuan fixun Information Technology Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201027 Address after: 318015 no.2-3167, zone a, Nonggang City, no.2388, Donghuan Avenue, Hongjia street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee after: Taizhou Jiji Intellectual Property Operation Co.,Ltd. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3666 Patentee before: Phicomm (Shanghai) Co.,Ltd. |
|
| TR01 | Transfer of patent right |