CN212085847U - Wireless charging device - Google Patents
Wireless charging device Download PDFInfo
- Publication number
- CN212085847U CN212085847U CN202020794586.4U CN202020794586U CN212085847U CN 212085847 U CN212085847 U CN 212085847U CN 202020794586 U CN202020794586 U CN 202020794586U CN 212085847 U CN212085847 U CN 212085847U
- Authority
- CN
- China
- Prior art keywords
- wireless charging
- heat dissipation
- heat
- charging device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present disclosure relates to a wireless charging device. The wireless charging device is used for charging electronic equipment, and comprises: a wireless charging module; the ventilation structure is arranged on the first side surface of the wireless charging module in a protruding mode, so that a first gap is formed between the wireless charging device and the electronic equipment; wherein the first gap is used for circulating airflow; the semiconductor refrigeration piece is arranged on the inner side of the wireless charging device and comprises a refrigeration surface and a heating surface which are oppositely arranged, and the ventilation structure is connected with the refrigeration surface; and the heat dissipation structure is connected with the heating surface of the semiconductor refrigeration piece. The wireless charging device disclosed by the invention is high in cooling speed and large in cooling area, and is suitable for electronic equipment of high-capacity batteries and high-power wireless charging equipment.
Description
Technical Field
The present disclosure relates to the field of wireless charging for electronic devices, and more particularly, to a wireless charging device with a good heat dissipation function.
Background
Along with the popularization of electronic equipment, especially mobile terminals, the life of people is greatly facilitated. As the functions of the mobile terminal become more and more powerful, the power consumption of the mobile terminal also becomes more and more large. Meanwhile, the demand for charging technology, especially wireless charging, for electronic devices is also increasing.
The wireless charging equipment is equipment for charging the battery under the condition of not being directly connected with the battery, and is convenient to use. Nowadays, wireless charging technology focuses more and more on high-power charging experience, and users hope to complete charging in a short time.
However, not only the electronic equipment but also the wireless charging device may be damaged by a large amount of heat generated during the charging process. High power wireless charging devices require higher heat dissipation.
In the related art, the heat dissipation mode of the electronic device is mainly heat dissipation through a housing of the electronic device. However, this method cannot solve the problem of heat dissipation of the wireless charging device during the charging process.
In the related technical scheme, the thermoelectric semiconductor radiator can be directly attached to the back of the mobile phone for cooling, and the other side of the thermoelectric semiconductor radiator adopts radiating fins or air cooling, water cooling and other modes to radiate the thermoelectric semiconductor radiator. However, during the wireless charging process, the thermoelectric semiconductor can isolate the magnetic field, so that the wireless charging device cannot work. The two methods can not solve the problem of heat dissipation of the electronic equipment in the wireless charging process, and the competitiveness of the product is reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems in the related art, the present disclosure provides a wireless charging device, which has a fast cooling speed and a large cooling area, and is suitable for electronic devices with large capacity batteries and high-power wireless charging devices.
An embodiment of the present disclosure provides a wireless charging device for charging an electronic device, including: a wireless charging module; the ventilation structure is arranged on the first side surface of the wireless charging module in a protruding mode, so that a first gap is formed between the wireless charging device and the electronic equipment; wherein the first gap is used for circulating airflow; the semiconductor refrigeration piece is arranged on the inner side of the wireless charging device and comprises a refrigeration surface and a heating surface which are oppositely arranged, and the ventilation structure is connected with the refrigeration surface; and the heat dissipation structure is connected with the heating surface of the semiconductor refrigeration piece.
In another possible embodiment, the refrigeration surface, the ventilation structure, the first side surface and the first void form a first ventilation path; the ventilation structure enables cold air of the refrigerating surface of the semiconductor refrigerating sheet to flow along the first ventilation path.
In another possible embodiment, the heat-generating surface and the heat-dissipating structure form a second ventilation path for carrying away heat from the heat-generating surface.
In another possible embodiment, the ventilation structure is a first fan.
In another possible embodiment, the heat dissipation structure includes a heat dissipation member and a second fan; the heat dissipation component is connected with the semiconductor refrigeration piece.
In another possible embodiment, the heat dissipating member is a heat sink or a heat dissipating post.
In another possible embodiment, the second fan is disposed on the same plane as the heat dissipation member.
In another possible embodiment, the outlet of the second fan is aligned with the heat sink.
In another possible embodiment, the heat sink is externally provided with heat dissipating fins.
In another possible embodiment, the wireless charging apparatus further includes: and the heat conduction structure is arranged between the heating surface and the heat dissipation structure.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
this is disclosed is through being connected the refrigeration face with ventilation structure and semiconductor refrigeration piece for ventilation structure can blow off cold air, has accelerated the cooling speed, has increased the cooling area, is applicable to the electronic equipment and the powerful wireless charging equipment of large capacity battery, because the ventilation structure protrusion sets up in the first side of wireless charging module, forms first space between electronic equipment and wireless charging device, is used for carrying out the air current circulation, can cool down electronic equipment and wireless charging equipment simultaneously. Moreover, in this disclosure, the semiconductor refrigeration piece does not directly contact with the electronic device, and the situation that the semiconductor refrigeration piece interferes with the wireless charging magnetic field in the wireless charging process can be avoided.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic structural diagram of a wireless charging device according to an exemplary embodiment.
Fig. 2 is a schematic diagram illustrating a specific structure of a wireless charging device according to an exemplary embodiment.
Fig. 3 is a schematic diagram illustrating a thermal conduction structure of a wireless charging apparatus according to an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Fig. 1 is a schematic structural diagram of a wireless charging device according to an exemplary embodiment.
As shown in fig. 1, a wireless charging device according to an embodiment of the present disclosure includes: the wireless charging device comprises a power interface 10, a wireless charging module 20, a semiconductor cooling plate 30, a ventilation structure 41 and a heat dissipation structure 42.
The power interface 10 supplies power to the wireless charging module 20. The wireless charging module 20 is used for wirelessly charging the electronic product. The electronic device may include: mobile phones, tablet computers, personal digital assistants, computers, and other electronic devices. The wireless charging module 20 may be a wireless charging circuit, a wireless charging coil, or the like.
The semiconductor cooling plate 30 is disposed inside the wireless charging module 2. The wireless charging module 20 generates heat when wirelessly charging the electronic product. When the power is supplied to the wireless charging module 20 through the power interface 10, the semiconductor cooling plate 30 may cool and dissipate heat of the wireless charging module 20.
The semiconductor chilling plate 30 may include a chilling surface 301 as a first surface, and a heating surface 302 as a second surface. The cooling surface 301 is disposed opposite the heating surface 302.
Because the volume of the electronic equipment is generally smaller and the temperature raised in the use process is limited, compared with a heat pipe or water cooling device and other refrigeration devices, the semiconductor refrigeration piece has the advantages of smaller volume, refrigeration function at lower temperature and the like, and is more suitable for refrigeration and cooling of the electronic equipment.
The semiconductor chilling plate may include an N-type semiconductor and a P-type semiconductor. During use of the wireless charging device, the current provided by the power supply flows from the N-type semiconductor to the P-type semiconductor, resulting in a decrease in the temperature of the cooling surface 301.
The ventilation structure 41 is disposed on the cooling surface 301 of the semiconductor cooling plate 30, and the heat dissipation structure 42 is disposed on the heating surface 302 of the semiconductor cooling plate 30.
The ventilation structure 41 can blow out cold air by using a connection relationship with the cooling surface 301 of the semiconductor cooling plate 30, and since the ventilation structure 41 is convexly disposed on the first side surface of the wireless charging module 20, when the electronic device is charged on the wireless charging module 20, a first gap is formed between the electronic device and the wireless charging device, enabling air circulation. The refrigeration surface 301, the ventilation structure 41, the first side surface and the first gap form a first ventilation path, and cold air blown out by the ventilation structure 41 through the refrigeration surface 301 of the semiconductor refrigeration sheet 30 can flow along the first ventilation path, that is, the cold air can simultaneously pass through the electronic device and the wireless charging device, so that the effect of cooling the electronic device and the wireless charging device simultaneously is achieved.
The ventilation structure 41 may be a first fan. The first fan can be a fan specially used for heat dissipation of the electronic equipment. The ventilation structure 41 is attached to the refrigerating surface 301 of the semiconductor refrigerating sheet 30, and one surface of the ventilation structure, which is attached to the refrigerating surface 301, is provided with a heat conducting plate or a heat conducting coating, so that heat of the refrigerating surface 301 can be rapidly transferred to the ventilation structure, cold air can be blown out from the ventilation structure, and the electronic equipment is cooled.
For some electronic devices, such as mobile electronic devices, the electronic devices themselves are also provided with a cooling heat dissipation structure, typically to dissipate heat using the housing of the mobile electronic device. In these electronic devices, the presence of the ventilation structure 41 can also increase the heat dissipation speed thereof.
The heat dissipation structure 42 can dissipate heat from the second side of the semiconductor cooling plate 30, i.e., from the heat generating side 302. The heat generating surface 302 and the heat dissipating structure 42 form a second ventilation path, thereby carrying away heat from the heat generating surface 302. The heat dissipation structure 42 may include a heat dissipation member 421 and a second fan 422.
The heat dissipation structure 42 may include a heat dissipation member 421, and the heat dissipation member 421 may be a heat sink, which is preferably made of metal, for example, aluminum or aluminum alloy. The heat sink composed of metal conducts more quickly. For example, the present embodiment uses a heat sink made of aluminum alloy.
The outside of the heat sink can also be provided with heat dissipation fins. The number of the heat dissipation fins may be set to be single or plural, and for example, the number of the heat dissipation fins in the present embodiment is set to be plural, thereby increasing the heat generation area. The plurality of radiating fins can be arranged to incline towards the same direction, so that the air circulation resistance can be reduced, and the radiating speed is accelerated.
The radiating fins can be made of aluminum alloy, and are light in weight, good in heat conductivity and capable of accelerating the radiating speed.
The second fan 422 is used for taking away the heat on the semiconductor chilling plate 30 by air cooling. The method and number of the second fans 422 are not particularly limited, as long as the heat dissipation purpose is achieved. In this embodiment, the number of the second fans 422 may be one, and the second fans 422 are disposed on the same plane as the heat dissipation fins, and the air outlets of the second fans 422 are aligned with the heat dissipation fins to increase the heat dissipation speed. The second fan 422 may be a fan dedicated to heat dissipation of the electronic device.
The temperature of the cooling surface 301 of the semiconductor cooling plate 30 is reduced, the temperature of the corresponding heating surface 302 is increased, the heating surface 302 is attached to the heat dissipation component 421, and the heat generated by the temperature increase of the heating surface 302 is conducted to the heat dissipation component 421 and is discharged through the heat dissipation component 421, so that the purpose of heat dissipation is achieved.
Fig. 2 is a schematic diagram illustrating a specific structure of a wireless charging device according to an exemplary embodiment.
As shown in fig. 2, a specific application of the wireless charging device shown in this embodiment can be as follows. The wireless charging device shown in the present embodiment may include a base 2, and a housing 6 that is inclined at a certain angle to the base 2.
A wireless charging module 20 is provided on the outer surface of the housing 6, and the wireless charging module 20 is provided on the lower half of the housing 6 close to the base 2. An electronic device 1 such as a mobile phone is charged by contacting a first side surface of a wireless charging module 20 provided in a housing 6.
A ventilation structure 41 is disposed on a first side surface of the wireless charging module 20, and the ventilation structure 41 is convexly disposed on the first side surface of the wireless charging module 20. As shown in fig. 2, since the first side surface of the wireless charging module 20 and the outer side of the housing 6 form a step difference, when the electronic device 1 is charged in the wireless charging device, a first gap is formed between the electronic device 1, the wireless charging module 20, and the housing 6 in the upper half of the housing 6.
The semiconductor chilling plates 30 are provided at the other side of the ventilation structure 41. The semiconductor cooling plate 30 is disposed inside the wireless charging module 20, and includes a cooling surface 301 and a heating surface 302 disposed opposite to each other. The ventilation structure 41 is connected with the cooling surface 301 of the semiconductor cooling plate 30.
In the process of wirelessly charging the electronic device 1, the refrigerating surface 301 of the semiconductor refrigerating sheet 30 is utilized for refrigerating, cold air of the semiconductor refrigerating sheet 30 is blown out through the ventilation structure 41, the cold air flows through the first ventilation path formed by the refrigerating surface 301, the ventilation structure 41, the first side surface and the first gap, when the wireless charging module 20 is cooled, the cold air can be blown out by utilizing the first gap formed between the electronic device 1 and the shell 6, and the effect of cooling the electronic device 1 is achieved.
In addition, since the semiconductor cooling sheet 30 is not directly in contact with the electronic device 1, the semiconductor cooling sheet does not interfere with an electromagnetic field generated during wireless charging, and thus the semiconductor cooling sheet can be applied to a wireless charging device.
The heat dissipation structure 42 can dissipate heat from the second side of the semiconductor cooling plate 30, i.e., from the heat generating side 302. The heat dissipation structure 42 includes a heat dissipation member 421, and the heat dissipation member 421 is a heat dissipation fin connected to the heat generating surface 302. The heat generating surface 302 and the heat sink form a second ventilation path, thereby carrying away heat from the heat generating surface 302.
A second fan 422 is further disposed on the upper half portion of the housing 6, and the second fan 422 and the heat sink are located on the same plane and are both disposed parallel to the housing 6. The air outlet of the second fan 422 is aligned with the heat sink, and the heat on the heat sink is taken away in an air cooling mode, so that the heat dissipation speed is increased. The second fan 422 and the heat sink are disposed on the same horizontal plane, so that the space of the upper half of the housing 6 is effectively utilized, the thickness of the wireless charging device is controlled, and the competitiveness of the product is enhanced.
In this embodiment, although the structure in which the base and the housing are combined is exemplified, it is not limited thereto. The shell can be arranged, so that the electronic equipment is horizontally placed on the shell for charging. At this time, the wireless charging module may be disposed at a central portion of the housing. From this, ventilation structure's cold wind can flow in the left and right sides direction for the cooling effect.
On the basis of the above technical solution, optionally, fig. 3 is a schematic structural diagram of a wireless charging device according to another exemplary embodiment.
As shown in fig. 3, the solution of the present embodiment may further include a heat conducting structure 7.
The heat conducting structure 7 may be a heat conducting plate or a heat conducting column. In the present embodiment, the heat conducting structure 7 used is constituted by a heat conducting plate, for example. One surface of the heat conductive plate is bonded to the heat generating surface 302, and the other surface of the heat conductive plate is bonded to the heat radiating member 421.
The heat conducting structure 421 can be made of a material with good heat conducting property, such as a metal material, preferably copper or a copper alloy. In the present embodiment, a heat conducting structure 7 made of copper alloy is used by way of example.
Electronic equipment, especially mobile electronic equipment, the heat production in the use is very fast, if can not timely and quick heat dissipation, will cause electronic equipment's damage. Therefore, the refrigerating and heat-dissipating device suitable for the electronic equipment not only achieves the aim of refrigerating and heat-dissipating, but also has higher requirements on the heat-dissipating speed. The heat conducting structure 7 added in this embodiment can quickly and uniformly conduct the heat generated by the heat generating surface 302 to the heat dissipating member 421, thereby increasing the heat dissipating speed.
In the above embodiments, the heat radiating member 421 is a heat radiating fin. In other possible embodiments, the heat dissipation member 421 may also be a heat dissipation column as long as the heat dissipation effect can be achieved.
The principle of the wireless charging device disclosed by the invention is that one side of the semiconductor refrigeration sheet is connected with the ventilation structure, and the other side of the semiconductor refrigeration sheet is connected with the heat dissipation structure, so that cold air is blown out from the ventilation structure, and heat is dissipated through the heat dissipation structure, and the purposes of dissipating heat for electronic equipment and maintaining normal use of the electronic equipment are finally achieved. The cooling and heat dissipation device is suitable for cooling and heat dissipation of wireless charging equipment, electronic equipment and the wireless charging equipment, but the application range of the cooling and heat dissipation device is not limited to the cooling and heat dissipation device. The wireless charging device can also be suitable for cooling and radiating the electronic equipment independently or cooling the wireless charging equipment independently.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A wireless charging device for charging an electronic device, comprising:
a wireless charging module;
the ventilation structure is arranged on the first side surface of the wireless charging module in a protruding mode, so that a first gap is formed between the wireless charging device and the electronic equipment; wherein the first gap is used for circulating airflow;
the semiconductor refrigeration piece is arranged on the inner side of the wireless charging device and comprises a refrigeration surface and a heating surface which are oppositely arranged, and the ventilation structure is connected with the refrigeration surface; and
and the heat dissipation structure is connected with the heating surface of the semiconductor refrigeration piece.
2. The wireless charging apparatus of claim 1,
the refrigeration surface, the ventilation structure, the first side surface and the first gap form a first ventilation path;
the ventilation structure enables cold air of the refrigerating surface of the semiconductor refrigerating sheet to flow along the first ventilation path.
3. The wireless charging apparatus of claim 1,
the heating surface and the heat dissipation structure form a second ventilation path for taking away heat of the heating surface.
4. The wireless charging apparatus of claim 1,
the ventilation structure is a first fan.
5. The wireless charging apparatus of claim 1,
the heat dissipation structure comprises a heat dissipation part and a second fan;
the heat dissipation component is connected with the semiconductor refrigeration piece.
6. The wireless charging apparatus of claim 5,
the heat dissipation part is a heat dissipation fin or a heat dissipation column.
7. The wireless charging apparatus of claim 5,
the second fan and the heat dissipation component are arranged on the same plane.
8. The wireless charging apparatus of claim 7,
the air outlet of the second fan is aligned with the heat dissipation part.
9. The wireless charging apparatus of claim 6,
and heat radiating fins are arranged outside the heat radiating fins.
10. The wireless charging apparatus of claim 1, further comprising:
and the heat conduction structure is arranged between the heating surface and the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020794586.4U CN212085847U (en) | 2020-05-13 | 2020-05-13 | Wireless charging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020794586.4U CN212085847U (en) | 2020-05-13 | 2020-05-13 | Wireless charging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212085847U true CN212085847U (en) | 2020-12-04 |
Family
ID=73567659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020794586.4U Active CN212085847U (en) | 2020-05-13 | 2020-05-13 | Wireless charging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212085847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024114300A1 (en) * | 2022-11-30 | 2024-06-06 | 蔚来移动科技有限公司 | Wireless charger for vehicle and vehicle |
-
2020
- 2020-05-13 CN CN202020794586.4U patent/CN212085847U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024114300A1 (en) * | 2022-11-30 | 2024-06-06 | 蔚来移动科技有限公司 | Wireless charger for vehicle and vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021169807A1 (en) | Electronic device, and control method and heat dissipation system therefor | |
| CN112714601B (en) | A heat radiation structure and intelligent terminal for intelligent terminal | |
| CN112383153B (en) | Wireless charger with cooling device | |
| CN212543377U (en) | Wireless charger | |
| CN212085847U (en) | Wireless charging device | |
| CN208638058U (en) | Wireless charger | |
| CN212323769U (en) | Wireless charging seat | |
| CN212588721U (en) | Heat sink device | |
| CN112286325A (en) | External radiator of notebook computer | |
| CN110970376A (en) | High-performance chip heat dissipation device | |
| CN213754110U (en) | Wireless charger with cooling device | |
| CN212323818U (en) | Charging seat and electronic equipment | |
| CN115701823A (en) | Charging equipment and charging system | |
| CN212392688U (en) | Wireless charging device and electronic system | |
| CN213752686U (en) | Electronic device | |
| CN115047961A (en) | Edge server cooling system and wide-ring-temperature edge server | |
| CN113677159A (en) | Water-cooling and air-cooling compatible heat dissipation device | |
| KR20070051308A (en) | Semiconductor cooling system and process for manufacturing the same | |
| CN110582189B (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN112864111A (en) | Heat dissipation structure for intelligent terminal and intelligent terminal | |
| US20050047085A1 (en) | High performance cooling systems | |
| CN210074809U (en) | Heat dissipation seat and wireless charging device | |
| CN113852144A (en) | Wireless charging device | |
| CN207166545U (en) | A kind of smart mobile phone radiator structure | |
| KR101818923B1 (en) | A battery pack for an electric vehicle having improved cooling efficiency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |