CN220475551U - Sealing heat dissipation device of military small-power servo motor - Google Patents
Sealing heat dissipation device of military small-power servo motor Download PDFInfo
- Publication number
- CN220475551U CN220475551U CN202223238933.3U CN202223238933U CN220475551U CN 220475551 U CN220475551 U CN 220475551U CN 202223238933 U CN202223238933 U CN 202223238933U CN 220475551 U CN220475551 U CN 220475551U
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- Prior art keywords
- heat dissipation
- heat
- main body
- servo motor
- military
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 103
- 238000007789 sealing Methods 0.000 title abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Abstract
The utility model relates to a sealing heat dissipation device of a military small-power servo motor, which comprises a main body, wherein a heating module is arranged in the main body, a first heat dissipation component and a centrifugal fan are arranged on a bottom plate of the main body, the centrifugal fan is arranged on one side of the first heat dissipation component, a second heat dissipation component is arranged on a side plate of the main body, and the first heat dissipation component on the bottom plate is communicated with the second heat dissipation component on the side plate. The sealed heat dissipation device for the low-power servo motor in the field of military industry is communicated with the second heat dissipation assembly on the side plate and the first heat dissipation assembly on the bottom, and the centrifugal fan can dissipate heat of the second heat dissipation assembly and the first heat dissipation assembly. The sealing device has the advantages that the heat dissipation problem of the sealing device in the field of military industry is effectively solved, the structure of each heat dissipation module in the sealing device is simple, the operation is easy, the heat dissipation device runs stably and reliably, and the sealing device can be cooled continuously, so that the safety and the reliability of the whole sealing device are ensured.
Description
Technical Field
The utility model relates to the field of heat dissipation devices, in particular to a sealed heat dissipation device of a military small-power servo motor.
Background
The technology in the field of the military industry is developed at a high speed, and the sealing device is widely applied in the field of the military industry. Based on the continuous improvement of the current output by the sealing device, the temperature in the sealing device is also continuously increased, and meanwhile, the requirements on the required heat dissipation conditions are higher and stricter, so that the heat dissipation device is safe and reliable, stable in performance and remarkable in heat dissipation effect.
However, the patent of the present disclosure CN2907006 discloses a sealed heat dissipation structure of an outdoor electrical cabinet, which comprises a cabinet body, wherein a through hole is formed in the rear wall of the cabinet body, a heat dissipation plate is fixedly connected on the outer side of the rear wall of the cabinet body in a sealing manner, and a semiconductor device installed in the cabinet body is fixedly connected on the inner surface of the heat dissipation plate positioned in the through hole of the rear wall of the cabinet body. The sealing and heat dissipation structure can ensure the sealing of the electric cabinet, can effectively dissipate heat of the semiconductor device installed in the electric cabinet, and ensures the normal operation of the electric cabinet under the outdoor changeable natural condition. Although the heat radiation structure can radiate the semiconductor device in the cabinet body through the heat radiation plate, the electric cabinet runs for a long time, the heat radiation effect of the cabinet body is unstable, and the running stability of the electric cabinet cannot be ensured.
Disclosure of Invention
The utility model provides a sealing heat dissipation device of a military low-power servo motor, which is used for continuously dissipating heat and cooling the sealing device and ensuring the running reliability and stability of the whole sealing device.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: the utility model provides a for military use miniwatt servo motor's sealed heat abstractor, includes the main part, is equipped with the module that generates heat in this main part, be equipped with first radiator unit and centrifugal fan on the bottom plate of main part, and this centrifugal fan arranges in one side of first radiator unit, be equipped with second radiator unit on the curb plate of main part, first radiator unit on the bottom plate communicates each other with the second radiator unit on the curb plate.
As a further improvement, a semiconductor heat dissipation assembly is further arranged in the main body, the semiconductor heat dissipation assembly comprises a semiconductor radiator, a thermal sensor of the semiconductor radiator is abutted to a second heat dissipation fin of the second heat dissipation assembly, a cold sensor of the semiconductor radiator is connected with a cold dissipation assembly, and an axial flow fan is arranged on the cold dissipation assembly.
As a further improvement, the cooling assembly comprises a mounting end, a plurality of cooling fins (and a connecting end, wherein the annular array of the cooling fins is arranged on the mounting end, and the axial flow fan is arranged on the connecting end.
As a further improvement, the first heat dissipating component is disposed in the bottom plate channel of the main body, and the first heat dissipating component includes a first mounting end and a plurality of first heat dissipating fins disposed on the first mounting end.
As a further improvement, every two adjacent first radiating fins are arranged in parallel at equal intervals and perpendicular to the first mounting ends.
As a further improvement, the second heat dissipation component is arranged in the channel of the side plate of the main body, and the first heat dissipation components are communicated with each other.
As a further improvement, the second heat dissipating assembly includes a second mounting end and a plurality of second heat dissipating fins disposed on the second mounting end.
As a further improvement, every two adjacent second radiating fins are arranged in parallel at equal intervals and perpendicular to the second mounting end.
As a further improvement, the heating module comprises a power device, an inductor and a capacitor.
As a further improvement, the inductor is arranged in the main body and is arranged at a side plate close to the main body and is adjacent to the second heat dissipation component, and the capacitor is arranged in the main body and is close to the centrifugal fan.
The technical scheme of the utility model has the following beneficial effects: according to the sealed heat dissipation device of the military low-power servo motor, the centrifugal fan is adopted to directionally increase the air convection speed of the first heat dissipation component on the bottom plate, so that the external air flow flows through the first heat dissipation component on the bottom plate, and the heat of the first heat dissipation component on the bottom plate is taken away to achieve the purpose of cooling; and secondly, the second heat dissipation component on the device and the first heat dissipation component on the bottom are mutually communicated, and the second heat dissipation component and the first heat dissipation component can be subjected to heat dissipation through the centrifugal fan. The sealing device has the advantages that the heat dissipation problem of the sealing device in the field of military industry is effectively solved, the structure of each heat dissipation module in the sealing device is simple, the operation is easy, the heat dissipation device runs stably and reliably, and the sealing device can be cooled continuously, so that the safety and the reliability of the whole sealing device are ensured.
Drawings
FIG. 1 is a schematic side cross-sectional view of the entire structure of a sealed heat sink for a military low-power servo motor of the present utility model;
FIG. 2 is a bottom view of the sealed heat sink of the military low power servo motor of the present utility model;
FIG. 3 is a front cross-sectional view of a sealed heat sink for a military low power servo motor of the present utility model;
fig. 4 is a top view of the internal structure of the sealed heat sink of the military low-power servo motor of the present utility model.
Detailed Description
Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 1 to 4, the sealed heat dissipation device of a military small-power servo motor disclosed by the utility model comprises a main body 100, wherein a heating module is arranged in the main body 100, the heating module comprises a power device 1, an inductor 3 and a capacitor 6, a first heat dissipation component 2 and a centrifugal fan 5 are arranged on a bottom plate of the main body 100, the centrifugal fan 5 is arranged on one side of the first heat dissipation component 2, a second heat dissipation component 8 is arranged on a side plate of the main body 100, the first heat dissipation component 2 on the bottom plate is communicated with the second heat dissipation component 8 on the side plate, and a semiconductor heat dissipation component 30 and a contactor 11 for controlling loads are also arranged in the main body 100.
Referring to fig. 1 and 2 in combination, the first heat dissipating component 2 is disposed in the bottom channel of the main body 100, and specifically includes a first mounting end 21 and a plurality of first heat dissipating fins 20 disposed on the first mounting end 21. In this embodiment, every two adjacent first heat dissipation fins 20 are disposed in parallel at equal intervals and perpendicular to the first mounting end 21.
Referring to fig. 3 and 4 in combination, the inductor 3 is disposed in the main body 100 and is located near a side plate of the main body 100 and adjacent to the second heat dissipation component 8, and heat generated during operation of the inductor 3 is dissipated by the second heat dissipation fins 82 in the second heat dissipation component 8 on the side plate.
The capacitor 6 is disposed in the main body 100 and near the centrifugal fan 5, and heat generated by the capacitor 6 during operation is dissipated and cooled by the semiconductor heat dissipating component 30.
The second heat dissipation assembly 8 is disposed in the channel of the side plate of the main body 100, and the first heat dissipation assemblies 2 are mutually communicated, and the second heat dissipation assembly 8 includes a second mounting end 81 and a plurality of second heat dissipation fins 82 disposed on the second mounting end 81. In this embodiment, every two adjacent second heat dissipation fins 82 are disposed in parallel at equal intervals and perpendicular to the second mounting end 81.
Referring to fig. 4 in combination, the semiconductor heat dissipation assembly 30 includes a semiconductor heat sink 9, a thermal sensor of the semiconductor heat sink 9 abuts against a second heat dissipation fin 82 of the second heat dissipation assembly 8, a cold sensor of the semiconductor heat sink 9 is connected with a cold dissipation assembly 10, and in this embodiment, the axial fan 4 is mounted on the cold dissipation assembly 10.
The cooling assembly 10 comprises a mounting end 101, a plurality of cooling fins 102 and a connecting end 103, wherein the cooling fins 102 are annularly arranged on the mounting end 101, the mounting end 101 is connected to a cold sensor of the semiconductor radiator 9, and the connecting end 103 is used for mounting the axial flow fan 4. When the inductor 3 transfers heat to the second heat dissipation component 8 on the side plate, the semiconductor radiator 9 senses the heat to start refrigerating, and transfers cold to the cooling fins 102 of the cooling component 10, and the axial flow fan 4 operates to dissipate the cold air into the device so as to realize cooling.
In this embodiment, heat is generated during operation of the power device 1, the heat emitted is transferred to the first heat dissipation component 2 on the bottom plate of the main body 100, the centrifugal fan 5 at the bottom increases the air convection speed on the plurality of first heat dissipation fins 20 in the first heat dissipation component 2 on the bottom plate in a directional manner, the heat emitted by the power device 1 is emitted along the direction parallel to the directions of the first heat dissipation fins 20, and hot air is led out upwards at the tail ends of the first heat dissipation fins 20, the inductor 3 in the device generates heat during operation, the emitted heat is transferred to the second heat dissipation component 8 on the side plate, the centrifugal fan 5 at the bottom dissipates heat to the bottom first heat dissipation component 2, meanwhile, the air direction passes through the second heat dissipation component 8 on the side plate, and takes away the heat on the second heat dissipation fins 82, when the inductor 3 transfers the heat to the second heat dissipation component 8 on the side plate, the semiconductor radiator 9 senses the heat to start to cool, the cold energy is transferred to the cooling fins 102 of the cooling component 10 during operation, the axial fan 4 dissipates the cold air into the device, the cooling effect is achieved, the capacitor 6 in the device generates heat, and the cooling effect is achieved by adopting the semiconductor radiator 9 to specifically cool the cooling fan 4 during operation, and the cooling effect is achieved.
In summary, the sealed heat dissipation device of the military low-power servo motor of the utility model increases the air convection speed to the first heat dissipation component 2 on the bottom plate by adopting the centrifugal fan 5 to orient, so that the external air flow flows through the first heat dissipation component 2 on the bottom plate, thereby taking away the heat of the first heat dissipation component 2 on the bottom plate to achieve the purpose of cooling; secondly, the device adopts the semiconductor heat dissipation refrigerator 9 to achieve the aim of reducing the temperature in the device, effectively solves the heat dissipation problem of the sealing device in the field of military industry, has the advantages of simple structure, easy operation, stable and reliable operation and continuous cooling of the sealing device, thereby ensuring the safety and reliability of the whole sealing device, and simultaneously has the characteristics of small volume, compact structure and convenient installation and maintenance; finally, the second heat dissipation component 8 on the device and the first heat dissipation component 2 on the bottom are mutually communicated, and heat dissipation can be carried out on the second heat dissipation component and the first heat dissipation component through a centrifugal fan at the bottom.
The above examples are merely illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solution of the present utility model should fall within the scope of protection defined by the claims of the present utility model without departing from the spirit of the present utility model.
Claims (8)
1. The utility model provides a for military use miniwatt servo motor's sealed heat abstractor, includes main part (100), is equipped with the module that generates heat in this main part (100), its characterized in that: a first heat dissipation component (2) and a centrifugal fan (5) are arranged on a bottom plate of the main body (100), the centrifugal fan (5) is arranged on one side of the first heat dissipation component (2), a second heat dissipation component (8) is arranged on a side plate of the main body (100), and the first heat dissipation component (2) on the bottom plate is communicated with the second heat dissipation component (8) on the side plate;
the semiconductor heat dissipation assembly (30) is further arranged in the main body (100), the semiconductor heat dissipation assembly (30) comprises a semiconductor heat radiator (9), a thermal sensor of the semiconductor heat radiator (9) is abutted to a second heat dissipation fin (82) of the second heat dissipation assembly (8), a cold sensor of the semiconductor heat radiator (9) is connected with a cold dissipation assembly (10), and an axial flow fan (4) is arranged on the cold dissipation assembly (10);
the cooling assembly (10) comprises a mounting end (101), a plurality of cooling fins (102) and a connecting end (103), wherein the cooling fins (102) are annularly arranged on the mounting end (101), and the connecting end (103) is provided with the axial flow fan (4).
2. The sealed heat sink for a military low power servo motor of claim 1, wherein: the first heat dissipation assembly (2) is arranged in the bottom plate channel of the main body (100), and the first heat dissipation assembly (2) comprises a first mounting end (21) and a plurality of first heat dissipation fins (20) arranged on the first mounting end (21).
3. The sealed heat sink for a military low power servo motor of claim 2, wherein: every two adjacent first radiating fins (20) are arranged in parallel at equal intervals and perpendicular to the first mounting ends (21).
4. The sealed heat sink for a military low power servo motor of claim 2, wherein: the second heat dissipation component (8) is arranged in a channel of a side plate of the main body (100), and the first heat dissipation components (2) are mutually communicated.
5. The sealed heat sink for a military low power servo motor of claim 2, wherein: the second heat dissipation assembly (8) comprises a second mounting end (81) and a plurality of second heat dissipation fins (82) arranged on the second mounting end (81).
6. The sealed heat sink for a military low power servo motor as set forth in claim 5, wherein: every two adjacent second radiating fins (82) are arranged in parallel at equal intervals and are perpendicular to the second mounting end (81).
7. The sealed heat sink for a military low power servo motor of claim 1, wherein: the heating module comprises a power device (1), an inductor (3) and a capacitor (6).
8. The sealed heat sink for a military low power servo motor as set forth in claim 7, wherein: the inductor (3) is arranged in the main body (100) and is arranged at a side plate close to the main body (100) and adjacent to the second heat dissipation component (8), and the capacitor (6) is arranged in the main body (100) and is close to the centrifugal fan (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223238933.3U CN220475551U (en) | 2022-12-02 | 2022-12-02 | Sealing heat dissipation device of military small-power servo motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223238933.3U CN220475551U (en) | 2022-12-02 | 2022-12-02 | Sealing heat dissipation device of military small-power servo motor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220475551U true CN220475551U (en) | 2024-02-09 |
Family
ID=89801475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223238933.3U Active CN220475551U (en) | 2022-12-02 | 2022-12-02 | Sealing heat dissipation device of military small-power servo motor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220475551U (en) |
-
2022
- 2022-12-02 CN CN202223238933.3U patent/CN220475551U/en active Active
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