CN219660244U - Semiconductor power module cooling element - Google Patents
Semiconductor power module cooling element Download PDFInfo
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- CN219660244U CN219660244U CN202320449135.0U CN202320449135U CN219660244U CN 219660244 U CN219660244 U CN 219660244U CN 202320449135 U CN202320449135 U CN 202320449135U CN 219660244 U CN219660244 U CN 219660244U
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- heat conducting
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 230000005855 radiation Effects 0.000 claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims description 11
- 230000035939 shock Effects 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 1
- 238000007664 blowing Methods 0.000 abstract description 8
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of power supply heat dissipation, and particularly discloses a semiconductor power supply module cooling element, which comprises a heat dissipation fan and a heat conduction plate, wherein the heat dissipation fan and the heat conduction plate are arranged on a power supply module; the top of the heat conducting plate is connected with a plurality of heat conducting strips, the semiconductor radiator is arranged at the top of the heat conducting strips, the heat radiating fan is arranged on one side of the semiconductor radiator, and the top of the heat conducting strips corresponds to the cold end of the semiconductor radiator; a wind distribution box arranged on the power supply module is arranged between the heat radiation fan and the semiconductor radiator and used for respectively guiding air into the top and the bottom of the semiconductor radiator; according to the utility model, the semiconductor radiator is adopted, the cold end of the semiconductor radiator corresponds to the heat conducting strip, so that heat can be timely dissipated, and the heat dissipation efficiency can be further improved by matching with the direct blowing of the heat dissipation fan.
Description
Technical Field
The utility model relates to the technical field of power supply heat dissipation, in particular to a semiconductor power supply module cooling element.
Background
A Power Control Unit (PCU) is one of the main subsystems in the EV. It consists of a power supply module (currently a high power IGBT), a capacitor bank and a gate driver, as well as many other components. When the power module works, a large amount of heat can be generated, and in actual use, a cooling component for heat dissipation needs to be paved on the power module for timely radiating the heat on the power module, so that the influence on the work of the power module is avoided.
The cooling mechanism for the power module disclosed in the prior patent publication No. CN217135913U comprises a power module main body and an oblique blowing mechanism, wherein a rectangular groove is formed in the top of the power module main body, and a plurality of radiating fins are fixedly connected with the inner cavity of the rectangular groove at equal intervals; the oblique blowing mechanism comprises a cooling fan, the cooling fan is arranged on the back of the power module main body, the front of the cooling fan is fixedly connected with a connecting ring, the connecting ring is fixedly connected with the back of the power module main body, two symmetrical and fixedly connected with bending pipes on two sides of the connecting ring, one ends of the two bending pipes are fixedly connected with strip-shaped pipes, a plurality of oblique blowing holes are uniformly formed in the outer walls of the two strip-shaped pipes at intervals, the setting of the bending pipes, the strip-shaped pipes and the oblique blowing holes is utilized, the oblique direction of air blown out by the cooling fan is blown to the cooling fin through the oblique blowing holes on the bending pipes, the strip-shaped pipes and the strip-shaped pipes, the phenomenon that hot air is blown to the connecting end of the power module is effectively avoided, and the service life of the power module is prolonged.
In the cooling mechanism, the radiating fins, the radiating fan and the like are arranged to radiate heat of the power supply module, but when radiating heat, the air of the radiating fan is led to the strip-shaped pipes and is blown to the radiating fins from the inclined air blowing holes on the two groups of strip-shaped pipes, so that the heat radiating efficiency is low and the improvement is still needed. In view of the above problems, a semiconductor power module cooling element is proposed.
Disclosure of Invention
The present utility model is directed to a cooling device for a semiconductor power module, which solves the above-mentioned problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
a semiconductor power module cooling element comprises a heat radiation fan and a heat conduction plate which are arranged on a power module;
the top of the heat conducting plate is connected with a plurality of heat conducting strips, the semiconductor radiator is arranged at the top of the heat conducting strips, the heat radiating fan is arranged on one side of the semiconductor radiator, and the top of the heat conducting strips corresponds to the cold end of the semiconductor radiator;
and a wind distribution box arranged on the power supply module is arranged between the heat radiation fan and the semiconductor radiator and used for respectively guiding air into the top and the bottom of the semiconductor radiator.
In one alternative: the air distribution box comprises a connection box and a bottom air distribution cover and a top air distribution cover which are connected to one side of the connection box, wherein the bottom of the side wall of the connection box is connected with a positioning block, the positioning block is fixed on a power module through a bolt, the bottom air distribution cover and the inner cavity of the top air distribution cover are communicated with the inner cavity of the connection box, one side, far away from the bottom air distribution cover, of the connection box is provided with an air inlet corresponding to the air outlet end of the heat dissipation fan, the air outlet end of the bottom air distribution cover corresponds to the heat conduction strip, and the air outlet end of the top air distribution cover corresponds to the top hot end of the semiconductor radiator.
In one alternative: and a heat dissipation runner is arranged between the adjacent heat conducting strips and corresponds to the air outlet end of the bottom air distribution cover.
In one alternative: the top cover of the semiconductor radiator is provided with a protective cover for protecting the semiconductor radiator and the heat conducting strips, and a ventilation cavity is arranged between a top plate of the protective cover and the semiconductor radiator.
In one alternative: the heat conducting plate is fixed on the power module through bolts, the bottom of the semiconductor radiator is connected with the fixing block, and the fixing block is fixed on the heat conducting strip through bolts.
In one alternative: a shock pad is arranged between the bottom of the heat radiation fan and the power module, the heat radiation fan is fixed on the power module through bolts, and mounting holes corresponding to the bolts are formed in the shock pad.
In one alternative: the air guide covers are arranged on two sides of the protective cover, the inner cavities of the air guide covers are communicated with the inner cavities of the protective cover, and the bottoms of the air guide covers are provided with air outlets.
In one alternative: the heat conduction strip is provided with an air guide opening, and the air guide opening corresponds to the air inlet end of the air guide cover.
Compared with the prior art, the utility model has the beneficial effects that:
the semiconductor radiator is adopted in the utility model, the cold end of the semiconductor radiator corresponds to the heat conducting strip, so that heat can be timely dissipated, and the heat dissipation efficiency can be further improved by matching with the direct blowing of the heat dissipation fan;
according to the utility model, the air distribution box is arranged, so that the air introduced by the heat dissipation fan can be timely sent to the hot end and the cold end of the semiconductor radiator, the flow of cold air and the heat dissipation of the hot end are facilitated, and the heat dissipation effect of the power supply module is improved.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic structural diagram of a heat dissipation fan according to the present utility model.
Fig. 3 is a schematic structural view of a semiconductor heat spreader and a heat conductive strip according to the present utility model.
Fig. 4 is a schematic structural view of the wind distribution box in the present utility model.
Fig. 5 is a schematic structural diagram of a wind scooper according to the present utility model.
FIG. 6 is a schematic view of the structure of the air guiding hole of the present utility model.
In the figure: 11. a protective cover; 12. a semiconductor heat sink; 13. an air distribution box; 14. a heat radiation fan; 15. a shock pad; 16. a heat conductive plate; 17. a heat conducting strip; 18. a fixed block; 19. a junction box; 20. a positioning block; 21. a bottom air distribution cover; 22. a top air distribution cover; 23. a wind scooper; 24. and (5) opening the air guide hole.
Detailed Description
Example 1
Referring to fig. 1-4, in the present embodiment, a semiconductor power module cooling element includes a heat dissipation fan 14 and a heat conduction plate 16 mounted on a power module;
as shown in fig. 2, the top of the heat conducting plate 16 is connected with a plurality of heat conducting strips 17, the semiconductor radiator 12 is installed at the top of the heat conducting strips 17, the heat radiating fan 14 is arranged at one side of the semiconductor radiator 12, and the top of the heat conducting strips 17 corresponds to the cold end of the semiconductor radiator 12;
heat of the power module can be transferred to the heat conducting strips 17 through the heat conducting plate 16 to contact the cold end of the semiconductor radiator 12;
the semiconductor radiator is a thermocouple formed by connecting an N-type semiconductor element and a P-type semiconductor element, after being connected with a direct current power supply, temperature difference and heat transfer can be generated at the joint, when current passes through P from N, electrons in N and holes in P flow reversely by an electric field, and energy generated by the current flows from heat energy of a transistor, so that heat is absorbed on a guide vane, and heat is released at the other end, and the heat is dissipated in a high temperature difference mode;
as shown in fig. 2, a wind distribution box 13 installed on the power module is arranged between the heat dissipation fan 14 and the semiconductor radiator 12, and is used for respectively guiding air into the top and the bottom of the semiconductor radiator 12;
when the heat radiation fan 14 works, external air is introduced into the air distribution box 13 and is input to the top and the bottom of the semiconductor radiator 12 through the air distribution box 13, so as to assist the semiconductor radiator 12 in heat radiation operation.
As shown in fig. 4, the wind distribution box 13 includes a connection box 19, a bottom wind distribution cover 21 and a top wind distribution cover 22 connected to one side of the connection box 19, a positioning block 20 is connected to the bottom of the side wall of the connection box 19, the positioning block 20 is fixed on the power module through bolts, inner cavities of the bottom wind distribution cover 21 and the top wind distribution cover 22 are both communicated with the inner cavity of the connection box 19, one side of the connection box 19 far away from the bottom wind distribution cover 21 is provided with an air inlet corresponding to the air outlet end of the heat dissipation fan 14, the air outlet end of the bottom wind distribution cover 21 corresponds to the heat conduction strip 17, and the air outlet end of the top wind distribution cover 22 corresponds to the top hot end of the semiconductor radiator 12;
the external air introduced from the heat radiation fan 14 enters the junction box 19, and is then blown to a target position through the bottom air distribution cover 21 and the top air distribution cover 22.
A heat dissipation flow channel is arranged between the adjacent heat conducting strips 17, and corresponds to the air outlet end of the bottom air distribution cover 21; the heat dissipation runner facilitates the flow of air.
As shown in fig. 1, the top of the semiconductor radiator 12 is covered with a protective cover 11 for protecting the semiconductor radiator 12 and the heat conducting strips 17, and a ventilation cavity is arranged between the top plate of the protective cover 11 and the semiconductor radiator 12;
the shield 11 may be mounted on the power module.
The heat conducting plate 16 is fixed on the power module through bolts, the bottom of the semiconductor radiator 12 is connected with the fixing block 18, and the fixing block 18 is fixed on the heat conducting strip 17 through bolts.
As shown in fig. 2, a shock pad 15 is arranged between the bottom of the heat dissipation fan 14 and the power module, the heat dissipation fan 14 is fixed on the power module through a bolt, and the shock pad 15 is provided with a mounting hole corresponding to the bolt; the shock pad 15 reduces the vibration transferred to the power module when the heat radiation fan 14 works.
In this embodiment, the heat of the power module can be transferred to the heat conducting strip 17 through the heat conducting plate 16 to contact with the cold end of the semiconductor radiator 12, and when the heat dissipation fan 14 works, the external air is introduced into the air distribution box 13 and is input to the top and bottom of the semiconductor radiator 12 through the air distribution box 13, so as to assist the semiconductor radiator 12 in heat dissipation operation.
Example 2
Referring to fig. 5 and 6, different from embodiment 1, wind scoopers 23 are installed on both sides of the protection cover 11, the inner cavity of the wind scoopers 23 is communicated with the inner cavity of the protection cover 11, and an air outlet is provided at the bottom of the wind scoopers 23.
The heat conducting strip 17 is provided with an air guide opening 24, and the air guide opening 24 corresponds to the air inlet end of the air guide cover 23;
in this embodiment, part of the air entering the heat dissipation flow channel carries cold air at the cold end of the semiconductor radiator 12 to be input into the air guide cover 23, and is discharged from an air outlet at the bottom of the air guide cover 23, so as to dissipate heat from the side wall of the power module.
Claims (8)
1. A semiconductor power module cooling element includes a heat radiation fan (14) and a heat conduction plate (16) mounted on a power module;
the method is characterized in that: the top of the heat conducting plate (16) is connected with a plurality of heat conducting strips (17), the semiconductor radiator (12) is arranged at the top of the heat conducting strips (17), the heat radiating fan (14) is arranged on one side of the semiconductor radiator (12), and the top of the heat conducting strips (17) corresponds to the cold end of the semiconductor radiator (12);
and an air distribution box (13) arranged on the power supply module is arranged between the heat radiation fan (14) and the semiconductor radiator (12) and is used for respectively guiding air into the top and the bottom of the semiconductor radiator (12).
2. A semiconductor power module cooling element according to claim 1, wherein: the utility model provides a semiconductor radiator, including connecting box (19), link up bottom cloth fan housing (21) and top cloth fan housing (22) of box (19) one side are kept away from to cloth fan housing (13), link up box (19) lateral wall bottom and connect locating piece (20), locating piece (20) are fixed on power module through the bolt, bottom cloth fan housing (21) and top cloth fan housing (22) inner chamber all with link up box (19) inner chamber intercommunication, link up box (19) one side and keep away from bottom cloth fan housing (21) be equipped with the air intake that cooling fan (14) air-out end corresponds, bottom cloth fan housing (21) air-out end corresponds with heat conduction strip (17), top cloth fan housing (22) air-out end corresponds with semiconductor radiator (12) top hot junction.
3. A semiconductor power module cooling element according to claim 2, wherein: and a heat dissipation flow channel is arranged between the adjacent heat conducting strips (17), and corresponds to the air outlet end of the bottom air distribution cover (21).
4. A semiconductor power module cooling element according to claim 1, wherein: the top cover of the semiconductor radiator (12) is provided with a protective cover (11) for protecting the semiconductor radiator (12) and the heat conducting strips (17), and a ventilation cavity is arranged between the top plate of the protective cover (11) and the semiconductor radiator (12).
5. A semiconductor power module cooling element according to claim 1, wherein: the heat conducting plate (16) is fixed on the power module through bolts, the bottom of the semiconductor radiator (12) is connected with the fixing block (18), and the fixing block (18) is fixed on the heat conducting strip (17) through bolts.
6. A semiconductor power module cooling element according to claim 1, wherein: a shock pad (15) is arranged between the bottom of the heat radiation fan (14) and the power module, the heat radiation fan (14) is fixed on the power module through bolts, and mounting holes corresponding to the bolts are formed in the shock pad (15).
7. A semiconductor power module cooling element according to claim 4, wherein: the air guide covers (23) are arranged on two sides of the protective cover (11), the inner cavities of the air guide covers (23) are communicated with the inner cavities of the protective cover (11), and an air outlet is arranged at the bottom of the air guide covers (23).
8. A semiconductor power module cooling element according to claim 7, wherein: the heat conducting strip (17) is provided with an air guide opening (24), and the air guide opening (24) corresponds to the air inlet end of the air guide cover (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320449135.0U CN219660244U (en) | 2023-02-28 | 2023-02-28 | Semiconductor power module cooling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320449135.0U CN219660244U (en) | 2023-02-28 | 2023-02-28 | Semiconductor power module cooling element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219660244U true CN219660244U (en) | 2023-09-08 |
Family
ID=87878954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320449135.0U Active CN219660244U (en) | 2023-02-28 | 2023-02-28 | Semiconductor power module cooling element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219660244U (en) |
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2023
- 2023-02-28 CN CN202320449135.0U patent/CN219660244U/en active Active
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