CN209232776U - A kind of deviding device frame structure - Google Patents
A kind of deviding device frame structure Download PDFInfo
- Publication number
- CN209232776U CN209232776U CN201822212875.4U CN201822212875U CN209232776U CN 209232776 U CN209232776 U CN 209232776U CN 201822212875 U CN201822212875 U CN 201822212875U CN 209232776 U CN209232776 U CN 209232776U
- Authority
- CN
- China
- Prior art keywords
- pin
- pad
- cooling fin
- frame structure
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of deviding device frame structure, copper alloy is processed into several frame units arranged side by side by punching press or lithographic method, the frame unit includes cooling fin, the heatsink upper surface two sides are respectively equipped with location hole and pad, for chip to be arranged on the pad, the position that the cooling fin bottom corresponds to the pad is equipped with trapezoidal groove, and sliding seat is equipped in the trapezoidal groove, and the sliding seating face is equipped with radiator；The cooling fin is connected with the first pin on the oblique company's of the being equipped with muscle of one middle side part of pad, the even muscle, and first pin two sides are symmetrically arranged with second pin and third pin；The second pin and the third pin pass through conducting wire respectively and the chip is electrically connected, and have the advantages that structure is simple, thermal diffusivity is good, conductive capability is strong and the service life is long.
Description
Technical field
The utility model belongs to leadframe technologies field, and in particular to a kind of deviding device frame structure.
Background technique
Lead frame belongs to semiconductor, microelectronics Packaging proprietary material, plays an important role in semiconductor package process.
Microelectronics or semiconductor packages are exactly intuitively the chip package that will be produced, provide energy for the normal work of chip
Amount, control signal, and heat dissipation and defencive function are provided.
Lead frame is that one kind is used as semiconductor chip carriers, and draws chip internal circuits by means of bonding wire
The electrical connection with outer lead is realized at end by lead frame pin, forms the key structure part of electric loop, in the semiconductors,
Lead frame mainly play a part of firm chip, conducted signal, transmission heat, need intensity, bending, electric conductivity, thermal conductivity,
Heat resistance, thermally matched, corrosion-resistant, stepping, coplanar shape, stress release etc. reach higher standard.Its major function is
The carrier of mechanical support is provided for chip, and forms pathway for electrical signals as chip circuit is connected inside and outside conducting medium, and
The thermal dissipating path of heat is generated when distributing chip operation outward together with package casing.Now, with semicon industry competition
Increasingly fierce, each semiconductor assembly and test enterprise is faced with increasing cost pressure, traditional discrete device lead frame
Frame heat dissipation effect is general, but improves material to improve thermal diffusivity higher cost.
Therefore the deviding device frame structure that a kind of structure is simple, thermal diffusivity is good, conductive capability is strong and the service life is long is needed.
Utility model content
The purpose of the utility model is to provide a kind of deviding device frame structures, to solve existing lead frame heat dissipation performance one
As, the problem of influencing chip conductive and service life.
The utility model provides the following technical solution:
Copper alloy is processed into several frame lists arranged side by side by punching press or lithographic method by a kind of deviding device frame structure
Member, the frame unit include cooling fin, and the heatsink upper surface two sides are respectively equipped with location hole and pad, on the pad
For chip to be arranged, the position that the cooling fin bottom corresponds to the pad is equipped with trapezoidal groove, wears in the trapezoidal groove
There is sliding seat, the sliding seating face is equipped with radiator；The cooling fin is close to the oblique company's of the being equipped with muscle of one middle side part of pad, institute
The first pin is connected on the company's of stating muscle, first pin two sides are symmetrically arranged with second pin and third pin；Described second draws
Foot and the third pin pass through conducting wire respectively and the chip is electrically connected.
Preferably, the second pin and the third pin widths are less than first pin widths.
Preferably, first pin, the second pin and the third pin are set to same plane and are parallel to institute
State cooling fin.
Preferably, the conducting wire is bonding wire.
Preferably, the radiator is plough groove type, parallel plate type or fence type.
The beneficial effects of the utility model are:
A kind of deviding device frame structure of the utility model, frame unit include cooling fin, heatsink upper surface two sides difference
Equipped with location hole and pad, for chip to be arranged on pad, the position that cooling fin bottom corresponds to pad is equipped with trapezoidal groove, trapezoidal
Sliding seat is equipped in groove, sliding seating face is equipped with radiator, and radiator is in reassembling type, can meet the need of different heat dissipations
It wants, there is excellent heat dissipation performance, be greatly improved the heat dissipation effect of chip；The integrated level for improving circuit, makes circuit structure more
Simply, small product size is smaller, and directly reduces circuit materials cost；
Cooling fin is even connected with the first pin, the first pin two sides pair on muscle close to the oblique company's of the being equipped with muscle of one middle side part of pad
Claim to be equipped with second pin and third pin；Second pin and third pin pass through conducting wire respectively and chip is electrically connected, and second draws
Less than the first pin widths, the first pin is more roomy for foot and third pin widths, can quickly export heat caused by chip, drop
Low chip temperature improves the fan thermal energy power and service life of discrete device；
The cross-sectional area for increasing the first pin, second pin and third pin reduces current density when pin conduction,
The loss in electric current transmission process is also reduced simultaneously, improves the conductive capability of discrete device；It increases discrete device and sets
Standby contact area reduces contact resistance, and facilitates being uniformly distributed for heat in chip adstante febre, avoids chip because of certain
Regional temperature is excessively high and fails.Effectively improve user's pcb board recurrent circuit deterioration and circuit defect in welding.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the utility model structure diagram；
Fig. 2 is part A schematic enlarged-scale view in Fig. 1.
In the figure, it is marked as 1. frame units, 2. cooling fins, 3. location holes, 4. pads, 5. chips, 6. trapezoidal grooves, 7. is sliding
Dynamic seat, 8. radiators, 9. connect muscle, 10. first pins, 11. second pins, 12. third pins, 13. conducting wires.
Specific embodiment
As shown in Figure 1, a kind of deviding device frame structure, if copper alloy is processed by punching press or lithographic method arranged side by side
Dry frame unit 1, frame unit 1 include cooling fin 2, and 2 upper surface two sides of cooling fin are respectively equipped with location hole 3 and pad 4, pad
For chip 5 to be arranged on 4, the position that 2 bottom of cooling fin corresponds to pad 4 is equipped with trapezoidal groove 6, is equipped with cunning in trapezoidal groove 6
Dynamic seat 7,7 surface of sliding seat are equipped with radiator 8；Cooling fin 2 even connects on muscle 9 close to the oblique company's of the being equipped with muscle 9 of 4 one middle side part of pad
There is the first pin 10,10 two sides of the first pin are symmetrically arranged with second pin 11 and third pin 12；Second pin 11 and third are drawn
Foot 12 is electrically connected by conducting wire 13 and chip 5 respectively.
As shown in Figure 1, second pin 11 and 12 width of third pin are less than 10 width of the first pin, the first pin 10,
Two pins 11 and third pin 12 are set to same plane and are parallel to cooling fin 2, and conducting wire 13 is bonding wire, and radiator 8 is groove
Formula, parallel plate type or fence type.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, although ginseng
The utility model is described in detail according to previous embodiment, it for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in practical
Within novel protection scope.
Claims (5)
1. a kind of deviding device frame structure, which is characterized in that if being processed into copper alloy by punching press or lithographic method arranged side by side
Dry frame unit, the frame unit include cooling fin, and the heatsink upper surface two sides are respectively equipped with location hole and pad, institute
It states for chip to be arranged on pad, the position that the cooling fin bottom corresponds to the pad is equipped with trapezoidal groove, the trapezoid-shaped trench
Sliding seat is equipped in slot, the sliding seating face is equipped with radiator；The cooling fin is tiltedly set close to one middle side part of pad
There is even muscle, is connected with the first pin on the even muscle, first pin two sides are symmetrically arranged with second pin and third pin；Institute
It states second pin and the third pin passes through conducting wire respectively and the chip is electrically connected.
2. a kind of deviding device frame structure according to claim 1, which is characterized in that the second pin and the third
Pin widths are less than first pin widths.
3. a kind of deviding device frame structure according to claim 1, which is characterized in that first pin, described second
Pin and the third pin are set to same plane and are parallel to the cooling fin.
4. a kind of deviding device frame structure according to claim 1, which is characterized in that the conducting wire is bonding wire.
5. a kind of deviding device frame structure according to claim 1, which is characterized in that the radiator is plough groove type, puts down
Andante formula or fence type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822212875.4U CN209232776U (en) | 2018-12-26 | 2018-12-26 | A kind of deviding device frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822212875.4U CN209232776U (en) | 2018-12-26 | 2018-12-26 | A kind of deviding device frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209232776U true CN209232776U (en) | 2019-08-09 |
Family
ID=67509307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822212875.4U Active CN209232776U (en) | 2018-12-26 | 2018-12-26 | A kind of deviding device frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209232776U (en) |
-
2018
- 2018-12-26 CN CN201822212875.4U patent/CN209232776U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A discrete frame structure Effective date of registration: 20200927 Granted publication date: 20190809 Pledgee: Jiangsu Zijin rural commercial bank Limited by Share Ltd. branch of science and technology Pledgor: SUNNYCHIP SEMICONDUCTOR Co. Registration number: Y2020980006505 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210913 Granted publication date: 20190809 Pledgee: Jiangsu Zijin rural commercial bank Limited by Share Ltd. branch of science and technology Pledgor: SUNNYCHIP SEMICONDUCTOR Co. Registration number: Y2020980006505 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A separator frame structure Effective date of registration: 20211015 Granted publication date: 20190809 Pledgee: Jiangsu Zijin Rural Commercial Bank Co.,Ltd. Gulou sub branch Pledgor: SUNNYCHIP SEMICONDUCTOR Co. Registration number: Y2021320000282 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230821 Granted publication date: 20190809 Pledgee: Jiangsu Zijin Rural Commercial Bank Co.,Ltd. Gulou sub branch Pledgor: SUNNYCHIP SEMICONDUCTOR CO. Registration number: Y2021320000282 |