KR101082580B1 - Thermoelectric cooler for printed circuit board with flip chip bonding - Google Patents

Thermoelectric cooler for printed circuit board with flip chip bonding Download PDF

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Publication number
KR101082580B1
KR101082580B1 KR1020100001423A KR20100001423A KR101082580B1 KR 101082580 B1 KR101082580 B1 KR 101082580B1 KR 1020100001423 A KR1020100001423 A KR 1020100001423A KR 20100001423 A KR20100001423 A KR 20100001423A KR 101082580 B1 KR101082580 B1 KR 101082580B1
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KR
South Korea
Prior art keywords
flip chip
printed circuit
circuit board
heat
thermoelectric element
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KR1020100001423A
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Korean (ko)
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KR20110080963A (en
Inventor
김시호
유정호
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충북대학교 산학협력단
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Priority to KR1020100001423A priority Critical patent/KR101082580B1/en
Publication of KR20110080963A publication Critical patent/KR20110080963A/en
Application granted granted Critical
Publication of KR101082580B1 publication Critical patent/KR101082580B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

The present invention relates to an apparatus for cooling a chip mounted on a printed circuit board. More particularly, the present invention relates to cooling a flip chip and a printed circuit board electrically connected by a flip chip bonding method, which is one of a chip on board (COB) mounting method. It relates to a device to.
To this end, the present invention uses a thin-film thermoelectric element to cool the flip chip mounted by the flip chip bonding method, and more specifically, underfilling with epoxy resin in the space between the flip chip spaced apart from each other by a bump and the printed circuit board. Instead of inserting a thin-film thermoelectric element to support the flip chip and simultaneously cool the flip chip, a heat sink may be installed on the top of the conventional flip chip, or cooling may be performed more efficiently than a conventional cooling structure using a cooling fan. The present invention relates to a thermoelectric cooling apparatus for a printed circuit board on which a flip chip of a new type, which can realize miniaturization and light weight of a device, is mounted.

Description

Thermoelectric cooler for printed circuit board with flip chip bonding

The present invention relates to an apparatus for cooling a chip mounted on a printed circuit board. More particularly, the present invention relates to cooling a flip chip electrically connected to a printed circuit board by a flip chip bonding method, which is one of a chip on board (COB) mounting method. It relates to a device to.

In order to solve the heat problem caused by the increased integration of the chip, the study of the cooling system of the chip is an important problem in terms of maintaining the performance of the current electronic equipment.

In order to solve the heat problem, various methods of mounting a chip on a printed circuit board (PCB) have been studied.

COB (Chip On Board) mounting is a method of mounting a chip on a printed circuit board (PCB) to increase the reliability and heat by electrically connecting the chip cut out on the wafer using a wire or bump to the PCB One of the chip mounting technologies with improved emission effect.

 At this time, the connection between the chip and the PCB substrate by the wire is called wire bonding, and the connection between the chip and the PCB substrate using the bump formed on the surface of the chip is called flip chip bonding.

1 is a cross-sectional view illustrating a cooling structure of a flip chip mounted on a PCB substrate in a COB method by conventional flip chip bonding.

The assembly process of such a flip chip is as follows.

① A bump 11 is formed on the surface of the chip 10.

② Mount the chip 10 having the bumps 11 formed on the PCB 20 as "face down".

③ Underfilling (30) to fill the empty space formed between the chip 10 and the PCB 20 by the non-conductive material by the bump (11).

In this case, the underfill 30 is to protect the electrical connection between the flip chip 10 and the PCB substrate 20 from an external stimulus, and generally uses an epoxy that is a non-conductive material.

Epoxy is a material with low conductivity and low thermal conductivity, which does not effectively release heat generated from flip chips.

Therefore, the heat transfer from the flip chip 10 to the PCB substrate 20 is performed only by the bumps 11, so that there is a limit to solving the heat generation of the chip due to the recent increase in the integration density of the chip and the increase in the operation speed of the chip. Since the flip chip 10 mounted on the PCB substrate 20 in a COB method by flip chip bonding, an additional cooling system is required.

To this end, in the related art, a heat sink 40 is mounted on a flip chip 10 mounted on a PCB substrate 20 by a COB method, or a cooling fan (not shown) is installed around the flip chip 10 to flip the flip chip 10. A method of cooling the heat generated in) has been proposed.

However, in recent years, in order to achieve miniaturization and light weight of electronic devices, thinning and high-density mounting are rapidly progressing, and thus, it is difficult to secure sufficient space in the PCB substrate to embed a heat sink. That is, a cooling structure in which a heat sink is installed on the top of the flip chip or a cooling fan is installed on the main surface of the flip chip in order to properly cool the flip chip has a structural disadvantage in that the size of the entire electronic device is increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and uses underfilling in an empty space between a flip chip mounted on a chip on board (COB) method by flip chip bonding and a printed circuit board (PCB). Instead, by inserting a thin-film cooling means to structurally protect against external magnetic poles and cooling the flip chip, a printed circuit equipped with a flip chip that can effectively control the miniaturization and weight of the electronic device and the heat generation of the flip chip can be effectively controlled. It is an object to provide a cooling device for a substrate.

In order to achieve the above object, a cooling device for a printed circuit board on which a flip chip is mounted according to the present invention includes a flip chip having a plurality of input / output pads and bumps formed on one surface thereof, and a heat spreader bumped on a portion corresponding to the bumps on an upper surface thereof. A pad is formed, and a bump is seated on the bump pad, and the printed circuit board is electrically connected to the flip chip, and the low temperature portion contacts the flip chip in a space spaced between the flip chip and the printed circuit board by the bump, Including a thin-film thermoelectric element inserted in contact with the thermal diffuser of the printed circuit board, the thin-film thermoelectric element supports the flip chip and at the same time the temperature of the low temperature portion of the thin-film thermoelectric element is lowered to cool the heat of the flip chip and The heat of the high temperature portion is released to the outside through the heat spreader, characterized in that to cool the flip chip.

The apparatus may further include a temperature sensor for contacting the flip chip to sense the temperature of the flip chip in real time, and a controller configured to control whether the thermoelectric device is powered by comparing the temperature measured by the temperature sensor with a reference temperature. It is characterized by.

Further, in order to improve cooling efficiency of the flip chip, heat transfer via holes vertically drilled on the printed circuit board and lower heat spreaders are further formed on the bottom surface of the printed circuit board, so that the heat of the flip chip is formed on the top surface of the printed circuit board. It is characterized in that each through the heat spreader formed through the heat spreader and the heat transfer via hole formed in the lower.

At this time, the bottom surface of the lower heat spreader may be provided with a heat sink having better heat dissipation ability than the lower heat spreader, or the outer casing of an electronic device having a printed circuit board on which a flip chip is mounted may have a lower temperature than the lower heat spreader. In the case, the lower heat spreader is installed in direct contact with the outer casing.

The effects of the present invention are as follows.

① A flip chip can be cooled by inserting a thin film type thermoelectric element between a flip chip mounted on a chip on board (COB) method by flip chip bonding and a printed circuit board (PCB). It solves the structural disadvantages of cooling by using a cooling fan has the advantage that can be appropriately respond to the demands of miniaturization and lightweight of electronic equipment.

② Instead of using the underfill which caused the heat dissipation problem of the flip chip between the flip chip and the printed circuit board, by inserting a thin-film thermoelectric element with low electrical conductivity and relatively higher thermal conductivity than epoxy, the cooling performance is remarkably improved and externally There is an advantage that can simultaneously serve to protect the circuit against the stimulus of.

③ By attaching a temperature sensor to the flip chip as in Example 2, it is possible to minimize the unnecessary energy used in the cooling device by selectively controlling the power of the thin film type thermoelectric element according to the required time and position by judging the heat generation time of the flip chip. There is an advantage to that.

④ Add a heat spreader to the bottom surface of the PCB as in Example 3, and connect the heat spreader to the heat spreader on the upper surface of the PCB through the heat transfer via hole formed on the PCB to increase the heat spreading path, thereby improving the heat spreading ability. This has the advantage of improving efficiency.

⑤ As in the fourth embodiment, the heat spreader having excellent heat dissipation ability is further installed in the heat spreader under the PCB substrate of the third embodiment to double the heat spreading ability.

⑥ When the external case of the electronic device is lower than the internal temperature of the device as in Example 5, the heat spreader under the PCB of Example 3 is directly connected to the external casing of the electronic device to double the heat spreading capacity without additional configuration such as a heat sink. It can be made, and there is an advantage that can implement the thin and short of electronic equipment.

1 is a cross-sectional view illustrating a cooling structure of a flip chip mounted on a PCB substrate in a COB method by conventional flip chip bonding.
2 is a cross-sectional view illustrating a cooling structure in which a thin film type thermoelectric element is inserted between a PCB substrate and a flip chip by a COB method by flip chip bonding according to a first embodiment of the present invention.
3 is a conceptual diagram illustrating a structure of the thin film thermoelectric element illustrated in FIG. 2.
4 is a cross-sectional view illustrating a cooling structure according to a second embodiment of the present invention, in which a temperature sensor is added in the first embodiment.
5 is a cross-sectional view of a cooling structure according to a third embodiment of the present invention, in which a lower heat spreader is added to a bottom surface of a printed circuit board of the first embodiment and connected to a heat transfer via hole.
6 is a cross-sectional view illustrating a cooling structure in which a heat sink is added to a bottom surface of a lower heat spreader of a third embodiment according to a fourth embodiment of the present invention.
7 is a cross-sectional view of a cooling structure in accordance with a fifth embodiment of the present invention, in which a lower heat spreader of the third embodiment is installed in direct contact with an outer casing of an electronic device.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, which can be replaced at the time of the present application. It should be understood that there may be various equivalents and variations.

2 is a cross-sectional view illustrating a cooling structure in which a thin film type thermoelectric element is inserted between a PCB substrate and a flip chip by a COB method by flip chip bonding according to a first embodiment of the present invention.

As shown in FIG. 2, the first embodiment of the present invention is a flip chip bonding technique, which is one of a chip on board (COB) mounting method, and a flip chip electrically connected using a bump 110. 100) and the printed circuit board (200, hereinafter referred to as a 'PCB substrate') in the space between the flip chip 100 can be supported at the same time without underfilling with a non-conductive material epoxy Provided is a cooling device capable of cooling the chip 100.

To this end, the present invention consists of inserting the thin-film thermoelectric element 300 in the space between the flip chip 100 and the PCB substrate 200 spaced from each other by the bump (110).

In this case, a chip electrically connected to the PCB substrate by flip chip bonding is called a flip chip. Flip chips are solder, gold, and lead (Pb) on input / output pads of the chip surface. A bump 110 made of a soft metal such as Pb) or silver (Ag) is formed, and the bump 110 faces face down without using wires or leads. Refers to a semiconductor chip bonded directly to), and is called a flip chip in the sense that the chip is flipped when bonded to the PCB substrate as described above.

Here, the bump 110 is an external connection terminal protruding to a predetermined height on the wafer Al pad, and electrically connects the PCB substrate 200 and the flip chip 100, and heats the flip chip 100 from the flip chip 100 to the PCB substrate 200. Providing transfer provides heat dissipation and provides space between flip chip 100 and flip chip 100 or between flip chip 100 and PCB substrate 200 to prevent electrical shorts and physically flip chip 100 It plays a role to support).

The height of the bump 110 may vary depending on the process, but is usually formed to a height of 5 ~ 10㎛.

In addition, the PCB substrate 200 has a configuration in which the flip chip 100 is mounted, and a bump pad 210 on which a bump 110 is seated is formed on a portion corresponding to the bump 110 of the flip chip 100. In addition, a heat spreader 220 is formed to diffuse and discharge heat generated from the flip chip 100 to the atmosphere.

Here, the heat spreader 220 is typically a metal layer made of a thin film of metal such as copper, which may be formed on the front surface of the PCB substrate 200 by various methods.

 For example, a method well known to those skilled in the art such as a screen printing method, a patterned coating method, a front coating method by spindle coating, or the like may be applied.

According to the present invention, in order to solve the heating problem of the flip chip 100 mounted on the PCB substrate 200 by the flip chip bonding technique, the thin film type thermoelectric element 300 thinner than the height of the bump 110 is flipped with the flip flip chip 100. The flip chip 100 is cooled by being inserted between the PCB substrates 200.

More specifically, the low temperature portion 310 of the thin film type thermoelectric element 300 contacts the flip chip 100 in a space spaced between the flip chip 100 and the PCB substrate 200 by the bump 110, and the thin film type thermoelectric element ( The high temperature part 320 of the 300 is inserted into and in contact with the heat spreader 220 of the PCB substrate 200.

 In this case, the thin film type thermoelectric element to be used has already been developed with an ultra thin film material having a micrometer (μm) unit, and the cooling function of the thermoelectric element has been sufficiently proven through many studies.

3 is a conceptual diagram illustrating a structure of a thin film type thermoelectric device applied to the present invention.

As shown in FIG. 3, the structure of the thin-film thermoelectric element 300 is formed of an array of P-type and N-type semiconductor elements serving as different conductors. The arrangement of the semiconductor devices is bonded between two ceramic substrates 330 so that they are electrically connected in series and thermally connected in parallel. When DC current flows between N-type and P-type, the temperature rises at one side and the other side decreases at the upper and lower junctions due to the Peltier effect, which absorbs or releases heat from the outside.

In this case, a portion that absorbs heat is referred to as a low temperature portion 310 and a portion that emits heat is referred to as a high temperature portion 320. The metal hot plate 340 is disposed on the upper and lower surfaces of the thermoelectric element in the high temperature part 320 and the low temperature part 310.

According to the present invention, the thin film type thermoelectric element 300 is installed between the flip chip 100 and the spaced apart space of the PCB substrate 200, and the low temperature portion 310 of the thin film type thermoelectric element 300 contacts the flip chip 100. The high temperature part 320 of the thin film type thermoelectric element 300 is installed to contact the heat spreader 220 of the PCB substrate 200. When a current flows in the thin film type thermoelectric element 300, the low temperature part 310 flips the chip 100. Absorb the heat generated from the high temperature portion 320 is released to the heat spreader 220 is radiated to the atmosphere.

As such, the thin film-type thermoelectric element 300 inserted into the empty space between the flip chip 100 and the PCB substrate 200 spaced apart due to the height of the bump 110 is heated from the flip chip 100 to the PCB substrate 200. It performs the role of transmitting the and supporting the flip chip 100 at the same time, it is possible to implement a slimmer and lighter electronic equipment than the cooling structure using a heat sink on the flip chip or using a cooling fan around the flip chip. In addition, there is an advantage that can simultaneously perform the role of protecting the circuit due to external shock even without using the underfill brought a conventional heat dissipation problem.

On the other hand, the present invention provides a cooling device that can minimize the unnecessary energy to the cooling device by determining the heating time of the flip chip to automatically turn on / off the power of the thin film type thermoelectric element according to the required cooling time and cooling position.

To this end, as shown in FIG. 4, in the second embodiment of the present invention, a temperature detecting sensor 400 which contacts the heating part of the flip chip 100 and detects the temperature of the flip chip 100, and the temperature The controller 500 is configured to control whether the thin film type thermoelectric element 300 is powered by comparing the temperature measured from the sensing sensor 400 with a set temperature (reference temperature).

Here, the thin film type thermoelectric element 300 operates by receiving power from a power supply unit (not shown) in which the power supply ON / OFF is controlled by the control unit 500.

Accordingly, when the flip chip 100 starts to be operated by the user, the temperature sensor 400 operates to measure the temperature of the flip chip 100 and the measured temperature data is transmitted to the control unit 500. 500 compares the measured temperature of the flip chip 100 with the reference temperature and determines that the measured temperature exceeds the reference temperature or requires cooling to operate the thin film type thermoelectric element 300 by sending a signal to the power supply unit.

In this case, the temperature sensor is introduced that the contact type temperature sensor is applied, but can be applied to a variety of other types of sensors, and the method of transmitting a signal between the temperature sensor and the control unit, if known in the art It is not particularly limited and may be adopted.

In addition, the third to fifth embodiments of the present invention provide a structure in which the diffusion path of heat and the heat dissipation capability are increased to improve the cooling efficiency of the flip chip.

First, according to the third embodiment of the present invention, as shown in FIG. 5, a heat spreader is further added to the bottom of the PCB substrate and connected to the heat transfer via hole to increase the diffusion path of heat.

In more detail, a lower heat spreader 230 is also formed on the bottom surface of the PCB substrate 200 having the heat spreader 220 formed thereon, and the heat transfer via hole 240 vertically and vertically drilled in the vertical direction on the PCB substrate 200. One or more of these are formed. The upper heat spreader 220 and the lower heat spreader 230 formed on the upper and lower surfaces of the PCB substrate 200 are connected to each other through the plurality of heat transfer via holes 240.

In this case, it is preferable that the inside of the heat transfer via hole 240 is plated with a metal having excellent thermal conductivity or a filler is applied so that the heat diffusion is performed more quickly.

Therefore, the heat emitted from the high temperature unit 320 of the thin film type thermoelectric element 300 radiates heat into the atmosphere through the heat spreader 220 formed on the upper surface of the PCB substrate 200, and at the same time, the PCB substrate (through the heat transfer via hole 240). Since heat is radiated to the atmosphere even through the lower heat spreader 230 formed on the bottom surface, heat generated from the flip chip 100 is cooled faster.

Next, as shown in FIG. 6, the fourth embodiment of the present invention has superior heat dissipation capability to the lower heat spreader 230 to the lower heat spreader 230 formed on the bottom surface of the PCB substrate 200 of the third embodiment of the present invention. The additional heat sink is installed to improve heat dissipation ability.

In more detail, the lower heat spreader 230 formed on the bottom surface of the PCB substrate 200 is provided to be in contact with the heat dissipation plate 600 having a plurality of heat dissipation fins.

As a result, the heat emitted from the high temperature part 320 of the thin film type thermoelectric element 300 is rapidly transferred to the heat sink 600 through the lower heat spreader 230, and heat is supplied through the heat radiation fins attached to the ends of the heat sink 600. Is released.

To this end, the heat sink 600 is preferably made of a metal material having a higher thermal conductivity than the lower heat spreader 230.

Finally, as shown in FIG. 7, the fifth embodiment of the present invention does not further contact the heat sink separately to the lower heat spreader 230 of the PCB substrate 200 as the fourth embodiment of the present invention. The substrate is installed to be in direct contact with the casing 700 forming the appearance of the electronic equipment is embedded.

This may be effectively applied when the temperature of the outer casing 700 of the electronic device is not higher than the exothermic temperature of the flip chip.

As a result, it is possible to cool the flip chip with high efficiency while suppressing the enlargement of the electronic equipment without requiring a separate heat sink for cooling the flip chip, thereby miniaturizing and reducing the weight of the electronic equipment, and maintaining the existing exterior casing. There is no additional cost by using the manufacturing cost is reduced there is an economic advantage.

100: flip chip 110: bump
200: printed circuit board (PCB substrate) 300: thin film type thermoelectric element
400: temperature sensor 500: control unit
700: heat sink 800: external casing of the electronic device

Claims (5)

  1. A flip chip 100 having bumps 110 formed on one surface thereof;
    A bump pad 210 is formed on a portion corresponding to the thermal diffuser 220 and the bump 110 on an upper surface thereof, and the bump 110 is seated on the bump pad 210 to be electrically connected to the flip chip 100. A printed circuit board 200 connected thereto; And
    The low temperature part 310 contacts the flip chip 100 and the high temperature part 320 contacts the printed circuit board 100 in an empty space of the flip chip 100 and the printed circuit board 200 spaced apart from each other by the bump 110. Including; thin-film thermoelectric element 300 is inserted into contact with the thermal diffuser 220 of the,
    While the thin film type thermoelectric element 300 supports the flip chip 100 and at the same time the temperature of the low temperature portion 310 of the thin film type thermoelectric element 300 decreases, the heat of the flip chip 100 is cooled and the thin film type thermoelectric element 300 The heat of the high temperature unit 320 is discharged to the outside through the heat spreader 220 to cool the flip chip 100,
    The thin film type thermoelectric element 300 is compared with the temperature measured by the temperature sensor 400 and the temperature sensor 400 that are in contact with the flip chip 100 and detect the temperature of the flip chip 100 and the reference temperature. And a control unit (500) for controlling whether or not the power is supplied to the furnace.
  2. delete
  3. The method according to claim 1,
    A lower heat spreader 230 is further formed on the bottom surface of the heat transfer via hole 240 and the bottom of the printed circuit board 200. The heat of the flip chip 100 is further formed in the printed circuit board 200. Thermoelectric cooling apparatus of a flip chip mounted printed circuit board, characterized in that is discharged through the lower heat spreader 230 via the heat spreader 220 and the heat transfer via hole 240 formed on the upper surface of the printed circuit board 200. .
  4. The method according to claim 3,
    A printed circuit board having a flip chip mounted on the bottom surface of the lower heat spreader 220 is further provided with a heat sink 600 having better heat dissipation capability than the lower heat spreader 220 to be in contact with the lower heat spreader 200. Thermoelectric cooling device of the substrate.
  5. The method according to claim 3,
    The bottom surface of the lower thermal diffuser 220 is installed thermoelectric cooling device of a flip chip mounted printed circuit board, characterized in that the printed circuit board 200 is installed in direct contact with the outer casing (700) of the electronic equipment is installed.
KR1020100001423A 2010-01-07 2010-01-07 Thermoelectric cooler for printed circuit board with flip chip bonding KR101082580B1 (en)

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Application Number Priority Date Filing Date Title
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101315525B1 (en) * 2011-10-27 2013-10-08 홍익대학교 산학협력단 Light emitting diode package having thermal via
KR101918261B1 (en) * 2011-11-28 2018-11-14 삼성전자주식회사 Semiconductor packages for a mobile device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071969A (en) 2002-08-08 2004-03-04 Okano Electric Wire Co Ltd Thermoelectric cooling apparatus
JP2006294782A (en) * 2005-04-08 2006-10-26 Hitachi Ltd Semiconductor light source device
KR100729362B1 (en) 2006-04-27 2007-06-11 삼성전자주식회사 Semiconductor package structures having heat dissipative element directly connected to internal circuit and methods of fabricating the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071969A (en) 2002-08-08 2004-03-04 Okano Electric Wire Co Ltd Thermoelectric cooling apparatus
JP2006294782A (en) * 2005-04-08 2006-10-26 Hitachi Ltd Semiconductor light source device
KR100729362B1 (en) 2006-04-27 2007-06-11 삼성전자주식회사 Semiconductor package structures having heat dissipative element directly connected to internal circuit and methods of fabricating the same

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