CN108581223B - Water-guided laser processing method and system - Google Patents
Water-guided laser processing method and system Download PDFInfo
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- CN108581223B CN108581223B CN201810383169.8A CN201810383169A CN108581223B CN 108581223 B CN108581223 B CN 108581223B CN 201810383169 A CN201810383169 A CN 201810383169A CN 108581223 B CN108581223 B CN 108581223B
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- 238000003672 processing method Methods 0.000 title abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 166
- 238000012545 processing Methods 0.000 claims abstract description 30
- 230000005684 electric field Effects 0.000 claims abstract description 15
- 238000003754 machining Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention relates to a water-guided laser processing method and a system, wherein an electrode generates a non-uniform electric field to act on a water beam, the deflected water beam is vertically downward, laser is focused in the vertically downward water beam, and the water beam guides the laser to act on a workpiece. The workpiece of the system is fixed on the bottom surface of a water tank on a workbench, 1 set of deflection water beam device is arranged, the water beam generated by a nozzle and the central line of a laser beam are positioned on the same plane, an electrode is arranged below the water beam, the water beam is deflected vertically downwards by a non-uniform electric field of the electrode, the laser is focused in the vertically downwards water beam, and the water beam guides the laser beam to act on the workpiece on the workbench. And 2-5 sets of deflection water beam devices can be matched, and all water beams are converged into a total water beam which is vertically downward to guide the laser beam. The high-temperature softened workpiece surface material of the laser reduces heat damage by cooling the processing area by the water beam. The invention does not need a nozzle consistent with the central line of the laser beam, the nozzle can not be ablated, the cost of the device is obviously reduced, and the invention is favorable for popularization and application of the water-guided laser.
Description
Technical Field
The invention relates to a water-guided laser processing technology, in particular to a water-guided laser processing method and a system, which adopt a non-uniform electric field to deflect the flow direction of a water beam so as to avoid the generation of water flow by laser ablation.
Background
The water-guided laser processing method focuses laser in the thin water beam, the laser is totally reflected in the water beam to propagate along the water beam, and the thin water beam impacts the workpiece to remove materials while the laser ablates the surface of the workpiece to finish cutting processing. The water beam diameter is very small, so that the water-guided laser processing realizes micro-damage cutting, and molten substances and cuttings generated by the water beam flushing laser enable the processing section to be flat, no obvious recast layer exists, and the processing quality is remarkably improved. There are some inherent drawbacks to overcome. Water-guided laser machining
Obviously, the water-guided laser processing has a great application prospect due to a plurality of excellent characteristics in the precision processing field, but the existing water-guided laser processing device has an obvious defect: the coupling of the laser and the water beam is difficult.
In the existing water-guided laser processing device, laser beams are focused to the center of a micropore of a water cavity nozzle through a focusing lens and are coupled into a low-pressure micro-water column generated by the nozzle. The micro water column guides the laser beam through total reflection of the interface between water and air to reach the surface of the workpiece, and the laser heats and softens the material in the processing area of the workpiece, and at the same time, the high-speed water flow of the water column impacts and removes the material in the softening area and strengthens the cooling effect.
In such an apparatus, the laser focus must be adjusted to be exactly centered in the nozzle that produces the water beam, and the high temperature of the laser beam will burn the nozzle with a slight deviation. In addition, during the processing process, the water beam generated by the nozzle may be pulled off if being influenced by the external environment, and the accident of laser ablation of the nozzle can be caused.
To achieve laser machining kerfs below 28 μm, the diameter of the micro-water beam cannot be greater than 22 μm, then the diameter of the nozzle micro-holes cannot exceed 26 μm, and the thickness of the nozzle is generally 1-2 mm, which requires machining through holes with a length exceeding 1mm and a diameter of 26 μm or less on high-hardness materials such as diamond and diamond, and requires extremely high finish on the machining surface, which puts extremely severe demands on the machining of the nozzle, resulting in high cost of the nozzle.
The nozzle is high in cost and easy to damage, so that the investment cost and maintenance cost of the existing water guide laser equipment are high, and popularization and use of the water guide laser process are prevented.
Disclosure of Invention
The invention aims to design a water-guided laser processing method, wherein an electrode generates a non-uniform electric field to act on a water beam, the deflected water beam is vertically downward, laser is focused in the vertically downward water beam, the water beam guides the laser to act on a workpiece, the workpiece surface material softened at high temperature of the laser is cooled by the water beam, and the thermal damage is reduced. The water guide laser method does not need a nozzle consistent with the central line of the laser beam, obviously reduces the cost of the device and is beneficial to popularization and application of the water guide laser.
Another object of the present invention is to provide a water-guided laser processing system designed based on the water-guided laser processing method of the present invention, which includes a water tank and a workbench for fixing the water tank, wherein a workpiece is fixed on the bottom surface of the water tank, an electrode is disposed below a water beam generated by a nozzle, the polarity of water molecules deflects the water beam vertically downward under the action of an uneven electric field of the electrode, and laser is focused in the vertically downward water beam, and the water beam guides the laser beam to act on the workpiece on the workbench.
According to the water-guided laser processing method, laser is guided and focused on the surface of a workpiece through a water beam, a nozzle for generating the water beam is positioned on one side of the laser beam, an uneven electric field is generated by an electrode to act on the water beam, the water beam deflects vertically downwards, the laser beam is focused in the vertically downwards water beam, the laser beam is positioned in the vertically downwards flowing water beam, and the water beam guides the laser beam to act on the workpiece, so that the water-guided laser processing is realized. The preferred solution is for the water beam flowing vertically downwards to coincide with the centre line of the laser beam.
The invention relates to a water guide laser processing system designed based on the water guide laser processing method, which comprises a water tank and a workbench, wherein the workbench surface is a horizontal plane, the water tank is fixed on the workbench surface, a workpiece is fixed on the inner bottom surface of the water tank, a laser is positioned above the water tank, the central line of a laser beam emitted by the laser is vertical to the workbench surface, and 1 set of deflection water beam devices are arranged, wherein each deflection water beam device comprises a nozzle, a positive electrode and a negative electrode. The nozzle for generating water beam is set on one side of laser beam, the central line of the nozzle and the central line of the laser beam are in the same vertical plane, the included angle between the two central lines is 10 deg. -30 deg., the distance between the outlet of the nozzle and the central line of the laser beam is 10-30 mm, and the distance between the outlet of the nozzle and the table top of the working table is 20-60 mm. The positive electrode is arranged below the water beam at the outlet of the nozzle, the negative electrode is arranged at the opposite position of the other side of the laser beam to the positive electrode, the voltage difference between the positive electrode and the negative electrode is 1000V-3000V, the uneven strong electric field generated by the positive electrode and the negative electrode is perpendicular to the plane formed by the central line of the nozzle and the central line of the laser beam, the centers of the positive electrode and the negative electrode are lower than the outlet of the nozzle, and the perpendicular distance between the centers of the positive electrode and the negative electrode and the outlet of the nozzle is 10 mm-30 mm. Because the water molecules are polar molecules, anions or cations of the water are attracted by the charged electrodes in the nonuniform electric field, and the nonuniform electric field acts on the water beam to enable the water beam to deflect downwards and flow vertically downwards. The laser beam is focused in a vertically downward flowing water beam, and the laser beam is totally reflected in the vertically downward water beam and propagates in the optical path of the water beam to reach the surface of a workpiece fixed on a workbench.
The aperture of the nozzle outlet is 10-600 mu m, and the flow velocity of the water flow at the nozzle outlet is 5-100 m/s.
The positive electrode is an electrode rod, the diameter of the electrode rod is equal to or larger than the caliber of the nozzle, the length of the electrode rod is 2-15 mm, the axial center line of the electrode rod is a horizontal line, and the electrode rod is positioned on a plane formed by the center line of the nozzle and the center line of the laser beam. The distance between one end of the electrode rod and the central line of the laser beam is 2/3-1/3 of the distance between the outlet of the nozzle and the central line of the laser beam.
The positive electrode is fixed on the three-dimensional adjusting frame so as to adjust the relative position of the electrode rod and the nozzle outlet.
The negative electrode is an electrode plate, and the plate surface of the electrode plate is perpendicular to the axial center line of the positive electrode. The area of the electrode plate surface is more than 20 times of the radial section of the positive electrode, an extension line of the axial center line of the positive electrode passes through the electrode plate surface, the distance between the electrode plate surface and the center line of the laser beam is 5-20 mm, and the preferable scheme is that the extension line of the axial center line of the positive electrode passes through the center of the electrode plate surface.
The workbench is a three-dimensional adjustable workbench.
When in use, the flow of the nozzle is regulated to stabilize the water beam; then, the voltage and the position of the positive electrode and the negative electrode are regulated to deflect the water beam, and the deflected water beam is vertically downward; finally, the laser and the focusing lens are adjusted to focus the laser beam into the water beam flowing vertically downwards.
Another scheme of the water-guiding laser processing system designed by the invention is that 2-5 sets of the water beam deflection devices are arranged, the water beams deflected by each set of the water beam deflection devices are combined into a total water beam flowing vertically downwards, and the laser beams are focused in the total water beam. The included angle between the positive electrode center line of each set of deflection water beam device and the plumb plane formed by the laser beam center line is 20-160 degrees.
The deflection water beam devices are the same.
Compared with the prior art, the water-guided laser processing method and system have the advantages that: 1. the water beam for guiding the laser does not need to be generated by an expensive nozzle with a large length-diameter ratio, the problem of nozzle ablation does not exist in the coupling process of the laser and the water beam, and the complex cavity structure in the traditional water-guiding laser device is not needed, so that the equipment cost and the maintenance cost are obviously reduced; 2. the diameter of the water beam is not limited by the diameter of a nozzle of a traditional water guide laser device, and finer water beam can be adopted, so that the processing precision is further improved; 3. the laser focus does not need to be accurately positioned at a specific position of a nozzle for generating the water beam, and only needs to be overlapped and collinear with the water beam which flows downwards vertically after deflection, so that the requirement on the focusing precision of the laser is reduced, and the coupling difficulty of the laser beam and the water beam is reduced; 4. the problems that the water beam is deflected by the liquid drops gathered around the nozzle, the laser and the water beam deviate from the processing path are avoided, so that the processing quality of the water-guided laser is stable.
Drawings
FIG. 1 is a schematic diagram of a water-guided laser processing system according to an embodiment 1;
FIG. 2 is a schematic diagram of a water-guided laser processing system according to embodiment 2;
FIG. 3 is a schematic top view of embodiment 2 of the present water-guided laser processing system;
fig. 4 is a schematic top view of embodiment 3 of the present water-guided laser processing system.
The reference numerals in the figures are: 1. nozzle 2, water beam 3, laser beam 4, negative electrode plate 5, workpiece 6, water tank 7, workbench 8, three-dimensional adjusting frame 9, positive electrode bar 10, total water beam.
Detailed Description
The invention is described in detail below with reference to the attached drawings and examples:
water conducting laser machining System example 1
In the embodiment 1 of the water-guided laser processing system, as shown in fig. 1, the table surface of a three-dimensional adjustable workbench 7 is a horizontal plane, a water tank 6 is fixed on the table surface of the workbench 7, a workpiece 5 is fixed on the inner bottom surface of the water tank 6, a laser is positioned above the water tank 6, the central line of a laser beam 3 emitted by the laser is perpendicular to the table surface of the workbench 7, and 1 set of deflection water beam devices are also arranged, wherein each deflection water beam device comprises a nozzle 1 and one of a positive electrode and a negative electrode. The nozzle 1 for generating the water beam 2 is arranged on one side of the laser beam 3, the center line of the nozzle 1 and the center line of the laser beam 3 are in the same plumb plane, the included angle theta=25° between the two center lines in this example, the distance between the outlet of the nozzle 1 and the center line of the laser beam 3 is 20mm, and the distance between the outlet of the nozzle 1 and the table surface of the workbench 7 is 40mm. The outlet aperture of the nozzle 1 in this example was 500. Mu.m, and the flow rate of the water flow at the nozzle outlet was 50m/s.
The positive electrode rod 9 is arranged below the water beam 2 at the outlet of the nozzle 1, the diameter of the electrode rod is 1mm, the length of the electrode rod is 20mm, the axial center line is a horizontal line, and the electrode rod is positioned on a plane formed by the center line of the nozzle 1 and the center line of the laser beam 3, and the vertical distance between the electrode rod and the outlet of the nozzle 1 is 20mm. One end of the electrode rod 9 is spaced 20mm from the center line of the laser beam 3. The positive electrode bar 9 is fixed on the three-dimensional adjusting frame 8 to adjust the relative position of the electrode bar 9 and the nozzle 1.
The non-uniform electric field generated by the positive electrode and the negative electrode is perpendicular to a plane formed by the central line of the nozzle and the central line of the laser beam, and the centers of the positive electrode and the negative electrode are lower than the outlet of the nozzle. Because the water molecules are polar molecules, anions or cations of the water are attracted by the charged electrode in the non-uniform strong electric field, the water beam is deflected, and the flowing direction is vertically downward.
The other side of the laser beam 3 is provided with a negative electrode plate 4 opposite to the positive electrode rod 9, the plate surface of the electrode plate 4 is vertical to the axial center line of the electrode rod 9, the plate surface of the electrode plate 4 is square with the side length of 10mm, and the extension line of the axial center line of the electrode rod 9 passes through the center of the plate surface of the electrode plate 4. The distance between the plate surface of the electrode plate 4 and the center line of the laser beam 3 is 10mm.
The voltages of the electrode rod 9 and the electrode plate 4 are respectively +1000V and-1000V, and a non-uniform electric field generated by the electrode rod 9 and the electrode plate 4 acts on the water beam 2 to downwards deflect the water beam 2, the laser beam 3 is focused in the water beam 2 flowing vertically downwards, and the laser beam 3 propagates in the optical path of the water beam 2 vertically downwards to reach the surface of a workpiece 5 fixed on a workbench 7.
When in use, the flow of the nozzle 1 is regulated to stabilize the water beam 2; then, the voltage and the position of the electrode rod 9 and the electrode plate 4 are regulated to deflect the water beam 2, and the deflected water beam 2 is vertically downward; finally, the laser and focusing lens are adjusted to focus the laser beam 3 into the vertically downward water beam 2.
Water conducting laser machining System example 2
Example 2 of the water-guided laser processing system as shown in fig. 2 and 3, this example is provided with 2 sets of deflection water beam devices, the water beams deflected by the 2 sets of deflection water beam devices are combined into a total water beam 10 flowing vertically downwards, and the laser beam 3 is focused in the total water beam 10. The laser beam 3 coincides with the center line of the total water beam 10. The included angle alpha between the center line of the electrode rod of the 2 sets of deflection water beam devices and the plumb plane formed by the center line of the laser beam 3 is 120 degrees.
One of the sets of the deflection water beam apparatus of this example 2 is the same as the deflection water beam apparatus described in the above example 1.
The distance between the outlet of the nozzle 1 of the other set of deflection water beam device and the central line of the laser beam 3 is 25mm, and the distance between the outlet of the nozzle 1 and the table surface of the workbench 7 is 50mm. The center line of the nozzle 1 and the center line of the laser beam 3 are in the same plumb plane, and the included angle θ=30° of the two center lines in this example. The outlet aperture of the nozzle 1 in this example was 600. Mu.m, and the flow rate of the water flow at the nozzle outlet was 60m/s. The diameter of the electrode rod of the sleeve is 2mm, the length of the electrode rod is 20mm, the axial center line is a horizontal line, and the vertical distance between the electrode rod and the outlet of the nozzle 1 of the sleeve and the plane formed by the center line of the nozzle 1 of the sleeve and the center line of the laser beam 3 is 20mm. One end of the electrode rod 9 is spaced 25mm from the center line of the laser beam 3. The other side of the laser beam 3 is opposite to the electrode plate 4 of the electrode rod 9, the plate surface of the electrode plate 4 is vertical to the axial center line of the electrode rod 9, the plate surface of the electrode plate 4 is square with the side length of 15mm, and the extension line of the axial center line of the electrode rod 9 passes through the center of the plate surface of the electrode plate 4. The distance between the plate surface of the electrode plate 4 and the center line of the laser beam 3 is 15mm. The voltages of the electrode rod 9 and the electrode plate 4 are respectively +1200V and-1200V.
Water conducting laser machining System example 3
Example 3 of the present water-guided laser processing system as shown in fig. 4, this example is provided with 3 sets of the deflecting water beam devices as described in example 1 above, the water beams deflected by the respective sets of the deflecting water beam devices are combined into a total water beam 10 flowing vertically downward, and the laser beam 3 is focused in the total water beam 10. The included angle between the center line of the electrode rod of the 3 sets of deflection water beam devices and the plumb plane formed by the center line of the laser beam 3 is 120 degrees.
The above embodiments are merely specific examples for further detailed description of the object, technical solution and advantageous effects of the present invention, and the present invention is not limited thereto. Any modification, equivalent replacement, improvement, etc. made within the scope of the present disclosure are included in the scope of the present invention.
Claims (7)
1. A water-guided laser processing system is characterized in that laser is guided and focused on the surface of a workpiece through a water beam (2), a nozzle (1) for generating the water beam (2) is positioned at one side of a laser beam (3), a non-uniform electric field generated by an electrode acts on the water beam (2), the water beam (2) deflects vertically downwards, the laser beam (3) is focused in the vertically downwards water beam (2), the laser beam (3) is positioned in the vertically downwards flowing water beam (2), and the water beam (2) guides the laser beam (3) to act on the workpiece (5) to realize water-guided laser processing;
the center lines of the vertically downward flowing water beam (2) and the laser beam (3) are coincident;
the water-guided laser processing system comprises a water tank (6) and a workbench (7), wherein the table top of the workbench (7) is a horizontal plane, the water tank (6) is fixed on the table top of the workbench (7), a workpiece (5) is fixed on the inner bottom surface of the water tank (6), a laser is positioned above the water tank (6), and the central line of a laser beam (3) emitted by the laser is perpendicular to the table top of the workbench (7), and the water-guided laser processing system is characterized in that:
the device is also provided with 1 set of deflection water beam device, which comprises a nozzle (1) and one of positive and negative electrodes (9, 4); the nozzle (1) for generating the water beam (2) is arranged on one side of the laser beam (3), the center line of the nozzle (1) and the center line of the laser beam (3) are positioned on the same plumb plane, the included angle between the two center lines is 10-30 degrees, the distance between the outlet of the nozzle (1) and the center line of the laser beam (3) is 10-30 mm, and the distance between the outlet of the nozzle (1) and the table top of the workbench (7) is 20-60 mm; the lower part of the water beam (2) at the outlet of the nozzle (1) is provided with a positive electrode (9), the opposite part of the other side of the laser beam (3) to the positive electrode (9) is provided with a negative electrode (4), the voltage difference between the positive electrode and the negative electrode (9, 4) is 1000V-3000V, the non-uniform electric field generated by the positive electrode and the negative electrode (9, 4) is perpendicular to the plane formed by the central line of the nozzle (1) and the central line of the laser beam (3), the centers of the positive electrode and the negative electrode (9, 4) are lower than the outlet of the nozzle (1), and the perpendicular distance between the centers of the positive electrode and the negative electrode (9, 4) and the outlet of the nozzle (1) is 10 mm-30 mm; the uneven strong electric field acts on the water beam (2) to enable the water beam to deflect downwards and flow vertically downwards; the laser beam (3) is focused in the vertically downward water beam (2), and the laser beam (3) propagates in the light path of the vertically downward water beam (2) to reach the surface of the workpiece (5); the positive electrode (9) is fixed on the three-dimensional adjusting frame (8).
2. The water-guided laser machining system of claim 1, wherein:
the aperture of the outlet of the nozzle (1) is 10-600 mu m, and the flow velocity of the water flow at the outlet of the nozzle (1) is 5-100 m/s.
3. The water-guided laser machining system of claim 1, wherein:
the positive electrode (9) is an electrode rod, the diameter of the electrode rod is equal to or larger than the caliber of the nozzle (1), the length of the electrode rod is 2-15 mm, the axial center line of the electrode rod is a horizontal line and is positioned on a plane formed by the center line of the nozzle (1) and the center line of the laser beam (3); the distance between one end of the electrode rod and the central line of the laser beam (3) is 2/3-1/3 of the distance between the outlet of the nozzle (1) and the central line of the laser beam (3).
4. The water-guided laser machining system of claim 1, wherein:
the negative electrode (4) is an electrode plate, and the plate surface of the electrode plate is perpendicular to the axial center line of the positive electrode (9); the extension line of the axial center line of the positive electrode (9) passes through the plate surface of the electrode plate, the area of the plate surface of the electrode plate is more than 20 times of the radial section of the positive electrode (9), and the distance between the plate surface of the electrode plate and the center line of the laser beam (3) is 5-20 mm.
5. The water-guided laser machining system of claim 4, wherein:
an extension line of the axial center line of the positive electrode (9) passes through the center of the electrode plate surface.
6. The water-guided laser machining system of any one of claims 1 to 5, wherein:
2-5 sets of deflection water beam devices are arranged, the water beams (2) deflected by each set of deflection water beam device are combined into a total water beam (10), and the laser beams (3) are focused in the total water beam (10); the included angle between the center line of the positive electrode (9) of each set of deflection water beam device and the plumb plane formed by the center line of the laser beam (3) is 20-160 degrees.
7. The water-guided laser machining system of claim 6, wherein:
the deflection water beam devices are the same.
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| CN201810383169.8A CN108581223B (en) | 2018-04-26 | 2018-04-26 | Water-guided laser processing method and system |
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| CN110125532B (en) * | 2019-05-15 | 2021-05-18 | 哈尔滨工业大学 | Method, system and equipment for processing workpiece by water-guided laser |
| CN113894444B (en) * | 2021-09-28 | 2022-06-14 | 武汉大学 | Water guide pulse laser processing system and method based on interference light path design |
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