CN206105148U - Self -focusing laser beam machining device - Google Patents
Self -focusing laser beam machining device Download PDFInfo
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- CN206105148U CN206105148U CN201621176158.5U CN201621176158U CN206105148U CN 206105148 U CN206105148 U CN 206105148U CN 201621176158 U CN201621176158 U CN 201621176158U CN 206105148 U CN206105148 U CN 206105148U
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Abstract
The utility model relates to a self -focusing laser beam machining device, fixture be fixed container that holds the nonlinear dielectric between lens and workstation. The laser beam gets into the nonlinear dielectric and wherein transmits the production self -focusing through the surface of lens focus in the nonlinear dielectric, the light beam after the lens focus, and through twice focus of lens and nonlinear dielectric, the sharp beam diameter who leaves the container is minimum, and straight line propagation reachs workpiece surface. The degree of depth of nonlinear dielectric in the container, self -focusing promptly is relevant apart from the energy of L and laser beam and the non -linear refractive index of a medium that adopts. Still is furnished with water jet auxiliary device, workpiece surface laser focusing point and the coincidence of efflux ejection point center. Take away residue and the heat that laser was got rid of in the impact of workpiece surface water jet. The lens focus combines together with the self -focusing, and it is near half the to reduce sharp beam diameter, improves laser beam energy density. Laser alignment transmission after the self -focusing, the angle of divergence is little, and favourable depth sculpture increases the degree of depth of processing, guarantees etching precision efficiency.
Description
Technical field
This utility model is related to technical field of laser processing, specially a kind of self-focusing laser processing device.
Background technology
Laser Processing is an important technology in micro Process field, and it has the ability and nothing of accurate cutting material at a high speed
The advantage of tool wear, has been applied to different fields, used as a kind of very effective fine processing method.
In laser processing procedure, the size of hot spot is the important parameter for affecting crudy at laser spot.In tradition
Laser Processing in, laser converges to form focus by condenser lenses, near focal point process workpiece.Laser spot hot spot is got over
It is little, it becomes possible to obtain more accurate processing part.
When general Laser Processing starts, laser focusing is in surface of the work.But as laser is carried out from surface of the work to depth
Etching, ablation point of the laser on workpiece is moved down, and laser focusing point is still because not swashing at surface of the work, i.e. laser ablation
The hot spot increase of light focal position event processing stand, result in the reduction of etching precision.What in addition operation of workbench etc. caused shakes
It is dynamic also to affect the accurate of laser focusing.
Self-focusing (self-focusing) is caused when the light pulse of high light intensity is propagated in transparent nonlinear dielectric
Nonlinear Self-Focusing effect.Its physical mechanism is that the light intensity on optical axis is stronger, apart from optical axis it is more remote where light intensity it is weaker, lead
Refractive index in the middle of cause light beam is higher, and the refractive index of beam edge is relatively low.This index distribution is just as a condenser lenses one
Sample, can produce focusing effect.
Occur for self-focusing being applied to laser process equipment design.As in Application No. 200910154783.8
A kind of state's utility application " self-focusing laser welding device ", the device does not need traditional condenser lenses or lens
Group, but the self-focusing effect using light laser in high non-linearity medium, realize the focusing of laser, for laser welding.
But only rely on self-focusing effect and realize the required laser beam focus of Laser Processing, difficulty is larger, it is also difficult to reach
The final requirement for focusing on.Thus have not yet to see and occurred in the market using the laser process equipment of self-focusing medium.
Utility model content
The purpose of this utility model is a kind of self-focusing laser processing device of design, in the light of existing laser-processing system
Increase the container for being contained with nonlinear dielectric on road, the nonlinear dielectric that the laser beam after lens focuss is entered in container is produced
Focusing is conigenous, laser beam further reduces along axis dynamic focusing, the hot spot of laser beam foucing, and laser beam transmission is similar to
Straight line, improves the precision and efficiency of Laser Processing, and its processing effect is processed equivalent to collimation laser.
A kind of self-focusing laser processing device of this utility model design includes laser instrument, lens and workbench, and workpiece is solid
Due to table surface, the laser beam Jing lens focuss of laser instrument, this device clamping device is fixed between lens and workbench
One container, in it nonlinear dielectric is held.Laser beam Jing lens focuss in the surface of nonlinear dielectric, Jing after lens focuss
Light beam enters nonlinear dielectric, and light is transmitted in the nonlinear dielectric, produces self-focusing, and Jing lens and nonlinear dielectric are twice
Focus on, the lasing beam diameter for leaving container will be minimum, straightline propagation reaches surface of the work.
The nonlinear dielectric is any one in propanol, methanol, Carbon bisulfide, benzene etc..
The depth of nonlinear dielectric in the container, i.e., the self-focusing of described nonlinear dielectric is apart from L and the energy of laser beam
The refractive index of amount and the nonlinear dielectric for being adopted is relevant, and self-focusing range formula is as follows：
L=(d/2) [n0/(2n2I0)]1/2
In formula, d is the diameter of laser beam, and lasing beam diameter during nonlinear dielectric is entered as after lens focuss；n0For
The linear refractive coefficient of nonlinear dielectric used；n2For the nonlinear refractive index of nonlinear dielectric used, I0For the peak of laser beam
Value power density.
Although laser beam transmission is similar to straight line after self-focusing, the aerial transmission of laser beam still has diverging,
Therefore, laser beam leaves nonlinear dielectric to inner bottom surface and surface of the work of the distance less than 4mm, i.e. container for reaching surface of the work
Distance is less than 4mm.
The centerline of the laser beam, lens and container is in same plumb line.
The container is transparent glass tube, and its bottom thickness is 0.5mm～2mm, to reduce what laser was transmitted in glass
Energy loss.
The internal diameter of the container is 8mm～12mm, is engaged with laser beam centrage in order to adjust, without prejudice to laser beam
Transmission.
This device is also equipped with water jet auxiliary device, including pond, pump and jet nozzle, the water jet that jet nozzle is produced
Beam is injected in surface of the work and forms water layer.The water jet sprays dot center and laser beam in surface of the work in surface of the work
The distance for focusing on dot center is equal to or less than laser beam at 1～2.5 times of surface of the work focal beam spot radius, and preferred plan is work
Part surface laser focus point and jet spray site center superposition.The residue of laser ablation is taken away in the impact of surface of the work water jet
And heat.
Compared with prior art, a kind of advantage of self-focusing laser processing device of this utility model is：1st, lens focuss with
Self-focusing combines, and transmission of the laser beam after lens focuss in nonlinear dielectric produces self-focusing, realizes secondary focusing, enters
One step reduces the diameter of laser beam, can be the half of lasing beam diameter after lens focuss, improves the energy density of laser beam, improves
Crudy and efficiency；2nd, the laser alignment transmission after self-focusing, the angle of divergence is little, when laser is carved from surface of the work to depth
During erosion, although ablation point is moved down, lasing beam diameter increase is few, improves the cone angle problem of laser boring, therefore can reduce processing
Aperture, reduces the groove width of processing, and increases the depth of processing, it is ensured that etching precision efficiency；3rd, water jet coordinates reduction laser to add
The re cast layer in work area and heat affecting.The generation of residual stress and micro-crack is avoided, slag is excluded in time, improve crudy and effect
Rate.
Description of the drawings
Fig. 1 this self-focusing laser processing device example structure schematic diagrams.
It is numbered in figure：
1st, lens, 2, container, 3, clamping device, 4, water jet auxiliary device.
Specific embodiment
This self-focusing laser processing device embodiment is as shown in figure 1, including laser instrument, lens 1, hold nonlinear dielectric
Container 2, water jet auxiliary device 4 and workbench.Workpiece is fixed on table surface, the reflected mirror reflection of laser beam of laser instrument
After changing direction, Jing lens 1 focus on surface of the work.Clamping device 3 is fixed on container 2 between lens 1 and workbench, swashs
The centerline of light beam, lens 1 and container 2 is in same plumb line.This example container 2 holds liquid carbon disulphide.
The wavelength of this example laser is 1024nm, and pulse energy intensity is 400mJ, and repetitive rate is 10HZ, and pulsewidth is 15ns, is put down
The diameter D=4mm of row laser beam, the focus point of lens 1 is in the surface of liquid, the diameter d=1.45mm of focal point laser beam；Two sulfur
Change the linear refractive coefficient n of carbon0=9.0 × 106esu；The nonlinear refractive index n of Carbon bisulfide2=96 × 10-12Esu, I0For
The peak power density of pulse, equal to pulse energy intensity divided by pulse pulsewidth again divided by liquid surface focal point laser facula
Radius.
I0=400/ (15 × d/2)=1.6152X1013W/㎡
This example self-focusing is as follows apart from the computing formula of L:
L=(d/2) [n0/(2n2I0)]1/2=40mm.
According to the suprasil that above result of calculation this example container 2 is height 45mm, a diameter of 5mm, bottom thickness is 1mm
Glass tubing, the height of the liquid of its interior Carbon bisulfide is 40mm, and the focal length of this example lens 1 is 24mm, and lens 1 are focused in container
Liquid surface, the inner bottom surface of container 2 is less than 3mm with surface of the work distance.
The water jet auxiliary device 4 of this device, including pond, pump and jet nozzle, the Water projectile that jet nozzle is produced
It is injected in surface of the work and forms water layer.The injection dot center of the water jet and laser beam are heavy in the focusing dot center of surface of the work
Close.
The present embodiment workpiece leads to, only 60 μm of diameter, and processing effect is good, and re cast layer and heat affected area are substantially less, and
Only 3 °～5 ° of the taper in processing hole, the taper for processing hole than conventional laser is substantially reduced.
As a comparison case, the container 2 in this device is removed, laser beam focus in surface of the work, are processed identical by lens 1
Workpiece, comparative example processing aperture is about 130 μm, and taper is 12 °～15 °, and processing effect is substantially not as good as the processing using this device
Effect.
It can be seen that after the device of this utility model design is to the laser beam secondary focusing after lens focuss, hence it is evident that reduce laser beam
The diameter of hot spot, is conducive to machining small, improves the quality and efficiency of retrofit.
Above-described embodiment, only further describes to the purpose of this utility model, technical scheme and beneficial effect
Specific case, this utility model is not limited to this.All any modifications made within scope of disclosure of the present utility model,
Equivalent, improvement etc., are all contained within protection domain of the present utility model.
Claims (9)
1. a kind of self-focusing laser processing device, including laser instrument, lens (1) and workbench, workpiece is fixed on table surface,
The laser beam Jing lens focuss of laser instrument, it is characterised in that：
Clamping device (3) fixes a container (2) in the lens (1) and workbench between, and in it nonlinear dielectric is held；Swash
Light beam Jing lens (1) focuses on the surface of nonlinear dielectric, and the light beam Jing after lens (1) are focused on enters nonlinear dielectric, and light exists
Transmission in the nonlinear dielectric produces self-focusing, and the laser beam straightline propagation for leaving container (2) reaches surface of the work.
2. self-focusing laser processing device according to claim 1, it is characterised in that：
The depth of the interior nonlinear dielectric of the container (2), i.e., the self-focusing of described nonlinear dielectric is as follows apart from L formula：
L=(d/2) [n0/(2n2I0)]1/2
In formula, d is the diameter of laser beam, as the lasing beam diameter after lens (1) focusing at liquid level；n0For non-thread used
The linear refractive coefficient of property medium；n2For the nonlinear refractive index of nonlinear dielectric used, I0Peak power for laser beam is close
Degree.
3. self-focusing laser processing device according to claim 1, it is characterised in that：
The inner bottom surface of the container (2) is less than 4mm with surface of the work distance.
4. self-focusing laser processing device according to claim 1, it is characterised in that：
The centerline of the laser beam, lens (1) and container (2) is in same plumb line.
5. self-focusing laser processing device according to claim 4, it is characterised in that：
The internal diameter of the container (2) is 8mm～12mm.
6. self-focusing laser processing device according to claim 1, it is characterised in that：
The container (2) is transparent glass tube, and its bottom thickness is 0.5mm～2mm.
7. self-focusing laser processing device according to claim 1, it is characterised in that：
Water jet auxiliary device (4), including pond, pump and jet nozzle are also equipped with, the Water projectile injection that jet nozzle is produced
Water layer is formed in surface of the work.
8. self-focusing laser processing device according to claim 7, it is characterised in that：
The water jet is equal in spray dot center and the laser beam of surface of the work in the distance of the focusing dot center of surface of the work
Or less than laser beam at 1～2.5 times of surface of the work laser beam focus spot radius.
9. self-focusing laser processing device according to claim 7, it is characterised in that：
The water jet sprays the focus point center superposition of dot center and laser beam in surface of the work in surface of the work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621176158.5U CN206105148U (en) | 2016-10-27 | 2016-10-27 | Self -focusing laser beam machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621176158.5U CN206105148U (en) | 2016-10-27 | 2016-10-27 | Self -focusing laser beam machining device |
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| CN206105148U true CN206105148U (en) | 2017-04-19 |
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ID=58525738
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| CN201621176158.5U Expired - Fee Related CN206105148U (en) | 2016-10-27 | 2016-10-27 | Self -focusing laser beam machining device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312302A (en) * | 2016-10-27 | 2017-01-11 | 桂林电子科技大学 | Self-focusing laser processing device |
| CN111195778A (en) * | 2020-03-16 | 2020-05-26 | 沈阳飞机工业（集团）有限公司 | Method for repairing and engraving leakage line of large sample plate by using laser marking machine |
| CN112705839A (en) * | 2020-12-31 | 2021-04-27 | 桂林电子科技大学 | Water-guided laser device based on positioning coupling |
| CN113290386A (en) * | 2021-05-10 | 2021-08-24 | 长春理工大学 | Laser/ultrasonic composite low-damage complex microstructure machining device and method for stable flow area |
-
2016
- 2016-10-27 CN CN201621176158.5U patent/CN206105148U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312302A (en) * | 2016-10-27 | 2017-01-11 | 桂林电子科技大学 | Self-focusing laser processing device |
| CN111195778A (en) * | 2020-03-16 | 2020-05-26 | 沈阳飞机工业（集团）有限公司 | Method for repairing and engraving leakage line of large sample plate by using laser marking machine |
| CN112705839A (en) * | 2020-12-31 | 2021-04-27 | 桂林电子科技大学 | Water-guided laser device based on positioning coupling |
| CN112705839B (en) * | 2020-12-31 | 2024-05-28 | 桂林电子科技大学 | Water guide laser device based on positioning coupling |
| CN113290386A (en) * | 2021-05-10 | 2021-08-24 | 长春理工大学 | Laser/ultrasonic composite low-damage complex microstructure machining device and method for stable flow area |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170419 Termination date: 20171027 |
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| CF01 | Termination of patent right due to non-payment of annual fee |