CN106312302B - A kind of self-focusing laser processing device - Google Patents

A kind of self-focusing laser processing device Download PDF

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Publication number
CN106312302B
CN106312302B CN201610951930.4A CN201610951930A CN106312302B CN 106312302 B CN106312302 B CN 106312302B CN 201610951930 A CN201610951930 A CN 201610951930A CN 106312302 B CN106312302 B CN 106312302B
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Prior art keywords
focusing
self
laser
lens
nonlinear dielectric
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CN106312302A (en
Inventor
龙芋宏
鲍家定
唐文斌
周嘉
刘清原
刘鑫
毛建冬
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Guilin University of Electronic Technology
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Guilin University of Electronic Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention is a kind of self-focusing laser processing device, and clamping device fixes the container for holding nonlinear dielectric between lens and workbench.Laser beam enters nonlinear dielectric through light beam of the lens focus behind the surface of nonlinear dielectric, lens focus and wherein transmits generation self-focusing, and the focusing twice through lens and nonlinear dielectric, the lasing beam diameter for leaving container is minimum, and straightline propagation reaches workpiece surface.The depth of nonlinear dielectric in container, i.e. self-focusing distance L are related with the refractive index of the energy of laser beam and used nonlinear dielectric.It is also equipped with water jet auxiliary device, workpiece surface laser focus point and jet stream injection dot center are overlapped.The residue and heat of laser ablation are taken away in the impact of workpiece surface water jet.Lens focus is combined with self-focusing, is reduced the nearly half of lasing beam diameter, is improved laser beam energy density.Laser alignment is transmitted after self-focusing, and the angle of divergence is small, and advantageous depth etching increases the depth of processing, guarantees etching precision efficiency.

Description

A kind of self-focusing laser processing device
Technical field
The present invention relates to technical field of laser processing, specially a kind of self-focusing laser processing device.
Background technique
Laser processing is an important technology in micro Process field, it has the ability and nothing of the accurate cutting material of high speed The advantages of tool wear, has been applied to different fields, as a kind of very effective fine processing method.
In laser processing procedure, the size of hot spot is the important parameter for influencing processing quality at laser spot.In tradition Laser processing in, laser converges to form focus by condenser lens, near focal point workpieces processing.Laser spot hot spot is got over It is small, it will be able to obtain more accurate processing part.
When general laser processing starts, laser focuses on workpiece surface.But as laser is carried out from workpiece surface to depth Etching, ablation point of the laser on workpiece move down, and laser focus point is still in workpiece surface, i.e., because not swashing at laser ablation The hot spot of light focal position event processing stand increases, and results in the reduction of etching precision.In addition it shakes caused by operation of workbench etc. It is dynamic also to will affect the accurate of laser focusing.
Self-focusing (self-focusing) is that the light pulse of high light intensity is caused when propagating in transparent nonlinear dielectric Nonlinear Self-Focusing effect.Its physical mechanism is that the light intensity on optical axis is stronger, and the local light intensity remoter apart from optical axis is weaker, is led Cause the refractive index among light beam higher, the refractive index of beam edge is lower.This index distribution is just as a condenser lens one Sample can produce focusing effect.
Occur self-focusing being applied to laser process equipment design scheme.Such as application No. is in 200910154783.8 State's application for a patent for invention " a kind of self-focusing laser welding device ", the device do not need traditional condenser lens or lens group, and It is to realize the focusing of laser using self-focusing effect of the light laser in high non-linearity medium, is used for laser welding.
But it only relies on self-focusing effect and realizes laser beam focus required for laser processing, difficulty is larger, it is also difficult to reach The requirement finally focused.It thus has not yet to see and is occurred in the market using the laser process equipment of self-focusing medium.
Summary of the invention
The purpose of the present invention is designing a kind of self-focusing laser processing device, in the optical path of existing laser-processing system Increase the container for being contained with nonlinear dielectric, the laser beam after lens focus enters the nonlinear dielectric in container, is produced from It focuses, laser beam is further reduced along axis dynamic focusing, the hot spot of laser beam foucing, and laser beam transmitting is similar to directly Line, improves the precision and efficiency of laser processing, and processing effect is equivalent to collimation laser processing.
A kind of self-focusing laser processing device that the present invention designs includes laser, lens and workbench, and workpiece is fixed on Table surface, for the laser beam of laser through lens focus, present apparatus clamping device fixes one between lens and workbench Container inside holds nonlinear dielectric.Light beam of the laser beam through lens focus in the surface of nonlinear dielectric, after lens focus Into nonlinear dielectric, light transmits in the nonlinear dielectric, generates self-focusing, gathering twice through lens and nonlinear dielectric Coke, the lasing beam diameter for leaving container will be minimum, and straightline propagation reaches workpiece surface.
The nonlinear dielectric is any one of propyl alcohol, methanol, carbon disulfide, benzene etc..
The depth of nonlinear dielectric in the container, i.e., the self-focusing distance L of the described nonlinear dielectric and the energy of laser beam Amount and the refractive index of used nonlinear dielectric are related, and self-focusing range formula is as follows:
L=(d/2) [n0/(2n2I0)]1/2
In formula, d is the diameter of laser beam, and lasing beam diameter when nonlinear dielectric is entered as after lens focus；n0For The linear refractive coefficient of nonlinear dielectric used；n2For the nonlinear refractive index of nonlinear dielectric used, I0For the peak of laser beam It is worth power density.
Although laser beam transmitting is similar to straight line after self-focusing, the aerial transmitting of laser beam still has diverging, Therefore, the distance that laser beam leaves nonlinear dielectric to arrival workpiece surface is less than 4mm, the i.e. inner bottom surface and workpiece surface of container Distance is less than 4mm.
The centerline of the laser beam, lens and container is in same plumb line.
The container is transparent glass tube, and bottom thickness is 0.5mm~2mm, is transmitted in glass with to reduce laser Energy loss.
The internal diameter of the container is 8mm~12mm, matches in order to adjust with laser beam center line, does not interfere laser beam Transmitting.
The present apparatus is also equipped with water jet auxiliary device, including pond, pump and jet nozzle, the water jet that jet nozzle generates Beam is injected in workpiece surface and forms water layer.The water jet is in the injection dot center of workpiece surface and laser beam in workpiece surface The distance for focusing dot center is equal to or less than laser beam at 1~2.5 times of workpiece surface focal beam spot radius, and preferred plan is work Part surface laser focus point and jet stream injection dot center are overlapped.The residue of laser ablation is taken away in the impact of workpiece surface water jet And heat.
Compared with prior art, the advantages of a kind of self-focusing laser processing device of the invention are as follows: 1, lens focus and autohemagglutination Coke combines, and transmitting of the laser beam after lens focus in nonlinear dielectric generates self-focusing, realizes secondary focusing, further The diameter of laser beam is reduced, can be the half of lasing beam diameter after lens focus, improve the energy density of laser beam, improve processing Quality and efficiency；2, the laser alignment transmitting after self-focusing, the angle of divergence is small, when laser is performed etching from workpiece surface to depth When, although ablation point moves down, lasing beam diameter increases seldom, improves the cone angle problem of laser boring, therefore can reduce the hole of processing Diameter reduces the groove width of processing, and increases the depth of processing, guarantees etching precision efficiency；3, water jet cooperation reduces laser processing The re cast layer and heat affecting in area.The generation for avoiding residual stress and micro-crack excludes slag in time, improves processing quality and effect Rate.
Detailed description of the invention
Fig. 1 this self-focusing laser processing device example structure schematic diagram.
Figure label are as follows:
1, lens, 2, container, 3, clamping device, 4, water jet auxiliary device.
Specific embodiment
This self-focusing laser processing device embodiment is as shown in Figure 1, including laser, lens 1, holding nonlinear dielectric Container 2, water jet auxiliary device 4 and workbench.Workpiece is fixed on table surface, and the laser beam of laser is reflected through reflecting mirror After changing direction, workpiece surface is focused on through lens 1.Container 2 is fixed between lens 1 and workbench by clamping device 3, is swashed The centerline of light beam, lens 1 and container 2 is in same plumb line.This example container 2 holds liquid carbon disulphide.
The wavelength of this example laser is 1024nm, and pulse energy intensity is 400mJ, repetitive rate 10HZ, pulsewidth 15ns, is put down The diameter D=4mm of row laser beam, 1 focus point of lens is in the surface of liquid, the diameter d=1.45mm of focal point laser beam；Two sulphur Change the linear refractive coefficient n of carbon0=9.0 × 106esu；The nonlinear refractive index n of carbon disulfide2=96 × 10-12Esu, I0For The peak power density of pulse, equal to pulse energy intensity divided by the pulsewidth of pulse again divided by liquid surface focal point laser facula Radius.
I0=400/ (15 × d/2)=1.6152X1013W/㎡
The calculation formula of this example self-focusing distance L is as follows:
L=(d/2) [n0/(2n2I0)]1/2=40mm.
It is height 45mm according to above calculated result this example container 2, the suprasil that diameter 5mm, bottom thickness are 1mm Glass tube, the height of the liquid of interior carbon disulfide are 40mm, and the focal length of this example lens 1 is 24mm, and lens 1 focus in container Liquid surface, 2 inner bottom surface of container and workpiece surface distance are less than 3mm.
The water jet auxiliary device 4 of the present apparatus, including pond, pump and jet nozzle, the Water projectile that jet nozzle generates It is injected in workpiece surface and forms water layer.The injection dot center of the water jet and laser beam are heavy in the focusing dot center of workpiece surface It closes.
The present embodiment workpiece is logical, and only 60 μm of diameter, processing effect is good, and re cast layer and heat affected area are obviously less, and Only 3 °~5 ° of taper for processing hole, the taper than conventional laser processing hole are substantially reduced.
As a comparison case, the container 2 in the present apparatus is removed, lens 1 in workpiece surface, process laser beam focus identical Workpiece, it is about 130 μm that comparative example, which processes aperture, and taper is 12 °~15 °, and processing effect is obviously not as good as the processing using the present apparatus Effect.
It can be seen that after the device that designs of the present invention is to the laser beam secondary focusing after lens focus, hence it is evident that reduce laser beam spot Diameter, be conducive to machining small, improve the quality and efficiency of retrofit.
Above-described embodiment is only further described the purpose of the present invention, technical scheme and beneficial effects specific A example, present invention is not limited to this.All any modifications made within the scope of disclosure of the invention, change equivalent replacement Into etc., it is all included in the scope of protection of the present invention.

Claims (8)

1. a kind of self-focusing laser processing device, including laser, lens (1) and workbench, workpiece are fixed on table surface, The laser beam of laser is through lens focus, it is characterised in that:
Clamping device (3) fixes a container (2) between the lens (1) and workbench, inside holds nonlinear dielectric；Swash Light beam focuses on the surface of nonlinear dielectric through lens (1), and the light beam after lens (1) focuses enters nonlinear dielectric, and light exists Transmitting generates self-focusing in the nonlinear dielectric, and the laser beam straightline propagation for leaving container (2) reaches workpiece surface；
The self-focusing distance L formula of the depth of the interior nonlinear dielectric of the container (2), i.e., the described nonlinear dielectric is as follows:
L=(d/2) [n0/(2n2I0)]1/2
In formula, d is the diameter of laser beam, as the lasing beam diameter after lens (1) focusing at liquid level；n0It is used non-thread The linear refractive coefficient of property medium；n2For the nonlinear refractive index of nonlinear dielectric used, I0It is close for the peak power of laser beam Degree；
Inner bottom surface and the workpiece surface distance of the container (2) are less than 4mm.
2. self-focusing laser processing device according to claim 1, it is characterised in that:
The nonlinear dielectric is any one of propyl alcohol, methanol, carbon disulfide and benzene.
3. self-focusing laser processing device according to claim 1, it is characterised in that:
The centerline of the laser beam, lens (1) and container (2) is in same plumb line.
4. self-focusing laser processing device according to claim 3, it is characterised in that:
The internal diameter of the container (2) is 8mm~12mm.
5. self-focusing laser processing device according to claim 1, it is characterised in that:
The container (2) is transparent glass tube, and bottom thickness is 0.5mm~2mm.
6. self-focusing laser processing device according to claim 1, it is characterised in that:
Water jet auxiliary device (4), including pond, pump and jet nozzle are also equipped with, the Water projectile injection that jet nozzle generates Water layer is formed in workpiece surface.
7. self-focusing laser processing device according to claim 6, it is characterised in that:
The water jet is equal in the injection dot center of workpiece surface and laser beam in the distance of the focusing dot center of workpiece surface Or less than laser beam at 2.5 times of workpiece surface focal beam spot radius.
8. self-focusing laser processing device according to claim 6, it is characterised in that:
The water jet is overlapped in the injection dot center of workpiece surface and laser beam in the focusing dot center of workpiece surface.
CN201610951930.4A 2016-10-27 2016-10-27 A kind of self-focusing laser processing device Active CN106312302B (en)

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CN107671438A (en) * 2017-11-08 2018-02-09 肇庆皈智能科技有限公司 A kind of structure and its process for laser machining mobile phone waterproof earpiece screen precise micropore
CN110018565B (en) * 2019-03-19 2021-10-01 北京工业大学 Method and device for improving focusing capacity of ultrafast laser beam
CN110125532B (en) * 2019-05-15 2021-05-18 哈尔滨工业大学 Method, system and equipment for processing workpiece by water-guided laser
CN112048285B (en) * 2019-06-06 2021-11-23 深圳市吉祥云科技有限公司 Glass punching auxiliary agent and preparation method thereof
CN111940907A (en) * 2020-07-28 2020-11-17 南京理工大学 Device and method for preparing micro-nano structure by flowing water assisted ultrafast laser
CN114986397A (en) * 2022-06-08 2022-09-02 中国人民解放军国防科技大学 Clamping device for water jet polishing process

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CN103358027A (en) * 2013-07-16 2013-10-23 桂林电子科技大学 Laser processing method and system assisted by water jet and gas jet

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CN103358027A (en) * 2013-07-16 2013-10-23 桂林电子科技大学 Laser processing method and system assisted by water jet and gas jet

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