CN113894444B - Water guide pulse laser processing system and method based on interference light path design - Google Patents

Water guide pulse laser processing system and method based on interference light path design Download PDF

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Publication number
CN113894444B
CN113894444B CN202111144558.3A CN202111144558A CN113894444B CN 113894444 B CN113894444 B CN 113894444B CN 202111144558 A CN202111144558 A CN 202111144558A CN 113894444 B CN113894444 B CN 113894444B
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laser
interference
water
water jet
pulse laser
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CN113894444A (en
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李辉
陈云
盛家正
申胜男
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Wuhan University WHU
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Wuhan University WHU
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a water-guided laser processing system and method based on interference light path design, wherein the processing system comprises a water jet nozzle, an interference laser generating device, a laser steering device and an electric field steering device; the invention generates interference laser by the interference laser generating device, adjusts the size and pulse waveform parameters of the interference laser, and generates an electric field by the electric field steering device to steer the water jet; and adjusting the direction of the interference laser by using a laser steering device, so that the interference laser is coupled with the water jet in a total reflection manner at the water jet steering position to form water-guided laser for processing, wherein the direction of the interference laser after being adjusted is coaxial with the steered water jet, and the water-guided laser acts on the surface of a workpiece to perform drilling processing. The invention reduces the diameter of the interfered laser beam by using the interference laser generating device, and improves the punching precision of the water-guided laser. The invention avoids firing the nozzle by laser and reduces the equipment cost of water-jet guided laser by deflecting the water jet.

Description

Water guide pulse laser processing system and method based on interference light path design
Technical Field
The invention belongs to the field of machining, relates to a water guide pulse laser punching technology, and particularly relates to a water guide pulse laser machining system and method based on interference light path design.
Background
With the rapid development of modern technology, the development of water-jet guided laser drilling technology has matured gradually and is recognized, accepted and adopted by more and more people. At present, water-guided laser is used for cutting and punching key parts or tiny electronic products. The water-guided laser has many excellent characteristics, so that the water-guided laser has a wide application prospect. The principle of water-guided laser is to guide laser to the surface of a workpiece by using a water beam optical fiber to conduct a laser beam. The laser is totally reflected in the water beam, and when the surface of the workpiece is ablated and fused by the laser, the micro water beam impacts the workpiece to remove materials and cool the workpiece, so that the workpiece is machined.
Although the existing water-jet guided laser processing system has many advantages, certain defects still exist. The concrete can be summarized into the following three points:
1. the water jet has a large diameter, so that extremely precise parts or instruments cannot be cut or punched;
2. the traditional water-jet guided laser beam needs to be focused at a certain point, the coupling head is complex, and the laser beam is difficult to couple with the water jet;
3. The coupling of the laser beam and the water jet is difficult, the nozzle is easy to ablate, and the water-jet guided laser device has higher cost.
Aiming at the defects, the traditional water-guide laser drilling technology cannot overcome the defects at the same time. The general improved water-guide pulse laser drilling technology meets the three defects, and only one of the three defects is usually taken as an improvement target, so that a water-guide pulse laser processing system and a water-guide pulse laser processing method based on interference optical path design are provided for solving the problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention designs the water guide pulse laser processing system and method based on the interference light path design, which can greatly reduce the diameter of the water jet, realize the ultra-precision water guide pulse laser drilling and greatly improve the processing precision. Meanwhile, the central line of the laser beam does not need to be consistent with the central line of the nozzle, so that the nozzle cannot be ablated, and the cost of the water-jet guided laser equipment is reduced.
In order to achieve the above object, the present invention provides a water guided laser processing system based on an interference optical path design, which is characterized in that: comprises a water jet nozzle, an interference laser generating device, a laser steering device and an electric field steering device;
The interference laser generating device is used for generating interference laser;
the water jet nozzle is used for jetting water jet for processing;
the electric field steering device is used for generating an electric field in a water jet passing area and steering the water jet;
the laser steering device is used for adjusting the direction of the interference laser, so that the interference laser is coupled with the water jet in a total reflection manner at the water jet steering position to form the water-guided laser for processing, and the direction of the interference laser after the direction adjustment is coaxial with the steered water jet.
Furthermore, the interference laser generating device comprises two pulse laser generators, an interference plate and a pulse laser receiver which are sequentially arranged along a light path, wherein the two pulse laser generators are used for generating two laser beams capable of interfering, an interference seam corresponding to the positions of the two pulse laser generators is arranged on the interference plate, and the pulse laser receiver is used for receiving and transmitting the interference laser formed after interference. Two pulse laser generators generate two coherent laser beams with the same frequency, constant phase difference and consistent vibration direction, and the laser interference is carried out through an interference plate to obtain interference laser.
Furthermore, the interference laser generating device further comprises a pulse laser shaper, and the pulse laser shaper is arranged on an exit light path of the pulse laser receiver and used for improving the stability of the interference laser.
Furthermore, the interference laser generating device further comprises a laser position adjuster, and the laser position adjuster is used for adjusting the distance between the two pulse laser generators and the laser interference plate, so that the diameter of the interference laser is adjusted.
Further, the laser steering device is a laser mirror.
Furthermore, a focusing lens for focusing is arranged on the reflection light path of the laser reflector.
Furthermore, a filter lens and a camera for detecting the diameter of the interference laser are further arranged on the back of a reflection light path of the laser reflector, the filter lens is used for filtering the over-strong scattering laser, and the camera is used for shooting a spot photo of the scattering laser so as to monitor the diameter of the laser.
Furthermore, the electric field steering device comprises a positive electrode and a negative electrode which are distributed on two sides of the water jet and an electrode power supply connected with the positive electrode and the negative electrode. The non-uniform strong electric fields generated by the positive electrode and the negative electrode can deflect the water beam to enable the water beam to deflect downwards and guide the pulse laser to act on a workpiece;
the principle that the non-uniform strong electric field can deflect the water beams is that water molecules are polar molecules, anions or cations of the water in the non-uniform strong electric field are attracted by charged electrodes, and the non-uniform electric field acts on the water beams to deflect the water beams downwards and flow vertically downwards.
The positive electrode rod is arranged on the electrode rod moving platform, the negative electrode plate is fixed on the negative electrode fixing plate, the electrode rod moving platform is a two-dimensional moving platform or a three-dimensional moving platform, the relative position between the positive electrode rod and the negative electrode plate can be adjusted through the electrode rod moving platform, the diameter of the positive electrode rod is 2-3 times of that of the nozzle, and the length of the positive electrode rod is 5-15 mm. The axial center line of the positive electrode bar is perpendicular to the surface of the negative electrode plate and passes through the center point of the negative electrode plate, the diameter of the electric shock bar is larger than that of the water beam, the area of the surface of the electric shock bar is more than 30 times of the radial section of the electric shock bar, and the negative electrode fixing plate is used for fixing the position of the electric shock bar. The power supply supplies voltage to the positive electrode and the negative electrode, so that a non-uniform electric field is generated.
Furthermore, the included angle between the center line of the water jet nozzle and the center line of the interference laser after the direction is adjusted is 10-30 degrees.
The invention also provides a water-guided laser processing method based on interference light path design, which adopts any one of the water-guided laser processing systems and is characterized by comprising the following steps:
step 1, building a water-guided laser processing system, and placing a workpiece to be processed on a processing platform;
Step 2, starting an interference laser generating device, and adjusting laser parameters and the diameter of interference laser;
step 3, turning on the water jet nozzle and the electric field steering device, and steering the water jet sprayed by the water jet nozzle to a required direction through the electric field steering device;
and 4, coupling the interference laser into water jet flow at the water jet flow steering position through total reflection of the laser steering device to form water-guided laser, and punching the workpiece through the water-guided laser.
Further, in order to obtain a stable pulse laser beam, the computer in step 1 has a determination function, and if the diameter of the pulse laser beam after interference is large, the computer transmits a signal to the controller, and the controller changes the position of the pulse laser or the wavelength of the pulse laser so that the diameter of the pulse laser beam after interference is reduced.
Further, the diameter of the outlet of the nozzle is 10-50 um, the vertical distance between the nozzle and the workpiece is 15-50 mm, and the nozzle, the radial axis of the positive electrode rod, the central vertical line of the negative electrode, the central line of the pulse laser and the central longitudinal section of the workpiece are located in the same plane. The centers of the positive electrode and the negative electrode are positioned right below the nozzle outlet with the distance of 15 mm-35 mm. The central line of the nozzle and the central line of the pulse laser beam interfering the laser after adjusting the direction form an acute angle, and the angle is 10-30 degrees.
Further, the water jet direction is adjusted. And opening an electrode power supply, and regulating the flow of the nozzle, wherein the flow of the nozzle is generally between 3m/s and 50m/s, so that the water beam is stable. And then adjusting the voltage and the position of the positive electrode and the negative electrode to deflect the water beam, wherein the deflected water beam is vertically downward. Wherein the voltage difference between the positive electrode and the negative electrode is between 500V and 2000V. Wherein the distance between the plate surface of the electrode plate and the central line of the laser beam is 5 mm-20 mm. The distance between the outlet of the nozzle and the central line of the laser beam is 15 mm-35 mm, and the distance between the positive electrode and the negative electrode is about 10 mm-30 mm.
Further, in step 4, the pulsed laser beam is totally reflected in the water beam. The total reflection condition is as follows: the pulse laser beam is emitted from the optically dense medium to the optically sparse medium, and the incident angle is larger than or equal to the critical angle. The focusing lens is adjusted to focus the pulsed laser beam within the water beam, the focal position being selected so that total reflection occurs at the location where the laser beam enters the water beam.
Compared with the traditional water-guided laser, the water-guided pulse laser processing system and method based on the interference light path design have the advantages that:
1. an interference device is added in the system, after two pulse laser beams interfere, the diameter of the interfered laser beams can be effectively reduced, the diameter of the water jet is reduced to the maximum extent, the cutting precision is greatly improved, and the material loss is extremely low. The laser cutting device is suitable for punching with a very small aperture (10-50 um) or ultra-high precision laser cutting;
2. The positive electrode and the negative electrode are adopted to change the flow direction of the water jet, the pulse laser beam does not need to be focused at a specific certain position, only the focusing point is required to be superposed with the water beam, and the pulse laser beam can be totally reflected in the water beam, so that the coupling difficulty of the pulse laser and the water beam is reduced;
3. the central line of the laser beam does not need to be consistent with the central line of the nozzle, the nozzle can not be ablated, a complex coupling water cavity structure in the traditional water-guided laser device is not needed, and the cost of the water-guided laser device is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a processing device of a water-guided laser system according to the present invention.
Illustration of the drawings: 1-a computer; 2-a positive electrode rod; 3-electrode bar moving platform; 4-electrode power supply; 5-a filter lens; 6-laser mirror; 7-a focusing lens; 8-a water jet nozzle; 9-a camera; 10-pulsed laser beam after interference; 11-a pulsed laser receiver; 12-a controller; 13-pulsed laser beam one; 14-a first pulsed laser generator; 15-laser position adjuster; 16-an interference laser generating device; 17-a second pulse laser generator; 18-pulsed laser beam two; 19-an interference plate; 20-pulse laser shaper; 21-negative electrode fixing plate; 22-a negative electrode plate; 23-workpiece.
Detailed Description
In order to facilitate an understanding of the invention, the invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of the invention is not limited to the specific embodiments below.
In this embodiment, the copper sheet is adopted as the experimental sample, and the copper sheet is processed by punching. As shown in fig. 1, a water-guided laser processing system based on interference light path design comprises a computer 1, a water jet nozzle 8, an interference laser generating device 16, a laser steering device and an electric field steering device;
the interference laser generating device 16 comprises two pulse laser generators, an interference plate 19 and a pulse laser receiver 11 which are sequentially arranged along an optical path, wherein the two pulse laser generators are a first pulse laser generator 14 and a second pulse laser generator 17 respectively; the two pulse laser generators are used for generating two coherent laser beams with the same frequency, constant phase difference and consistent vibration direction, an interference slot corresponding to the two pulse laser generators is arranged on the interference plate 19, and the pulse laser receiver 11 is used for receiving and transmitting interference laser formed after interference;
the water jet nozzle 8 is used for jetting water jet for machining;
The electric field steering device is used for generating an electric field in a water jet passing area and steering the water jet; the electric field steering device comprises a positive electrode and a negative electrode which are distributed on two sides of the water jet and an electrode power supply 4 connected with the positive electrode and the negative electrode, a specific positive electrode rod 2 is connected with the positive electrode of the electrode power supply 4 through a lead, the positive electrode rod 2 is installed on an electrode rod moving platform 3, a negative electrode plate 22 is connected with the negative electrode of the electrode power supply 4 through a lead, the negative electrode plate 22 is fixed on a negative electrode fixing plate 21, the electric field intensity and distribution can be adjusted by moving the position of the positive electrode rod 2 through the electrode rod moving platform 3, and therefore the deflection angle of the water jet is adjusted.
In order to improve the stability of the interference laser, the interference laser generator 16 further includes a pulse laser shaper 20, and the pulse laser shaper 20 is disposed on an exit optical path of the pulse laser receiver 11 for improving the stability of the interference laser.
In order to adjust the diameter of the interference laser, the interference laser generator 16 further includes a laser position adjuster, two pulse laser generators are mounted on the laser position adjuster, and the laser position adjuster is used for adjusting the distance between the two pulse laser generators and the laser interference plate 19, so as to adjust the diameter of the interference laser.
The laser steering device is used for adjusting the direction of the interference laser, so that the interference laser is coupled with the water jet in a total reflection manner at the water jet steering position to form water-guided laser for processing, and the direction of the interference laser after being adjusted is coaxial with the steered water jet; in this embodiment, the laser steering device is a laser mirror 6, most of the interference laser is reflected by the laser mirror 6 to change the direction of the light path, and a small part of the laser is scattered by the laser mirror 6, so that the diameter of the interference laser can be detected by arranging a filter lens 5 and a camera 9 on the back of the reflected light path of the laser mirror 6; the filter lens 5 is used for filtering the over-strong scattered laser, and the camera 9 is used for shooting a spot photo of the scattered laser, so that the diameter of the laser is monitored.
In order to improve the coupling effect, a focusing lens 7 for focusing is also provided on the reflection light path of the laser mirror 6.
The included angle between the central line of the water jet nozzle 8 and the central line of the interference laser after the direction is adjusted is 10-30 degrees.
Of course, in order to facilitate the control of the present invention, the present invention further comprises a computer 1 and a controller 12, wherein the computer 1 is used for sending instructions and receiving analysis experiment data, and the controller 12 is connected with the pulse laser generator and the laser position adjuster and is used for controlling the wavelength and the pulse waveform of the laser emitted by the pulse laser generator and the movement direction and the displacement of the laser position adjuster.
The invention also provides a water-guided laser processing method based on interference light path design, which comprises the following steps
The specific implementation of the invention comprises the following steps:
step 1, assembling the water-guided laser processing system (perforating device) of the present invention as shown in fig. 1;
and 2, sequentially opening the camera 9, the computer 1, the controller 12 and the interference laser generating device 16, adjusting the pulse laser wavelength and the pulse laser pulse waveform through the controller 12 according to requirements, and adjusting the position of the pulse laser generator through the laser position adjuster so as to adjust the diameter of the interference laser.
In step 2, the interference laser generator 16 is used as follows. After the water-guided laser processing system is turned on, a post-interference pulse laser pattern is displayed in the computer 1, and the laser beam diameter is the diameter of the interference laser beam received by the pulse laser receiver 11. The calculation formula of the diameter of the received interference laser beam is D ═ L x λ)/(2 x D), where D is the diameter of the interference laser, L is the distance from the interference plate 19 to the laser receiver, λ is the laser wavelength, and D is the distance between the double slits on the interference plate 19.
The pulse laser shaper 20 shapes and adjusts the interfered pulse to stabilize parameters such as the pulse laser wavelength, duty ratio, amplitude and the like. The controller 12 is connected with a laser position adjuster 15, a first pulse laser generator 14 and a second pulse laser generator 17 respectively, and the position of the pulse laser generator and the laser wavelength are accurately adjusted according to requirements.
Step 3, turning on an electrode power supply 4 and a water jet nozzle 8, and adjusting the positions of the positive electrode and the negative electrode;
step 3 is roughly divided into two adjustment processes: one is to adjust the relative positions of the positive and negative electrodes and the water jet nozzle 8 and the water jet. The purpose is to make the water beam vertically and downwards jet and the water flow of the water beam is stable without shaking the tail end; secondly, adjusting the voltage difference between the positive electrode and the negative electrode.
The specific adjusting process is as follows, firstly, the position of the water jet nozzle 8 is adjusted, in this embodiment, the included angle between the water jet nozzle 8 and the center line of the pulse laser beam reflected by the laser reflector 6 is 20 degrees, the distance between the outlet of the water jet nozzle 8 and the center line of the laser beam reflected by the laser reflector 6 is 15mm, the diameter of the outlet of the water jet nozzle 8 is 30um, the flow rate of the water jet nozzle 8 is 20m/s, the diameter of the positive electrode rod 2 is 1mm, the surface of the negative electrode plate 22 is a square with the side length of 20mm, the distance between the positive electrode rod 2 and the laser beam reflected by the laser reflector 6 is 10mm, the positive electrode rod 2 is 20mm under the water jet nozzle 8, and the distance between the positive electrode rod 2 and the negative electrode plate 22 is 25 mm. Wherein the water jet nozzle 8 is positioned in the same plane with the radial axis of the positive electrode bar 2, the central vertical line of the negative electrode, the central line of the pulse laser and the central longitudinal section of the workpiece 23. The water jet nozzle 8 is opened to generate a stable water jet.
And connecting the electrode power supply 4 with the leads of the positive electrode and the negative electrode, and turning on the electrode power supply 4. Because the water molecules are polar molecules, anions or cations of water are attracted by the charged electrodes in the non-uniform strong electric field, the non-uniform electric field acts on the water beams to deflect the water beams downwards, the voltage difference between the positive electrode and the negative electrode is adjusted, the water beams vertically flow downwards and are stable, and the conditions of shaking and the like are avoided.
And 4, adjusting the position of the focusing lens 7 (which can be automatically adjusted by a three-dimensional moving platform or manually adjusted and fixed by a support), focusing the pulse laser in the water beam, totally reflecting the pulse laser in the water beam, and guiding the pulse laser to act on the workpiece 23 by the water beam to realize the ultrahigh-precision pulse laser drilling process.
In step 4, the vertical distance between the focusing lens 7 and the water jet nozzle 8 is 20mm to 50mm in this embodiment, and the interfered pulse laser beam transmitted from the reflector is received, and the positions of the focusing lens 7 in the up-down direction and the left-right direction are adjusted to focus the pulse laser beam in a stable water beam.
The pulse laser generates total reflection in the water beam, and the total reflection condition is as follows: the pulse laser beam is emitted from the optically dense medium to the optically sparse medium, and the incident angle is larger than or equal to the critical angle. The laser beam is irradiated to the air from the optically dense medium to the optically sparse medium in the water beam, so that the laser beam can be totally reflected in the water beam as long as the incident angle of the laser beam is larger than or equal to the critical angle when the laser beam propagates in the water beam. And adjusting the angle of the pulse laser of the focusing lens 7 entering the water to ensure that the incident angle is larger than or equal to the critical angle when the laser propagates in the water beam.
Compared with the traditional water-guided laser, the water-guided laser drilling device and the method have the advantages that the interference device is added in the system, after two pulse laser beams interfere, the diameter of the interfered laser beam can be effectively reduced, the diameter of the water jet can be reduced to the maximum extent, and the device and the method are suitable for drilling in a minimum aperture (10 um-50 um) or cutting in ultra-high precision laser. The positive electrode and the negative electrode are adopted to change the flow direction of the water jet, so that the coupling difficulty of the pulse laser and the water beam is reduced. The water jet nozzle 8 can not be ablated, and a complex coupling water cavity structure in the traditional water-jet guided laser device is not needed, so that the cost of the water-jet guided laser device is reduced.
It should be noted that the computer 1 of the present invention is a device selected for convenience of control and data acquisition, and does not need to be a device, and data acquisition may be performed manually, and the controller 12 of the present invention is a device for controlling a pulse laser generator, and does not need a separately designed controller 12.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (8)

1. A water guide pulse laser processing system based on interference light path design is characterized in that: comprises a water jet nozzle, an interference laser generating device, a laser steering device and an electric field steering device;
the interference laser generating device is used for generating interference laser;
the water jet nozzle is used for jetting water jet for machining;
the electric field steering device is used for generating an electric field in a water jet passing area and steering the water jet;
the laser steering device is used for adjusting the direction of the interference laser, so that the interference laser is coupled with the water jet in a total reflection manner at the water jet steering position to form water-guided laser for processing, and the direction of the interference laser after being adjusted is coaxial with the steered water jet;
the interference laser generating device comprises two pulse laser generators, an interference plate and a pulse laser receiver, wherein the two pulse laser generators are sequentially arranged along a light path and are used for generating two laser beams capable of interfering, interference gaps corresponding to the positions of the two pulse laser generators are arranged on the interference plate, and the pulse laser receiver is used for receiving and transmitting the interference laser formed after interference;
the interference laser generating device also comprises a laser position adjuster, and the laser position adjuster is used for adjusting the distance between the two pulse laser generators and the laser interference plate, so that the diameter of the interference laser is adjusted.
2. The water-guided pulse laser processing system designed based on the interference optical path as claimed in claim 1, wherein: the interference laser generating device further comprises a pulse laser shaper, and the pulse laser shaper is arranged on an outlet light path of the pulse laser receiver and used for improving the stability of the interference laser.
3. The water-guided pulse laser processing system designed based on the interference optical path of claim 1, wherein: the laser steering device is a laser reflector.
4. The water-guided pulse laser processing system designed based on the interference optical path of claim 3, wherein: and a focusing lens for focusing is also arranged on the reflection light path of the laser reflector.
5. The water-guided pulse laser processing system designed based on the interference optical path of claim 3, wherein: the back of a reflection light path of the laser reflector is also provided with a filter lens and a camera, the filter lens is used for filtering the over-strong scattered laser, and the camera is used for shooting a spot photo of the scattered laser so as to monitor the diameter of the laser.
6. The water-guided pulse laser processing system designed based on the interference optical path according to any one of claims 1 to 5, characterized in that: the electric field steering device comprises a positive electrode and a negative electrode which are distributed on two sides of the water jet and an electrode power supply connected with the positive electrode and the negative electrode.
7. The water-guided pulse laser processing system designed based on the interferometric optical path according to any one of claims 1 to 5, characterized in that: the included angle between the central line of the water jet nozzle and the central line of the interference laser after the direction is adjusted is 10-30 degrees.
8. A water-guided laser processing method based on interference light path design, which adopts the water-guided pulse laser processing system of any one of claims 1 to 7, and is characterized by comprising the following steps:
step 1, constructing a water-guided pulse laser processing system, and placing a workpiece to be processed on a processing platform;
step 2, starting an interference laser generating device, and adjusting laser parameters and the diameter of interference laser;
step 3, turning on the water jet nozzle and the electric field steering device, and steering the water jet sprayed by the water jet nozzle to a required direction through the electric field steering device;
and 4, coupling the interference laser into water jet flow at the water jet flow steering position through total reflection of the laser steering device to form water-guided laser, and punching the workpiece through the water-guided laser.
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