CN108031986A - Devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond - Google Patents
Devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond Download PDFInfo
- Publication number
- CN108031986A CN108031986A CN201711468964.9A CN201711468964A CN108031986A CN 108031986 A CN108031986 A CN 108031986A CN 201711468964 A CN201711468964 A CN 201711468964A CN 108031986 A CN108031986 A CN 108031986A
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- Prior art keywords
- diamond
- water jet
- lens
- water
- ultrashort pulse
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to the device and method based on ultrashort pulse Water Jet Guided Laser processing diamond, speculum is disposed with the lens combination light path output of picosecond laser, the first lens are disposed with the reflected light path of speculum, the arranged beneath of the output light path of first lens has water cavity, water cavity has storage chamber, its side is equipped with a water inlet, upper top surface and bottom surface have perforate, the tapping of upper top surface fixes a window lens, the tapping of bottom surface fixes a ruby nozzle, and the lower section of ruby nozzle is equipped with the electric platforms for being used for placing diamond；The second lens and camera have been sequentially arranged directly over the speculum.The ultrashort laser pulse of high-energy is coupled in atomic thin high-speed water jet, breaks through the limitation of optical focus depth of focus, have it is longer can processing interval, realize the cutting to thicker material；Since water jet column diameter is superfine, high cutting accuracy is realized, spillage of material is smaller；Cooling effect during processing because of water jet further reduces heat affecting.
Description
Technical field
The present invention relates to a kind of devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond.
Background technology
Diamond is as material most hard in nature, it is extremely difficult to processes flakiness.Traditional processing scheme generally uses
Machine cuts are in blocks, then grind flakiness.This traditional processing proposal is larger to spillage of material, and cutting accuracy is not high.
Certainly, it is possible to use existing laser technology cuts diamond, but since the depth-to-width ratio of laser cutting limits, it is right
The thickness of material has certain limitation, still needs to grind after cutting, overall processing is inefficient.
The content of the invention
The purpose of the present invention is overcome the shortcomings of the prior art, there is provided one kind is processed based on ultrashort pulse Water Jet Guided Laser
The devices and methods therefor of diamond.
The purpose of the present invention is achieved through the following technical solutions：
Based on the device of ultrashort pulse Water Jet Guided Laser processing diamond, feature is：In the lens combination light path output of picosecond laser
Speculum is disposed with, the first lens are disposed with the reflected light path of speculum, the arranged beneath of the output light path of the first lens has
Water cavity, water cavity have storage chamber, its side is equipped with a water inlet, and upper top surface and bottom surface have perforate, the perforate of upper top surface
A window lens are fixed at place, and the tapping of bottom surface fixes a ruby nozzle, and the lower section of ruby nozzle, which is equipped with, to be used to place
The electric platforms of diamond；The second lens and camera have been sequentially arranged directly over the speculum.
Further, the above-mentioned device based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, first lens
It is installed on reciprocating mechanism.
Further, the above-mentioned device based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, the ruby spray
Mouth has the through hole of 50um.
Further, the above-mentioned device based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, the window lens
For sapphire glass.
Further, it is above-mentioned based on ultrashort pulse Water Jet Guided Laser processing diamond device, wherein, the water cavity it is upper
The centre of top surface and bottom surface is equipped with perforate.
Further, it is above-mentioned based on ultrashort pulse Water Jet Guided Laser processing diamond device, wherein, the water cavity be by
There is the structure of storage chamber made of stainless steel metal.
Method of the present invention based on ultrashort pulse Water Jet Guided Laser processing diamond, the picosecond laser arteries and veins of picosecond laser output
Punching reflexes to the first lens through speculum, and then laser is transmitted through the window lens above water cavity, focuses to the ruby of lower section
Nozzle, size and position by camera observation laser spot, by adjusting the angle of speculum, makes laser spot and ruby
The nozzle bore center of nozzle overlaps, and laser goes out from nozzle bore central homology, and the first lens can move up and down, to focus on laser simultaneously
Adjust the upper-lower position of focus；
Deionized water, which is pressurizeed, injects the storage chamber of water cavity, and after stable water pressure, water is projected from the nozzle bore of ruby nozzle,
Form water jets beam；
Diamond is placed on electric platforms, and water jets beam is sprayed to diamond；The running parameter of picosecond laser is set,
Electric platforms are made to drive diamond at the uniform velocity to move back and forth at the same time, until laser cuts completely through diamond.
Further, the above-mentioned method based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, setting picosecond swashs
The running parameter of light device：Pulse recurrence rate 200kHz, wavelength 515nm, pulsewidth 10ps.
Further, the above-mentioned method based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, on electric platforms
Diamond and the distance between ruby nozzle be 5mm.
Further, the above-mentioned method based on ultrashort pulse Water Jet Guided Laser processing diamond, wherein, the water in water cavity
Press as 1.5MPa.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas：
1. the present invention is based on ultrashort pulse Water Jet Guided Laser, the ultrashort laser pulse of high-energy is coupled to atomic thin high speed
In water jet, the limitation of optical focus depth of focus can be broken through, have it is longer can processing interval, realize the cutting to thicker material；
2. due to water jet column diameter superfine (about 50um), it can be achieved that high cutting accuracy, and it is smaller to spillage of material；
3. heat affecting of the ultrashort pulse processing to material is smaller, and because the cooling effect of water jet can be by heat affecting when processing
Further reduce, while current can remove processing caused by hot slag, realize high quality diamond wafers cutting；
4. the thin slice of high quality can be cut out on the diamond, depth of cut is more than 1mm, and cutting depth-to-width ratio is more than 20；It is overall
Processing efficiency is higher, is discharged after cutting without poisonous and harmful substance, more environmentally friendly.
Brief description of the drawings
Fig. 1：The light channel structure schematic diagram of the present invention.
Embodiment
In order to which the technical features, objects and effects of the present invention are more clearly understood, specific implementation is now described in detail
Scheme.
As shown in Figure 1, the device based on ultrashort pulse Water Jet Guided Laser processing diamond, defeated in the light path of picosecond laser 1
Outlet is disposed with speculum 2, and the first lens 3 are disposed with the reflected light path of speculum 2, and the first lens 3, which are installed on, to be moved up and down
In mechanism, the arranged beneath of the output light path of the first lens 3 has water cavity 4, and water cavity 4 is that have water storage made of stainless steel metal
The structure of cavity, its side are equipped with a water inlet 7, and the centre of upper top surface and bottom surface is equipped with perforate, the perforate of upper top surface
A window lens 5 are fixed at place, and window lens 5 are sapphire glass, and the tapping of bottom surface fixes a ruby nozzle 6, red treasured
Stone nozzle 6 has the through hole of 50um, and the lower section of ruby nozzle 6 is equipped with the electric platforms 8 for being used for placing diamond；Speculum 2
Surface be sequentially arranged the second lens 9 and camera 10.
Optical focus part is formed by 2 and first lens 3 of speculum, for focusing on laser, and adjusts the upper bottom of focus
Put.
Second lens 9 and camera 10 form coaxial image part, for observing the size of laser spot and position.
During concrete application, the Ps Laser Pulse that picosecond laser 1 exports reflexes to the first lens 3 through speculum 2, and then
Window lens 5 of the laser through the top of water cavity 4 transmit, and focus to the ruby nozzle 6 of lower section, laser spot is observed by camera 10
Size and position, by adjusting the angle of speculum 2, make laser spot be overlapped with the nozzle bore center of ruby nozzle 6, swash
Light goes out from nozzle bore central homology, and the first lens 3 can move up and down, and focuses on laser and adjusts the upper-lower position of focus；
Exterior deionized water injects water cavity 4 after water pump pressurizes, via water pipe, and hydraulic pressure is set as 1.5MPa, treats that hydraulic pressure is steady
After fixed, the nozzle bore of ruby nozzle 6 projects, and forms the water jets beam of superfine (about 50um)；
Diamond is placed on electric platforms 8, and the distance between diamond and ruby nozzle 6 are 5mm, and water jets beam sprays
To diamond；The running parameter of picosecond laser 1 is set：Pulse recurrence rate 200kHz, power about 20W, wavelength 515nm, arteries and veins
Wide 10ps；Electric platforms 8 are made to drive diamond at the uniform velocity to move reciprocatingly along Y-direction with the speed of 0.5mm/s at the same time, until laser
Cut completely through the diamond of 1.5mm thickness, reciprocal time about 40 times.
After completion of processing, laser is closed, is switched off the pump.
In conclusion the present invention is based on ultrashort pulse Water Jet Guided Laser, by the ultrashort laser pulse of high-energy coupled to atomic
In thin high-speed water jet, the limitation of optical focus depth of focus can be broken through, have it is longer can processing interval, realize to thicker material
Cutting.Simultaneously as water jet column diameter superfine (about 50um) is, it can be achieved that high cutting accuracy, and to spillage of material compared with
It is small.In addition, heat affecting of the ultrashort pulse processing to material is smaller, and when processing because water jet cooling effect can by heat affecting into
One step reduces, while current can remove hot slag caused by processing, is cut so as to fulfill the diamond wafers of high quality.
The thin slice of high quality can be cut out on the diamond based on ultrashort pulse Water Jet Guided Laser, depth of cut is more than 1mm, cutting
Depth-to-width ratio is more than 20.Overall processing efficiency is higher, smaller to spillage of material.Discharged after cutting without poisonous and harmful substance, more ring
Protect.
It should be noted that：The foregoing is merely the preferred embodiment of the present invention, is not limited to power of the invention
Sharp scope；At the same time more than description, should can understand and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (10)
1. the device based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is defeated in the light path of picosecond laser (1)
Outlet is disposed with speculum (2), and the first lens (3), the output of the first lens (3) are disposed with the reflected light path of speculum (2)
The arranged beneath of light path has water cavity (4), and water cavity (4) has storage chamber, its side is equipped with a water inlet (7), and upper top surface is with
There is perforate in bottom surface, and the tapping of upper top surface fixes a window lens (5), and the tapping of bottom surface fixes a ruby nozzle
(6), the lower section of ruby nozzle (6) is equipped with the electric platforms (8) for being used for placing diamond；The surface of the speculum (2)
It has been sequentially arranged the second lens (9) and camera (10).
2. the device according to claim 1 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is described
First lens (3) are installed on reciprocating mechanism.
3. the device according to claim 1 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is described
Ruby nozzle (6) has the through hole of 50um.
4. the device according to claim 1 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is described
Window lens (5) are sapphire glass.
5. the device according to claim 1 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is described
The centre of the upper top surface and bottom surface of water cavity (4) is equipped with perforate.
6. the device according to claim 1 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is described
Water cavity (4) is the structure for having made of stainless steel metal storage chamber.
7. realize the method based on ultrashort pulse Water Jet Guided Laser processing diamond, its feature using the device described in claim 1
It is：The Ps Laser Pulse of picosecond laser (1) output reflexes to the first lens (3) through speculum (2), and then laser is through water
Window lens (5) transmission above chamber (4), focuses to the ruby nozzle (6) of lower section, by camera (10) observation laser spot
Size and position, by adjusting the angle of speculum (2), make laser spot and the nozzle bore center weight of ruby nozzle (6)
Close, laser goes out from nozzle bore central homology, and the first lens (3) can move up and down, and focuses on laser and adjusts the upper-lower position of focus；
Deionized water, which is pressurizeed, injects the storage chamber of water cavity (4), and after stable water pressure, the nozzle bore of water from ruby nozzle (6) is penetrated
Go out, form water jets beam；
Diamond is placed on electric platforms (8), and water jets beam is sprayed to diamond；The work ginseng of picosecond laser (1) is set
Number, while electric platforms (8) is driven diamond at the uniform velocity to move back and forth, until laser cuts completely through diamond.
8. the method according to claim 7 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：Set
The running parameter of picosecond laser (1)：Pulse recurrence rate 200kHz, wavelength 515nm, pulsewidth 10ps.
9. the method according to claim 7 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：It is electronic
The distance between diamond and ruby nozzle (6) on platform (8) are 5mm.
10. the method according to claim 7 based on ultrashort pulse Water Jet Guided Laser processing diamond, it is characterised in that：Water
Hydraulic pressure in chamber (4) is 1.5MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711468964.9A CN108031986A (en) | 2017-12-29 | 2017-12-29 | Devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711468964.9A CN108031986A (en) | 2017-12-29 | 2017-12-29 | Devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond |
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| Publication Number | Publication Date |
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| CN108031986A true CN108031986A (en) | 2018-05-15 |
Family
ID=62097970
Family Applications (1)
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|---|---|---|---|
| CN201711468964.9A Pending CN108031986A (en) | 2017-12-29 | 2017-12-29 | Devices and methods therefor based on ultrashort pulse Water Jet Guided Laser processing diamond |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109405971A (en) * | 2018-10-18 | 2019-03-01 | 南京邮电大学 | A kind of micro- polarization spectrum analysis system and method |
| CN110125540A (en) * | 2019-05-15 | 2019-08-16 | 哈尔滨工业大学 | A kind of method, system and its equipment of water guiding laser processing workpiece |
| CN110202478A (en) * | 2019-07-05 | 2019-09-06 | 湖南科技大学 | A kind of dressing method of arc-shaped skive |
| CN113518685A (en) * | 2019-03-06 | 2021-10-19 | 辛诺瓦有限公司 | Method and apparatus for manufacturing a workpiece into a product |
| CN113579471A (en) * | 2021-07-17 | 2021-11-02 | 北京工业大学 | Ultrafast laser efficient coupling micro-jet device and method |
| CN113634874A (en) * | 2021-09-23 | 2021-11-12 | 山东理工大学 | High-power water-conducting laser water optical coupling device with multi-focus lens |
| CN113634930A (en) * | 2021-09-23 | 2021-11-12 | 山东理工大学 | Water-guided laser water-optical coupling variable-curvature light column lens |
| CN113649707A (en) * | 2021-07-07 | 2021-11-16 | 西安电子科技大学芜湖研究院 | Machining method for rounding SiC crystal and one-step forming of reference surface |
| CN113894444A (en) * | 2021-09-28 | 2022-01-07 | 武汉大学 | Water-guided pulse laser processing system and method based on interference light path design |
| CN114682929A (en) * | 2020-12-31 | 2022-07-01 | 华为技术有限公司 | Method and system for drilling diamond film |
| CN116079230A (en) * | 2023-04-10 | 2023-05-09 | 中科德迈(沈阳)激光技术有限公司 | Water-guided laser processing method, device, system and readable storage medium |
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| CN102259236A (en) * | 2011-07-01 | 2011-11-30 | 中国电子科技集团公司第四十五研究所 | Alignment device for coupling of water-jet guided laser |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109405971A (en) * | 2018-10-18 | 2019-03-01 | 南京邮电大学 | A kind of micro- polarization spectrum analysis system and method |
| CN113518685A (en) * | 2019-03-06 | 2021-10-19 | 辛诺瓦有限公司 | Method and apparatus for manufacturing a workpiece into a product |
| CN113518685B (en) * | 2019-03-06 | 2023-11-21 | 辛诺瓦有限公司 | Method and apparatus for manufacturing a workpiece into a product |
| CN110125540A (en) * | 2019-05-15 | 2019-08-16 | 哈尔滨工业大学 | A kind of method, system and its equipment of water guiding laser processing workpiece |
| CN110202478A (en) * | 2019-07-05 | 2019-09-06 | 湖南科技大学 | A kind of dressing method of arc-shaped skive |
| CN110202478B (en) * | 2019-07-05 | 2020-10-30 | 湖南科技大学 | Method for trimming circular arc diamond grinding wheel |
| CN114682929A (en) * | 2020-12-31 | 2022-07-01 | 华为技术有限公司 | Method and system for drilling diamond film |
| CN113649707A (en) * | 2021-07-07 | 2021-11-16 | 西安电子科技大学芜湖研究院 | Machining method for rounding SiC crystal and one-step forming of reference surface |
| CN113649707B (en) * | 2021-07-07 | 2023-08-08 | 西安电子科技大学芜湖研究院 | Processing method for rounding SiC crystal and forming reference surface at one time |
| CN113579471A (en) * | 2021-07-17 | 2021-11-02 | 北京工业大学 | Ultrafast laser efficient coupling micro-jet device and method |
| CN113634930A (en) * | 2021-09-23 | 2021-11-12 | 山东理工大学 | Water-guided laser water-optical coupling variable-curvature light column lens |
| CN113634874A (en) * | 2021-09-23 | 2021-11-12 | 山东理工大学 | High-power water-conducting laser water optical coupling device with multi-focus lens |
| CN113634930B (en) * | 2021-09-23 | 2023-01-31 | 山东理工大学 | Water-guided laser water-optical coupling variable-curvature focusing light column lens |
| CN113634874B (en) * | 2021-09-23 | 2023-03-14 | 山东理工大学 | High-power water-conducting laser water optical coupling device with multi-focus lens |
| CN113894444A (en) * | 2021-09-28 | 2022-01-07 | 武汉大学 | Water-guided pulse laser processing system and method based on interference light path design |
| CN116079230A (en) * | 2023-04-10 | 2023-05-09 | 中科德迈(沈阳)激光技术有限公司 | Water-guided laser processing method, device, system and readable storage medium |
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