CN108581223A - A kind of Water Jet Guided Laser processing method and system - Google Patents
A kind of Water Jet Guided Laser processing method and system Download PDFInfo
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- CN108581223A CN108581223A CN201810383169.8A CN201810383169A CN108581223A CN 108581223 A CN108581223 A CN 108581223A CN 201810383169 A CN201810383169 A CN 201810383169A CN 108581223 A CN108581223 A CN 108581223A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 177
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 230000005684 electric field Effects 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims description 37
- 238000013461 design Methods 0.000 claims description 5
- 210000003296 saliva Anatomy 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 230000018984 mastication Effects 0.000 abstract description 2
- 238000010077 mastication Methods 0.000 abstract description 2
- 230000003685 thermal hair damage Effects 0.000 abstract description 2
- 238000002679 ablation Methods 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- DNHVXYDGZKWYNU-UHFFFAOYSA-N lead;hydrate Chemical compound O.[Pb] DNHVXYDGZKWYNU-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention is a kind of Water Jet Guided Laser processing method and system, and electrode generates non-uniform electric field to water Shu Zuoyong, and straight down, laser focuses in water beam straight down the water beam after deflection, and water beam guides laser action in workpiece.This system workpiece is fixed on the sink bottom surface on workbench, equipped with 1 set of deflection water bundle device, the centerline of water beam and laser beam that nozzle generates is in same plane, electrode is set below water beam, make the deflection of water beam straight down in the non-uniform electric field of electrode, laser focuses in water beam straight down, and water beam guiding laser beam acts on the workpiece on workbench.2~5 sets of deflection water bundle devices can also be matched, each water beam convergence is total water beam guiding laser beam straight down.The workpiece surface material of the hot mastication of the laser of the present invention machining area of water beam cooling simultaneously reduces thermal damage.The present invention be not necessarily to the nozzle consistent with laser beam center line, nozzle will not ablation, significantly reduce the cost of device, be conducive to the popularization and application of Water Jet Guided Laser.
Description
Technical field
The present invention relates to Water Jet Guided Laser processing technology, specially a kind of Water Jet Guided Laser processing method and system, using non-even
Forceful electric power field deflection water line is to avoid the nozzle of laser ablation generation flow.
Background technology
Water Jet Guided Laser processing method focuses on laser inside thin water beam, and laser is passed in water beam inner full-reflection along water beam
It broadcasts, laser ablation workpiece surface while, thin water beam impact workpiece material removal completed cutting processing.Because water beam diameter is minimum, institute
Micro-damage cutting is realized with Water Jet Guided Laser processing, and because water beam washes away melt substance and the chip of laser generation, keeps processing disconnected
Face is smooth, without apparent re cast layer, significantly improves processing quality.Overcome with some intrinsic defect needs.Water
Lead laser processing
Obviously in many excellent characteristics of Precision Machining field Water Jet Guided Laser processing with huge application prospect,
But there are one apparent defects for existing Water Jet Guided Laser processing unit (plant)：The coupling of laser and water beam is difficult.
Laser beam passes through condenser lens in existing Water Jet Guided Laser processing unit (plant), is focused onto in water cavity nozzle micropore
The heart is coupled into the micro- water column of low pressure of nozzle generation.Micro- water column guides laser beam by the total reflection at interface between water and air,
Reach workpiece surface, the machining area material of workpiece is heated and softened in laser, meanwhile, the high speed water jet impact removal softening of water column
The material in region and strengthen cooling effect.
It must will adjust laser spot in such device to be allowed to be positioned exactly at the nozzle center for generating water beam, slightly partially
The high temperature of difference, laser beam i.e. can scaling loss nozzle.In addition in process, the water Shu Ruguo that nozzle generates is influenced by external environment
It may be drawn partially, will also result in the accident of laser ablated nozzle.
28 μm of laser processing cut marks below are completed, the diameter of micro- water beam cannot be more than 22 μm, then nozzle micropore is straight
Diameter cannot be more than 26 μm, and the thickness of nozzle, generally in 1~2mm, this requires in high hardness materials such as diamond, diamonds
On, processing requires finished surface to have high finish more than 1mm length, a diameter of 26 μm or even smaller through-hole,
This proposes the processing of nozzle extremely harsh requirement, causes the cost of nozzle higher.
Nozzle is of high cost and fragile, this makes existing Water Jet Guided Laser equipment input cost and maintenance cost all higher,
Interfere promoting the use of for Water Jet Guided Laser technique.
Invention content
The purpose of the present invention is designing a kind of Water Jet Guided Laser processing method, electrode generates non-uniform electric field to water Shu Zuoyong,
Straight down, laser focuses in water beam straight down water beam after deflection, and water beam guides laser action in workpiece, laser
The workpiece surface material of the hot mastication machining area of water beam cooling simultaneously reduces thermal damage.This Water Jet Guided Laser method is not necessarily to and laser
The consistent nozzle of beam center line, significantly reduces the cost of device, is conducive to the popularization and application of Water Jet Guided Laser.
It is sharp it is another object of the present invention to be led based on a kind of a kind of water of Water Jet Guided Laser processing method design of aforementioned present invention
Light system of processing, includes the workbench of sink and fixed sink, and workpiece is fixed on sink bottom surface, is set below the water beam that nozzle generates
Set electrode, the polarity of hydrone makes the deflection of water beam straight down under electrode non-uniform electric field effect, laser focus on vertically to
Under water beam in, the water beam guiding laser beam act on the workpiece on workbench.
A kind of Water Jet Guided Laser processing method that the present invention designs, laser is guided focused in workpiece surface through water beam, generates water
The nozzle of beam is located at laser beam side, and electrode generates non-uniform electric field to water Shu Zuoyong, and water beam deflects straight down, and laser beam is poly-
In water beam straight down, laser beam is within flowing water beam straight down coke, and water beam guiding laser beam acts on
Workpiece realizes Water Jet Guided Laser processing.Preferred version overlaps for the center line of flowing water beam and laser beam straight down.
The present invention is based on a kind of a kind of Water Jet Guided Laser system of processing of Water Jet Guided Laser processing method design of aforementioned present invention, packets
Sink and workbench are included, table surface is horizontal plane, and sink is fixed on table surface, and workpiece is fixed on sink inner bottom surface,
Laser is located above sink, and the laser beam central axis that laser is sent out is also equipped with 1 set of deflection water beam in table surface
Device, each one including nozzle and positive and negative electrode.The nozzle for generating water beam is set to laser beam side, nozzle centerline
With laser beam centerline in same vertical plane, the angle of two center lines is 10 °~30 °, jet expansion and laser beam center
The distance of line is 10mm~30mm, and jet expansion is 20~60mm at a distance from table surface.The lower section of jet expansion water beam
Equipped with positive electrode, laser beam other side place opposite with positive electrode is furnished with negative electrode, the voltage difference of positive and negative electrode be 1000V~
3000V, the plane that the non-uniform electric field that positive and negative electrode generates is formed perpendicular to nozzle centerline and laser beam center line are positive and negative
Electrode centers are less than jet expansion, and the vertical range of positive and negative electrode center and jet expansion is 10mm~30mm.Because hydrone is
Polar molecule, the electrode that the anion of water or cation are charged in non-uniform electric field attract, and inhomogeneous field acts on water
Beam makes water beam deflect down, flow straight down.In flowing water beam straight down, laser beam exists the laser beam focus
It is totally reflected in water beam straight down, the workpiece surface for reaching and being fixed on workbench is propagated in the light path of water beam.
The flow rate of water flow in 10 μm~600 μm of the jet expansion aperture, jet expansion is 5m/s~100m/s.
The positive electricity extremely electrode bar, diameter are equal to or more than nozzle diameter, the length of 2mm~15mm, electrode bar
Longitudinal center line be horizontal line, the plane constituted in nozzle centerline and laser beam center line.One end of electrode bar with swash
The distance of beam center line is the 2/3~1/3 of jet expansion and laser beam center line distance.
Positive electrode is fixed on three-dimensional trim holder, to adjust the relative position of electrode bar and jet expansion.
Negative electricity extremely electrode plate, electrode plate plate face are vertical with the longitudinal center line of positive electrode.The area of electrode plate plate face is
The extended line of 20 times or more of positive electrode radial section, the longitudinal center line of positive electrode passes through electrode plate plate face, electrode plate plate face
With at a distance from laser beam center line be 5~20mm, preferred version be positive electrode longitudinal center line extended line pass through electrode plate
The center of plate face.
The workbench is three-dimensional adjustable workbench.
Nozzle flow is adjusted when use, makes water Shu Wending；Then voltage and the position for adjusting positive and negative electrode, keep water beam inclined
Turn, and water beam is straight down after deflection；Laser and condenser lens are finally adjusted, laser beam focus is made to be flowed straight down
Water beam in.
A kind of another program for Water Jet Guided Laser system of processing that the present invention designs is equipped with 2~5 sets of deflections as described above
Water bundle device, total water beam that the water Shu Hewei that each set deflection water bundle device deflects flows straight down, laser beam focus is in Zong Shui
In beam.Respectively the angle between the positive electrode center line of set deflection water bundle device and the vertical plane of laser beam center line composition is
20 °~160 °.
Each set deflection water bundle device is identical.
Compared with prior art, the advantages of a kind of Water Jet Guided Laser processing method and system of the invention, is：1, laser is guided
The problem of water beam need not be generated by the expensive nozzle of big L/D ratio, and nozzle erosion is not present in the coupling process of laser and water beam,
Chamber structure complicated in traditional water-conducted laser device is not needed, equipment cost and maintenance cost significantly reduce yet；2, water beam
Diameter is not limited by traditional water-conducted laser device nozzle diameter, and more tiny water beam may be used, and further increases processing essence
Degree；3, laser spot is not necessarily to be positioned accurately at the specific position for generating water beam nozzle, only needs and is flowed straight down after deflecting
Water Shu Chonghe it is conllinear, reduce laser focusing accuracy requirement, reduce the coupling difficulty of laser beam and water beam；4, it does not deposit
The problem of drop assembled around nozzle draws inclined water beam, laser and water beam to deviate machining path, makes Water Jet Guided Laser processing quality
Stablize.
Description of the drawings
Fig. 1 is 1 structural schematic diagram of this Water Jet Guided Laser system of processing embodiment；
Fig. 2 is 2 structural schematic diagram of this Water Jet Guided Laser system of processing embodiment；
Fig. 3 is the schematic top plan view of this Water Jet Guided Laser system of processing embodiment 2；
Fig. 4 is the schematic top plan view of this Water Jet Guided Laser system of processing embodiment 3.
Figure internal label is：1, nozzle, 2, water beam, 3, laser beam, 4, negative electrode electrodes plate, 5, workpiece, 6 sinks, 7, work
Platform, 8, three-dimensional trim holder, 9, positive electrode electrode bar, 10, total water beam.
Specific implementation mode
The present invention is described in detail with reference to the accompanying drawings and examples：
Water Jet Guided Laser system of processing embodiment 1
This Water Jet Guided Laser system of processing embodiment 1 is as shown in Figure 1, three-dimensional adjustable 7 table top of workbench is horizontal plane, water
Slot 6 is fixed on 7 table top of workbench, and workpiece 5 is fixed on 6 inner bottom surface of sink, and laser is located at 6 top of sink, what laser was sent out
3 central axis of laser beam is also equipped with 1 set of deflection water bundle device, including nozzle 1 and positive and negative electrode in 7 table top of workbench
Each one.The nozzle 1 for generating water beam 2 is set to 3 side of laser beam, and 1 center line of nozzle is with 3 centerline of laser beam in same lead
Vertical plane, angle theta=25 ° of two center line of this example, the outlet of nozzle 1 are 20mm at a distance from 3 center line of laser beam, and nozzle 1 goes out
Mouth is 40mm at a distance from 7 table top of workbench.The flow rate of water flow of 500 μm of 1 outlet aperture of this example nozzle, jet expansion is 50m/s.
The lower section that nozzle 1 goes out saliva beam 2 is furnished with positive electrode electrode bar 9, and this example electrode bar diameter 1mm, length 20mm are axial
Center line is horizontal line, the plane constituted in 1 center line of nozzle and 3 center line of laser beam, the vertical range exported with nozzle 1
For 20mm.One end of electrode bar 9 is 20mm at a distance from 3 center line of laser beam.Positive electrode electrode bar 9 is fixed on three-dimensional trim holder
On 8, to adjust the relative position of electrode bar 9 and nozzle 1.
The plane that the non-uniform electric field that positive and negative electrode generates is formed perpendicular to nozzle centerline and laser beam center line, just,
Negative electrode center is less than jet expansion.Because hydrone be polar molecule, in non-uniform electric field the anion of water or cation by
The electrode of electrification attracts, and water beam is deflected, and flow direction is straight down.
3 other side of this example laser beam is opposite with positive electrode electrode bar 9 to be furnished with negative electrode electrodes plate 4,4 plate face of electrode plate and electricity
The longitudinal center line of pole stick 9 is vertical, and 4 plate face of electrode plate is the square of length of side 10mm, the extension of the longitudinal center line of electrode bar 9
Line passes through the center of 4 plate face of electrode plate.4 plate face of electrode plate is 10mm at a distance from 3 center line of laser beam.
The voltage of electrode bar 9 and electrode plate 4 is respectively+1000V and -1000V, and the inhomogeneous field that they are generated acts on
Water beam 2 makes water beam 2 deflect down, and the laser beam 3 focuses in flowing water beam 2 straight down, laser beam 3 vertically to
Under water beam 2 light path in propagate reach be fixed on 5 surface of workpiece on workbench 7.
1 flow of nozzle is adjusted when use, and water beam 2 is made to stablize；Then voltage and the position of electrode bar 9 and electrode plate 4 are adjusted,
Water beam 2 is set to deflect, and water beam 2 is straight down after deflection；Laser and condenser lens are finally adjusted, laser beam 3 is made to focus on
In water beam 2 straight down.
Water Jet Guided Laser system of processing embodiment 2
This Water Jet Guided Laser system of processing embodiment 2 is as shown in Figures 2 and 3, and this example is equipped with 2 sets of deflection water bundle devices, 2 sets of deflections
Total water beam 10 that the water Shu Hewei of water bundle device deflection flows straight down, laser beam 3 focus in total water beam 10.Laser beam 3
It is overlapped with the center line of total water beam 10.The vertical that the electrode bar center line of 2 sets of deflection water bundle devices is constituted with 3 center line of laser beam
Angle α between plane is 120 °.
It is a set of identical as upper deflection water bundle device described in embodiment 1 in 2 sets of deflection water bundle devices of this example.
It is another set of deflection water bundle device nozzle 1 export with 3 center line of laser beam at a distance from be 25mm, nozzle 1 outlet and
The distance of 7 table top of workbench is 50mm.1 center line of nozzle is with 3 centerline of laser beam in same vertical plane, two center of this example
Angle theta=30 ° of line.The flow rate of water flow of 600 μm of 1 outlet aperture of this example nozzle, jet expansion is 60m/s.The electrode bar of this set
Diameter 2mm length 20mm, longitudinal center line is horizontal line, what 1 center line of nozzle and 3 center line of laser beam in this set were constituted
Plane is 20mm with the vertical range that this set nozzle 1 exports.One end of electrode bar 9 is at a distance from 3 center line of laser beam
25mm.3 other side of the laser beam electrode plate 4 opposite with the electrode bar 9,4 plate face of electrode plate and the longitudinal center line of electrode bar 9 hang down
Directly, 4 plate face of electrode plate is the square of length of side 15mm, and the extended line of the longitudinal center line of electrode bar 9 passes through 4 plate face of electrode plate
Center.4 plate face of electrode plate is 15mm at a distance from 3 center line of laser beam.The voltage of this set electrode bar 9 and electrode plate 4 be respectively+
1200V and -1200V.
Water Jet Guided Laser system of processing embodiment 3
This Water Jet Guided Laser system of processing embodiment 3 is as shown in figure 4, this example is furnished with 3 sets of deflection water described in embodiment 1 as above
Bundle device, total water beam 10 that the water Shu Hewei that each set deflection water bundle device deflects flows straight down, laser beam 3 focus on Zong Shui
In beam 10.3 sets deflection water bundle device electrode bar center lines and 3 center line of laser beam constitute vertical plane between angle be
120°。
Above-described embodiment is only further described the purpose of the present invention, technical solution and advantageous effect specific
A example, present invention is not limited to this.All any modifications made within the scope of disclosure of the invention, change equivalent replacement
Into etc., it is all included in the scope of protection of the present invention.
Claims (10)
1. a kind of Water Jet Guided Laser processing method, laser are guided focused in workpiece surface through water beam, it is characterised in that：
The nozzle (1) for generating the water beam (2) is located at laser beam (3) side, and the non-uniform electric field that electrode generates makees water beam (2)
Deflected straight down with, water beam (2), laser beam (3) focuses in water beam (2) straight down, laser beam (3) be in vertically to
In lower flowing water beam (2), the water beam (2) guiding laser beam (3) acts on workpiece (5), realizes Water Jet Guided Laser processing.
2. Water Jet Guided Laser processing method according to claim 1, it is characterised in that：
The center line of the beam of flowing water straight down (2) and laser beam (3) overlaps.
3. a kind of Water Jet Guided Laser system of processing of Water Jet Guided Laser processing method design according to claim 1, including sink
(6) and workbench (7), workbench (7) table top are horizontal plane, and sink (6) is fixed on workbench (7) table top, and workpiece (5) is fixed on
Sink (6) inner bottom surface, laser are located above sink (6), and laser beam (3) central axis that laser is sent out is in workbench
(7) table top, it is characterised in that：
It is also equipped with 1 set of deflection water bundle device, including nozzle (1) and each one of positive and negative electrode (9,4)；Generate water beam (2)
Nozzle (1) is set to laser beam (3) side, and nozzle (1) center line and laser beam (3) centerline are in same vertical plane, and two
The angle of center line is 10 °~30 °, and nozzle (1) outlet is 10mm~30mm, nozzle (1) at a distance from laser beam (3) center line
Outlet is 20~60mm at a distance from workbench (7) table top；The lower section that nozzle (1) goes out saliva beam (2) is furnished with positive electrode (9), swashs
Opposite place is furnished with negative electrode (4) with positive electrode (3) for light beam (3) other side, and the voltage difference between positive and negative electrode (9,4) is 1000V
~3000V, the non-uniform electric field that positive and negative electrode (9,4) generates is perpendicular to nozzle (1) center line and laser beam (3) center line group
At plane, positive and negative electrode (9,4) center exports less than nozzle (1), the outlet of positive and negative electrode (9,4) center and nozzle (1)
Vertical range is 10mm~30mm；The inhomogeneous field acts on water beam (2) and is allowed to deflect down, flow straight down；Institute
It states laser beam (3) to focus in flowing water beam (2) straight down, laser beam (3) is in the light path of water beam (2) straight down
It propagates and reaches workpiece (5) surface.
4. Water Jet Guided Laser system of processing according to claim 3, it is characterised in that：
The flow rate of water flow of 10 μm~600 μm of nozzle (1) outlet aperture, nozzle (1) outlet is 5m/s~100m/s.
5. Water Jet Guided Laser system of processing according to claim 3, it is characterised in that：
The positive electrode (9) is electrode bar, and diameter is equal to or more than nozzle (1) bore, the length of 2mm~15mm, electrode
The longitudinal center line of stick (9) is horizontal line, the plane constituted in nozzle (1) center line and laser beam (3) center line；Electrode bar
(9) one end is nozzle (1) outlet and the 2/3~1/3 of laser beam (3) center line distance at a distance from laser beam (3) center line.
6. Water Jet Guided Laser system of processing according to claim 3, it is characterised in that：
The positive electrode (9) is fixed on three-dimensional trim holder (8).
7. Water Jet Guided Laser system of processing according to claim 3, it is characterised in that：
The negative electrode (4) is electrode plate, and electrode plate (4) plate face is vertical with the longitudinal center line of positive electrode (9)；Positive electrode (9)
The extended line of longitudinal center line to pass through electrode plate (4) plate face, the area of electrode plate (4) plate face be positive electrode (9) radial section
20 times or more, electrode plate (4) plate face at a distance from laser beam (3) center line be 5~20mm.
8. Water Jet Guided Laser system of processing according to claim 7, it is characterised in that：
The extended line of the longitudinal center line of the positive electrode (9) passes through the center of electrode plate (4) plate face.
9. the Water Jet Guided Laser system of processing according to any one of claim 3 to 8, it is characterised in that：
Equipped with the deflection water bundle device described in 2~5 sets, the water beam (2) of each set deflection water bundle device deflection is combined into total water beam (10),
Laser beam (3) focuses in total water beam (10)；Positive electrode (9) center line of each set deflection water bundle device and laser beam (3) center
Angle between the vertical plane that line is constituted is 20 °~160 °.
10. Water Jet Guided Laser system of processing according to claim 9, it is characterised in that：
Each set deflection water bundle device is identical.
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| CN201810383169.8A CN108581223B (en) | 2018-04-26 | 2018-04-26 | Water-guided laser processing method and system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125532A (en) * | 2019-05-15 | 2019-08-16 | 哈尔滨工业大学 | A kind of method, system and its equipment of water guiding laser processing workpiece |
| CN113894444A (en) * | 2021-09-28 | 2022-01-07 | 武汉大学 | Water-guided pulse laser processing system and method based on interference light path design |
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| CN107433397A (en) * | 2017-08-02 | 2017-12-05 | 武汉大学 | A kind of wafer cutting device and method of jet auxiliary laser plasma |
| CN208662839U (en) * | 2018-04-26 | 2019-03-29 | 桂林电子科技大学 | A kind of Water Jet Guided Laser system of processing |
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| CN110125532A (en) * | 2019-05-15 | 2019-08-16 | 哈尔滨工业大学 | A kind of method, system and its equipment of water guiding laser processing workpiece |
| CN113894444A (en) * | 2021-09-28 | 2022-01-07 | 武汉大学 | Water-guided pulse laser processing system and method based on interference light path design |
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