CN108568928B

CN108568928B - Resin molding method and method for producing resin molded article

Info

Publication number: CN108568928B
Application number: CN201810181874.XA
Authority: CN
Inventors: 花崎昌则; 奥西祥人
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2017-03-07
Filing date: 2018-03-06
Publication date: 2021-02-02
Anticipated expiration: 2038-03-06
Also published as: KR20180102494A; JP2018144371A; TWI666105B; JP6785690B2; CN108568928A; TW201832895A; KR102232403B1

Abstract

The present invention relates to a resin sealing device, a resin molding method, and a method for manufacturing a resin molded article. The invention can suppress the poor molding conditions such as lead bending, resin leakage and unfilled, and can reduce the pressure inside the molding module. The resin sealing device is provided with a molding module (1), a control unit (8) for controlling the degree of vacuum, a decompression unit (3), and a vacuum gauge (2). The vacuum degree control means (8) is provided with a vacuum degree control valve (6), switching valves (4, 5), and a vacuum degree control unit (9). A2 nd gas flow path (33a) connected to a vacuum degree control valve (6) is connected between the molding module (1) and the switching valves (4, 5) of a 1 st gas flow path (30a) connecting the molding module (1) and the pressure reducing unit (3) through the switching valves (4, 5).

Description

Resin molding method and method for producing resin molded article

Technical Field

The present invention relates to a resin sealing device, a resin molding method, and a method for manufacturing a resin molded article.

Background

Japanese patent application laid-open No. 2008-143186 (patent document 1) describes a resin sealing device for sealing and molding by injecting a resin into a cavity formed between vertically opposed molds, the resin sealing device including a pressure adjusting mechanism in a closed space including a final cavity space, the pressure adjusting mechanism being capable of reducing and adjusting a pressure in the closed space through an air flow path connectable from outside the closed space.

Disclosure of Invention

However, in the resin sealing device described in patent document 1, when the pressure in the sealed space is reduced by the pressure adjustment mechanism, the resin is excessively foamed, and a wire sweep (wire sweep) or the like may occur due to the foamed resin contacting the lead mounted on the substrate. In addition, the foamed resin may be conducted through the substrate, and the resin may leak from the frame.

On the other hand, if the pressure in the sealed space is high, unfilled portions such as voids and chips may be formed in the sealing resin.

According to embodiments disclosed herein, there may be provided a resin sealing apparatus including: a forming module; a vacuum degree control unit for controlling the vacuum degree inside the forming module; a decompression unit for decompressing the inside of the forming module; and a vacuum gauge for measuring the degree of vacuum inside the forming module; the vacuum degree control means is provided with a vacuum degree control valve for adjusting the gas discharge amount inside the molding module, a switching valve for adjusting the gas discharge amount inside the molding module depending on the decompression means, and a control unit for adjusting the vacuum degree of the vacuum degree control valve in accordance with the vacuum degree inside the molding module measured by the vacuum gauge, and a 2 nd gas flow path connected to the vacuum degree control valve is connected between the molding module and the switching valve of a 1 st gas flow path connecting the molding module and the decompression means via the switching valve.

According to embodiments disclosed herein, there may be provided a resin forming method including: a step of supplying a plate-like member having electronic parts mounted thereon to a die surface of a 2 nd die opposed to a die surface of a 1 st die in a molding module; a step of supplying a resin material into a cavity of the 1 st die; a step of heating the resin material; a step of bringing the 1 st mold into proximity with the 2 nd mold; depressurizing the inside of the molding block; carrying out mold clamping (mold clamping) on the 1 st mold and the 2 nd mold; and a step of resin-sealing the electronic component with a cured resin obtained by curing the heated resin material after the step of closing the 1 st mold and the 2 nd mold; and the step of performing pressure reduction includes the step of adjusting, by the switching valve, an exhaust amount of gas exhausted through a 1 st gas flow path connecting the forming module and the pressure reduction unit via the switching valve, and adjusting, by the vacuum degree control valve, an exhaust amount of gas exhausted from the 1 st gas flow path between the forming module and the switching valve through a 2 nd gas flow path connected to the vacuum degree control valve.

According to the embodiments disclosed herein, a method for producing a resin molded article by the resin molding method can be provided.

According to the embodiments disclosed herein, it is possible to provide a resin sealing device, a resin molding method, and a method for manufacturing a resin molded article, which can suppress molding defects such as lead bending, resin leakage, and underfill, and can reduce the pressure inside a molding module.

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention, which is to be read in connection with the accompanying drawings.

Drawings

Fig. 1 is a schematic configuration diagram of a resin sealing device according to embodiment 1.

Fig. 2 is a diagram showing an example of a change in the pressure (degree of vacuum) [ Torr (Torr) ] inside the molding module with respect to the elapsed time [ second ] from the start of depressurization when the pressure inside the molding module is depressurized using the resin sealing apparatus of the reference example.

Fig. 3 is a diagram showing another example of a change in the pressure (degree of vacuum) [ Torr ] inside the molding module with respect to the elapsed time [ sec ] from the start of decompression when the pressure inside the molding module is decompressed using the resin sealing apparatus according to embodiment 1 and the resin sealing apparatus according to the reference example.

Fig. 4 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to embodiment 1.

Fig. 5 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to embodiment 1.

Fig. 6 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 7 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 8 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 9 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 10 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 11 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 12 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 13 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to embodiment 1.

Fig. 14 is a schematic configuration diagram of a modification of the molding module according to embodiment 1.

Fig. 15 is a schematic configuration diagram of a resin sealing device according to embodiment 2.

[ description of symbols ]

1: a forming module;

2: a vacuum gauge;

2 a: a vacuum gauge at about atmospheric pressure;

2 b: a vacuum gauge for high vacuum;

3: a pressure reducing unit;

4: a flow rate large/small switching valve;

5: an open/close switching valve;

6: vacuum degree control valve/proportional solenoid valve;

7: a controller/proportional solenoid controller;

8: a control unit of vacuum degree;

9: a control unit for controlling the degree of vacuum;

10: to switch the flow of gas to a large or small signal;

11: a signal indicating a target value of the degree of vacuum;

12. 13: a signal indicating a measured value of the current vacuum degree;

14: a switching signal;

15: a sensor signal switching unit/switching unit of the vacuum gauge;

16: a signal;

21: a lower fixed disk;

22: a movable unit;

23: a mold clamping mechanism;

24: a movable disk;

25: a lower die;

26: an upper die;

27: an upper fixed tray;

28. 30, 31, 32, 33, 81, 82: piping;

28a, 31a, 32a, 81a, 82 a: a gas flow path;

29: a column;

30 a: gas flow path/first gas flow path;

33 a: gas flow path/second gas flow path;

41: a gas flow path;

42: an O-shaped ring;

43 a: an upper mold outer gas blocking member;

43 b: a lower mold external gas blocking member;

44: a side member;

45: a mold cavity;

46: a bottom surface member;

47: an elastic member;

51: demolding the film;

52: a resin material;

53: a lead wire;

54: an electronic component;

55: a substrate;

61: melting the resin;

62: hardening the resin;

71: and (3) foaming resin.

Detailed Description

Hereinafter, embodiments will be described. In the drawings used for the description of the embodiments, the same reference numerals are used for the same or corresponding portions.

[ embodiment 1]

Fig. 1 is a schematic configuration diagram of a resin sealing apparatus according to embodiment 1. The resin sealing apparatus according to embodiment 1 includes a plurality of molding modules 1, one depressurizing unit 3 for depressurizing the inside of the molding modules 1, and one vacuum degree control unit 8 for controlling the vacuum degree of the inside of the molding modules 1.

The molding module 1 includes: a lower die 25, an upper die 26 opposed to the lower die 25, an upper fixed plate 27 for fixing the upper die 26, a movable plate 24 for fixing the lower die 25, a mold clamping mechanism 23 for moving the movable plate 24, a lower fixed plate 21 for fixing the mold clamping mechanism 23, and a column 29 provided between the upper fixed plate 27 and the lower fixed plate 21.

The movable unit 22 is constituted by the lower fixed disk 21, the mold clamping mechanism 23, and the movable disk 24. The clamping mechanism 23 moves the movable platen 24 in the vertical direction along the direction in which the columns 29 extend from the lower fixed platen 21 to the upper fixed platen 27. Thereby, the movable unit 22 enables relative movement of the lower die 25 with respect to the upper die 26 (movement in a direction in which the lower die 25 relatively approaches the upper die 26, and movement in a direction in which the lower die 25 relatively separates from the upper die 26). Instead of the column 29, a wall-shaped block may be used to connect (a side surface of) the upper fixed disk 27 and (a side surface of) the lower fixed disk 21.

The resin sealing apparatus further includes a vacuum gauge 2 for measuring the degree of vacuum in the molding module 1, and an open/close switching valve 5 for adjusting the amount of gas discharged into and out of the molding module 1. The open/close switching valve 5 is connected to one end of a gas passage 28a in the pipe 28 that can pass through the upper fixed disk 27 and communicate with the inside of the molding module 1. The other end of the gas flow passage 28a inside the pipe 28 is connected to the gas flow passage 30a inside the pipe 30 via the open/close switching valve 5. The vacuum gauge 2 is connected to a gas passage 28a in the pipe 28 between the open/close switching valve 5 and the upper fixed disk 27.

The pressure reducing unit 3 is connected to one end of a gas flow path 31a inside the pipe 31, and the other end of the gas flow path 31a is connected to a gas flow path 30a inside the pipe 30 via a flow rate large/small switching valve 4. The pressure reducing unit 3 can reduce the pressure inside the molding module 1 by discharging the gas inside the molding module 1 through the upper fixed disk 27, the gas flow path 28a, the open/close switching valve 5, the gas flow path 30a, the flow rate large/small switching valve 4, and the gas flow path 31 a. The flow rate large/small switching valve 4 can adjust the amount of gas discharged when the pressure inside the molding module 1 is reduced by the pressure reducing unit 3. As the pressure reducing unit 3, for example, a vacuum pump or the like can be used. Further, when the resin sealing apparatus has only one molding module 1, the open/close switching valve 5 may not be used.

The vacuum degree control means 8 includes: a flow rate large/small switching valve 4, a vacuum degree control valve (proportional solenoid valve) 6, a controller (proportional solenoid valve controller) 7, a vacuum degree control unit 9, and a sensor signal switching unit (switching unit of a vacuum gauge) 15.

The vacuum degree control valve 6 is connected to a gas flow passage 30a inside the pipe 30 between the flow rate large/small switching valve 4 and the open/close switching valve 5 via a gas flow passage 33a of the pipe 33. Further, in the vacuum degree control valve 6, the other end of the gas flow path 32a is connected so that gas such as air can be introduced from one end of the gas flow path 32a in the pipe 32. The gas introduced from one end of the gas flow path 32a can be introduced into the molding module 1 through the gas flow path 32a, the vacuum degree control valve 6, the gas flow path 33a, the gas flow path 30a, the open/close switching valve 5, the gas flow path 28a, and the upper fixed disk 27.

In the resin sealing device according to embodiment 1, the vacuum degree in the molding module 1 is measured by the vacuum gauge 2, and a signal 13 indicating the current measurement value of the vacuum degree in the molding module 1 is constantly sent to the control unit 9 of the vacuum degree via the sensor signal switching unit 15. Further, for example, when there are a plurality of vacuum gauges 2 as described later, the sensor signal switching unit 15 can switch the vacuum gauges 2 by receiving the switching signal 14 from the control unit 9 for the degree of vacuum.

The vacuum degree control unit 9 transmits a signal 10 for switching the flow rate of the gas discharged from the gas flow path 30a through the gas flow path 31a to a large or small value to the flow rate large/small switching valve 4 based on the received signal 13 indicating the current measurement value of the vacuum degree. Thus, the flow rate large/small switching valve 4 roughly adjusts the amount of gas discharged from the gas flow path 30a into the gas flow path 31a so that the amount of gas discharged becomes either large or small.

The vacuum degree control unit 9 transmits a signal 11 indicating a target value of the vacuum degree in the molding module 1 to the controller 7, and transmits a signal 12 indicating a current measurement value of the vacuum degree to the controller 7 at all times based on a signal 13 indicating a current measurement value of the vacuum degree. The controller 7 adjusts the vacuum degree control valve 6 based on the difference between the target value of the vacuum degree inside the molding module 1 and the current measurement value of the vacuum degree inside the molding module 1, and finely adjusts the introduction amount of the gas introduced from the gas flow path 32a into the gas flow path 33 a.

As described above, in the resin sealing device according to embodiment 1, by combining the rough adjustment of the gas discharge amount by the flow rate large/small switching valve 4 and the fine adjustment of the gas introduction amount by the vacuum degree control valve 6, the overshoot (overshot) amount of the pressure reduction with respect to the target value of the pressure at the time of starting the pressure reduction in the molding block 1 can be reduced. The timing of switching the flow rate increase/decrease switching valve 4 can be determined, for example, in accordance with the overshoot of the reduced pressure with respect to the target value of the pressure inside the molding block 1 and the time (speed) until the pressure reaches the target value of the pressure inside the molding block 1.

Fig. 2 shows an example of a change in the pressure (degree of vacuum) [ Torr ] inside the molding module 1 with respect to the elapsed time [ second ] from the start of depressurization when the pressure inside the molding module 1 is depressurized using the resin sealing apparatus of the reference example. Here, the resin sealing apparatus of the reference example reduces the pressure inside the molding module 1 under the same conditions and by the same method as those of the resin sealing apparatus of embodiment 1, except that the amount of gas introduced is not finely adjusted by the vacuum degree control valve 6, and the amount of gas discharged is set to be only large by the flow rate large/small switching valve 4. In addition, the change in the internal pressure of the molding block 1 of the reference example is expressed by comparison with a target value of the internal pressure of the molding block 1.

As shown in fig. 2, in the case of the reference example, the gas discharge amount may become large, and the pressure inside the molding module 1 may drop at once (the atmospheric air introduction may not catch up). At this time, when the target value on the side close to the atmospheric pressure is set, the pressure inside the molding module 1 may overshoot and become uncontrollable. That is, the pump capacity (gas discharge amount) and the amount of air that can be introduced cannot be controlled at the same time. This means that the pressure inside the molding module 1 cannot be controlled unless it is equal to or lower than a predetermined pressure.

When the discharge amount of the gas is set to be small by the flow rate large/small switching valve, the pressure inside the molding module 1 can be controlled even when a target value close to the atmospheric pressure side is set because the gas discharge amount is small. However, since the gas discharge amount is small, when a target value close to the vacuum side is set, the time until the target value is reached may become late.

Therefore, by switching the flow rate of the discharge amount of the gas between the high flow rate and the low flow rate by the flow rate high/low switching valve 4, the pressure inside the molding block 1 can be controlled even if the target value is closer to the atmospheric pressure side, and the time lag until the target value of the pressure inside the molding block 1 is reached can be suppressed even if the target value is closer to the vacuum side. For example, the flow rate of the flow rate large/small switching valve 4 may be set to be small until a predetermined pressure is reached, and the flow rate large/small switching valve 4 may be switched to use a large flow rate when the pressure becomes equal to or lower than the predetermined pressure. The timing of switching the flow rate large/small switching valve 4 may be determined in advance by experiments or the like. Even when the flow rate of the gas to be discharged is set to be small by the flow rate large/small switching valve 4, the vacuum degree control valve 6 may be adjusted to increase the amount of the gas to be introduced into the gas flow path 30a when the rate of pressure reduction is large in order to suppress foaming of the resin, thereby suppressing the rate of pressure reduction. In the case where the flow rate of the gas to be discharged is set to be small by the flow rate large/small switching valve 4, when the rate of pressure reduction is too small in order to suppress foaming of the resin, the flow rate large/small switching valve 4 may be switched to be large, and the degree of vacuum control valve 6 may be adjusted so as to increase the amount of gas introduced into the gas flow path 30a to such an extent that foaming of the resin can be suppressed, thereby suppressing the rate of pressure reduction. Further, the amount of gas introduced into the gas flow path 30a may be gradually changed from large to small by adjusting only the vacuum degree control valve 6 while maintaining the large amount of gas discharged by the flow rate large/small switching valve 4 from the start of pressure reduction to the end of pressure reduction, to such an extent that foaming of the resin can be suppressed.

Further, as shown in fig. 3, in the resin sealing device of embodiment 1, since the overshoot of the reduced pressure can be reduced, the pressure can be easily reduced stepwise for each target value of the degree of vacuum (750Torr, 600Torr, 450Torr, 300Torr, and 150 Torr). On the other hand, in the resin sealing device of the reference example in which the overshoot of the reduced pressure is large, it is difficult to perform the pressure reduction step by step for each target value of the degree of vacuum as in the resin sealing device of embodiment 1.

An example of a resin sealing method according to embodiment 1 using the resin sealing device according to embodiment 1 will be described below with reference to schematic cross-sectional views of fig. 4 to 13. First, as shown in fig. 4, the upper die 26 fixed to the upper fixed platen 27 and the lower die 25 fixed to the movable platen 24 are provided so that their die surfaces face each other. Further, a gas passage 41 for connecting the inside of the molding module 1 and a gas passage 28a of the pipe 28 shown in fig. 1 is provided inside the upper fixed disk 27.

An upper mold external air blocking member 43a and a lower mold external air blocking member 43b are disposed on the respective edges of the upper fixed disk 27 and the movable disk 24 via O-rings 42. The O-ring 42 is also disposed between the upper mold external gas blocking member 43a on the upper fixed disk 27 side and the lower mold external gas blocking member 43b on the movable disk 24 side.

The lower mold 25 includes a bottom surface member 46, a side surface member 44 surrounding the bottom surface member 46, and an elastic member 47 disposed between the side surface member 44 and the movable platen 24. The lower die 25 has a cavity 45 in a space surrounded by the side surface member 44 above the bottom surface member 46. The cavity 45 is for holding the resin material.

Then, as shown in fig. 5, a substrate 55, which is a plate-like member on which electronic components 54 electrically connected by leads 53 are mounted, is supplied onto the die surface of the upper die 26 and held, and a resin material 52 (granular resin in embodiment 1) is supplied into the cavity 45 of the lower die 25 through the mold release film 51 and held.

Further, examples of the plate-like member include: a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor chip, a lead frame, or the like.

The resin material 52 is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. In addition, a composite material may be used in which a thermosetting resin or a thermoplastic resin is partially contained. Examples of the form of the resin to be supplied to the resin sealing device of embodiment 1 include: granular resin, liquid resin, sheet resin, tablet resin, or powder resin.

Then, as shown in fig. 6, the resin material 52 is heated and melted to produce a molten resin (flowable resin) 61.

Then, as shown in fig. 7, the movable platen 24 is moved upward, and the lower mold 25 and the upper mold 26 are brought close to each other. Thereby, the upper mold external gas blocking member 43a on the upper fixed disk 27 side and the lower mold external gas blocking member 43b on the movable disk 24 side are in close contact with each other via the O-ring 42 therebetween, and the external gas is blocked.

Then, as shown in fig. 8, the gas inside the forming module 1 is discharged through the gas flow path 41, and the inside of the forming module 1 is depressurized. At this time, the molten resin 61 foams to become the foamed resin 71. The reason why the molten resin 61 is foamed when the pressure inside the molding module 1 is reduced is considered to be (i) a gas involved when the resin material 52 is melted, (ii) moisture contained in the molten resin 61, and (iii) a volatile component contained in the molten resin 61.

Here, in the resin sealing device according to embodiment 1, the inside of the molding module 1 can be gradually depressurized by combining rough adjustment of the gas discharge amount by the flow rate size/size switching valve 4 and fine adjustment of the gas introduction amount by the vacuum degree control valve 6. This reduces the overshoot of the pressure reduction at the start of the pressure reduction in the molding module 1, compared with the conventional (reference example), and thus, for example, as shown in fig. 9, the rapid expansion of the foamed resin 71 can be suppressed. Therefore, the occurrence of troubles such as bending of the lead and resin leakage due to excessive foaming of the molten resin 61 can be reduced.

In the resin sealing device according to embodiment 1, since the pressure inside the molding module 1 can be sufficiently reduced, it is possible to suppress occurrence of unfilled portions such as voids and chips in the cured resin 62 in which the electronic component 54 is sealed by the step described later.

Further, the internal pressure of the molding block 1 of the resin sealing apparatus according to embodiment 1 may be gradually reduced in stages to reach the final target value of the degree of vacuum, as shown in fig. 3, for example. Even in this case, rapid expansion of the foamed resin 71 can be suppressed.

In the internal decompression of the molding block 1 by the resin sealing apparatus according to embodiment 1, the degree of vacuum may be increased (the pressure in the molding block 1 may be decreased) at the initial stage of the decompression, and then the degree of vacuum may be once decreased (the pressure in the molding block 1 may be increased) and then the degree of vacuum may be increased again. By doing so, the molten resin 61 is foamed in the initial stage of the pressure reduction, and thereafter the foam of the foamed resin 71 is crushed by a low degree of vacuum, and the pressure inside the molding module 1 is reduced again to a target value.

Further, as shown in fig. 10, the lower die 25 and the upper die 26 are brought closer together by further moving the movable platen 24 upward, and the side surface member 44 is in a state of pressing the substrate 55 via the release film 51, whereby the resin leakage when the degree of vacuum in the inside of the molding module 1 is increased can be further suppressed. Even when this state is achieved, the cavity may be depressurized by providing a vent hole in the upper surface of the side member 44.

Subsequently, as shown in fig. 11, the lower mold 25 and the upper mold 26 are clamped. The lower mold 25 and the upper mold 26 are clamped together by, for example, moving the movable platen 24 further upward until the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Here, the pressure inside the molding module 1 may be maintained by closing the open/close switching valve 5 after a predetermined time has elapsed from the time when the electronic component 54 is immersed in the molten resin 61.

Then, the molten resin 61 is cured in a state where the electronic component 54 on the substrate 55 is immersed in the molten resin 61. As a result, as shown in fig. 12, the electronic component 54 on the substrate 55 is resin-sealed by curing the resin 62, thereby producing a resin molded product. In embodiment 1, the resin molded product includes a substrate 55 and an electronic component 54 resin-sealed on the substrate 55 by curing a resin 62.

Subsequently, as shown in fig. 13, the lower mold 25 is separated from the upper mold 26 by moving the movable platen 24 downward, thereby separating the release film 51 from the cured resin 62. Thereafter, the resin molded product is removed from the upper mold 26, whereby the resin molded product can be obtained.

The resin sealing method according to embodiment 1 is not particularly limited to the above method, and may or may not include a step other than the step of compression molding the resin material by the compression molding method (compression molding step), for example. The other step is not particularly limited, and may be, for example, a cutting step of cutting the intermediate product produced in the compression molding step to separate a finished compression molded product. More specifically, for example, an intermediate product obtained by compression molding (resin sealing) a plurality of chips arranged on one substrate by compression molding may be manufactured, and the intermediate product may be cut by the cutting step to separate the intermediate product into individual chips to obtain a resin-sealed compression molded product (finished product). The resin sealing method according to embodiment 1 can be used for a method other than the compression molding method such as transfer molding.

In embodiment 1, the case where the resin sealing apparatus includes one vacuum gauge 2 has been described, but the resin sealing apparatus may include two vacuum gauges, i.e., a vacuum gauge 2a at around atmospheric pressure and a vacuum gauge 2b for high vacuum, as the vacuum gauges 2, as shown in fig. 14, for example. In this case, the pressure inside the forming module 1 can be measured more accurately according to the situation. The vacuum gauge 2a at or near atmospheric pressure is connected to a gas passage 82a of a pipe 82 connected to the gas passage 28a of the pipe 28 between the open/close switching valve 5 and the upper fixed disk 27. The vacuum gauge 2b for high vacuum is connected to a gas passage 81a of a pipe 81 connected to a gas passage 28a of the pipe 28 between the open/close switching valve 5 and the upper fixed disk 27. Examples of the vacuum gauge in the vicinity of atmospheric pressure include a diaphragm vacuum gauge (diaphragm vacuum gauge) and the like, and examples of the vacuum gauge for high vacuum degree include a pirani vacuum gauge (pirani vacuum gauge) and the like.

In embodiment 1, as the control unit 9 of the degree of vacuum, for example, a Programmable Logic Controller (PLC), a microcomputer, a personal computer, or the like can be used.

In embodiment 1, a case where a proportional solenoid valve is used as the vacuum degree control valve 6 has been described, but an electro-pneumatic regulator (electro-pneumatic regulator) or the like may be used as the vacuum degree control valve 6 instead of the proportional solenoid valve. The controller 7 is not particularly limited as long as it can control the vacuum degree control valve 6 based on the signal 12 indicating the current measurement value of the vacuum degree received from the control unit 9 of the vacuum degree.

In embodiment 1, the case where the pressure (vacuum degree) inside the plurality of molding modules 1 is controlled by the single vacuum degree control means 8 and the single depressurizing means 3 has been described, but the number of molding modules 1 is not limited, and there may be one molding module 1. The forming modules 1 may be increased or decreased. When the pressure inside the plurality of molding blocks 1 is controlled, for example, the pressure inside one molding block 1 may be reduced for about 30 seconds, the pressure may be maintained (the open/close switching valve 5 of the molding block 1 that has been reduced in pressure is turned "off"), and the pressure inside the other molding block 1 may be reduced (the open/close switching valve 5 of the other molding block 1 is turned "on"). That is, only the time required to control the pressure (vacuum degree) inside one forming module 1 may be controlled, and then the pressure (vacuum degree) inside the other forming module 1 may be immediately controlled. Therefore, the pressure (vacuum degree) inside the plurality of forming modules 1 can be efficiently controlled by one vacuum degree control unit 8 and one decompression unit 3.

[ embodiment 2]

Fig. 15 is a schematic configuration diagram of a resin sealing device according to embodiment 2. The resin sealing device of embodiment 2 has the following features: the other end of the gas flow path 32a inside the pipe 32 connected to the vacuum degree control valve 6 is connected to the gas flow path 31a of the pipe 31 connected to the decompression unit 3, and the open/close switching valve 5 is used instead of the flow rate large/small switching valve 4.

In the resin sealing device according to embodiment 2, the vacuum degree control unit 9 determines whether or not to discharge the gas from the gas flow path 30a through the gas flow path 31a based on the received signal 13 indicating the current measurement value of the vacuum degree, and sends a signal 16 to the open/close switching valve 5 based on the determination, and the open/close switching valve 5 determines whether to turn the open/close switching valve "on" or "off". Thus, even in the case where the inside of the molding block 1 is depressurized by combining the rough adjustment of the gas discharge amount by the open/close switching valve 5 and the fine adjustment of the gas discharge amount by the vacuum degree control valve 6 (for example, the open/close switching valve is set to "open" to a predetermined pressure, and is set to "closed" when the pressure becomes equal to or lower than the predetermined pressure, and the adjustment by the vacuum degree control valve is started), the inside of the molding block 1 can be depressurized more slowly than before, as in the resin sealing apparatus according to embodiment 1. For example, the following control may be performed: at the start of the pressure reduction, the opening/closing switching valve 5 on the molding module 1 side is set to "on", the opening/closing switching valve 5 of the control means 8 for the degree of vacuum is set to "off", and when the rate of pressure reduction is excessively small in order to suppress foaming of the resin, the degree of vacuum control valve 6 is adjusted so as to increase the rate of pressure reduction by increasing the amount of gas discharged into the gas flow path 30a to such an extent that foaming of the resin can be suppressed, and thereafter the opening/closing switching valve 5 of the control means 8 for the degree of vacuum is set to "on".

Therefore, in the resin sealing device of embodiment 2, since the inside of the molding module 1 can be sufficiently decompressed while reducing the overshoot of the decompression with respect to the target value of the pressure at the start of the decompression of the inside of the molding module 1, it is possible to reduce the occurrence of troubles such as bending of the lead wire and leakage of the resin due to excessive foaming of the resin, and also to suppress the occurrence of unfilled portions such as voids and chipping in the cured resin sealing the electronic component of the resin molded product, as in the resin sealing device of embodiment 1.

The description of embodiment 2 other than the above is the same as embodiment 1, and therefore, the description thereof will not be repeated here.

As described above, the embodiment and the modifications are explained, but the configuration of the embodiment and the modifications is also determined from the first place as appropriate.

The embodiments of the present invention have been described, but the embodiments disclosed herein are not to be considered as limiting in all respects. The scope of the present invention is indicated by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. A method of forming a resin, comprising:

a step of supplying a plate-like member having electronic parts mounted thereon to a die surface of a 2 nd die opposed to a die surface of a 1 st die in a molding module;

a step of supplying a resin material into a cavity of the 1 st die;

a step of heating the resin material;

a step of bringing the 1 st mold into proximity with the 2 nd mold;

depressurizing the inside of the forming module;

clamping the 1 st die and the 2 nd die; and

a step of resin-sealing the electronic component with a cured resin obtained by curing the heated resin material after the step of clamping the 1 st die and the 2 nd die;

the step of performing pressure reduction includes a step of adjusting, by a 1 st switching valve, a discharge amount of gas discharged through a 1 st gas flow path connecting the molding block and a pressure reduction unit via the 1 st switching valve, and adjusting, by a vacuum degree control valve, a discharge amount of gas discharged into and discharged from a 2 nd gas flow path connected to the vacuum degree control valve on the molding block side connecting the 1 st switching valve with respect to the 1 st gas flow path;

a step of adjusting a discharge amount of gas inside the molding block by a 2 nd switching valve through a 3 rd gas flow path connecting the 1 st gas flow path and the plurality of molding blocks, respectively, and measuring a degree of vacuum inside the molding blocks by a vacuum gauge on the molding block side of the 2 nd switching valve provided in the 3 rd gas flow path;

controlling the degree of vacuum inside the plurality of forming modules by one vacuum control unit and one decompression unit having the 1 st switching valve and the vacuum control valve;

wherein the 1 st switching valve is a flow rate large/small switching valve, and

the overshoot of the pressure reduction with respect to the target value of the pressure at the start of the pressure reduction inside the molding module is reduced by combining the adjustment of the amount of gas discharged by the 1 st switching valve and the adjustment of the amount of gas introduced by the vacuum degree control valve.

2. The resin molding method according to claim 1, wherein in the step of performing decompression, the pressure inside the molding block is gradually reduced.

3. The resin molding method according to claim 1, wherein an introduction amount of the gas introduced from the 2 nd gas flow path into the 1 st gas flow path is adjusted by the vacuum degree control valve.

4. The resin forming method according to claim 1, characterized in that a discharge amount of the gas discharged from the 1 st gas flow path into the 2 nd gas flow path is adjusted by the vacuum degree control valve.

5. The resin molding method according to claim 1, wherein the step of performing resin sealing includes a step of producing a resin molded article,

the resin molding method further includes a step of taking out the resin molded article.

6. A method for producing a resin molded article, characterized in that the resin molded article is produced by the resin molding method according to any one of claims 1 to 5.