JP2018144371A - Resin sealing apparatus, resin molding method, and method for manufacturing resin molded product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable pressure reduction in a molding module to reduce molding failures such as wire sweeps, resin leakages, and short fillings.SOLUTION: A resin sealing apparatus includes: a molding module (1); a unit for controlling vacuum (8); a pressure reduction unit (3), and a vacuum gage (2). The unit for controlling vacuum (8) includes: a valve for controlling vacuum (6), switching valves (4, 5), and a part for controlling vacuum (9). A second gas passage (33a) is connected to the valve for controlling vacuum (6) between the molding module (1) of a first gas passage (30a), connecting the molding module (1) and the pressure reduction unit (3) to each other via the switching valves (4, 5), and the switching valves (4, 5).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin sealing device, a resin molding method, and a method for manufacturing a resin molded product.

  Patent Document 1 discloses a resin sealing device that seals and molds resin into a cavity formed between upper and lower opposing molds, and in a sealed space including a final cavity space, There is described a resin sealing device provided with a pressure adjusting means capable of reducing and adjusting the pressure in the sealed space via an air flow path that can be connected from outside the sealed space.

JP 2008-143186 A

  However, in the resin sealing device described in Patent Document 1, when the pressure in the sealed space is reduced by the pressure adjusting means, the resin is too foamed and the foamed resin contacts the wire mounted on the substrate. As a result, a wire flow or the like may occur. In addition, the foamed resin may travel along the substrate, causing resin leakage from the frame mold.

  On the other hand, when the pressure in the sealed space is high, unfilling such as voids and chips may occur in the sealing resin.

  According to the embodiments disclosed herein, a molding module, a vacuum degree control unit for controlling the degree of vacuum inside the molding module, a decompression unit for decompressing the inside of the molding module, and a molding module A vacuum gauge for measuring the degree of vacuum inside, the degree of vacuum control unit includes a vacuum degree control valve for adjusting the amount of gas discharged inside the molding module, and an inside of the molding module by the decompression unit. A switching valve for adjusting the gas discharge amount and a vacuum degree control unit for adjusting the vacuum degree control valve according to the degree of vacuum inside the molding module measured by a vacuum gauge, A second gas flow path connected to the vacuum degree control valve is connected between the molding module of the first gas flow path that connects the molding module and the decompression unit via the switching valve. It is possible to provide a resin sealing apparatus are.

  According to the embodiment disclosed herein, a step of supplying a plate-like member on which electronic components are mounted to a second mold surface opposite to the first mold surface inside the molding module; A step of supplying a resin material to the cavity of one mold, a step of heating the resin material, a step of bringing the first mold and the second mold closer, a step of decompressing the inside of the molding module, a first mold and a first mold Including a step of clamping the mold 2 and a step of sealing the electronic component with a cured resin obtained by curing the resin material after heating after the step of clamping the first mold and the second mold. The step of adjusting the discharge amount of the gas discharged through the first gas flow path connecting the molding module and the decompression unit via the switching valve with the switching valve and between the molding module and the switching valve. Connected to the vacuum control valve from the first gas flow path The incoming emissions second gas inlet discharged through the gas channel may provide a resin molding method comprising the step of adjusting the degree of vacuum control valves.

  According to the embodiment disclosed herein, it is possible to provide a method for manufacturing a resin molded product that manufactures a resin molded product by the above resin molding method.

  According to the embodiments disclosed herein, a resin sealing device, a resin molding method, and a resin molded product manufacturing method capable of reducing pressure inside a molding module while suppressing molding defects such as wire flow, resin leakage, and unfilling. Can be provided.

It is a typical block diagram of the resin sealing apparatus of Embodiment 1. An example of a change in the internal pressure (degree of vacuum) [Torr] of the molding module with respect to the elapsed time [seconds] from the start of pressure reduction when the internal pressure of the molding module is reduced using the resin sealing device of the reference example is shown. FIG. The pressure (degree of vacuum) in the molding module relative to the elapsed time [seconds] from the start of pressure reduction when the pressure in the molding module is reduced using the resin sealing device of Embodiment 1 and the resin sealing device of the reference example. ) It is a figure which shows another example of the change of [Torr]. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. 2 is a schematic cross-sectional view illustrating a part of an example of the resin sealing method of Embodiment 1. FIG. It is a typical block diagram of the modification of the shaping | molding module of Embodiment 1. FIG. It is a typical block diagram of the resin sealing apparatus of Embodiment 2.

  Hereinafter, embodiments will be described. In the drawings used to describe the embodiments, the same reference numerals represent the same or corresponding parts.

[Embodiment 1]
In FIG. 1, the typical block diagram of the resin sealing apparatus of Embodiment 1 is shown. The resin sealing device of Embodiment 1 includes a plurality of molding modules 1, one decompression unit 3 for decompressing the inside of the molding module 1, and one vacuum for controlling the degree of vacuum inside the molding module 1. Degree control unit 8.

  The molding module 1 includes a lower mold 25, an upper mold 26 opposite to the lower mold 25, an upper fixed board 27 for fixing the upper mold 26, and a movable board 24 capable of fixing the lower mold 25. A mold clamping mechanism 23 capable of moving the movable platen 24, a lower fixed platen 21 for fixing the mold clamping mechanism 23, and a post 29 provided between the upper fixed platen 27 and the lower fixed platen 21. I have.

  The lower fixed platen 21, the mold clamping mechanism 23, and the movable platen 24 constitute a movable unit 22. The mold clamping mechanism 23 makes the movable platen 24 movable in the vertical direction along the direction in which the post 29 extends from the lower fixed platen 21 to the upper fixed platen 27. As a result, the movable unit 22 moves relative to the upper mold 26 relative to the lower mold 25 (moving in a direction in which the lower mold 25 is relatively approached relative to the upper mold 26 and lower relative to the upper mold 26. The movement in the direction in which the mold 25 is relatively separated is possible. Instead of the post 29, the upper fixing plate 27 (the side surface) and the lower fixing plate 21 (the side surface) may be connected by a wall-shaped block.

  The resin sealing device further includes a vacuum gauge 2 for measuring the degree of vacuum inside the molding module 1 and an open / close switching valve 5 for adjusting the amount of gas in and out of the molding module 1. I have. The open / close switching valve 5 is connected to one end of a gas flow path 28 a inside the pipe 28 that can communicate with the inside of the molding module 1 through the upper fixed platen 27. The other end of the gas flow path 28 a inside the pipe 28 is connected to the gas flow path 30 a inside the pipe 30 via the open / close switching valve 5. The vacuum gauge 2 is connected to a gas flow path 28 a inside a pipe 28 between the open / close switching valve 5 and the upper fixed platen 27.

  The decompression unit 3 is connected to one end of the gas flow path 31 a inside the pipe 31, and the other end of the gas flow path 31 a is connected to the gas flow path inside the pipe 30 via the flow rate large / small switching valve 4. 30a. The decompression unit 3 discharges the gas inside the molding module 1 through the upper fixed platen 27, the gas flow path 28a, the open / close switching valve 5, the gas flow path 30a, the flow rate large / small switching valve 4 and the gas flow path 31a. As a result, the pressure inside the molding module 1 can be reduced. The flow rate large / small switching valve 4 is capable of adjusting the gas discharge amount when the pressure inside the molding module 1 is reduced by the pressure reducing unit 3. As the decompression unit 3, for example, a vacuum pump or the like can be used. When the resin sealing device has only one molding module 1, the open / close switching valve 5 may not be used.

  The degree-of-vacuum control unit 8 includes a flow rate large / small switching valve 4, a degree-of-vacuum control valve (proportional solenoid valve) 6, a controller (proportional solenoid valve controller) 7, a degree-of-vacuum control unit 9, and sensor signal switching. Unit (vacuum gauge switching unit) 15.

  The degree-of-vacuum control valve 6 is connected to the gas flow path 30 a inside the pipe 30 between the large / small flow rate switching valve 4 and the open / close switching valve 5 via the gas flow path 33 a of the pipe 33. . Further, the other end of the gas flow path 32 a is connected to the vacuum degree control valve 6 so that a gas such as air can be introduced from one end of the gas flow path 32 a inside the pipe 32. The gas introduced from one end of the gas flow path 32a includes the gas flow path 32a, the vacuum degree control valve 6, the gas flow path 33a, the gas flow path 30a, the open / close switching valve 5, the gas flow path 28a, and the upper fixing plate 27. Through, it can be introduced into the molding module 1.

  In the resin sealing device of the first embodiment, the degree of vacuum inside the molding module 1 is measured by the vacuum gauge 2, and the signal 13 indicating the current measured value of the degree of vacuum inside the molding module 1 is a sensor signal switching unit 15. Is always transmitted to the control unit 9 for the degree of vacuum. The sensor signal switching unit 15 can switch the vacuum gauge 2 by receiving the switching signal 14 from the vacuum degree control unit 9 when there are a plurality of vacuum gauges 2 as described later, for example.

  The degree-of-vacuum control unit 9 is a signal for switching the flow rate of the gas discharged from the gas passage 30a through the gas passage 31a between large and small based on the received signal 13 indicating the current measurement value of the degree of vacuum. 10 is transmitted to the flow rate large / small switching valve 4. As a result, the large / small flow rate switching valve 4 roughly adjusts the amount of gas discharged from the gas flow path 30a to the gas flow path 31a to be either large or small.

  The control unit 9 for the degree of vacuum transmits a signal 11 indicating the target value of the degree of vacuum inside the molding module 1 to the controller 7, while based on the received signal 13 indicating the measured value of the current degree of vacuum. A signal 12 indicating the measured value of the degree of vacuum is constantly transmitted to the controller 7. The controller 7 adjusts the degree of vacuum control valve 6 based on the difference between the target value of the degree of vacuum inside the molding module 1 and the received measurement value of the degree of vacuum inside the current molding module 1, The amount of gas introduced into the gas flow path 33a from 32a is finely adjusted.

  As described above, in the resin sealing device of the first embodiment, the rough adjustment of the gas discharge amount by the flow rate large / small switching valve 4 and the fine adjustment of the gas introduction amount by the vacuum degree control valve 6 are combined. As a result, the overshoot amount of the pressure reduction with respect to the target value of the pressure at the start of pressure reduction inside the molding module 1 can be reduced. The switching timing of the flow rate large / small switching valve 4 is, for example, an overshoot amount of pressure reduction with respect to a target value of the pressure inside the molding module 1 and a time (speed) to reach the target value of the pressure inside the molding module 1. Can be decided accordingly.

  FIG. 2 shows the pressure (degree of vacuum) [Torr] inside the molding module 1 with respect to the elapsed time [seconds] from the start of pressure reduction when the pressure inside the molding module 1 is reduced using the resin sealing device of the reference example. An example of the change is shown. Here, the resin sealing device of the reference example does not perform fine adjustment of the gas introduction amount by the vacuum degree control valve 6, except that the gas discharge amount by the flow rate large / small switching valve 4 is only the large flow rate. The pressure inside the molding module 1 is reduced under the same conditions and the same method as in the resin sealing device of the first embodiment. The change in the pressure inside the molding module 1 of the reference example is shown in comparison with the target value of the pressure inside the molding module 1.

  As shown in FIG. 2, in the case of the reference example, the gas discharge amount increases, and the pressure inside the molding module 1 may drop at a stroke (the introduction of air cannot catch up). At this time, when a target value close to the atmospheric pressure side is set, the pressure inside the molding module 1 may overshoot and cannot be controlled. That is, a range in which control is impossible is possible in consideration of the pump capacity (gas discharge amount) and the amount that can be introduced into the atmosphere. This means that it cannot be controlled unless the internal pressure of the molding module 1 becomes a predetermined pressure or lower.

  When the gas discharge amount by the large / small flow rate switching valve is set to a small flow rate, the control of the pressure inside the molding module 1 is performed even when a target value close to the atmospheric pressure is set because the gas discharge amount is small. Is possible. However, since the gas discharge amount is small, when a target value close to the vacuum side is set, reaching the target value may be delayed.

  Therefore, the internal pressure of the molding module 1 can be controlled even when the target value is close to the atmospheric pressure side by switching between the large flow rate and the small flow rate of the gas discharge amount by using the flow rate large / small switching valve 4. In addition, even if the target value is close to the vacuum side, delay in reaching the target value of the pressure inside the molding module 1 can be suppressed. For example, the flow rate of the large / small flow rate switching valve 4 may be small until a predetermined pressure, and the large flow rate may be used by switching the large / small flow rate switching valve 4 when the flow rate becomes equal to or lower than the predetermined pressure. The switching timing or the like of the flow rate large / small switching valve 4 may be determined in advance through experiments or the like. In order to suppress the foaming of the resin even when the gas discharge amount is reduced by the flow rate large / small switching valve 4, the vacuum degree control valve 6 is adjusted and introduced into the gas flow path 30a when the decompression speed is high. The rate of decompression can be suppressed by increasing the amount of gas introduced. In addition, when the rate of pressure reduction is too small to suppress the foaming of the resin when the gas discharge amount is reduced by the flow rate large / small switching valve 4, the flow rate large / small switching valve 4 is switched to the large flow rate. By adjusting the degree of vacuum control valve 6, the amount of gas introduced into the gas flow path 30 a can be increased to such an extent that the foaming of the resin can be suppressed, and the pressure reduction rate can be suppressed. Further, the foaming of the resin can be suppressed by adjusting only the vacuum degree control valve 6 with the gas discharge amount kept large by the flow large / small switching valve 4 from the start of the decompression to the end of the decompression. The amount of gas introduced into the gas flow path 30a may be gradually changed from large to small.

  In addition, as shown in FIG. 3, in the resin sealing device of the first embodiment, since the amount of overshoot of decompression can be reduced, it is stepped for each target value of vacuum degree (750 Torr, 600 Torr, 450 Torr, 300 Torr, and 150 Torr). Pressure reduction can be easily performed. On the other hand, in the resin sealing apparatus of the reference example having a large pressure overshoot amount, it is difficult to perform stepwise pressure reduction for each target value of the degree of vacuum as in the resin sealing apparatus of the first embodiment.

  Hereinafter, an example of the resin sealing method of the first embodiment using the resin sealing device of the first embodiment will be described with reference to schematic cross-sectional views of FIGS. 4 to 13. First, as shown in FIG. 4, the mold surface of the upper mold 26 fixed to the upper fixed platen 27 and the mold surface of the lower mold 25 fixed to the movable platen 24 are installed so as to face each other. In addition, a gas flow path 41 that connects the inside of the molding module 1 and the gas flow path 28a of the pipe 28 shown in FIG.

  An upper-type outside air blocking member 43a and a lower-type outside air blocking member 43b are disposed on the periphery of each of the upper fixed plate 27 and the movable plate 24 via an O-ring 42. The O-ring 42 is also arranged between the upper mold outside air blocking member 43a on the upper fixed platen 27 side and the lower mold outside air blocking member 43b on the movable platen 24 side.

  The lower mold 25 includes a bottom member 46, a side member 44 that surrounds the bottom member 46, and an elastic member 47 that is disposed between the side member 44 and the movable platen 24. The lower mold 25 has a cavity 45 in a space surrounded by the side member 44 above the bottom member 46. The cavity 45 is used for holding a resin material.

  Next, as shown in FIG. 5, a substrate 55, which is a plate-like member on which an electronic component 54 electrically connected by a wire 53 is mounted, is supplied to and held on the mold surface of the upper mold 26, and A resin material 52 (granular resin in the first embodiment) is supplied and held in the cavity 45 of the mold 25 through the release film 51.

  Examples of the plate member include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor wafer, and a lead frame.

  The resin material 52 is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. Examples of the form of the resin supplied to the resin sealing device of Embodiment 1 include a granular resin, a liquid resin, a sheet-like resin, a tablet-like resin, and a powder-like resin.

  Next, as shown in FIG. 6, a molten resin (flowable resin) 61 is produced by heating and melting the resin material 52.

  Next, as shown in FIG. 7, the movable platen 24 is moved upward to bring the lower mold 25 and the upper mold 26 closer. As a result, the upper outside air blocking member 43a on the upper fixed platen 27 side and the lower outside air blocking member 43b on the movable platen 24 side are in close contact with each other via the O-ring 42 therebetween, thereby blocking outside air.

  Next, as shown in FIG. 8, the gas inside the molding module 1 is discharged through the gas flow path 41, and the inside of the molding module 1 is decompressed. At this time, the molten resin 61 is foamed to become the foamed resin 71. The reason why the molten resin 61 foams when the pressure inside the molding module 1 is reduced is as follows: (i) gas entrained when the resin material 52 melts, (ii) moisture contained in the molten resin 61, and (iii) melting A volatile component contained in the resin 61 can be considered.

  Here, in the resin sealing device of the first embodiment, by combining the rough adjustment of the gas discharge amount by the flow rate large / small switching valve 4 and the fine adjustment of the gas introduction amount by the vacuum degree control valve 6. The inside of the molding module 1 can be gently depressurized. Thereby, since the amount of overshoot of the decompression at the start of decompression inside the molding module 1 can be reduced as compared with the conventional (reference example), for example, rapid expansion of the foamed resin 61 is suppressed as shown in FIG. be able to. Therefore, the occurrence of problems such as wire flow and resin leakage due to excessive foaming of the molten resin 61 can be reduced.

  Moreover, in the resin sealing apparatus of Embodiment 1, since the pressure inside the molding module 1 can be sufficiently reduced, voids, chips, etc. are added to the cured resin 62 that seals the electronic component 54 in the process described later. Occurrence of unfilled can also be suppressed.

  Note that the internal pressure of the molding module 1 by the resin sealing device of Embodiment 1 is reduced gradually in a stepwise manner as shown in FIG. It is also possible to reach the target value. Also in this case, it is possible to suppress rapid expansion of the foamed resin 61.

  Moreover, the pressure reduction inside the molding module 1 by the resin sealing device of Embodiment 1 increases the degree of vacuum at the initial stage of pressure reduction (lowers the pressure inside the molding module 1), and then once lowers the degree of vacuum ( After the pressure inside the molding module 1 is increased), the degree of vacuum can be increased again. By doing in this way, the molten resin 61 can be foamed at the initial stage of pressure reduction, and then the foam of the foamed resin 71 can be crushed by a low degree of vacuum, and the pressure inside the molding module 1 can be lowered to the target value again. .

  Further, as shown in FIG. 10, the movable platen 24 is moved further upward to bring the lower die 25 and the upper die 26 closer to each other, and the side member 44 is pressed against the substrate 55 via the release film 51. By doing, the resin leak at the time of raising the vacuum degree inside the shaping | molding module 1 can further be suppressed. Even in this state, it is possible to depressurize the cavity by providing an air vent on the upper surface of the side member 44.

  Next, as shown in FIG. 11, the lower mold 25 and the upper mold 26 are clamped. Clamping of the lower mold 25 and the upper mold 26 can be performed, for example, by moving the movable platen 24 further upward until the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Here, the pressure inside the molding module 1 may be maintained by closing the open / close switching valve 5 after a predetermined time has elapsed since the electronic component 54 was immersed in the molten resin 61.

  Next, the molten resin 61 is cured in a state where the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Thus, as shown in FIG. 12, the electronic component 54 on the substrate 55 is resin-sealed with the cured resin 62 to produce a resin molded product. In the first embodiment, the resin molded product includes a substrate 55 and an electronic component 54 that is resin-sealed with a cured resin 62 on the substrate 55.

  Next, as shown in FIG. 13, the movable film 24 is moved downward to separate the lower mold 25 from the upper mold 26, thereby separating the release film 51 from the cured resin 62. Thereafter, the resin molded product can be obtained by removing the resin molded product from the upper mold 26.

  The resin sealing method of Embodiment 1 is not specifically limited to the above-mentioned method, For example, the process may contain other processes other than the process (compression molding process) of compressing a resin material by the compression molding method. It does not have to be. Although the other steps are not particularly limited, for example, it may be a cutting step in which an intermediate product manufactured by the compression molding step is cut to separate a final compression molded product. More specifically, for example, an intermediate product is produced by compression molding (resin sealing) a plurality of chips arranged on one substrate by compression molding, and further, the intermediate product is cut by the above-described cutting process, Individual chips may be separated into compression molded products (finished products) sealed with resin. Moreover, the resin sealing method of Embodiment 1 can be used also for methods other than compression molding methods, such as a transfer molding method, for example.

  In the first embodiment, the case where the resin sealing device includes one vacuum gauge 2 has been described. For example, as illustrated in FIG. 14, the resin sealing device is a vacuum near atmospheric pressure as the vacuum gauge 2. Two vacuum gauges, a total gauge 2a and a high vacuum degree vacuum gauge 2b, may be provided. In this case, the pressure inside the molding module 1 can be measured more accurately according to the situation. A vacuum gauge 2 a near atmospheric pressure is connected to a gas flow path 82 a of a pipe 82 connected to a gas flow path 28 of a pipe 28 between the open / close switching valve 5 and the upper fixed platen 27. The high vacuum degree vacuum gauge 2 b is connected to a gas flow path 81 a of a pipe 81 connected to a gas flow path 28 of a pipe 28 between the open / close switching valve 5 and the upper fixed platen 27. An example of a vacuum gauge near atmospheric pressure is a diaphragm vacuum gauge, and an example of a high vacuum degree vacuum gauge is a Pirani vacuum gauge.

  In the first embodiment, for example, a PLC (programmable logic controller), a microcomputer, or a personal computer can be used as the degree of vacuum control unit 9.

  In the first embodiment, the case where the proportional solenoid valve is used as the vacuum degree control valve 6 has been described. However, as the vacuum degree control valve 6, an electropneumatic regulator or the like may be used instead of the proportional solenoid valve. The controller 7 is not particularly limited as long as it can control the vacuum control valve 6 based on the signal 12 indicating the current measurement value of the vacuum received from the vacuum control unit 9. .

  In the first embodiment, the case where the pressure (vacuum degree) inside the plurality of molding modules 1 is controlled by one vacuum degree control unit 8 and one decompression unit 3 has been described. Is not limited, and there may be one molding module 1. The molding module 1 can be increased or decreased. In the case of controlling the pressure inside the plurality of molding modules 1, for example, the pressure inside the molding module 1 is reduced for about 30 seconds to maintain the pressure (open / close switching valve of the reduced molding module 1). Then, the inside of another molding module 1 can be depressurized (the open / close switching valve 5 of another molding module 1 can be “opened”). That is, it is possible to control only the time required to control the pressure (vacuum degree) inside one molding module 1 and immediately control the pressure (vacuum degree) inside another molding module 1. become. Therefore, the internal pressure (vacuum degree) of the plurality of molding modules 1 can be efficiently controlled by one vacuum degree control unit 8 and one decompression unit 3.

[Embodiment 2]
In FIG. 15, the typical block diagram of the resin sealing apparatus of Embodiment 2 is shown. In the resin sealing device of the second embodiment, the other end of the gas flow path 32 a inside the pipe 32 connected to the vacuum degree control valve 6 is connected to the gas flow path 31 a of the pipe 31 connected to the decompression unit 3. In addition, an open / close switching valve 5 is used in place of the large / small flow rate switching valve 4.

  In the resin sealing device of the second embodiment, whether or not the vacuum degree control unit 9 discharges from the gas flow path 30a through the gas flow path 31a based on the received signal 13 indicating the current measurement value of the vacuum degree. Based on this determination, a signal 16 is transmitted to the open / close switching valve 5 to determine whether the open / close switching valve 5 opens or closes the open / close switching valve. Thereby, the rough adjustment of the gas discharge amount by the open / close switching valve 5 and the fine adjustment of the gas discharge amount by the vacuum degree control valve 6 are combined (for example, “open” the open / close switching valve to a predetermined pressure). When the pressure is equal to or lower than the predetermined pressure, the inside of the molding module 1 is decompressed by setting “closed” and starting the adjustment by the vacuum degree control valve. As in the case of the resin sealing device 1, the inside of the molding module 1 can be gently depressurized as compared with the conventional one. For example, at the start of decompression, the open / close switching valve 5 on the molding module 1 side is set to “open”, and the open / close switching valve 5 of the vacuum control unit 8 is set to “closed” to suppress resin foaming. When the pressure reduction rate is too low, the vacuum control valve 6 is adjusted to increase the gas discharge amount to the gas flow path 30a to the extent that the resin foaming can be suppressed, thereby increasing the pressure reduction rate. After that, it is possible to control to open / close the switching valve 5 of the vacuum degree control unit 8.

  Therefore, also in the resin sealing device of the second embodiment, the inside of the molding module 1 can be sufficiently depressurized while reducing the amount of overshoot of the depressurization with respect to the target value of the pressure at the start of the decompression inside the molding module 1. Therefore, similarly to the resin sealing device of the first embodiment, the occurrence of defects such as wire flow and resin leakage due to excessive foaming of the resin can be reduced, and the electronic component of the resin molded product is sealed. It is also possible to suppress occurrence of unfilling such as voids and chips in the cured resin.

  Since the description other than the above in the second embodiment is the same as that in the first embodiment, the description thereof will not be repeated here.

  Although the embodiment and the modification have been described as described above, it is also planned from the beginning to appropriately combine the configurations of the above-described embodiment and the modification.

  It should be thought that embodiment and the modification which were disclosed this time are an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1 Molding module, 2 vacuum gauge, 2a vacuum gauge near atmospheric pressure, 2b vacuum gauge for high vacuum, 3 pressure reducing unit, 4 flow high / small switching valve, 5 open / close switching valve, 6 vacuum control valve, 7 Controller, 8 Vacuum degree control unit, 9 Vacuum degree control unit, 10 Signal for switching the gas flow rate to large or small, 11 Signal indicating the target value of vacuum degree, 12, 13 Current vacuum degree measurement Signal indicating value, 14 switching signal, 15 sensor signal switching unit, 21 lower fixed platen, 22 movable unit, 23 mold clamping mechanism, 24 movable platen, 25 lower die, 26 upper die, 27 upper fixed platen, 28, 30, 31, 32, 33, 81, 82 Piping, 28a, 30a, 31a, 32a, 33a, 81a, 82a Gas flow path, 29 post, 42 O-ring, 43a Upper mold outside air blocking member, 4 b Lower mold outside air blocking member, 44 Side member, 45 Cavity, 46 Bottom member, 47 Elastic member, 51 Release film, 52 Resin material, 53 Wire, 54 Electronic component, 55 Substrate, 61 Molten resin, 62 Cured resin, 71 Foam resin.

Claims (16)

A molding module;
A degree-of-vacuum control unit for controlling the degree of vacuum inside the molding module;
A decompression unit for decompressing the interior of the molding module;
A vacuum gauge for measuring the degree of vacuum inside the molding module,
The vacuum degree control unit includes a vacuum degree control valve for adjusting a gas discharge amount inside the molding module, and a switching valve for adjusting a gas discharge amount inside the molding module by the decompression unit. And a vacuum degree control unit for adjusting the vacuum degree control valve according to the degree of vacuum inside the molding module measured by the vacuum gauge,
A second gas flow path connected to the vacuum control valve between the forming module and the switching valve of the first gas flow path connecting the molding module and the pressure reducing unit via the switching valve. The resin sealing device to which is connected.   The second switching valve for adjusting an amount of gas in and out of the molding module in the first gas channel between the molding module and the second gas channel is further provided. 1. The resin sealing device according to 1.   3. The resin sealing device according to claim 1, wherein an introduction amount of a gas introduced from the second gas flow path into the first gas flow path is adjusted by the vacuum degree control valve.   The resin sealing device according to claim 1 or 2, wherein a discharge amount of gas discharged from the first gas flow path to the second gas flow path is adjusted by the vacuum degree control valve. The molding module includes a first mold, a second mold opposite to the first mold, a movement in a direction in which the first mold is relatively approached from the second mold, and a movement in a direction in which the first mold is separated. With a movable unit that enables,
The first mold includes a cavity for holding a resin material,
The said 2nd type | mold is a resin sealing apparatus of any one of Claims 1-4 which can hold | maintain the plate-shaped member with which the electronic component was mounted | worn. The movable unit includes a movable plate for fixing the first mold, a mold clamping mechanism for moving the movable plate, and a first fixed plate for fixing the mold clamping mechanism.
The molding module further includes a second fixing plate for fixing the second mold, and the second fixing plate connects the first gas flow path and the inside of the molding module. With a gas flow path inside,
The vacuum gauge includes a first vacuum gauge and a second vacuum gauge having a measurement range of a degree of vacuum different from that of the first vacuum gauge, and the first vacuum gauge includes a fourth gas flow path. The second gas gauge is connected to the first gas flow path via a fifth gas flow path, and is connected to the first gas flow path via the first gas flow path. The resin sealing apparatus of description.   The resin sealing according to any one of claims 1 to 6, wherein the vacuum degree inside the plurality of molding modules is controlled by one vacuum degree control unit and one pressure reduction unit. apparatus. Supplying a plate-like member on which electronic components are mounted to the mold surface of the second mold opposite to the mold surface of the first mold inside the molding module;
Supplying a resin material to the cavity of the first mold;
Heating the resin material;
Bringing the first mold and the second mold close to each other;
Depressurizing the interior of the molding module;
Clamping the first mold and the second mold;
Including the step of resin-sealing the electronic component with a cured resin obtained by curing the resin material after heating after the step of clamping the first mold and the second mold,
The depressurizing step adjusts the amount of gas discharged through the first gas flow path connecting the molding module and the decompression unit via a switching valve by the switching valve; and The vacuum control valve adjusts the amount of gas that enters and exits through the second gas flow channel connected to the vacuum control valve from the first gas flow channel to the switching valve. A resin molding method including a process.   The step of reducing the pressure is discharged through the first gas flow path by a second switching valve provided in the first gas flow path between the molding module and the second gas flow path. The resin molding method according to claim 8, further comprising a step of adjusting a gas discharge amount.   The resin molding method according to claim 8 or 9, wherein, in the step of reducing the pressure, the pressure inside the molding module is decreased stepwise.   The amount of gas introduced from the second gas flow path to the first gas flow path is adjusted by the vacuum degree control valve, according to any one of claims 8 to 10. Resin molding method.   11. The discharge amount of gas discharged from the first gas flow path to the second gas flow path is adjusted by the vacuum degree control valve, according to claim 8. Resin molding method. The resin sealing step includes a step of producing a resin molded product,
The resin molding method according to claim 8, wherein the resin molding method further includes a step of taking out the resin molded product. The molding module includes a first mold, a second mold opposed to the first mold, a second fixing plate for fixing the second mold, and the first mold relative to the second mold. A movable unit that enables movement in a direction in which the two are relatively approaching and movement in a direction in which they are leaving,
The first mold includes a cavity for holding a resin material,
The second mold can hold a plate-like member on which an electronic component is mounted,
The second stationary platen includes a third gas flow path that connects the first gas flow path and the inside of the molding module,
The movable unit includes a movable plate for fixing the first mold, a mold clamping mechanism for moving the movable plate, and a first fixed plate for fixing the mold clamping mechanism.
A vacuum gauge is connected to the first gas flow path between the molding module and the second gas flow path;
The vacuum gauge includes a first vacuum gauge and a second vacuum gauge having a measurement range of a degree of vacuum different from that of the first vacuum gauge, and the first vacuum gauge includes the first gas flow rate. The second vacuum gauge is connected via the first gas flow path and the fifth gas flow path, and the second vacuum gauge is connected via the fourth gas flow path. The resin molding method according to claim 13.   The resin molding method according to any one of claims 8 to 14, wherein the degree of vacuum inside the plurality of molding modules is controlled by one vacuum degree control unit and one decompression unit.   The manufacturing method of a resin molded product which manufactures a resin molded product with the resin molding method of any one of Claims 8-15.

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