KR20180102494A - Resin sealing apparatus, resin molding method and manufacturing method of resin molded article - Google Patents

Abstract

The present invention relates to a resin sealing apparatus, a resin molding method, and a method for producing a resin molded article. The resin sealing apparatus enables decompression in a molding module by preventing molding incompatibility such as wire deformation, resin leakage, and unfilled state. To this end, the resin sealing apparatus includes a molding module (1), a vacuum degree control unit (9), a decompression unit (3), and a vacuum gauge (2). The vacuum degree control unit (9) comprises a vacuum degree control valve (6), switching valves (4, 5), and a vacuum degree control part (9). A second gas flow path (33a) connected to the vacuum degree control valve (6) is coupled between the switching valves (4, 5) and the molding module (1) of a first gas flow path (30a) connecting the decompression unit (3) and the molding module (1) by means of the switching valves (4, 5).

Description

Technical Field [0001] The present invention relates to a resin sealing apparatus, a resin molding method, and a method of manufacturing a resin molded article,

The present invention relates to a resin sealing apparatus, a resin molding method, and a method of manufacturing a resin molded article.

Japanese Unexamined Patent Application Publication No. 2008-143186 (Patent Document 1) discloses a resin encapsulating device for injecting resin into a cavity formed between vertically opposed molds and sealing and molding the enclosed space. In the sealed enclosure including the final cavity space, And a pressure regulating means capable of regulating and regulating the pressure in the closed space through an air flow passage connectable from the pressure regulating means.

Japanese Patent Application Laid-Open No. 2008-143186

However, in the resin sealing apparatus disclosed in Patent Document 1, when the pressure in the closed space is reduced by the pressure adjusting means, the resin is excessively foamed, and the resin deforms due to contact of the foamed resin with the wire mounted on the substrate . In addition, the foamed resin may ride on the substrate and cause leakage of resin from the edge type.

On the other hand, when the pressure in the sealed space is high, voids and voids may occur in the sealing resin.

According to the embodiment disclosed herein, there is provided a molding apparatus including a molding module, a control unit for controlling the degree of vacuum of the inside of the molding module, a decompression unit for decompressing the inside of the molding module, A control unit for controlling the degree of vacuum includes a vacuum degree control valve for controlling the amount of gas exhausted from the inside of the molding module, a switching valve for controlling the discharge amount of gas inside the molding module by the pressure reducing unit, And a control unit for controlling the vacuum degree control valve in accordance with the degree of vacuum inside the molding module. The degree of vacuum between the molding module and the switching valve of the first gas passage, which connects the molding module and the decompression unit, And a second gas passage connected to the control valve is connected to the second gas passage.

According to the embodiment disclosed herein, there is provided a method of manufacturing a semiconductor device, comprising the steps of: supplying a plate-like member having an electronic component mounted thereon to a mold surface of a second type opposite to the mold surface of the first mold inside the molding module; A step of heating the resin material, a step of approaching the first and second molds, a step of reducing the pressure inside the molding module, a step of closing the first and second molds, And a step of sealing the electronic component with a cured resin after the step of closing the first and second molds by curing the resin material after heating, wherein the step of reducing the pressure includes connecting the molding module and the decompression unit And a second gas flow path connected to the vacuum degree control valve from the first gas flow path between the molding module and the switching valve is provided in the first gas flow path, And controlling a vacuum degree control valve to adjust an inlet / outlet amount of a gas passing through and entering / exiting the apparatus.

According to the embodiments disclosed herein, it is possible to provide a method of manufacturing a resin molded article in which a resin molded article is produced by the above resin molding method.

According to the embodiments disclosed herein, it is possible to provide a resin sealing apparatus, a resin molding method, and a method of manufacturing a resin molded article, which can suppress molding incompatibility such as wire deformation, resin leakage,

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic structural view of a resin encapsulation device according to Embodiment 1. Fig.
2 is a graph showing changes in the internal pressure (vacuum degree) [Torr] of the molding module with respect to the elapsed time [second] from the start of decompression when the internal pressure of the molding module is reduced using the resin sealing device of the reference example Fig.
Fig. 3 is a graph showing the relationship between the pressure inside the molding module (the degree of vacuum (degree of vacuum), the degree of vacuum, and the like) with respect to the elapsed time [second] from the start of decompression when the pressure inside the molding module is reduced by using the resin- ) [Torr] according to another embodiment of the present invention.
4 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
5 is a schematic cross-sectional view illustrating a part of a process of an example of the resin sealing method of Embodiment 1. Fig.
6 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
7 is a schematic cross-sectional view illustrating a part of a process of an example of the resin sealing method of Embodiment 1. Fig.
8 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
9 is a schematic cross-sectional view illustrating a part of a process of an example of the resin encapsulation method of Embodiment 1. Fig.
10 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
11 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
12 is a schematic cross-sectional view illustrating a part of a process of an example of the resin encapsulation method of Embodiment 1. Fig.
13 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of Embodiment 1. Fig.
Fig. 14 is a schematic structural view of a modified example of the molding module according to the first embodiment; Fig.
Fig. 15 is a schematic structural view of a resin encapsulation device according to Embodiment 2. Fig.

Hereinafter, an embodiment will be described. In the drawings used in the description of the embodiments, the same reference numerals denote the same or substantially equivalent parts.

[Embodiment 1]

Fig. 1 shows a schematic constitution diagram of a resin encapsulation device of Embodiment 1. Fig. The resin sealing apparatus of Embodiment 1 includes a plurality of molding modules 1, one decompression unit 3 for decompressing the inside of the molding module 1, And a control unit 8 of one degree of vacuum.

The molding module 1 includes a lower mold 25, an upper mold 26 opposed to the lower mold 25, an upper fixing bar 27 for fixing the upper mold 26, and a lower mold 25 A lower fixing plate 21 for fixing the closing mechanism 23 and a lower fixing plate 21 for fixing the upper fixing plate 27 and the lower fixing plate 23, And a post (29) provided between the stage (21).

The movable unit 22 is constituted by the lower fixing plate 21, the closing mechanism 23 and the movable plate 24. The closing mechanism 23 allows the movable plate 24 to move up and down in accordance with the direction in which the posts 29 extend from the lower fixed plate 21 to the upper fixed plate 27. Thereby, the movable unit 22 can move relative to the upper mold 26 in the direction in which the lower mold 25 relatively moves relative to the upper mold 26 and in the direction in which the lower mold 25 relatively approaches the upper mold 26, (Movement in the direction in which the arm 25 relatively falls). Instead of the post 29, the upper fixing plate 27 (side surface) and the lower fixing plate 21 (side surface) may be connected by a wall-shaped block.

The resin sealing apparatus further comprises a vacuum system 2 for measuring the degree of vacuum inside the molding module 1 and an opening / closing switching valve 5 for controlling the amount of gas exhausted into the molding module 1 Respectively. The opening / closing switch valve 5 is connected to one end of the gas flow path 28a inside the pipe 28 communicable with the inside of the molding module 1 through the upper fixing plate 27. [ The other end of the gas passage 28a inside the pipe 28 is connected to the gas passage 30a inside the pipe 30 through the opening / closing switching valve 5. [ The vacuum gauge 2 is connected to the gas flow path 28a inside the piping 28 between the opening / closing switching valve 5 and the upper fixing plate 27.

The decompression unit 3 is connected to one end of the gas passage 31a inside the pipe 31. The other end of the gas passage 31a is connected to the pipe 30 by using the flow volume / And is connected to the gas flow path 30a inside. The decompression unit 3 is provided with an upper fixing plate 27, a gas passage 28a, an opening / closing switching valve 5, a gas passage 30a, a flow rate switching valve 4 and a gas passage 31a It is possible to reduce the pressure inside the molding module 1 by discharging the gas inside the molding module 1. [ The flow rate change-over valve 4 is capable of adjusting the discharge amount of the gas when the internal pressure of the molding module 1 is reduced by the pressure reducing unit 3. As the decompression unit 3, for example, a vacuum pump or the like can be used. Further, when the resin-sealing apparatus has only one molding module 1, the opening / closing switching valve 5 may not be used.

The control unit 8 of the degree of vacuum has a flow rate switching valve 4, a vacuum level control valve (proportional solenoid valve) 6, a controller (proportional solenoid valve controller) 7, a vacuum degree control unit 9, And a sensor signal switching unit (switching unit for a vacuum system) 15.

The degree of vacuum control valve 6 is connected to the gas flow path inside the pipe 30 between the flow rate large / small switching valve 4 and the opening / closing switching valve 5 through the gas flow path 33a of the pipe 33 30a. The other end of the gas passage 32a is connected to the vacuum degree control valve 6 so that gas such as air can be introduced from one end of the gas passage 32a inside the pipe 32. [ The gas introduced from one end of the gas passage 32a flows through the gas passage 32a, the degree of vacuum control valve 6, the gas passage 33a, the gas passage 30a, the opening / closing switching valve 5, And the upper fixing plate 27 so as to be introduced into the molding module 1.

The degree of vacuum inside the molding module 1 is measured by the vacuum system 2 and the signal 13 indicating the measured value of the current degree of vacuum in the molding module 1 is converted into the sensor signal Is always transmitted to the control unit 9 of the degree of vacuum through the control unit (15). The sensor signal switching section 15 receives the switching signal 14 from the control section 9 of the degree of vacuum when a plurality of vacuum gauges 2 exist as described later, You can switch.

The control unit 9 of the degree of vacuum controls the degree of vacuum to change the flow rate of the gas discharged from the gas flow path 30a through the gas flow path 31a to a large or small amount based on the received signal 13 indicating the measured value of the degree of vacuum And transmits the signal 10 to the flow rate change-over valve 4. Thus, the flow rate switching valve 4 roughly adjusts the discharge amount of the gas discharged from the gas flow path 30a to the gas flow path 31a to be either large or small.

The control unit 9 of the vacuum degree transmits to the controller 7 a signal 11 indicating a target value of the degree of vacuum of the inside of the molding module 1 and outputs a signal 13 indicating the measured value of the current degree of vacuum , And always transmits to the controller 7 a signal 12 indicating the measured value of the current degree of vacuum. The controller 7 adjusts the degree of vacuum control valve 6 based on the difference between the target value of the degree of vacuum inside the forming module 1 and the measured value of the degree of vacuum inside the current forming module 1 received, The amount of gas introduced from the flow path 32a into the gas flow path 33a is finely adjusted.

As described above, in the resin-sealing apparatus of Embodiment 1, by roughly adjusting the amount of gas discharged by the flow rate switching valve 4 and combining the amount of introduction of the gas by the degree of vacuum control valve 6 in fine adjustment , It is possible to reduce the overshoot amount of the reduced pressure with respect to the target value of the pressure at the start of the depressurization inside the molding module 1. [ The switching timing of the flow rate / change-over valve 4 is controlled, for example, by the amount of overshoot of the reduced pressure with respect to the target value of the pressure inside the molding module 1 and the target value of the pressure inside the molding module 1 (Speed) at which it can be determined.

2 shows the pressure (degree of vacuum) of the molding module 1 with respect to the elapsed time [second] from the start of decompression when the pressure inside the molding module 1 is reduced by using the resin sealing device of the reference example, [Torr]. ≪ / RTI > Here, in the resin sealing apparatus of the reference example, the amount of gas introduced by the degree of vacuum control valve 6 is not finely adjusted, and the amount of gas discharged by the flow rate / The pressure inside the molding module 1 is reduced under the same conditions and in the same manner as in the resin-sealing apparatus of Mode 1. The change in the pressure inside the molding module 1 in the reference example is in contrast to the target value of the pressure inside the molding module 1. [

As shown in Fig. 2, in the case of the reference example, there is a case where the gas discharge amount becomes large, and the pressure inside the molding module 1 is instantaneously lowered (the introduction of the atmosphere does not follow). At this time, when the target value close to the atmospheric pressure side is set, the pressure inside the molding module 1 may overshoot and can not be controlled. That is, there arises a range in which control can not be performed due to a balance between the pump capability (gas discharge amount) and the amount of air introduction. This means that the inside of the forming module 1 can not be controlled unless the pressure becomes lower than a predetermined pressure.

In the case where the amount of gas discharged by the flow rate switching valve is a flow rate portion, the pressure inside the molding module 1 can be controlled even when the target value close to the atmospheric pressure side is set because the gas discharge amount is small. However, since the gas discharge amount is small, when the target value close to the vacuum side is set, the reaching of the target value may be delayed.

Therefore, by switching the flow rate of the gas discharge amount and the flow rate of the gas discharge amount by the flow rate change-over valve 4, it becomes possible to control the pressure inside the molding module 1 even if the target value close to the atmospheric pressure side is used, It is possible to suppress the delay in reaching the target value of the pressure inside the molding module 1 even if the target value is close to the vacuum side. For example, when the flow rate of the flow rate change-over valve 4 is reduced to a predetermined pressure and the pressure becomes equal to or lower than the predetermined pressure, the flow rate changeover valve 4 may be switched to use the flow rate range . The switching timing of the flow rate / change-over valve 4 and the like may be determined in advance by experiments or the like. In order to suppress the foaming of the resin even when the discharge amount of the gas is set to the flow rate by the flow rate switching valve 4, the degree of vacuum is controlled so as to control the degree of vacuum control valve 6 to control the gas introduced into the gas flow path 30a The rate of the depressurization can be suppressed. In order to suppress the foaming of the resin when the discharge amount of the gas is set to the flow rate by the flow rate change-over valve 4, the flow rate change-over valve 4 is switched to the flow rate The vacuum degree control valve 6 can be adjusted together to increase the amount of gas introduced into the gas passage 30a so as to suppress the foaming of the resin, thereby suppressing the rate of the depressurization. Further, only the degree of vacuum control valve 6 can be controlled with the amount of gas exhausted by the flow rate large / small switching valve 4 from the start of decompression to the end of decompression, thereby suppressing the foaming of the resin The amount of the gas introduced into the gas passage 30a may be gradually changed from the front to the front.

3, since the amount of overshoot of the reduced pressure can be reduced in the resin sealing apparatus of the first embodiment, it is possible to easily reduce the pressure stepwise for each of the desired values of vacuum degree (750 Torr, 600 Torr, 450 Torr, 300 Torr and 150 Torr) . On the other hand, in the resin sealing apparatus of the reference example in which the overshoot amount of the reduced pressure is large, it is difficult to perform the stepwise depressurization for each target value of the vacuum degree as in the resin sealing apparatus of the first embodiment.

Hereinafter, an example of the resin sealing method of the first embodiment using the resin sealing apparatus of the first embodiment will be described with reference to schematic cross-sectional views of Figs. 4 to 13. Fig. First, as shown in Fig. 4, the mold surface of the upper mold 26 fixed to the upper fixing plate 27 and the mold surface of the lower mold 25 fixed to the movable mold 24 are opposed to each other. A gas flow path 41 for connecting the inside of the molding module 1 and the gas flow path 28a of the pipe 28 shown in Fig. 1 is provided in the upper fixing plate 27. [

Shaped outer air shielding member 43a and a lower outer air shielding member 43b are disposed on the periphery of each of the upper fixing plate 27 and the movable plate 24 through an O-ring 42. [ The O-ring 42 is disposed between the upper-type outer-air shielding member 43a on the upper fixing plate 27 side and the lower-type outer-air shielding member 43b on the movable plate 24 side.

The lower mold 25 includes a bottom member 46, a side member 44 surrounding the periphery of the bottom member 46 and an elastic member 47 disposed between the side member 44 and the movable base 24 . The lower mold 25 has a cavity 45 in a space surrounded by the side member 44 above the bottom member 46. [ The cavity 45 is used to hold the resin material.

Next, as shown in Fig. 5, a substrate 55, which is a plate-like member on which an electronic component 54 electrically connected by a wire 53 is mounted, is fed and held on the mold surface of the upper mold 26 The resin material 52 (granular resin in Embodiment Mode 1) is supplied to the cavity 45 of the lower mold 25 via the release film 51 and held.

The plate-shaped member may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor wafer, or a lead frame.

The resin material 52 is not particularly limited and may be thermosetting resin such as epoxy resin or silicone resin, or thermoplastic resin. Further, a composite material containing a thermosetting resin or a thermoplastic resin as a part may be used. Examples of the form of the resin to be supplied to the resin-sealing apparatus of Embodiment 1 include granular resins, liquid resins, sheet-like resins, tablet-like resins, and powdered resins.

Next, as shown in Fig. 6, the molten resin (fluid resin) 61 is produced by heating and melting the resin material 52. As shown in Fig.

Next, as shown in Fig. 7, the movable die 24 is moved upward to bring the lower die 25 and the upper die 26 close to each other. Thereby, the upper-type outer airblock member 43a on the side of the upper fixing plate 27 and the lower-type outer-airblock member 43b on the side of the movable base 24 come in close contact with each other through the O- do.

Next, as shown in Fig. 8, the gas inside the molding module 1 is discharged through the gas passage 41, and the inside of the molding module 1 is decompressed. At this time, the molten resin 61 is foamed to become the foaming resin 71. The reasons that the molten resin 61 is foamed when the inside of the molding module 1 is decompressed include (i) the gas entrained when the resin material 52 is melted, (ii) the moisture contained in the molten resin 61, and (Iii) volatile components contained in the molten resin 61 are considered.

Here, in the resin-sealing apparatus of Embodiment 1, by roughly adjusting the discharge amount of the gas by the flow rate switching valve 4 and combining the amount of introduction of the gas by the vacuum degree control valve 6 in fine adjustment, The inside of the molding module 1 can be relieved gently. 9, since the amount of overshoot of the reduced pressure at the start of decompression in the molding module 1 can be made smaller than that in the conventional example (reference example), for example, So that rapid expansion can be suppressed. Therefore, it is possible to reduce occurrence of non-conformity such as wire deformation and resin leakage due to the inclusion of the molten resin 61 too much.

In addition, in the resin-sealing apparatus of Embodiment 1, since the pressure inside the molding module 1 can be sufficiently reduced, voids and voids (not shown) are adhered to the cured resin 62 in which the electronic component 54 is sealed in a step It is possible to suppress the occurrence of uncharged charges.

3, the internal pressure of the molding module 1 is gradually reduced stepwise by the resin sealing device of the first embodiment, The target value of the degree of vacuum may be reached. Even in this case, it is possible to suppress the rapid expansion of the foamed resin 61.

Further, the decompression of the inside of the molding module 1 by the resin sealing apparatus of the first embodiment is performed by increasing the degree of vacuum (lowering the pressure inside the molding module 1) at the initial stage of the depressurization, (The pressure inside the molding module 1 is increased), and then the degree of vacuum can be increased again. By doing so, the molten resin 61 is foamed at the initial stage of the depressurization, and then the foam of the foamed resin 71 is smoothened by the low degree of vacuum, and the pressure inside the molding module 1 is again lowered to the target value can do.

10, the movable mold 24 is further moved upward so that the lower mold 25 and the upper mold 26 are further brought closer to each other so that the side member 44 is moved to the substrate 55 are pressed tightly, it is possible to further suppress the resin leakage when the degree of vacuum inside the molding module 1 is increased. Further, even in this state, it is possible to reduce the pressure in the cavity by providing an air vent on the upper surface of the side member 44.

Next, as shown in Fig. 11, the lower mold 25 and the upper mold 26 are closed. Closing of the lower mold 25 and the upper mold 26 can be achieved by moving the movable mold 24 further upward, for example, until the electronic component 54 on the substrate 55 is immersed in the molten resin 61 . Here, after the predetermined time has elapsed after the electronic component 54 is immersed in the molten resin 61, the inside / closing valve 5 is closed to maintain the pressure inside the molding module 1 It is also good.

Next, the molten resin 61 is cured in a state in which the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Thus, as shown in Fig. 12, the electronic part 54 on the substrate 55 is resin-sealed with the cured resin 62 to produce a resin molded article. In the first embodiment, the resin molded article includes a substrate 55 and an electronic component 54 resin-sealed with a cured resin 62 on the substrate 55.

Next, as shown in Fig. 13, the movable mold 24 is moved downward and the lower mold 25 is separated from the upper mold 26 to separate the release film 51 from the cured resin 62 Leave. Thereafter, the resin molded product is separated from the upper mold 26, whereby a resin molded product can be obtained.

The resin encapsulation method of Embodiment 1 is not particularly limited by the above-described method. For example, the resin encapsulation method of Embodiment 1 may or may not include a step other than the step of compressing the resin material (compression molding step) good. The other process is not particularly limited, but may be, for example, a cutting process in which an intermediate product produced by a compression molding process is cut to separate a compression molded product of the finished product. More specifically, for example, an intermediate product in which a plurality of chips arranged on one substrate are compression-molded (resin-sealed) by compression molding is produced, and the intermediate product is cut by the above- The individual chips may be separated into a resin-sealed compression molded product (finished product). The resin sealing method of Embodiment 1 can also be used for a method other than a compression molding method such as a transfer molding method.

In the first embodiment, the case where the resin sealing apparatus is provided with one vacuum system 2 has been described. For example, as shown in Fig. 14, the resin sealing apparatus is a vacuum system 2, , And a vacuum system 2b for high vacuum degassing. In this case, it becomes possible to measure the pressure inside the molding module 1 more accurately in response to the situation. The vacuum system 2a near the atmospheric pressure is connected to the gas passage 82a of the pipe 82 connected to the gas passage 28 of the pipe 28 between the opening / closing switching valve 5 and the upper fixing bar 27, . The vacuum gauge 2b for high vacuum degassing is connected to the gas passage 81a of the pipe 81 connected to the gas passage 28 of the pipe 28 between the open / close switching valve 5 and the upper fixing bar 27 . Examples of the vacuum system near the atmospheric pressure include a diaphragm vacuum system, and examples of the vacuum system for high vacuum degassing include a Piranha vacuum system and the like.

In Embodiment 1, for example, a PLC (programmable logic controller), a microcomputer, a personal computer, or the like can be used as the degree of vacuum controller 9.

In the first embodiment, the proportional solenoid valve is used as the vacuum degree control valve 6. However, as the vacuum degree control valve 6, an electropneumatic regulator or the like may be used in place of the proportional solenoid valve. The controller 7 is not particularly limited as long as it can control the degree of vacuum control valve 6 based on the signal 12 indicating the measured value of the degree of vacuum received from the control unit 9 of the degree of vacuum.

Although the first embodiment has been described with respect to the case where the pressure (degree of vacuum) of the plurality of molding modules 1 is controlled by the control unit 8 of one degree of vacuum and one pressure reducing unit 3, ) Is not limited, and one molding module 1 may be used. The molding module 1 can be increased or decreased. In order to control the pressure inside the molding modules 1, for example, the inside of one molding module 1 is depressurized for about 30 seconds to maintain the pressure The open / close switching valve 5 of the other molding module 1 is set to "open", the inside of the other molding module 1 is depressurized ). That is, it is possible to control only the time required to control the pressure (vacuum degree) inside the molding module 1, and to immediately control the pressure (vacuum degree) inside the other molding module 1. Therefore, the pressure (degree of vacuum) inside the plurality of molding modules 1 can be efficiently controlled by the control unit 8 of one degree of vacuum and one depressurization unit 3.

[Embodiment 2]

Fig. 15 shows a schematic configuration diagram of the resin encapsulation device of the second embodiment. The resin sealing apparatus of the second embodiment is configured such that the other end of the gas flow path 32a inside the piping 32 connected to the vacuum level control valve 6 is connected to the gas flow path 31a of the piping 31 connected to the decompression unit 3 And the open / close switching valve 5 is used in place of the flow rate / small switching valve 4.

In the resin sealing apparatus according to the second embodiment, the degree of vacuum control unit 9 determines whether or not the vacuum degree control unit 9 determines whether or not the vacuum degree control unit 9 determines that the vacuum degree control unit 9 determines, based on the received signal 13 indicating the measured degree of vacuum, And the signal 16 is transmitted to the open / close switching valve 5 based on the determination, and whether or not the open / close changeover valve 5 makes the open / close changeover valve "open" or "close" . As a result, it is possible to adjust the discharge amount of the gas by the opening / closing switch valve 5 and the discharge amount of the gas by the vacuum degree control valve 6 in combination (for example, The valve is set to " open ", and when the pressure is lower than the predetermined pressure, the valve is set to " closed ", and the adjustment by the vacuum degree control valve is started). In this case, It is possible to gently depressurize the interior of the molding module 1 as in the conventional resin sealing apparatus of the first embodiment. For example, at the start of the depressurization, the open / close switching valve 5 on the molding module 1 side is set to "open" and the open / close changeover valve 5 of the vacuum degree control unit 8 is set to " When the decompression speed is too low to suppress the foaming of the resin, the degree of vacuum control valve 6 is adjusted to increase the amount of gas discharged into the gas passage 30a so as to suppress foaming of the resin, And the open / close switching valve 5 of the control unit 8 of the degree of vacuum can be controlled to be " open ".

Therefore, even in the resin sealing apparatus of the second embodiment, the inside of the molding module 1 can be sufficiently reduced while reducing the overshoot amount of the reduced pressure with respect to the target value of the pressure at the start of the decompression in the molding module 1 , It is possible to reduce the occurrence of wire deformation due to excessive resin inclusion of the resin and the incidence of inadequacy such as resin leakage as in the case of the resin encapsulation apparatus of Embodiment 1, It is possible to suppress the occurrence of uncharged parts such as shorting.

Since the other descriptions in the second embodiment are the same as those in the first embodiment, the description thereof will not be repeated here.

Although the embodiments and the modifications have been described as above, it is also originally planned to appropriately combine the configurations of the embodiment and the modification described above.

While the embodiments of the present invention have been described, it should be understood that the embodiments disclosed herein are illustrative and non-restrictive in all respects. It is intended that the scope of the invention be indicated by the appended claims and that all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.

1: Molding module 2: Vacuum gauge
2a: Vacuum system near atmospheric pressure 2b: Vacuum system for high vacuum degree
3: Decompression unit 4: Flow rate changeover valve
5: Open / close switching valve 6: Vacuum degree control valve
7: Controller 8: Control unit of vacuum degree
9: Control of vacuum degree
10: Signal for switching the flow rate of the gas to large or small
11: Signal indicating the target value of vacuum degree
12, 13: signal indicating the measured value of the present degree of vacuum
14: Switching signal 15: Sensor signal switching section
21: lower fixing plate 22: movable unit
23: closing mechanism 24:
25: lower mold 26: upper mold
27: upper fixing plate 28, 30, 31, 32, 33, 81, 82: piping
28a, 30a, 31a, 32a, 33a, 81a, 82a:
29: post 42: O-ring
43a: upper-surface type outdoor unit shutoff member 43b: lower-
44: side member 45: cavity
46: bottom member 47: elastic member
51: release film 52: resin material
53: wire 54: electronic part
55: substrate 61: molten resin
62: hardened resin 71: foamed resin

Claims (17)

A molding module,
A vacuum degree control unit for controlling the degree of vacuum inside the molding module,
A decompression unit for decompressing the interior of the molding module,
And a vacuum system for measuring the degree of vacuum inside the molding module,
The control unit of the degree of vacuum includes a vacuum degree control valve for controlling the amount of gas exhausted from the molding module, a switching valve for controlling the amount of gas exhausted from the molding module by the pressure reducing unit, And a control unit for controlling the degree of vacuum to adjust the degree of vacuum control valve in response to a degree of vacuum inside the forming module,
And a second gas flow path connected to the vacuum degree control valve is connected between the forming module and the switching valve in a first gas flow path connecting the forming module and the pressure reducing unit through the switching valve . The method according to claim 1,
Further comprising a second switching valve for controlling an amount of gas exhausted from the inside of the molding module into the first gas flow path between the molding module and the second gas flow path. The method according to claim 1,
Wherein an amount of introduction of the gas introduced into the first gas flow path from the second gas flow path is regulated by the vacuum degree control valve. The method according to claim 1,
Wherein the degree of vacuum discharge control of the gas discharged from the first gas passage to the second gas passage is controlled by the vacuum degree control valve. The method according to claim 1,
Wherein the molding module includes a first mold, a second mold opposite to the first mold, and a second mold capable of moving in a direction in which the first mold relatively approaches and moving in a falling direction with respect to the second mold, Unit,
Wherein the first mold has a cavity for holding a resin material,
And the second mold is capable of holding a plate-like member on which the electronic component is mounted. 6. The method of claim 5,
The movable unit includes a movable plate for fixing the first die, a closing mechanism for moving the movable plate, and a first fixed plate for fixing the closing mechanism,
Wherein the molding module further includes a second fixed bar for fixing the second mold, and the second fixed bar has a third gas channel connecting the first gas channel and the interior of the molding module Respectively,
Wherein the vacuum system includes a first vacuum system and a second vacuum system having a different degree of vacuum measurement for the first vacuum system, and the first vacuum system is connected to the first gas system through the fourth gas system, And said second vacuum system is connected to said first gas flow path through a fifth gas flow path. 7. The method according to any one of claims 1 to 6,
Wherein the degree of vacuum of the inside of the plurality of molding modules is controlled by one control unit of the degree of vacuum and one of the decompression units. A step of supplying a plate-like member on which electronic parts are mounted to a mold surface of a second type facing the mold surfaces of the first mold inside the molding module,
A step of supplying a resin material to the cavity of the first type;
A step of heating the resin material;
A step of approaching the first mold and the second mold,
A step of reducing the pressure inside the molding module,
Closing the first mold and the second mold;
And a step of resin-sealing the electronic component with a cured resin obtained by curing the resin material after heating after the step of closing the first mold and the second mold,
Wherein the pressure reducing step includes controlling the amount of discharge of the gas discharged through the first gas passage connecting the molding module and the decompression unit through the switch valve by the switch valve, And controlling, by the vacuum degree control valve, an inlet / outlet amount of gas passing through the second gas flow path connected to the vacuum level control valve from the first gas flow path of the first gas flow path. 9. The method of claim 8,
Wherein the step of reducing the pressure comprises regulating the amount of gas discharged through the first gas flow path by the second switching valve provided in the first gas flow path between the molding module and the second gas flow path ≪ / RTI > 9. The method of claim 8,
Wherein the pressure inside the molding module is gradually reduced in the step of reducing the pressure. 9. The method of claim 8,
The resin molding method according to claim 8, wherein the amount of introduction of the gas introduced into the first gas flow path from the second gas flow path is controlled by the vacuum degree control valve. 9. The method of claim 8,
Wherein the degree of vacuum discharge control of the gas discharged from the first gas flow path to the second gas flow path is controlled by the vacuum degree control valve. 9. The method of claim 8,
Wherein the resin sealing step includes a step of manufacturing a resin molded article,
Wherein the resin molding method further comprises a step of taking out the resin molded article. 9. The method of claim 8,
Wherein the molding module comprises a first type, a second type opposite to the first type, a second type for fixing the second type, and a second type for fixing the first type relative to the second type And a movable unit capable of moving in a direction to move and a direction to move in a falling direction,
Wherein the first mold has a cavity for holding a resin material,
The second mold is capable of holding a plate-like member on which an electronic component is mounted,
Wherein the second fixed plate has a third gas flow path connecting the first gas flow path and the inside of the molding module,
The movable unit includes a movable plate for fixing the first die, a closing mechanism for moving the movable plate, and a first fixed plate for fixing the closing mechanism,
A vacuum system is connected to the first gas passage between the molding module and the second gas passage,
Wherein the vacuum system comprises a first vacuum system and a second vacuum system having a different degree of vacuum measurement for the first vacuum system, wherein the first vacuum system is connected to the first gas channel through a fourth gas channel And the second vacuum system is connected to the first gas flow path through a fifth gas flow path. 15. The method according to any one of claims 8 to 14,
Wherein the degree of vacuum of the inside of the plurality of molding modules is controlled by a control unit of one degree of vacuum and one decompression unit. A method for producing a resin molded article, characterized by producing a resin molded article by the resin molding method according to any one of claims 8 to 14. A method for producing a resin molded article characterized by producing a resin molded article by the resin molding method according to claim 15.

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