KR102232403B1 - Resin sealing apparatus, resin molding method and manufacturing method of resin molded article - Google Patents

Abstract

The present invention makes it possible to depressurize the inside of the molding module by suppressing molding improper, such as wire deformation, resin leakage, and non-filling .
The resin sealing device includes a molding module 1, a vacuum degree control unit 8, a decompression unit 3, and a vacuum system 2. The control unit 8 of the degree of vacuum includes a degree of vacuum control valve 6, the switching valves 4 and 5, and the control unit 9 of the degree of vacuum. Control of the degree of vacuum between the forming module 1 and the switching valves 4 and 5 of the first gas flow path 30a connecting the forming module 1 and the decompression unit 3 through the switching valves 4 and 5 A second gas flow path 33a connected to the valve 6 is connected.

Description

A resin sealing device, a resin molding method, and a manufacturing method of a resin molded article TECHNICAL FIELD [RESIN SEALING APPARATUS, RESIN MOLDING METHOD AND MANUFACTURING METHOD OF RESIN MOLDED ARTICLE}

The present invention relates to a resin sealing device, a resin molding method, and a method for producing a resin molded article.

Japanese Unexamined Patent Application Publication No. 2008-143186 (Patent Document 1) discloses a resin sealing device in which resin is injected into the cavity formed between the upper and lower molds, and is sealed and molded. A resin sealing device including a pressure adjusting means capable of depressurizing and adjusting the pressure in the closed space through an air flow passage that can be connected from is disclosed.

Japanese Patent Laid-Open Publication No. 2008-143186

However, in the resin sealing device described in Patent Document 1, when the pressure in the enclosed space is reduced by the pressure adjusting means, the resin is too foamed and the foamed resin contacts the wire mounted on the substrate, causing wire deformation, etc. There is this. In addition, the foamed resin travels through the substrate, causing resin leakage from the rim shape.

On the other hand, when the pressure in the enclosed space is high, voids and insufficient filling may occur in the encapsulating resin.

According to the embodiment disclosed herein, a molding module, a vacuum degree control unit for controlling the vacuum degree inside the molding module, a decompression unit for depressurizing the inside of the molding module, and a vacuum meter for measuring the vacuum degree inside the molding module The vacuum degree control unit includes: a vacuum degree control valve for adjusting the discharge amount of gas inside the molding module, a first switching valve for adjusting the discharge amount of gas inside the molding module by the decompression unit, and a vacuum gauge The molding module of the first gas flow path and the first gas flow path connecting the molding module and the decompression unit through the first switching valve and having a control unit of the degree of vacuum to adjust the vacuum degree control valve in response to the internal vacuum degree of the molding module measured by It is possible to provide a resin sealing device in which a second gas flow path connected to a vacuum degree control valve is connected between the switching valve of 1 and the valve.

According to the embodiment disclosed herein, a step of supplying a plate-shaped member having an electronic component mounted thereon to a mold surface of a second mold facing each other to a mold surface of a first mold inside the molding module, and a resin material to the cavity of the first mold. A process of supplying a resin material, a process of heating the resin material, a process of approaching the first and second types, a process of decompressing the interior of the molding module, and a process of closing the first and second types, After the process of closing the 1st and 2nd types, the electronic component is resin-sealed with a cured resin curing the resin material after heating, and the step of reducing pressure is reduced to the molding module and the pressure reduction through the first switching valve. The discharge amount of gas discharged through the first gas flow path connecting the unit is controlled by the first switching valve, and the vacuum degree control valve from the first gas flow path between the forming module and the first switching valve is controlled. It is possible to provide a resin molding method including a step of adjusting the amount of the gas in and out through the connected second gas flow path by means of a vacuum degree control valve.

According to the embodiment disclosed herein, it is possible to provide a method of manufacturing a resin molded article for manufacturing a resin molded article by the above resin molding method.

According to the embodiment disclosed herein, it is possible to provide a resin encapsulation device, a resin molding method, and a method of manufacturing a resin molded article capable of reducing pressure inside a molding module by suppressing molding unsuitability such as wire deformation, resin leakage, and non-filling.

The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention, which is understood in connection with the accompanying drawings.

1 is a schematic configuration diagram of a resin sealing device according to a first embodiment.
Fig. 2 shows a limit of changes in the pressure (vacuum degree) [Torr] of the molding module with respect to the elapsed time [seconds] from the start of depressurization when the pressure inside the molding module is reduced by using the resin sealing device of the reference example. A drawing showing an example.
3 shows the pressure inside the molding module (vacuum diagram) versus the elapsed time [seconds] from the start of depressurization when reducing the pressure inside the molding module using the resin sealing device of Embodiment 1 and the resin sealing device of a reference example. ) A diagram showing another example of a change in [Torr].
4 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
5 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
6 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
7 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
8 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
9 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method according to the first embodiment.
10 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
11 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
12 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
13 is a schematic cross-sectional view illustrating a part of a step of an example of the resin sealing method of the first embodiment.
14 is a schematic configuration diagram of a modification example of the molding module according to the first embodiment.
15 is a schematic configuration diagram of a resin sealing device according to a second embodiment.

Hereinafter, an embodiment will be described. In addition, in the drawings used for description of the embodiment, the same reference numerals denote the same or corresponding parts.

[Embodiment 1]

1 shows a schematic configuration diagram of a resin sealing device according to a first embodiment. The resin sealing device of Embodiment 1 includes a plurality of molding modules 1, one decompression unit 3 for depressurizing the inside of the molding module 1, and for controlling the degree of vacuum inside the molding module 1 It is equipped with a control unit 8 of one degree of vacuum.

The molding module (1) is to fix the lower mold (25), the upper mold (26) facing each other to the lower mold (25), the upper fixing plate (27) for fixing the upper mold (26), and the lower mold (25). The movable panel 24, the closing mechanism 23 capable of moving the movable panel 24, the lower fixing panel 21 for fixing the closing mechanism 23, the upper fixing panel 27 and the lower fixing It is provided with a post (29) provided between the half (21).

The movable unit 22 is constituted by the lower fixed board 21, the closing mechanism 23, and the movable board 24. The closing mechanism 23 makes the movable plate 24 free to move in the vertical direction according to the direction in which the post 29 extends from the lower fixed plate 21 to the upper fixed plate 27. Thereby, the movable unit 22 is moved relative to the upper mold 26 with respect to the lower mold 25 (movement in the direction in which the lower mold 25 is relatively approaching with respect to the upper mold 26, and the lower mold with respect to the upper mold 26). (25) makes it possible to move in a relatively falling direction). Further, instead of the post 29, the upper fixing plate 27 (the side surface) and the lower fixing plate 21 (the side surface) may be connected by a wall-shaped block.

The resin sealing device also includes a vacuum gauge 2 for measuring the degree of vacuum inside the molding module 1, and an open/close switching valve 5 for adjusting the amount of gas in and out of the molding module 1 I have it. The opening/closing switching valve 5 is connected to one end of a gas flow path 28a inside a pipe 28 that is capable of communicating with the inside of the molding module 1 through an upper fixing plate 27. The other end of the gas flow path 28a inside the pipe 28 is connected to the gas flow path 30a inside the pipe 30 through an open/close switching valve 5. The vacuum system 2 is connected to the gas flow path 28a inside the pipe 28 between the opening/closing switching valve 5 and the upper fixing plate 27.

The pressure reducing unit 3 is connected to one end of the gas flow path 31a inside the pipe 31, and the other end of the gas flow path 31a uses the flow rate large/small switching valve 4, and the pipe 30 It is connected to the gas flow path 30a inside of. The pressure reducing unit 3 includes an upper fixed panel 27, a gas flow path 28a, an open/close switching valve 5, a gas flow path 30a, a large/small flow rate switching valve 4, and a gas flow path 31a. By passing through and discharging the gas inside the molding module 1, it is possible to reduce the pressure inside the molding module 1. The flow rate large/small switching valve 4 is capable of adjusting the amount of gas discharged when the pressure inside the molding module 1 is reduced by the pressure reducing unit 3. As the depressurization unit 3, for example, a vacuum pump or the like can be used. In addition, when the resin sealing device has only one molding module 1, it is not necessary to use the open/close switching valve 5.

The vacuum degree control unit 8 includes a flow rate large/small switching valve 4, a vacuum degree control valve (proportional solenoid valve) 6, a controller (proportional solenoid valve controller) 7, and a vacuum degree control unit 9 Wow, a sensor signal switching unit (a vacuum system switching unit) 15 is provided.

The vacuum degree control valve 6 is a gas flow path inside the pipe 30 between the flow large/small switching valve 4 and the open/close switching valve 5 through the gas flow path 33a of the pipe 33. 30a). Further, the other end of the gas flow path 32a is connected to the vacuum degree control valve 6 so that gas such as air can be introduced from one end of the gas flow path 32a inside the pipe 32. The gas introduced from one end of the gas flow path 32a is a gas flow path 32a, a vacuum degree control valve 6, a gas flow path 33a, a gas flow path 30a, an open/close switching valve 5, and a gas flow path 28a. ) And the upper fixing plate 27, and can be introduced into the molding module 1.

In the resin sealing device of the first embodiment, the degree of vacuum inside the molding module 1 is measured by the vacuum gauge 2, and the signal 13 indicating the measured value of the current degree of vacuum inside the molding module 1 is switched to the sensor signal. It is always transmitted to the control unit 9 of the degree of vacuum through the unit 15. In addition, the sensor signal switching unit 15 receives the switching signal 14 from the control unit 9 of the degree of vacuum when a plurality of vacuum gauges 2 are present, for example, as described later, so that the vacuum gauge 2 is You can switch.

The control unit 9 of the degree of vacuum is for converting the flow rate of the gas discharged from the gas flow path 30a through the gas flow path 31a to large or small, based on the received signal 13 indicating the measured value of the current vacuum level. The signal 10 is transmitted to the flow rate large/small switching valve 4. Thereby, the flow rate large/small switching valve 4 approximately adjusts so that the discharge amount of the gas discharged from the gas passage 30a to the gas passage 31a becomes either large or small.

The control unit 9 of the degree of vacuum transmits a signal 11 indicating the target value of the degree of vacuum inside the shaping module 1 to the controller 7, while based on the received signal 13 indicating the measured value of the current degree of vacuum. Thus, the signal 12 indicating the current measured value of the vacuum degree is always transmitted to the controller 7. The controller 7 adjusts the vacuum degree control valve 6 based on the difference between the target value of the vacuum degree inside the molding module 1 and the measured value of the current vacuum degree inside the molding module 1 received. The amount of gas introduced into the gas flow path 33a from the flow path 32a is finely adjusted.

As described above, in the resin sealing device of the first embodiment, by combining the approximate control of the amount of gas discharged by the flow rate large/small switching valve 4 and the fine adjustment of the amount of gas introduced by the vacuum degree control valve 6, , It is possible to reduce the amount of overshoot of the decompression relative to the target value of the pressure at the start of decompression inside the molding module 1. The switching timing of the flow rate large/small switching valve 4 reaches, for example, the amount of overshoot of reduced pressure relative to the target value of the internal pressure of the molding module 1 and the target value of the internal pressure of the molding module 1. It can be determined according to the time (speed) to do.

In Fig. 2, the pressure inside the molding module 1 against the elapsed time [seconds] from the start of decompression when reducing the pressure inside the molding module 1 using the resin sealing device of the reference example (vacuum degree) An example of the change of [Torr] is shown. Here, the resin sealing device of the reference example does not finely control the amount of gas introduced by the vacuum degree control valve 6, except that the amount of gas discharged by the large/small switching valve 4 is set to Taiwan. The pressure inside the molding module 1 is reduced by the same conditions and the same method as in the resin sealing device of the first aspect. In addition, the change in the pressure inside the molding module 1 of the reference example is shown in contrast with the target value of the pressure inside the molding module 1.

As shown in Fig. 2, in the case of the reference example, the gas discharge rate increases, so that the pressure inside the molding module 1 decreases at once (air introduction cannot catch up) in some cases. At this time, when a target value close to the atmospheric pressure side is set, the pressure inside the molding module 1 may overshoot and control may not be possible. In other words, the balance between the pump capacity (gas discharge) and the amount that can be introduced into the atmosphere creates a range that cannot be controlled. This means that if the pressure inside the molding module 1 does not fall below a predetermined pressure, it cannot be controlled.

In the case where the amount of gas discharged by the large/small flow rate switching valve is used as the flow rate station, the gas discharge amount is small, and therefore even when a target value close to the atmospheric pressure side is set, the pressure inside the molding module 1 can be controlled. However, since the amount of gas discharged is small, when a target value close to the vacuum side is set, reaching the target value may be delayed.

Therefore, by switching the flow rate band and the flow rate of gas discharge by the flow rate large/small switching valve 4, it is possible to control the internal pressure of the molding module 1 even at a target value close to the atmospheric pressure side, Further, even if the target value is close to the vacuum side, the delay in reaching the target value of the pressure inside the molding module 1 can be suppressed. For example, the flow rate of the large/small flow rate switching valve 4 may be reduced up to a predetermined pressure, and when the pressure is lower than the predetermined pressure, the flow rate large/small switching valve 4 may be switched to use a flow rate band. . The timing of switching the flow rate large/small switching valve 4 may be determined in advance by experiment or the like. In order to suppress the foaming of resin even when the amount of gas discharged by the flow rate large/small switching valve 4 is used as the flow rate, the gas introduced into the gas flow path 30a by adjusting the vacuum level control valve 6 when the speed of depressurization is high. It is possible to suppress the rate of depressurization by increasing the amount of introduced. In addition, in order to suppress the foaming of resin when the gas discharged by the flow rate large/small switching valve 4 is used as a flow rate station, when the depressurization speed is too small, the flow rate large/small switching valve 4 is switched to the flow rate range. Together, the vacuum degree control valve 6 is adjusted to increase the amount of gas introduced into the gas flow path 30a so as to suppress the foaming of the resin, thereby suppressing the speed of depressurization. In addition, from the start of decompression to the end of the decompression, the expansion of the resin can be suppressed by adjusting only the vacuum level control valve 6 in a state where the amount of gas discharged by the large/small switching valve 4 remains large. The amount of gas introduced into the gas flow path 30a may be gradually changed from large to small.

In addition, as shown in Fig. 3, since the overshoot amount of reduced pressure can be reduced in the resin sealing device of the first embodiment, stepwise decompression can be easily performed for each target value (750 Torr, 600 Torr, 450 Torr, 300 Torr, and 150 Torr) of the vacuum degree. You can do it. On the other hand, in the resin sealing device of the reference example having a large amount of overshoot of reduced pressure, it is difficult to perform stepwise pressure reduction for each target value of the vacuum degree, as in the resin sealing device of the first embodiment.

Hereinafter, an example of the resin sealing method of the first embodiment using the resin sealing device of the first embodiment will be described with reference to schematic cross-sectional views of FIGS. 4 to 13. First, as shown in FIG. 4, the mold surface of the upper mold 26 fixed to the upper fixed plate 27 and the mold face of the lower mold 25 fixed to the movable plate 24 are provided so as to face each other. In addition, a gas flow path 41 connecting the inside of the molding module 1 and the gas flow path 28a of the pipe 28 shown in FIG. 1 is provided inside the upper fixing plate 27.

At the peripheries of each of the upper fixed panel 27 and the movable panel 24, an upper external air blocking member 43a and a lower external air blocking member 43b are disposed through an O-ring 42. The O-ring 42 is also configured to be disposed between the upper external air blocking member 43a on the upper fixed panel 27 side and the lower external air blocking member 43b on the movable panel 24 side.

The lower mold 25 includes a bottom member 46, a side member 44 surrounding the bottom member 46, and an elastic member 47 disposed between the side member 44 and the movable plate 24. ). The lower mold 25 has a cavity 45 in a space surrounded by a side member 44 above the bottom member 46. The cavity 45 is used to hold the resin material.

Next, as shown in Fig. 5, a plate-shaped member, a substrate 55, on which an electronic component 54 electrically connected by a wire 53 is mounted on the mold surface of the upper mold 26 is supplied and held. In addition, a resin material 52 (granular resin in the first embodiment) is supplied to the cavity 45 of the lower mold 25 through the release film 51 to be held.

Moreover, as a plate-shaped member, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor wafer, a lead frame, etc. are mentioned, for example.

The resin material 52 is not particularly limited, and for example, a thermosetting resin such as an epoxy resin or a silicone resin may be used, and a thermoplastic resin may be used. Further, a composite material containing a thermosetting resin or a thermoplastic resin in part may be used. Examples of the form of the resin supplied to the resin encapsulation device of the first embodiment include granular resin, liquid resin, sheet-shaped resin, tablet-shaped resin, or powdery resin.

Next, as shown in FIG. 6, the resin material 52 is heated and melted to produce a molten resin (fluid resin) 61.

Next, as shown in FIG. 7, the movable plate 24 is moved upward to bring the lower mold 25 and the upper mold 26 closer. Thereby, the upper external air blocking member 43a on the upper fixed panel 27 side and the lower external air blocking member 43b on the movable panel 24 side are in close contact with each other through the O-ring 42 therebetween, thereby blocking external air. do.

Next, as shown in FIG. 8, the gas inside the molding module 1 is discharged through the gas flow path 41, and the inside of the molding module 1 is depressurized. At this time, the molten resin 61 foams to form a foamed resin 71. The reasons why the molten resin 61 foams when the inside of the molding module 1 is depressurized are: (i) gas that is rolled up when the resin material 52 is melted, (ii) moisture contained in the molten resin 61, and (Iii) Volatile components etc. contained in the molten resin 61 are considered.

Here, in the resin sealing device of the first embodiment, by combining the approximate control of the amount of gas discharged by the flow rate large/small switching valve 4 and the fine adjustment of the amount of gas introduced by the vacuum degree control valve 6, The inside of the molding module 1 can be gently depressurized. As a result, since the overshoot amount of the decompression at the start of decompression inside the molding module 1 can be reduced compared to the conventional (reference example), for example, as shown in Fig. 9, the foamed resin 71 Sudden expansion can be suppressed. Therefore, it is possible to reduce the occurrence of nonconformities such as wire deformation and resin leakage due to excessive foaming of the molten resin 61.

In addition, in the resin sealing device according to the first embodiment, since the pressure inside the molding module 1 can be sufficiently reduced, the cured resin 62 sealing the electronic component 54 in the process described later may contain voids, insufficient, etc. It is also possible to suppress the occurrence of uncharged.

In addition, the pressure reduction inside the molding module 1 by the resin sealing device of the first embodiment gradually decreases the pressure inside the molding module 1 in stages, as shown in FIG. 3, for example, It can also be made to reach the target value of a typical vacuum degree. Even in this case, it becomes possible to suppress the rapid expansion of the foamed resin 71.

In addition, the pressure reduction inside the molding module 1 by the resin sealing device of the first embodiment increases the degree of vacuum (lower the pressure inside the molding module 1) in the initial stage of the depressurization, and then, once the degree of vacuum is increased. After lowering (higher pressure inside the molding module 1), the degree of vacuum may be increased again. By doing this, the molten resin 61 is foamed at the initial stage of decompression, and then the foam of the foamed resin 71 is crushed by a low degree of vacuum, and again, the pressure inside the molding module 1 is lowered to the target value. can do.

In addition, as shown in FIG. 10, the movable plate 24 is further moved upward to further bring the lower mold 25 and the upper mold 26 closer to each other, so that the side member 44 passes through the release film 51 to the substrate ( When 55) is pressed firmly, resin leakage can be further suppressed when the vacuum degree inside the molding module 1 is increased. In addition, even in this state, by providing an air vent on the upper surface of the side member 44, it is possible to decompress the inside of the cavity.

Next, as shown in FIG. 11, the lower mold 25 and the upper mold 26 are closed. Closing of the lower mold 25 and the upper mold 26 is performed by moving the movable panel 24 further upward until the electronic component 54 on the substrate 55 is immersed in the molten resin 61, for example. Can be done. Here, after a predetermined time has elapsed after the electronic component 54 is immersed in the molten resin 61, the open/close switching valve 5 is closed to maintain the pressure inside the molding module 1 Also good.

Next, the molten resin 61 is cured while the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Thereby, as shown in FIG. 12, the electronic component 54 on the board|substrate 55 is resin-sealed with the cured resin 62, and a resin molded article is produced. In the first embodiment, the resin molded article includes a substrate 55 and an electronic component 54 resin-sealed with a cured resin 62 on the substrate 55.

Next, as shown in FIG. 13, by moving the movable panel 24 downward and separating the lower mold 25 from the upper mold 26, the release film 51 is separated from the cured resin 62. Put it. After that, by separating the resin molded article from the upper mold 26, a resin molded article can be obtained.

The resin sealing method of Embodiment 1 is not particularly limited to the above-described method, for example, may or may not include other processes other than the process of compression molding a resin material by a compression molding method (compression molding process). good. The other steps are not particularly limited, but may be, for example, a cutting step in which the intermediate product manufactured by the compression molding step is cut to separate the compression molded product of the finished product. More specifically, for example, an intermediate product obtained by compression molding (resin sealing) a plurality of chips disposed on one substrate by compression molding is manufactured, and the intermediate product is cut by the above-described cutting process, Individual chips may be separated into resin-sealed compression molded products (finished products). Moreover, the resin sealing method of Embodiment 1 can also be used for methods other than compression molding methods, such as a transfer molding method.

In the first embodiment, the case where the resin sealing device is provided with one vacuum system 2 has been described. However, as shown in FIG. 14, for example, the resin sealing device is a vacuum system 2, which is a vacuum system 2a near atmospheric pressure. ) And a vacuum system 2b for high vacuum degree may be provided. In this case, it becomes possible to measure the pressure inside the molding module 1 more accurately according to the situation. The vacuum gauge 2a near atmospheric pressure is the gas flow path 82a of the pipe 82 connected to the gas flow path 28a of the pipe 28 between the open/close switching valve 5 and the upper fixing plate 27 Is connected with. The vacuum gauge (2b) for high vacuum degree is connected to the gas flow path (81a) of the pipe (81) connected to the gas flow path (28a) of the pipe (28) between the open/close switching valve (5) and the upper fixing panel (27). Has been. Examples of the vacuum system near atmospheric pressure include a diaphragm vacuum system, and examples of the vacuum system for high vacuum degree include a Pirani vacuum system.

In the first embodiment, as the vacuum degree control unit 9, for example, a PLC (programmable logic controller), a microcomputer, a personal computer, or the like can be used.

In the first embodiment, a case where a proportional solenoid valve is used as the degree of vacuum control valve 6 has been described, but as the vacuum degree control valve 6, an electric power regulator or the like may be used instead of the proportional solenoid valve. In addition, the controller 7 is not particularly limited as long as it can control the vacuum degree control valve 6 based on the signal 12 that represents the current measured value of the vacuum degree received from the control unit 9 of the degree of vacuum.

In the first embodiment, a case of controlling the internal pressures (vacuum degrees) of the plurality of molding modules 1 with one control unit 8 of the degree of vacuum and one decompression unit 3 has been described, but the molding module 1 The number of) is not limited, and the molding module 1 may be one. It is possible to increase or decrease the molding module (1). In addition, in the case of controlling the internal pressure of the plurality of molding modules 1, for example, the inside of one molding module 1 is depressurized for about 30 seconds to maintain the pressure (decompressed molding module 1). The opening/closing switching valve 5 is set to "closed"), after that, the inside of the other forming module 1 is depressurized (the opening/closing switching valve 5 of the other forming module 1 is "opened". It can be). That is, it is possible to control only the time required to control the internal pressure (vacuum degree) of one molding module 1, and immediately control the internal pressure (vacuum degree) of the other molding module 1. Therefore, the pressure (vacuum degree) inside the plurality of molding modules 1 can be efficiently controlled with one control unit 8 of the degree of vacuum and one decompression unit 3.

[Embodiment 2]

15 shows a schematic configuration diagram of a resin sealing device according to the second embodiment. In the resin sealing device of the second embodiment, the other end of the gas flow path 32a inside the pipe 32 connected to the vacuum degree control valve 6 is connected to the gas flow path 31a of the pipe 31 connected to the pressure reducing unit 3 In addition, it has a feature in that the open/close switching valve 5 is used instead of the flow large/small switching valve 4.

In the resin sealing device of the second embodiment, whether the control unit 9 of the vacuum degree passes through the gas flow path 31a from the gas flow path 30a and discharges it based on the received signal 13 indicating the measured value of the current vacuum level. It determines whether or not, and transmits the signal 16 to the open/close selector valve 5 based on the determination, and determines whether the open/close selector valve 5 calls “open” or “closed” the open/close selector valve. Decide. Thereby, a combination of rough control of the amount of gas discharged by the open/close switching valve 5 and fine control of the amount of gas discharged by the vacuum degree control valve 6 (e.g., switching open/close to a predetermined pressure The valve is set to "open", and when the pressure falls below a predetermined pressure, it is set to "closed", and the vacuum level control valve starts adjustment) to depressurize the inside of the molding module 1, even in this case, Similar to the resin sealing device of the first embodiment, it becomes possible to gently depressurize the inside of the molding module 1 as compared with the conventional one. For example, at the start of depressurization, the opening/closing switching valve 5 on the molding module 1 side is set to “open”, and the opening/closing switching valve 5 of the vacuum degree control unit 8 is “closed”. In order to suppress the foaming of the resin, when the speed of depressurization is too small, the vacuum degree control valve 6 is adjusted to increase the amount of gas discharged to the gas flow path 30a to the extent that the foaming of the resin can be suppressed. After that, the open/close switching valve 5 of the control unit 8 of the degree of vacuum can be controlled to "open" after that.

Therefore, even in the resin sealing device of the second embodiment, the inside of the molding module 1 can be sufficiently depressurized while reducing the amount of overshoot of the decompression relative to the target value of the pressure at the start of the decompression inside the molding module 1. , Similar to the resin sealing device of the first embodiment, the occurrence of defects such as wire deformation and resin leakage due to excessive foaming of the resin can be reduced, and in the cured resin sealing the electronic component of the resin molded product, voids and It is also possible to suppress the occurrence of insufficient charge such as insufficient charge.

Since the description other than the above in Embodiment 2 is the same as in Embodiment 1, the description will not be repeated here.

As described above, the embodiments and modifications have been described, but it is also planned from the beginning to appropriately combine the configurations of the embodiments and modifications described above.

Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, and it is intended that the meanings equivalent to the claims and all modifications within the scope are included.

1: molding module 2: vacuum gauge
2a: vacuum gauge near atmospheric pressure 2b: vacuum gauge for high vacuum
3: pressure reducing unit 4: flow large/small switching valve
5: open/close switching valve 6: vacuum degree control valve
7: controller 8: control unit of the degree of vacuum
9: control of the degree of vacuum
10: Signal for converting the gas flow rate to large or small
11: Signal indicating the target value of the degree of vacuum
12, 13: Signal indicating the measured value of the current degree of vacuum
14: switching signal 15: sensor signal switching unit
21: lower fixed board 22: movable unit
23: closing mechanism 24: movable panel
25: lower type 26: upper type
27: upper fixed panel 28, 30, 31, 32, 33, 81, 82: piping
28a, 30a, 31a, 32a, 33a, 81a, 82a: gas flow path
29: post 42: O-ring
43a: upper external air blocking member 43b: lower external air blocking member
44: side member 45: cavity
46: bottom member 47: elastic member
51: release film 52: resin material
53: wire 54: electronic component
55: substrate 61: molten resin
62 cured resin 71 foamed resin

Claims (17)

Molding module,
A vacuum degree control unit for controlling the degree of vacuum inside the molding module,
A decompression unit for decompressing the inside of the molding module,
Equipped with a vacuum gauge for measuring the degree of vacuum inside the molding module,
The vacuum degree control unit includes a vacuum degree control valve for adjusting the discharge amount of gas inside the molding module, a first switching valve for adjusting the discharge amount of gas inside the molding module by the decompression unit, and the It has a vacuum degree control unit for adjusting the degree of vacuum control valve in response to the degree of vacuum inside the molding module measured by a vacuum meter,
A first gas flow path connecting the molding module and the decompression unit through the first switching valve, and the vacuum degree control valve from the molding module side than the first switching valve with respect to the first gas flow path. A second gas flow path to connect is installed,
A plurality of third gas flow paths are connected to the first gas flow path, and the shaping module is connected to each of the plurality of third gas flow paths,
Each of the plurality of third gas flow paths is provided with a second switching valve for adjusting the amount of gas in and out of the molding module,
The vacuum gauge is disposed on the side of the shaping module rather than the second switching valve in the plurality of third gas flow paths, corresponding to each of the plurality of shaping modules,
A resin sealing device, characterized in that one control unit of the degree of vacuum and one of the depressurization units control the degree of vacuum inside the plurality of molding modules. The method of claim 1,
The resin sealing device, wherein the amount of gas introduced into the first gas flow path from the second gas flow path is adjusted by the vacuum degree control valve. The method of claim 1,
The resin sealing device, characterized in that the amount of gas discharged from the first gas flow path to the second gas flow path is controlled by the vacuum degree control valve. The method of claim 1,
The molding module is movable to enable movement in a direction in which the first type is relatively approaching and in a direction away from the first type, the second type facing each other to the first type, and the second type. It has a unit and a post or a block,
The first type has a cavity for holding a resin material,
The second type is a resin sealing device, characterized in that it is possible to hold the plate-shaped member on which the electronic component is mounted. A step of supplying a plate-shaped member having an electronic component mounted thereon to a mold surface of a second mold that faces each other with a mold surface of the first mold inside the molding module, and
A step of supplying a resin material to the first type cavity, and
A step of heating the resin material, and
A step of approaching the first type and the second type, and
A step of depressurizing the inside of the molding module, and
A step of closing the first type and the second type, and
A step of resin-sealing the electronic component with a cured resin obtained by curing the resin material after heating after the step of closing the first mold and the second mold,
In the step of reducing the pressure, the discharge amount of the gas discharged through the first gas flow path connecting the molding module and the pressure reducing unit through the first switching valve is adjusted by the first switching valve, and the first switching valve A step of adjusting the amount of gas in and out of the gas flow in and out of the gas flow passage through a second gas flow passage connecting the vacuum degree control valve from the side of the forming module to the first switching valve with respect to the first switching valve, by the vacuum degree control valve; and ,
Through a third gas flow path connecting the first gas flow path and a plurality of the molding modules respectively, the inlet and discharge amount of the gas inside the molding module is controlled by a second switching valve, and the third gas flow path is controlled by a second switching valve. Including a step of measuring the degree of vacuum inside the molding module by a vacuum gauge disposed on the molding module side rather than the second switching valve in the gas flow path,
A resin molding method, characterized in that, in one vacuum degree control unit having the first switching valve and the vacuum degree control valve, and one of the depressurization units, the inner vacuum degree of the plurality of molding modules is controlled. The method of claim 5,
In the step of reducing the pressure, the pressure inside the molding module is gradually reduced. The method of claim 5,
The resin molding method, wherein the amount of gas introduced into the first gas flow path from the second gas flow path is adjusted by the vacuum degree control valve. The method of claim 5,
The resin molding method, characterized in that the amount of gas discharged from the first gas flow path to the second gas flow path is controlled by the vacuum degree control valve. A method for producing a resin molded article, comprising producing a resin molded article by the resin molding method according to any one of claims 5 to 8. delete delete delete delete delete delete delete delete

Images