JP2006295010A - Molding apparatus and molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing method for sealing a board having a plurality of semiconductor devices mounted thereon which method enables molding ensuring a given mold height and mold size even if a resin of a low viscosity is used, and reduces voids by applying pressure on a mold resin to offer a highly reliable semiconductor device. <P>SOLUTION: Heated upper and lower dies 1, 2 are provided. A board 10 having a semiconductor chip 8 mounted thereon is supplied to the lower die 2, and a plate 11 having a through-hole is overlaid on the lower die 2 and the board 10 to form a cavity 12. A trench 13 and a second through-hole 14 formed on the plate 11 form a spare cavity. Then, a mold resin 15 is supplied directly into the cavity 12, and the dies 1, 2 are completely closed after depressurizing the inside of the dies to fill the cavity 12 with the resin 15 while causing the excess sealing resin 15 to flow into the spare cavity. Subsequently, the bottom 5 of the spare cavity 12, which can be controlled by pressure, is raised to apply pressure to the resin 15 to mold it. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a molding method in which a substrate on which a semiconductor chip is mounted and a mold resin are pressed with upper and lower molds.

In recent years, with the downsizing and cost reduction of products centering on portable electronic devices, semiconductor devices are required to be thinner, smaller and lower in cost.
For this reason, many substrates in which a plurality of semiconductor chips are wire-bonded or flip-bonded in a matrix are collectively resin-molded, and the batch-molded product is divided into individual semiconductor devices to form a single semiconductor device.

Hereinafter, a conventional molding method will be described with reference to FIG.
FIG. 8 is a diagram for explaining a conventional molding method, and is a cross-sectional view of a molding apparatus in a resin mold.

  As shown in FIG. 8 (a), even if the mold part is thin, a method of resin molding in a lump without deforming the wire 9 connecting the semiconductor chip 8 and the substrate 10 by the flow of the mold resin 15 or FIG. As shown in (b), as a method of filling the narrow gap between the flip-mounted semiconductor chip 8 and the substrate 10 with the mold resin 15 and performing resin molding at once, the liquid is directly applied onto the substrate 10 on which the semiconductor chip 8 is mounted. There is a method in which a mold resin 15 is applied and resin molding is performed.

For example, a liquid resin having a low viscosity and a high filling property is used for the mold resin 15, and the liquid mold resin 15 is applied in a vacuum to the substrate 10 on which the semiconductor chip 8 is mounted, and the substrate on which the liquid mold resin 15 is applied. There has been proposed a method of resin molding using a process in which 10 is mounted on a press device and heated and clamped between an upper mold 1 and a lower mold 2 (see, for example, Patent Document 1).
JP 2004-179460 A

However, the conventional molding method has the following problems.
For wire bond mounting products with thin wires and narrow pitch, and flip mounting products with a narrow gap between the semiconductor chip and the substrate, a liquid resin with low viscosity must be used as the mold resin, and the area where the liquid resin should be molded When it is applied to the surface, the surface tension is low, so that it spreads thinner and thinner than the applied position, and it is difficult to secure a predetermined mold height, so that it spreads out of the predetermined mold range.

  In addition, when bubbles on the mold resin are generated in the mold resin due to heating on the mold, the lateral direction is open even when sandwiched between the upper and lower molds and pressed, and the pressure is low due to the low viscosity of the resin. However, there is a problem that voids are likely to occur.

  In order to solve the above-mentioned conventional problems, the present invention is a molding which ensures a predetermined mold height and a predetermined mold size even when a liquid resin having a low viscosity, or a powder resin or a granule resin is used. An object of the present invention is to perform resin molding of a semiconductor device that can reduce voids generated during molding and has high reliability.

  In order to achieve the above object, a molding apparatus according to claim 1 of the present invention is a molding apparatus that molds a substrate on which one or a plurality of semiconductor chips are mounted with a mold resin when manufacturing a semiconductor device. , A lower mold for fixing the substrate at a predetermined position, a preliminary cavity formed on the lower mold and having a bottom movable mechanism, and fixed on the lower mold, and supplied with the mold resin. And a plate provided with a groove for connecting the cavity and the preliminary cavity, and an upper mold that is in close contact with the lower mold across the plate, and the inside of the mold is in contact with the mold. The pressure is reduced, and further, the inside of the mold is pressurized using a vertically movable mechanism of the preliminary cavity.

  The mold forming method according to claim 2 is a mold forming method in which a substrate on which one or a plurality of semiconductor chips are mounted is molded using an upper die and a lower die when manufacturing a semiconductor device. Fixing the mold to a predetermined position of the lower mold, supplying the mold resin directly to the area for fixing the substrate, and bringing the upper mold into close contact with the lower mold, and then depressurizing the interior of the mold And a step of boosting the inside of the mold to a predetermined pressure after decompression.

  The mold forming method according to claim 3 is a mold forming method in which when a semiconductor device is manufactured, a plurality of substrates mounted with one or a plurality of semiconductor chips are molded using an upper mold and a lower mold. A step of fixing an arbitrary one of the substrates at a predetermined position of the lower mold, a step of supplying mold resin directly to a region for fixing the substrate, and fixing the remaining substrate to the lower mold After the upper mold is brought into close contact with the semiconductor chip mounting surface facing downward, the inside of the mold is depressurized, and after the depressurization, the inside of the mold is increased to a predetermined pressure.

The mold molding method according to claim 4 is the mold molding method according to claim 2 or 3, wherein when molding the semiconductor chip flip-mounted on the substrate, the lower mold is provided with the mold. Immediately before supplying the substrate, liquid resin is discharged onto the substrate in the vicinity of at least one side of the flip-mounted semiconductor chip, and the liquid resin is filled between the semiconductor chip and the substrate.
According to a fifth aspect of the present invention, when manufacturing a semiconductor device, a lower mold and an upper mold having a preliminary cavity whose bottom part is a vertically movable mechanism are used on a substrate on which one or a plurality of semiconductor chips are mounted. A mold forming method for forming a mold, comprising: a step of fixing the substrate at a predetermined position of the lower mold, a cavity to which mold resin is supplied, and a groove connecting the cavity and the preliminary cavity Fixing the mold on the lower mold, supplying the mold resin directly to the cavity, and attaching the upper mold to the lower mold via the plate and then depressurizing the interior of the mold And a step of boosting the inside of the mold to a predetermined pressure after the pressure reduction by using a vertically movable mechanism of the preliminary cavity.

  According to a sixth aspect of the present invention, when the semiconductor device is manufactured, the substrate on which one or more semiconductor chips are mounted is provided with one or more spare cavities having pins whose bottom portions are vertically movable mechanisms. A molding method for molding using a mold and a lower mold, the step of fixing the substrate to a predetermined position of the lower mold, a cavity to which mold resin is supplied, the cavity, and the preliminary cavity Fixing a plate having a through-hole for connecting to the lower mold; supplying a mold resin directly to the cavity; and contacting the upper mold to the lower mold via the cavity And a step of depressurizing the interior of the rear mold, and a step of increasing the pressure in the mold to a predetermined pressure using a pin of the preliminary cavity after the depressurization.

  8. The mold forming method according to claim 7, wherein in manufacturing a semiconductor device, a plurality of substrates on which one or a plurality of semiconductor chips are mounted are provided with an upper mold and a lower mold having a preliminary cavity whose bottom is a vertically movable mechanism. A mold forming method for molding using a mold, the step of fixing an arbitrary one of the substrates to a predetermined position of the lower mold, a cavity to which mold resin is supplied, the cavity, and the preliminary cavity Fixing a plate having a groove for connecting to the lower mold, supplying a mold resin directly to the cavity, and fixing the remaining substrate to the lower mold via the plate After the die is brought into close contact with the semiconductor chip mounting surface facing downward, the inside of the die is decompressed, and after the decompression, the inside of the die is moved using the vertical movable mechanism of the spare cavity. Characterized by a step of boosting a predetermined pressure Te.

  The molding method according to claim 8 is the molding method according to claim 2 or 3, wherein a sealing material is provided around the upper mold and the lower mold.

  As described above, it is possible to mold with a predetermined mold height and a predetermined mold size even when using a low-viscosity liquid resin, or even a powder resin or granule resin, and the voids generated during molding can be reduced. Therefore, resin molding of a highly reliable semiconductor device can be performed.

  In the present invention, after a plate that forms a cavity having a groove for allowing mold resin to flow out is placed in a preliminary cavity on a lower mold on which a substrate on which a semiconductor chip is mounted is mounted, the upper mold is brought into close contact with the lower mold. A certain molding pressure can be applied to the mold resin by depressurizing the inside of the mold and raising the bottom of the preliminary cavity. Therefore, even if a liquid resin having a low viscosity, a powder resin or a granule resin is used, a predetermined mold is used. Molding can be performed while ensuring a height and a predetermined mold size, and by applying pressure to the mold resin, voids can be reduced and a highly reliable semiconductor device can be realized.

  Also, a preliminary cavity with pins is provided in the upper mold, the upper mold with the substrate to be stacked is brought into close contact with the mold, the inside of the mold is depressurized, and the pins of the preliminary cavity are lowered to form a certain mold resin. Since pressure can be applied, a preliminary cavity connected to the cavity is installed at necessary locations including the center of the cavity, thereby suppressing lateral resin flow when the upper and lower molds are closed and the mold resin is compressed. Therefore, it is possible to reduce the flow of the wire in the product with wire bond mounting, and to achieve a predetermined mold height and a predetermined mold size even when a liquid resin having a low viscosity, or a powder resin or a granule resin is used. A highly reliable semiconductor device that can reduce voids by applying pressure to the mold resin. It can be current.

Hereinafter, embodiments of the molding method of the present invention will be described with reference to the drawings.
First, the first embodiment of the present invention will be described.

  FIG. 1 is a process cross-sectional view illustrating a mold resin supply process of the mold forming method according to Embodiment 1 of the present invention, and FIG. 2 is a process cross-sectional view illustrating a pressure control process of the mold forming method according to Embodiment 1 of the present invention. It is.

  As shown in FIG. 1A, the upper mold 1 and the lower mold 2 are heated (the heating device is not shown). In the lower mold 2, the substrate mounting recess 3, the pilot pin 4 and the spare cavity are provided. Is formed. The preliminary cavity bottom 5 is a vertically movable mechanism by pressure control, and is lowered to a predetermined position before molding. An upper mold seal material 6 is installed around the upper mold 1, and a lower mold seal material 7 is installed around the lower mold 2.

  Next, as shown in FIG. 1B, the substrate 10 on which one or a plurality of semiconductor chips 8 are mounted is supplied to the substrate mounting recess of the lower mold 2 by restricting the position with the pilot pins 4. The semiconductor chip 8 and the substrate 10 are electrically connected by wires 9.

  Next, as shown in FIG. 1C, the position of the plate 11 is restricted by the pilot pins 4 on the lower mold 2 and the substrate 10, and the through holes formed in the plate 11 are thereby formed. One or a plurality of cavities 12 are formed, and a groove 13 and a second through hole 14 are processed in the plate 11 so as to be connected to the cavity 12.

  Next, as shown in FIG. 1D, a slightly larger mold resin 15 is supplied into the cavity with respect to the cavity volume. As the mold resin 15, not only a liquid resin but also a powder resin and a granular resin can be used.

  Next, as shown in FIG. 2A, the upper and lower molds are brought close to a height at which the inside of the mold can be hermetically sealed with the upper mold sealing material 6 formed on the outer periphery of the upper mold 1, and the inside of the mold is hermetically sealed. Air in the mold is exhausted from an exhaust port (not shown) installed in the upper mold 1 or the lower mold 2 to depressurize the mold.

Next, as shown in FIG. 2B, the mold is completely closed when the mold resin 15 is melted to a predetermined level and the pressure in the mold is reduced to the predetermined level.
When the pressure is reduced and the mold is completely closed, the mold resin 15 spreads in the cavity to a predetermined mold height and size, and the semiconductor chip 8 mounted on the substrate 10 is molded and processed into the plate 11. The groove 13 and the second through hole 14 become a runner and a spare cavity, respectively, and excess mold resin 15 flows in.

  Next, as shown in FIG. 2C, the preliminary cavity bottom 5 is raised by pressure control, and a predetermined molding pressure (6 MPa to 15 MPa) is applied to the mold resin 15 and cured for a predetermined time (30 sec to 300 sec).

Finally, as shown in FIG. 2D, after curing for a predetermined time, the product is removed from the mold.
Here, the mold resin 15 is pressurized using the preliminary cavity, but it may be pressurized by other methods.

  As described above, a cavity, that is, a predetermined mold size, is formed by overlapping a plate that forms a cavity with a groove for allowing mold resin to flow out into a spare cavity on a lower mold on which a substrate on which a semiconductor chip is mounted is mounted. Since the frame is formed, it is possible to mold with a predetermined mold height and a predetermined mold size even when using a low-viscosity liquid resin, or even a powder resin or granule resin. Since the inside of the mold can be depressurized and the bottom of the preliminary cavity can be raised to apply a certain molding pressure to the mold resin, a void can be reduced and a highly reliable semiconductor device can be realized.

Next, a second embodiment of the present invention will be described.
FIG. 3 is a process cross-sectional view illustrating a mold fixing process of a mold forming method according to Embodiment 2 of the present invention, and FIG. 4 is a process cross-sectional view illustrating a pressure control process of the mold forming method according to Embodiment 2 of the present invention. It is.

  As shown in FIG. 3A, in the upper mold 1 and the lower mold 2 heated (heating device is not shown), the substrate mounting recess 3, the pilot pin 4 and the spare cavity are provided in the lower mold 2. Is formed. The preliminary cavity bottom 5 is a vertically movable mechanism by pressure control, and is lowered to a predetermined position before molding. An upper mold seal material 6 is installed around the upper mold 1, and a lower mold seal material 7 is installed around the lower mold 2.

Next, as shown in FIG. 3B, the first substrate 17 on which the semiconductor chip 8 is mounted with the bumps 16 is supplied to the substrate mounting recess 3 of the lower mold 2 by regulating the position with the pilot pins 4. .
Next, as shown in FIG. 3 (c), the plate 11 is overlaid on the lower mold 2 and the first substrate 17 by restricting the position of the plate 11 with the pilot pins 4, thereby being processed into the plate 11. The through hole thus formed becomes the cavity 12, and the groove 13 and the second through hole 14 are processed in the plate 11 so as to be connected to the cavity 12.

  Next, as shown in FIG. 3D, the second chip 21 on which the semiconductor chip 18 is mounted with bumps 19 and the bumps 20 are formed is placed on the upper mold with the surface on which the semiconductor chip 18 is mounted facing downward. Fix to 1.

  Next, as shown in FIG. 4A, a slightly larger mold resin 15 is supplied into the cavity with respect to the cavity volume. As the mold resin 15, not only a liquid resin but also a powder resin and a granular resin can be used.

  Next, as shown in FIG. 4 (b), the upper and lower molds are brought close to a height at which the inside of the mold can be hermetically sealed with the upper mold sealing material 6 formed on the outer periphery of the upper mold 1, and the inside of the mold is hermetically sealed. Air in the mold is exhausted from an exhaust port (not shown) installed in the upper mold 1 or the lower mold 2 to depressurize the mold.

  Next, as shown in FIG. 4C, when the mold resin 15 is melted to a predetermined level and the pressure inside the mold is reduced to the predetermined level, the mold is completely closed. When the mold is completely closed, the substrate 17 and the substrate 21 are electrically connected via the bumps 20, and the mold resin 15 is distributed in the cavity, so that the mold 17 is mounted on the first substrate 17 and the second substrate 21. Each of the semiconductor chips is molded, and the grooves 13 and the second through holes 14 processed in the plate 11 serve as runners and spare cavities, respectively, and excess mold resin 15 flows in.

  Next, as shown in FIG. 4D, the preliminary cavity bottom 5 is raised by pressure control, and a predetermined molding pressure (6 MPa to 15 MPa) is applied to the mold resin 15 and cured for a predetermined time (30 sec to 300 sec).

Finally, as shown in FIG. 2 (i), the product after curing for a predetermined time is taken out from the mold.
Here, the mold resin 15 is pressurized using the preliminary cavity, but it may be pressurized by other methods.

  As described above, a cavity, that is, a predetermined mold size, is formed by overlapping a plate that forms a cavity with a groove for allowing mold resin to flow out into a spare cavity on a lower mold on which a substrate on which a semiconductor chip is mounted is mounted. Since the frame is formed, molding with a predetermined mold height and a predetermined mold size is possible even when a liquid resin having a low viscosity, or a powder resin or a granule resin is used. Furthermore, since the upper mold with the substrate to be stacked is brought into close contact with the mold, the inside of the mold is depressurized, the bottom of the preliminary cavity is raised, and a certain molding pressure can be applied to the mold resin. In addition, a multi-chip type semiconductor device in which the semiconductor device itself can be stacked can be efficiently realized, and by applying pressure to the mold resin, voids can be reduced and a highly reliable semiconductor device can be realized.

Next, a third embodiment of the present invention will be described.
FIG. 5 is a process cross-sectional view illustrating a mold resin supply process of the mold forming method according to Embodiment 3 of the present invention, and FIG. 6 is a process cross-sectional view illustrating a pressure control process of the mold forming method according to Embodiment 3 of the present invention. It is.

  As shown in FIG. 5A, the upper mold 1 and the lower mold 2 are heated (the heating device is not shown). In the lower mold 2, the substrate mounting recess 3, pilot pin 4 and pin 22 are provided. Is formed. The pin 22 is a vertically movable mechanism by pressure control, and is raised to a predetermined position before molding. An upper mold seal material 6 is installed around the upper mold 1, and a lower mold seal material 7 is installed around the lower mold 2.

Next, as shown in FIG. 5 (b), the substrate 10 having the semiconductor chip 8 mounted with the wires 9 is supplied to the substrate mounting recess 3 of the lower mold 2 by regulating the position with the pilot pins 4.
Next, as shown in FIG. 5 (c), the plate 11 is overlaid on the lower mold 2 and the substrate 10 by restricting the position of the plate 11 with the pilot pins 4. A cavity 12 is formed.

Next, as shown in FIG. 5D, a slightly larger mold resin 15 is supplied into the cavity with respect to the cavity volume. As the mold resin 15, not only a liquid resin but also a powder resin and a granular resin can be used.
Next, as shown in FIG. 6A, the second plate 24 in which the through hole 23 is processed is stacked on the plate 11 so that the through hole 23 is positioned on the cavity. A plate sealing material 25 is installed around the second plate 24.

  Next, as shown in FIG. 6B, the inside of the mold can be hermetically sealed with the upper mold seal material 6 installed on the outer periphery of the upper mold 1 and the plate seal material 25 installed around the second plate 24. The upper and lower molds are brought close to the height so that the mold is hermetically sealed, and air in the mold is exhausted from an exhaust port (not shown) installed in the upper mold 1 or the lower mold 2 to depressurize the mold.

Next, as shown in FIG. 6C, the mold is completely closed when the mold resin 15 is melted to a predetermined level and the pressure in the mold is reduced to the predetermined level.
By completely closing the mold, the mold resin 15 spreads in the cavity to a predetermined mold height and size, and the semiconductor chip 8 mounted on the substrate 10 is molded and processed into the second plate 24. The excess through hole 23 becomes a preliminary cavity, and excess mold resin 15 flows.

  Next, as shown in FIG. 6D, the pin 22 is lowered by pressure control, and a predetermined molding pressure (6 MPa to 15 MPa) is applied to the mold resin 15 and cured for a predetermined time (30 sec to 300 sec).

Finally, as shown in FIG. 6 (e), the product after curing for a predetermined time is taken out from the mold.
Here, the mold resin 15 is pressurized using the pin 22 of the preliminary cavity, but it may be pressurized by other methods.

  As described above, a preliminary cavity having pins is provided in the upper mold, the upper mold is brought into close contact with the lower mold with the two plates sandwiched therebetween, the inside of the mold is decompressed, and the pins of the preliminary cavity are lowered. Since a certain molding pressure can be applied to the mold resin, a spare cavity connected to the cavity is installed at the required location including the center of the cavity, so that the mold resin can be compressed in the lateral direction by closing the upper and lower molds. Since the resin flow can be suppressed, the flow of the wire can be further reduced in a wire-bond mounted product, and a predetermined mold height can be obtained even if a low-viscosity liquid resin, or a powder resin or granule resin is used. Highly reliable semiconductor that can be molded with a predetermined mold size and can reduce voids by applying pressure to the mold resin. It can realize the location.

Next, a fourth embodiment of the present invention will be described.
FIG. 7 is a process cross-sectional view illustrating a molding method according to Embodiment 4 of the present invention.
First, as shown in FIG. 7A, when the substrate 10 on which the semiconductor chip 8 is flip-mounted by the bump 16 in the first to third embodiments is molded, immediately before the substrate 10 is supplied to the mold. Then, the underfill resin 26 is discharged onto the substrate 10 in the vicinity of at least one side of the semiconductor chip 8.

Next, in the substrate 10 supplied to the heated mold, as shown in FIG. 7B, the underfill resin is filled between the semiconductor chip 8 and the substrate 10 by heat and capillary phenomenon and cured.
As a result, even when the space between the semiconductor chip and the substrate is narrow and the mold resin cannot be filled, the filling and curing of the underfill resin using the underfill resin with optimized filling properties is performed in the mold process. Since it can be realized by parallel processing, the cost can be reduced and the airtightness can be enhanced by the underfill resin with optimized filling property, so that a highly reliable flip chip type semiconductor device can be realized.

  The mold molding apparatus and the mold molding method according to the present invention can be molded while ensuring a predetermined mold height and a predetermined mold size even when a liquid resin having a low viscosity, or a powder resin or a granule resin is used. In addition, since voids generated during molding can be reduced, a highly reliable semiconductor device can be provided, which is useful for a molding method in which a substrate on which a semiconductor chip is mounted and a mold resin are pressed with upper and lower molds.

Process sectional drawing explaining the mold resin supply process of the molding method in Embodiment 1 of this invention Process sectional drawing explaining the pressure control process of the molding method in Embodiment 1 of this invention Process sectional drawing explaining the metal mold | die fixing process of the molding method in Embodiment 2 of this invention Process sectional drawing explaining the pressure control process of the molding method in Embodiment 2 of this invention Process sectional drawing explaining the mold resin supply process of the molding method in Embodiment 3 of this invention Process sectional drawing explaining the pressure control process of the molding method in Embodiment 3 of this invention Process sectional drawing explaining the molding method in Embodiment 4 of this invention The figure explaining the conventional molding method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper die 2 Lower die 3 Substrate mounting recessed part 4 Pilot pin 5 Preliminary cavity bottom 6 Upper die seal material 7 Lower die seal material 8 Semiconductor chip 9 Wire 10 Substrate 11 Plate 12 Cavity 13 Groove 14 Second through-hole DESCRIPTION OF SYMBOLS 15 Mold resin 16 Bump 17 1st board | substrate 18 Semiconductor chip 19 Bump 20 Bump 21 2nd board | substrate 22 Pin 23 Through-hole 24 2nd plate 25 Plate seal material

Claims (8)

When manufacturing a semiconductor device, a mold forming apparatus for forming a substrate on which one or a plurality of semiconductor chips are mounted with a mold resin,
A lower mold for fixing the substrate in place;
A preliminary cavity formed in the lower mold and having a bottom movable mechanism;
A plate fixed on the lower mold and provided with a cavity for supplying the mold resin and a groove for connecting the cavity and the preliminary cavity;
An upper mold that is in close contact with the lower mold across the plate, and the pressure inside the mold is reduced after the mold is in close contact, and the inside of the mold is further moved by using a vertically movable mechanism of the preliminary cavity. A molding apparatus characterized in that the pressure is increased. A method of molding a semiconductor device by molding a substrate on which one or more semiconductor chips are mounted using an upper mold and a lower mold,
Fixing the substrate at a predetermined position of the lower mold;
Supplying mold resin directly to a region for fixing the substrate;
A step of reducing the pressure inside the mold after the upper mold is closely attached to the lower mold;
And a step of increasing the pressure inside the mold to a predetermined pressure after depressurization. In manufacturing a semiconductor device, a mold forming method of molding a plurality of substrates mounted with one or more semiconductor chips using an upper mold and a lower mold,
Fixing any of the substrates to a predetermined position of the lower mold; and
Supplying mold resin directly to a region for fixing the substrate;
A step of reducing the pressure inside the mold after closely attaching the upper mold with the remaining substrate fixed to the lower mold with the semiconductor chip mounting surface facing downward;
And a step of increasing the pressure inside the mold to a predetermined pressure after depressurization. When molding the semiconductor chip flip-mounted on the substrate,
Immediately before supplying the substrate to the lower mold,
4. The liquid resin is discharged onto the substrate in the vicinity of at least one side of the semiconductor chip flip-mounted, and the liquid resin is filled between the semiconductor chip and the substrate. The mold forming method of crab. A method of molding a semiconductor device by using a lower mold and an upper mold, each having a preliminary cavity whose bottom is a vertically movable mechanism, on a substrate on which one or more semiconductor chips are mounted. ,
Fixing the substrate at a predetermined position of the lower mold;
Fixing a plate provided with a cavity to which mold resin is supplied and a groove connecting the cavity and the preliminary cavity on the lower mold; and
Supplying mold resin directly to the cavity;
A step of reducing the pressure inside the mold after the upper mold is brought into close contact with the lower mold via the plate;
And a step of increasing the pressure in the mold to a predetermined pressure by using a vertically movable mechanism of the preliminary cavity after depressurization. In manufacturing a semiconductor device, a substrate on which one or more semiconductor chips are mounted is molded using an upper die and a lower die provided with one or more spare cavities having pins whose bottom portions are vertically movable mechanisms. A mold forming method for forming,
Fixing the substrate at a predetermined position of the lower mold;
Fixing a plate having a cavity to which mold resin is supplied and a through-hole connecting the cavity and the preliminary cavity on the lower mold;
Supplying mold resin directly to the cavity;
Depressurizing the inside of the mold after the upper mold is brought into close contact with the lower mold through the cavity;
And a step of boosting the inside of the mold to a predetermined pressure using a pin of the preliminary cavity after decompression. In manufacturing a semiconductor device, a plurality of substrates on which one or more semiconductor chips are mounted are molded by using a lower mold having an upper mold and a preliminary cavity having a bottom movable mechanism. There,
Fixing any of the substrates to a predetermined position of the lower mold; and
Fixing a plate provided with a cavity to which mold resin is supplied and a groove connecting the cavity and the preliminary cavity on the lower mold; and
Supplying mold resin directly to the cavity;
A step of depressurizing the inside of the mold after closely attaching the upper mold with the remaining substrate fixed to the lower mold via the plate with the semiconductor chip mounting surface facing downward;
And a step of increasing the pressure in the mold to a predetermined pressure by using a vertically movable mechanism of the preliminary cavity after depressurization.   The molding method according to claim 2, wherein a sealing material is installed around the upper mold and the lower mold.

Images