CN108568427A - A kind of ultrasonic cleaning equipment of silicon chip - Google Patents
A kind of ultrasonic cleaning equipment of silicon chip Download PDFInfo
- Publication number
- CN108568427A CN108568427A CN201810651679.9A CN201810651679A CN108568427A CN 108568427 A CN108568427 A CN 108568427A CN 201810651679 A CN201810651679 A CN 201810651679A CN 108568427 A CN108568427 A CN 108568427A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- pot
- rack
- ultrasonic cleaning
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 53
- 239000010703 silicon Substances 0.000 title claims abstract description 53
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000004140 cleaning Methods 0.000 claims abstract description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000010453 quartz Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 abstract description 29
- 229910021641 deionized water Inorganic materials 0.000 abstract description 29
- 239000012535 impurity Substances 0.000 abstract description 15
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 210000003934 vacuole Anatomy 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000002242 deionisation method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of ultrasonic cleaning equipments of silicon chip, belong to wafer cleaning technical.The device includes supersonic wave cleaning machine, locating rack, quartzy pot, rack, water inlet pipe, drainpipe, the locating rack is positioned in supersonic wave cleaning machine, the quartz pot is positioned in locating rack, the rack is positioned in quartzy pot, the water inlet pipe is set to above quartzy pot, and the ultrasonic cleaning motor spindle is provided with drainpipe.Ultrasonic cleaning equipment provided by the invention can clear up the impurity being suspended in after silicon chip surface disengaging in deionized water in time, avoid causing secondary pollution to the silicon chip cleaned, and cleaning performance is good, easy to operate, and personnel are not had to during cleaning and are guarded, time saving and energy saving.
Description
Technical field
The present invention relates to a kind of ultrasonic cleaning equipments of silicon chip, belong to wafer cleaning technical.
Background technology
During ultrasonic cleaning, wafer surface layer atom is destroyed due to shape silicon chip because of the chemical bond in terrace cut slice direction
Various impurity are easily adsorbed, such as particle, organic impurities, inorganic impurity, metal with increasing for suspension number of keys at dangling bonds
Ion, silica flour dust etc..However, potential pollution existing for each procedure in silicon chip production may all lead to the generation of defect
With the failure of semiconductor devices.Currently, generally using supersonic wave cleaning machine come cleaning silicon chip, supersonic wave cleaning machine is usually provided with
Rinse bath is provided with deionized water inlet and outlet on rinse bath, a certain amount of deionized water is maintained in rinse bath, and
Deionized water is in flow regime always；In addition, in cleaning silicon chip, usually silicon chip is positioned in the software gaily decorated basket or quartz
On stick frame.
Above-mentioned method for suppersonic cleaning has the following defects：First, in ultrasonic cleaning, the various impurity of silicon chip surface
It progressively disengages, suspends in deionized water, be difficult to be discharged to a large amount of impurity in time outside cleaning slot only by water outlet, this just makes
After the completion of cleaning, when taking out silicon chip from rinse bath, the partial impurities being suspended in deionized water are adsorbed in again
Silicon chip surface causes secondary pollution to silicon chip, carrys out larger difficulty to the follow-up cleaning tape of silicon chip, or even influence chip entirety matter
Amount；Second, the software gaily decorated basket polytetrafluoro material for placing silicon chip makes, and the software gaily decorated basket can adsorb and stop ultrasound when cleaning
The transmission of wave, another situation lie against the silicon chip on quartz pushrod due to not having limiting device to fix, and when cleaning shakes always
It is dynamic, influence cleaning performance.
Invention content
In order to solve the above technical problems, the present invention provides a kind of ultrasonic cleaning equipments of silicon chip.
The present invention is achieved by the following technical programs：A kind of ultrasonic cleaning equipment of silicon chip, including ultrasonic wave are clear
Washing machine, locating rack, quartzy pot, rack, water inlet pipe, drainpipe, the locating rack are positioned in supersonic wave cleaning machine, the stone
English pot is positioned in locating rack, and the rack is positioned in quartzy pot, and the water inlet pipe is set to above quartzy pot, described super
Sound wave cleaning motor spindle is provided with drainpipe.
The locating rack is provided with support leg.
The quartz pot is provided with handle.
The spout of the quartz pot is higher than pot mouth line.
The pot mouth line of the quartz pot is higher than drainpipe.
The rack is provided with card slot.
The rack is provided with support leg.
The rack making material is quartz pushrod.
It is provided with valve on the water inlet pipe.
The valve is ball valve.
The beneficial effects of the present invention are：First, using quartzy pot by the deionized water in silicon chip and supersonic wave cleaning machine
Keep apart, deionized water when cleaning in quartz pot is constantly in overflow status, and the deionized water of spilling can will be disengaged from silicon in time
The impurity on piece surface takes quartzy pot out of, and impurity is avoided to cause secondary pollution to the silicon chip in quartzy pot；Second, quartzy pot and placement
Frame is made with quartz, and ultrasonic wave has quartz penetrates effect well, and card slot, silicon chip are in addition provided on rack
It is inserted and more consolidates, cleaning performance is more preferable；Third, it is easy to operate, personnel are not had to during Wafer Cleaning and are guarded, time saving province
Power.
Description of the drawings
Fig. 1 is the complete section structural schematic diagram of the present invention；
Fig. 2 is the locating rack structural schematic diagram of the present invention；
Fig. 3 is the quartzy pot structural schematic diagram of the present invention；
Fig. 4 is the rack structural schematic diagram of invention；
In figure：1- supersonic wave cleaning machines, 2- locating racks, 3- quartz pots, 4- racks, 5- water inlet pipes, 51- valves, 6- rows
Water pipe.
Specific implementation mode
Technical scheme of the present invention is further described with reference to the attached drawing in embodiment, but claimed range is not
It is confined to described.
As shown in Figure 1 to Figure 4, the present invention provides following technical scheme：A kind of ultrasonic cleaning equipment of silicon chip, including ultrasonic wave
Cleaning machine 1, locating rack 2, quartzy pot 3, rack 4, water inlet pipe 5, drainpipe 6, the locating rack 2 are positioned over supersonic wave cleaning machine
In 1, the quartz pot 3 is positioned in locating rack 2, and the rack 4 is positioned in quartzy pot 3, and the water inlet pipe 5 is set to stone
3 top of English pot, 1 bottom of the supersonic wave cleaning machine is provided with drainpipe 6.
Further, locating rack 2 is provided with support leg, convenient for picking and placeing locating rack 2 and preferably limiting quartzy pot 3.
Further, quartzy pot 3 is provided with handle, conveniently picks and places quartzy pot 3.
Further, the spout of quartzy pot 3 is higher than pot mouth line, ensures that the deionized water in quartzy pot 3 is overflowed from pot mouth line, more
For the impurity in quartzy pot 3 is discharged in time.
Further, the pot mouth line of quartzy pot 3 is higher than drainpipe 6, makes the deionized water in quartzy pot 3 and supersonic wave cleaning machine
Deionized water in 1 forms ladder, prevents the deionized water in supersonic wave cleaning machine 1 from flooding quartzy pot 3.
Further, rack 4 is provided with card slot, the effectively firm silicon chip 7 being put into card slot.
Further, rack 4 is provided with support leg, and 4 card slot of rack is inserted into convenient for picking and placeing rack 4 and preferably limiting
In silicon chip 7.
Further, 4 making material of rack is quartz pushrod, compares the software gaily decorated basket, and ultrasonic wave energy acquirement preferably penetrates effect
Fruit.
Further, it is provided with valve 51 on water inlet pipe 5, the open and close convenient for control deionized water and flow.
Further, valve 51 is ball valve.
A kind of ultrasonic cleaning equipment of silicon chip of the present invention, the wherein structure of supersonic wave cleaning machine 1 and work are former
Reason is as follows：
Supersonic wave cleaning machine 1 includes mainly rinse bath, ultrasonic oscillator, supersonic generator, and ultrasonic oscillator is mounted on
Bottom of rinse bath, supersonic generator are connected by circuit with ultrasonic oscillator, and rinse bath is for loading deionized water and clear
Workpiece is washed, rinse bath can be rectangle, circle, ellipse etc., and the effect of ultrasonic oscillator is that electrical power is converted to ultrasonic wave
And pass, the effect of supersonic generator is that alternating current is converted to the corresponding high-frequency alternating current of ultrasonic oscillator is super to drive
Acoustic wave transducer works；Open supersonic generator, driving ultrasonic oscillator generates ultrasonic wave, and to rinse bath and quartzy pot
Deionized water in 3 transmits ultrasonic wave, and ultrasonic wave is a kind of vibration wave of density, and pressure medium can be made to make alternately to change, gone
The power that tearing is generated in ionized water is formed simultaneously the vacuole of vacuum, and vacuum vacuole is extruded and vanished by subsequent compressing force, this
Vibration under sound field reflecting, when acoustic pressure reaches ultrasonic cleaning certain value, bubble will rapidly increase, and close then and suddenly
It closes, when bubble is closed, since mutually collision generates powerful shock wave between liquid, thousands of a atmospheric pressure is generated around bubble
Pressure, i.e., " ultrasonic cavitation ".Therefore, the cleaning on 7 surface of silicon chip " impurity " is mainly come as the following：One, vacuole is broken
The strong impact wave generated when going out makes " impurity " on 7 surface of silicon chip be stripped, and dispersion is split away off；Two, cavitation phenomenon generates
Bubble expansion synchronous with raw pressure, shrinks, generates the physical force repeat function as peeling in " impurity " on 7 surface of silicon chip；Three,
Cleaning action power of the ultrasonic vibration of deionized water itself to 7 surface of silicon chip in ultrasonic cleaning.
Further increase the objects such as water inlet pipe 5 and quartzy pot 3 in the present invention in supersonic wave cleaning machine 1, generally forms
A kind of ladder running water mode makes deionized water that will show that " impurity " that is detached from cleans out quartzy pot 3 from silicon chip 7 in time, avoids clear
It washes after the completion of work, when taking out silicon chip 7 from deionized water, impurity causes secondary pollution to silicon chip.
A kind of ultrasonic cleaning equipment of silicon chip of the present invention, cleaning method mainly include the following steps that：
(1) silicon chip is placed：It is inserted into silicon chip 7 into the card slot of rack 4, quartzy pot 3 is correspondingly placed into locating rack 2；
(2) deionized water is filled：The valve 51 on water inlet pipe 5 is opened, is filled into quartzy pot 3 and supersonic wave cleaning machine 1
Deionized water, until beginning with a small amount of deionized water outflow in drainpipe 6；
(3) it cleans：Supersonic wave cleaning machine 1 is opened, silicon chip 7 is cleaned by ultrasonic 10~15 minutes；
(4) it rinses, rinse：Supersonic wave cleaning machine 1 and valve 51 are closed, quartzy pot 3 is taken out from supersonic wave cleaning machine 1,
The deionized water in quartzy pot 3 is outwelled, silicon chip 7 is taken out from rack 4, with deionization pure water rinsing, rinsing, is completed after drying
It is super to wash work.
Embodiment 1：
Water inlet pipe 5 is installed in trepanning on supersonic wave cleaning machine 1, and ball valve 51 is equipped on water inlet pipe 5, and silicon chip 7 is inserted
In the card slot for entering rack 4, the quartzy pot 3 equipped with rack 4 is correspondingly placed into locating rack 2, opens ball valve 51 to quartz
Deionized water is injected in pot 3 and supersonic wave cleaning machine 1, until beginning with a small amount of deionized water outflow, adjustment water inlet in drainpipe 6
The injection rate of deionized water in pipe 5 ensures that drainpipe 6 can arrange the deionized water overflowed from quartzy pot 3 in time when cleaning
It removes, avoids the deionized water water surface in supersonic wave cleaning machine 1 from being gradually increasing and flood quartzy pot 3, open supersonic wave cleaning machine 1 and start
Cleaning takes out quartzy pot 3, and outwells the deionized water in quartzy pot 3 after 15 minutes, silicon chip 7 is taken out from rack 4,
With deionization pure water rinsing, rinsing, drying, the ultrasonic cleaning work of silicon chip 7 is completed.
Claims (10)
1. a kind of ultrasonic cleaning equipment of silicon chip, it is characterised in that：Including supersonic wave cleaning machine (1), locating rack (2), quartz
Pot (3), rack (4), water inlet pipe (5), drainpipe (6), the locating rack (2) is positioned in supersonic wave cleaning machine (1), described
Quartzy pot (3) is positioned in locating rack (2), and the rack (4) is positioned in quartzy pot (3), and the water inlet pipe (5) is set to
Above quartzy pot (3), supersonic wave cleaning machine (1) bottom is provided with drainpipe (6).
2. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：Locating rack (2) setting
There is support leg.
3. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：The quartz pot (3) is arranged
There is handle.
4. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：The pot of the quartz pot (3)
Mouth is higher than pot mouth line.
5. a kind of ultrasonic cleaning equipment of silicon chip as claimed in claim 4, it is characterised in that：The pot of the quartz pot (3)
Mouth line is higher than drainpipe (6).
6. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：Rack (4) setting
There is card slot.
7. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：Rack (4) setting
There is support leg.
8. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：The rack (4) makes
Material is quartz pushrod.
9. a kind of ultrasonic cleaning equipment of silicon chip as described in claim 1, it is characterised in that：It is set on the water inlet pipe (5)
It is equipped with valve (51).
10. a kind of ultrasonic cleaning equipment of silicon chip as claimed in claim 9, it is characterised in that：The valve (51) is ball
Valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651679.9A CN108568427A (en) | 2018-06-22 | 2018-06-22 | A kind of ultrasonic cleaning equipment of silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651679.9A CN108568427A (en) | 2018-06-22 | 2018-06-22 | A kind of ultrasonic cleaning equipment of silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108568427A true CN108568427A (en) | 2018-09-25 |
Family
ID=63573495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810651679.9A Pending CN108568427A (en) | 2018-06-22 | 2018-06-22 | A kind of ultrasonic cleaning equipment of silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108568427A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109390262A (en) * | 2018-11-30 | 2019-02-26 | 江苏润阳悦达光伏科技有限公司 | The making herbs into wool groove-type cleaning machine unhook gaily decorated basket cleans purpose airing cart |
| CN110548725A (en) * | 2019-10-21 | 2019-12-10 | 上海加奇生物科技苏州有限公司 | Ultrasonic cleaning device system for implant raw material and method for cleaning implant raw material |
| CN111438133A (en) * | 2020-04-30 | 2020-07-24 | 深圳市路维光电股份有限公司 | Chromium plate cleaning jig and cleaning method |
| CN113053791A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Nitrogen gas cleaning device |
| CN118002553A (en) * | 2024-04-10 | 2024-05-10 | 江苏英思特半导体科技有限公司 | Silicon wafer cleaning machine with silicon wafer adjusting function |
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| CN208643504U (en) * | 2018-06-22 | 2019-03-26 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon wafer |
-
2018
- 2018-06-22 CN CN201810651679.9A patent/CN108568427A/en active Pending
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| JPH11204477A (en) * | 1998-01-16 | 1999-07-30 | Tokyo Electron Ltd | Ultrasonic cleaning device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109390262A (en) * | 2018-11-30 | 2019-02-26 | 江苏润阳悦达光伏科技有限公司 | The making herbs into wool groove-type cleaning machine unhook gaily decorated basket cleans purpose airing cart |
| CN110548725A (en) * | 2019-10-21 | 2019-12-10 | 上海加奇生物科技苏州有限公司 | Ultrasonic cleaning device system for implant raw material and method for cleaning implant raw material |
| CN111438133A (en) * | 2020-04-30 | 2020-07-24 | 深圳市路维光电股份有限公司 | Chromium plate cleaning jig and cleaning method |
| CN113053791A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Nitrogen gas cleaning device |
| CN113053791B (en) * | 2021-04-23 | 2022-11-29 | 上海珩旭机电设备有限公司 | Nitrogen gas cleaning device |
| CN118002553A (en) * | 2024-04-10 | 2024-05-10 | 江苏英思特半导体科技有限公司 | Silicon wafer cleaning machine with silicon wafer adjusting function |
| CN118002553B (en) * | 2024-04-10 | 2024-06-04 | 江苏英思特半导体科技有限公司 | Silicon wafer cleaning machine with silicon wafer adjusting function |
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