CN118002553B - Silicon wafer cleaning machine with silicon wafer adjusting function - Google Patents
Silicon wafer cleaning machine with silicon wafer adjusting function Download PDFInfo
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- CN118002553B CN118002553B CN202410425105.5A CN202410425105A CN118002553B CN 118002553 B CN118002553 B CN 118002553B CN 202410425105 A CN202410425105 A CN 202410425105A CN 118002553 B CN118002553 B CN 118002553B
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- silicon wafer
- return pipe
- pipe
- cleaning
- cleaning machine
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 131
- 239000010703 silicon Substances 0.000 title claims abstract description 131
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 238000004140 cleaning Methods 0.000 title claims abstract description 123
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 83
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 239000012535 impurity Substances 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 93
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 14
- 238000010992 reflux Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000001502 supplementing effect Effects 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 244000309464 bull Species 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 88
- 239000003921 oil Substances 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009711 regulatory function Effects 0.000 description 1
- 230000008844 regulatory mechanism Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention relates to the field of semiconductor device manufacturing, in particular to a silicon wafer cleaning machine with a silicon wafer adjusting function. Including ultrasonic cleaner, link, electric putter, bull stick etc. a plurality of link symmetry is connected in ultrasonic cleaner, and electric putter connects on the link, and the bull stick rotates to be connected on electric putter's telescopic link. According to the invention, the electric push rod, the rotating rod, the alignment wheel I, the driving mechanism and the pressing mechanism are matched, so that the alignment wheel I can jack up the silicon wafer and drive the silicon wafer to rotate and adjust, the silicon wafer can display and clean a self cleaning blind area through the rotation and adjustment, and then the particle impurities in the cleaning solution can be removed through the matching of the return pipe I, the splicing pipe, the return pipe II, the water pump I, the return pipe III and the replacement mechanism, so that the adhesion of the particle impurities floating in the cleaning solution when the follow-up silicon wafer is completely cleaned is prevented, and the cleaning effect of the silicon wafer is improved.
Description
Technical Field
The invention relates to the field of semiconductor device manufacturing, in particular to a silicon wafer cleaning machine with a silicon wafer adjusting function.
Background
In the semiconductor manufacturing industry, a silicon wafer is used as a basic carrier of an integrated circuit, and the cleanliness and the surface quality of the silicon wafer directly influence the performance and the yield of the chip; along with the continuous shrinkage of the feature size of an integrated circuit and the increasingly severe requirements on the processing precision of a microstructure, the importance of a silicon wafer cleaning link in the whole silicon wafer production process is increasingly remarkable; the silicon wafer cleaning machine is used as a key device special for precisely cleaning the silicon wafer, and remarkable progress is made in technology and functionality in recent years.
The traditional silicon wafer cleaning machine mainly adopts a plurality of means such as ultrasonic cleaning, chemical cleaning, spray rinsing and the like to remove particulate pollutants, organic residues and other impurities on the surface of the silicon wafer; however, when the traditional silicon wafer cleaning machine is used, the silicon wafer is usually required to be placed in the placing frame, then the placing frame is placed in the cleaning liquid by the machine arm, so that the silicon wafer in the placing frame is cleaned in the cleaning liquid, but when the cleaning mode is carried out, the contact surface of the silicon wafer and the placing frame is shielded, so that the contact surface of the silicon wafer and the placing frame is easy to have a cleaning blind area, the silicon wafer is not cleaned, in the cleaning process, the particle impurities cleaned from the silicon wafer can be suspended in the cleaning liquid, and the particle impurities are attached and remained when the silicon wafer is taken out, so that the cleaning effect of the silicon wafer is affected.
Disclosure of Invention
In view of the above, the invention provides a silicon wafer cleaning machine with a silicon wafer adjusting function, which can solve the defects that when the traditional silicon wafer cleaning machine is used for cleaning a silicon wafer, a cleaning blind area is easy to exist on the contact surface of the silicon wafer and a placing frame, so that the silicon wafer is not cleaned, and the silicon wafer is easy to be adhered and remained by floating particle impurities on a cleaning liquid when taken out, so that the cleaning effect of the silicon wafer is affected.
The technical scheme of the invention is as follows: the utility model provides a silicon chip cleaning machine with silicon chip regulatory function, including ultrasonic cleaner, control the panel, apron and rack, still including the link, electric putter, the bull stick, counterpoint wheel I, the back flow I, the splicing pipe, back flow II, water pump I, back flow III, actuating mechanism, hold-down mechanism and change mechanism, a plurality of link symmetrical connection is in the ultrasonic cleaner, electric putter connects on the link, the bull stick rotates and connects on electric putter's telescopic link, a plurality of counterpoint wheel I interval connection is on the bull stick, make electric putter can drive counterpoint wheel I remove to jack up the silicon chip, thereby make silicon chip and rack separate, back flow I communicates on ultrasonic cleaner, the splicing pipe is detachable installs on back flow I, and be used for placing the filter media in the splicing pipe, one end and the splicing pipe detachable connection of back flow II, back flow II's the other end is connected with water pump I, back flow III communicates between splicing pump I and ultrasonic cleaner, through back flow I, II and back flow III can carry out the hydrologic cycle to the cleaning solution in the ultrasonic cleaner, and through the microparticle that the splicing pipe can filter out in the cleaning solution, thereby carry out the rotation of the drive mechanism to the silicon chip and carry out the rotation, thereby carry out the rotation to the impurity and remove the impurity in the back flow I and carry out the rotation regulation mechanism, make the rotation and carry out the regulation and carry out the rotation and clean impurity to the rotary regulation.
As a preferable technical scheme of the invention, the driving mechanism comprises a servo motor and a gear box, wherein the servo motor is connected to a telescopic rod of the electric push rod, and two ends of the gear box are respectively connected to an output shaft of the servo motor and a rotating rod, so that the servo motor can drive the rotating rod to rotate through the gear box.
As a preferable technical scheme of the invention, the compressing mechanism comprises a hollow cylinder, a sliding rod, a spring, a fixed rod and an aligning wheel II, wherein the hollow cylinder is connected to the cover plate, the sliding rod is slidably connected in the hollow cylinder, two ends of the spring are respectively connected to the hollow cylinder and the sliding rod, the fixed rod is connected to the sliding rod, a plurality of aligning wheels II are rotatably connected to the fixed rod, and the aligning wheel II can compress and limit the silicon wafer when the aligning wheels II are in contact with the silicon wafer.
As a preferable technical scheme of the invention, the replacing mechanism comprises a threaded sleeve and a valve, wherein the threaded sleeve is connected to the return pipe I and the return pipe II in a threaded manner, the threaded sleeves on the return pipe I and the return pipe II are connected with the splicing pipe in a threaded manner, so that the splicing pipe is fixed between the return pipe I and the return pipe II through the threaded sleeve, the valves are arranged on the return pipe I and the return pipe II, the return pipe I and the return pipe II are internally blocked through the valves, the splicing pipe is unfixed through the threaded sleeve, and the splicing pipe can be taken down and the filter material is replaced.
As a preferable technical scheme of the invention, the device also comprises thermopile sensors, a plurality of thermopile sensors are connected to the cover plate at intervals, and the thermopile sensors are used for detecting the temperature of the silicon wafer.
As a preferable technical scheme of the invention, the ultrasonic cleaning device further comprises an oil-water separation mechanism, the oil-water separation mechanism comprises an oil-water separator and a connecting pipe, the oil-water separator is communicated with the ultrasonic cleaning device, the oil-water separator is used for separating oil from water of cleaning liquid, and two ends of the connecting pipe are respectively communicated with a water outlet of the oil-water separator and a return pipe II.
As a preferable technical scheme of the invention, the cleaning liquid heating device further comprises a heating mechanism, wherein the heating mechanism comprises a temperature sensor and a heater, the temperature sensor is arranged on the return pipe III and is used for detecting the temperature of the cleaning liquid in the return pipe III, the heater is arranged on the return pipe III and is used for heating the cleaning liquid in the return pipe III.
As a preferable technical scheme of the invention, the ultrasonic cleaning machine further comprises a liquid supplementing mechanism, wherein the liquid supplementing mechanism comprises a water tank, a water pump II and a liquid level sensor, the water tank is connected to the ultrasonic cleaning machine, two ends of the water pump II are respectively communicated with the water tank and a return pipe II, the liquid level sensor is arranged in the ultrasonic cleaning machine, and the liquid level sensor is used for detecting the liquid level of cleaning liquid in the ultrasonic cleaning machine, so that the water pump II can pump the cleaning liquid in the water tank into the ultrasonic cleaning machine for liquid supplementing.
The beneficial effects are that: 1. according to the invention, the electric push rod, the rotating rod, the alignment wheel I, the driving mechanism and the pressing mechanism are matched, so that the alignment wheel I can jack up the silicon wafer and drive the silicon wafer to rotate and adjust, the silicon wafer can display and clean a self cleaning blind area through the rotation and adjustment, and then the particle impurities in the cleaning solution can be removed through the matching of the return pipe I, the splicing pipe, the return pipe II, the water pump I, the return pipe III and the replacement mechanism, so that the adhesion of the particle impurities floating in the cleaning solution when the follow-up silicon wafer is completely cleaned is prevented, and the cleaning effect of the silicon wafer is improved.
2. According to the invention, by arranging the thermopile sensor, the thermopile sensor can detect the temperature of the silicon wafer in the ultrasonic cleaning machine in a non-contact manner, so that not only can the abrasion between the thermopile sensor and the silicon wafer be prevented, but also the silicon wafer is in a certain temperature range in the cleaning liquid, and the influence of the too high or too low temperature on the cleaning of the silicon wafer is avoided.
3. According to the invention, the oil-water separator and the connecting pipe are arranged, so that the oil-water separator can separate oil from water of the cleaning liquid, thus the oil remained after the silicon wafer is cleaned in the cleaning liquid is automatically treated, and the separated cleaning liquid can be returned to the ultrasonic cleaner for repeated use, so that the reusability of the cleaning liquid is improved.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic rear perspective view of the present invention.
Fig. 3 is a sectional view of the ultrasonic cleaning machine of the present invention.
Fig. 4 is a bottom cross-sectional view of the ultrasonic cleaning machine of the present invention.
Fig. 5 is a schematic perspective view of the driving mechanism and the compressing mechanism of the present invention.
Fig. 6 is a schematic perspective view of the replacement mechanism according to the present invention.
Fig. 7 is a structural exploded view of the replacement mechanism of the present invention.
Fig. 8 is a cross-sectional view of a cover plate of the present invention.
Fig. 9 is a schematic perspective view of the cover plate removed according to the present invention.
Fig. 10 is a schematic rear perspective view of the cover plate removed according to the present invention.
Marked in the figure as: the ultrasonic cleaning machine comprises a 1-ultrasonic cleaning machine, a 2-control panel, a 3-cover plate, a 4-placing frame, a 401-silicon wafer, a 5-connecting frame, a 6-electric push rod, a 7-rotating rod, an 8-aligning wheel I, a 9-backflow pipe I, a 10-splicing pipe, a 1001-filter material, an 11-backflow pipe II, a 12-water pump I, a 13-backflow pipe III, a 14-servo motor, a 15-gearbox, a 16-hollow cylinder, a 17-sliding rod, a 18-spring, a 19-fixed rod, a 20-aligning wheel II, a 21-threaded sleeve, a 22-valve, a 23-thermopile sensor, a 24-oil-water separator, a 25-connecting pipe, a 26-temperature sensor, a 27-heater, a 28-water tank, a 29-water pump II and a 30-liquid level sensor.
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description, but does not limit the scope of protection and the application of the invention.
Examples: the silicon wafer cleaning machine with the silicon wafer adjusting function is shown in the drawings 1-7, and comprises an ultrasonic cleaning machine 1, a control panel 2, a cover plate 3 and a placing frame 4; the control panel 2 is connected to the ultrasonic cleaner 1, the ultrasonic cleaner 1 is electrically connected with the control panel 2, and the ultrasonic cleaner 1 has the functions of heating and cooling so as to heat and cool cleaning liquid in the ultrasonic cleaner 1; the cover plate 3 is rotatably connected to the ultrasonic cleaner 1; the placing frame 4 is placed in the ultrasonic cleaner 1, and the placing frame 4 is used for placing the silicon wafers 401 at intervals so that the silicon wafers 401 can be cleaned in the ultrasonic cleaner 1;
The device also comprises a connecting frame 5, an electric push rod 6, a rotating rod 7, an alignment wheel I8, a return pipe I9, a splicing pipe 10, a return pipe II 11, a water pump I12, a return pipe III 13, a driving mechanism, a compressing mechanism and a replacing mechanism; the four connecting frames 5 are symmetrically connected in the ultrasonic cleaner 1; the electric push rod 6 is connected to the connecting frame 5, and the electric push rod 6 is electrically connected with the control panel 2; a rotating rod 7 is rotatably connected between the telescopic rods of the two electric push rods 6 at the same lateral side, and the number of the rotating rods 7 is two; the alignment wheels I8 are connected to the rotating rod 7 at intervals, so that when the electric push rod 6 drives the rotating rod 7 to move upwards, the rotating rod 7 can drive the alignment wheels I8 to move upwards to jack up the silicon wafer 401, and the silicon wafer 401 is separated from the placing frame 4; the two return pipes I9 are symmetrically communicated with the left side and the right side of the ultrasonic cleaner 1, the splicing pipe 10 is detachably arranged on the return pipe I9, and the splicing pipe 10 is internally used for placing the filter material 1001; one end of the return pipe II 11 is detachably connected with the splicing pipe 10; the other end of the return pipe II 11 is connected with a water pump I12, and the water pump I12 is electrically connected with the control panel 2; the return pipe III 13 is communicated between the water outlet of the water pump I12 and the ultrasonic cleaner 1, cleaning liquid in the ultrasonic cleaner 1 can be circulated through the return pipe I9, the return pipe II 11 and the return pipe III 13, and particulate impurities in the cleaning liquid can be filtered out through the filter material 1001 in the splicing pipe 10, so that the particulate impurities in the cleaning liquid are removed, the silicon wafer 401 cleaned in the cleaning liquid cannot be attached by suspended particulate impurities when taken out, and the cleaning effect of the silicon wafer 401 is improved; the driving mechanism is used for driving the rotating rod 7 to rotate so as to drive the alignment wheel I8 to synchronously rotate; the compressing mechanism is used for compressing and limiting the silicon wafer 401, so that the alignment wheel I8 can drive the silicon wafer 401 to rotate and adjust through friction force, and therefore the silicon wafer 401 can display self cleaning blind areas through the rotation and adjustment, and further the self cleaning blind areas of the silicon wafer 401 are cleaned; the replacement mechanism is used for replacing the filter material 1001 in the splice tube 10, so that the filtering effect of the filter material 1001 in the splice tube 10 is ensured.
Referring to fig. 5, the drive mechanism includes a servo motor 14 and a gear box 15; the servo motor 14 is connected to the telescopic rod of the electric push rod 6, and the servo motor 14 is electrically connected with the control panel 2; the gear box 15 is connected to the servo motor 14, wherein an input end of the gear box 15 is connected to an output shaft of the servo motor 14, and an output end of the gear box 15 is connected to the rotating rod 7, so that the servo motor 14 can drive the rotating rod 7 to rotate through the gear box 15.
Referring to fig. 4 and 5, the pressing mechanism comprises a hollow cylinder 16, a sliding rod 17, a spring 18, a fixed rod 19 and an alignment wheel ii 20; the four hollow cylinders 16 are symmetrically connected to the bottom end of the cover plate 3; the sliding rod 17 is connected in the hollow cylinder 16 in a sliding way; the two ends of the spring 18 are respectively connected to the hollow cylinder 16 and the sliding rod 17; fixing rods 19 are connected between the bottom ends of the two sliding rods 17 at the same lateral side, and the number of the fixing rods 19 is two; the plurality of alignment wheels II 20 are connected to the fixed rod 19 in a rotating mode at intervals, the number of the alignment wheels II 20 on the fixed rod 19 is identical to the number of the alignment wheels I8 on the rotating rod 7, the alignment wheels II 20 are aligned with the alignment wheels I8 up and down, and when the alignment wheels II 20 are in contact with the silicon wafer 401, the alignment wheels II 20 can compress and limit the silicon wafer 401.
Referring to fig. 6 and 7, the replacement mechanism includes a threaded sleeve 21 and a valve 22; the thread sleeves 21 are connected to the reflux tube I9 and the reflux tube II 11 in a threaded manner, and the thread sleeves 21 on the reflux tube I9 and the reflux tube II 11 are connected with the splicing tube 10 in a threaded manner, so that the splicing tube 10 is fixed between the reflux tube I9 and the reflux tube II 11 by the thread sleeves 21; valve 22 is installed on back flow I9 and back flow II 11, and flow break is carried out in back flow I9 and back flow II 11 through valve 22, and rethread twists thread bush 21 and rotates, enables thread bush 21 to loosen the concatenation pipe 10 to remove fixedly to the concatenation pipe 10, later take off concatenation pipe 10 and can change filter media 1001.
Before use, the valve 22 can be closed, then the thread sleeve 21 is twisted to rotate, so that the thread sleeve 21 loosens the splicing pipe 10, then the splicing pipe 10 is taken down, the filter material 1001 is put into the splicing pipe 10, then the splicing pipe 10 is put back in place, and the thread sleeve 21 is twisted to rotate reversely, so that the thread sleeve 21 fixes the splicing pipe 10 between the return pipe I9 and the return pipe II 11, and therefore, the filter material 1001 can be fed, and then the filter material 1001 in the splicing pipe 10 can be replaced by repeating the operation;
When in use, cleaning liquid is poured into the ultrasonic cleaner 1, then the cleaning liquid is heated and cooled by the ultrasonic cleaner 1, so that the cleaning liquid is in a specified temperature range, then the control panel 2 controls the water pump I12 to start, the water pump I12 pumps the cleaning liquid in the ultrasonic cleaner 1 into the return pipe I9, the splicing pipe 10, the return pipe II 11 and the return pipe III 13, so that the filter material 1001 in the splicing pipe 10 filters the cleaning liquid, and is further used for filtering out particulate impurities in the cleaning liquid, and then the filtered cleaning liquid flows back into the ultrasonic cleaner 1 by the return pipe III 13, the particle impurities in the cleaning liquid in the ultrasonic cleaner 1 can be removed, so that the adhesion of the particle impurities floating in the cleaning liquid when the subsequent silicon wafer 401 is cleaned is prevented; then arranging the silicon wafers 401 in the placing frame 4 at intervals, pulling the cover plate 3 to rotate and open, then placing the placing frame 4 with the silicon wafers 401 in the ultrasonic cleaner 1, immersing the silicon wafers 401 in cleaning liquid, pushing the cover plate 3 to reversely close, then controlling the ultrasonic cleaner 1 to clean the silicon wafers 401 through the control panel 2, simultaneously controlling the electric push rod 6 through the control panel 2 to drive the rotating rod 7 and the alignment wheel I8 to move upwards, when the alignment wheel I8 contacts with the bottom end of the silicon wafers 401 in the placing frame 4, the alignment wheel I8 pushes the silicon wafers 401 to move upwards, when the top ends of the silicon wafers 401 contact with the alignment wheel II 20, the silicon chip 401 can extrude the alignment wheel II 20, the fixed rod 19 and the sliding rod 17 to move upwards, the spring 18 compresses, the spring 18 can extrude the sliding rod 17, the fixed rod 19 and the alignment wheel II 20 under the elastic force of the spring 18, the alignment wheel II 20 compresses the top end of the silicon chip 401, so as to compress and limit the silicon chip 401, after the silicon chip 401 moves upwards to be separated from the placement frame 4, the contact surface between the silicon chip 401 and the placement frame 4 disappears, the silicon chip 401 contacts with the alignment wheel I8 and the alignment wheel II 20, then the servo motor 14 is controlled by the control panel 2 to drive the rotating rod 7 and the alignment wheel I8 to rotate through the gear box 15, the alignment wheel I8 drives the silicon wafer 401 to rotate and adjust by utilizing friction force, so that the silicon wafer 401 displays self cleaning blind areas through rotation adjustment, and then the self cleaning blind areas of the silicon wafer 401 are cleaned, so that the whole body of the silicon wafer 401 is cleaned, the cleaning effect of the silicon wafer 401 is improved, after the silicon wafer 401 is cleaned, the control panel 2 is used for controlling the servo motor 14 to drive the rotating rod 7 and the alignment wheel I8 to stop rotating through the gear box 15, and the control panel 2 is used for controlling the electric push rod 6 to drive the rotating rod 7 and the alignment wheel I8 to move downwards for resetting, so that the silicon wafer 401 follows the alignment wheel I8 to move downwards for resetting, until the silicon chip 401 returns to the placing frame 4 and is separated from the alignment wheel I8, when the silicon chip 401 is separated from the alignment wheel II 20, the spring 18 is restored, the spring 18 drives the sliding rod 17, the fixed rod 19 and the alignment wheel II 20 to move downwards for resetting, then the ultrasonic cleaning machine 1 is controlled by the control panel 2 to stop cleaning the silicon chip 401, the cover plate 3 is pulled to rotate and open, then the placing frame 4 filled with the silicon chip 401 is taken out from the ultrasonic cleaning machine 1, then the cover plate 3 is pushed to be reversely closed, and then the cleaned silicon chip 401 is taken down from the placing frame 4; and then repeating the operation, namely cleaning all the silicon wafers 401, and controlling the water pump I12 to be closed through the control panel 2 after the silicon wafers 401 are completely cleaned.
Referring to fig. 8, a thermopile sensor 23 is further included; the thermopile sensors 23 are connected to the bottom end of the cover plate 3 at intervals, the thermopile sensors 23 are used for detecting the temperature of the silicon wafer 401, and the thermopile sensors 23 are electrically connected with the control panel 2.
By providing the thermopile sensor 23, the temperature of the silicon wafer 401 in the ultrasonic cleaning machine 1 can be detected by the thermopile sensor 23 in a noncontact manner, and by detecting the silicon wafer 401 by the thermopile sensor 23 in a noncontact manner, abrasion between the thermopile sensor 23 and the silicon wafer 401 can be prevented, thereby protecting the thermopile sensor 23 and the silicon wafer 401; when the thermopile sensor 23 detects that the temperature of the silicon wafer 401 is higher than a preset value, the thermopile sensor 23 sends out a signal, and the control panel 2 controls the ultrasonic cleaner 1 to cool the cleaning liquid after receiving the signal, so that the temperature of the silicon wafer 401 in the cleaning liquid is reduced; when the thermopile sensor 23 detects that the temperature of the silicon wafer 401 is lower than a preset value, the thermopile sensor 23 sends out a signal, and the control panel 2 controls the ultrasonic cleaner 1 to heat the cleaning liquid after receiving the signal, so that the temperature of the silicon wafer 401 in the cleaning liquid is increased, the silicon wafer 401 is in a certain temperature range in the cleaning liquid, and the influence of the too high or too low temperature on the cleaning of the silicon wafer 401 is avoided.
Referring to fig. 9 and 10, the oil-water separator comprises an oil-water separator 24 and a connecting pipe 25; the two oil-water separators 24 are symmetrically communicated with the left side and the right side of the ultrasonic cleaner 1, the oil-water separators 24 are used for carrying out oil-water separation on the cleaning liquid, the cleaning liquid is discharged from a water outlet of the oil-water separators 24, the oil is discharged from an oil outlet of the oil-water separators 24, and the oil-water separators 24 are electrically connected with the control panel 2; the two ends of the connecting pipe 25 are respectively communicated with the water outlet of the oil-water separator 24 and the return pipe II 11, so that the cleaning solution separated in the oil-water separator 24 can flow back to the ultrasonic cleaner 1 through the return pipe II 11 for reuse.
After the cleaning solution is poured into the ultrasonic cleaner 1, the oil-water separator 24 can be controlled by the control panel 2 to start, after the cleaning solution flows into the oil-water separator 24, the oil-water separator 24 can perform oil-water separation on the cleaning solution, after the oil-water separation is completed in the cleaning solution, the separated cleaning solution can be returned to the ultrasonic cleaner 1 through the connecting pipe 25 and the return pipe II 11 to be reused, and separated oil is discharged through an oil outlet of the oil-water separator 24, so that the residual oil after the silicon wafer 401 is cleaned in the cleaning solution can be treated; when the silicon wafer 401 is completely cleaned, the oil-water separator 24 is controlled to be closed by the control panel 2.
Referring to fig. 10, a heating mechanism is further included, and the heating mechanism includes a temperature sensor 26 and a heater 27; the temperature sensor 26 is mounted on the return pipe III 13, the temperature sensor 26 is used for detecting the temperature of the cleaning liquid in the return pipe III 13, and the temperature sensor 26 is electrically connected with the control panel 2; the heater 27 is installed on the return pipe III 13, and the heater 27 is electrically connected with the control panel 2, and the heater 27 is used for heating the cleaning solution in the return pipe III 13, so as to prevent the cleaning solution which flows back into the ultrasonic cleaner 1 through the return pipe III 13 from being too low in temperature, thereby affecting the cleaning solution at high temperature in the ultrasonic cleaner 1.
By providing the temperature sensor 26, the temperature sensor 26 can detect the temperature of the cleaning liquid flowing back in the return pipe III 13; when the temperature sensor 26 detects that the temperature of the cleaning solution in the return pipe III 13 is lower than a preset value, the temperature sensor 26 sends a signal, and the control panel 2 controls the heater 27 to heat the cleaning solution in the return pipe III 13 after receiving the signal so as to enable the temperature of the cleaning solution in the return pipe III 13 to reach a specified range, thereby preventing the temperature of the cleaning solution in the return pipe III 13 flowing back into the ultrasonic cleaner 1 from being too low and further causing temperature influence on the cleaning solution in the ultrasonic cleaner 1 at high temperature; when the temperature sensor 26 detects that the temperature of the cleaning solution in the return pipe iii 13 is higher than the preset value, the temperature sensor 26 sends a signal, and the control panel 2 controls the heater 27 to stop heating the cleaning solution in the return pipe iii 13 after receiving the signal.
Referring to fig. 9 and 10, the liquid supplementing device further comprises a liquid supplementing mechanism, wherein the liquid supplementing mechanism comprises a water tank 28, a water pump II 29 and a liquid level sensor 30; the water tank 28 is connected to the lower side of the ultrasonic cleaner 1; two ends of a water pump II 29 are respectively communicated with the water tank 28 and the return pipe II 11, and the water pump II 29 is electrically connected with the control panel 2; the liquid level sensor 30 is installed in the ultrasonic cleaner 1, the liquid level sensor 30 is electrically connected with the control panel 2, and the liquid level sensor 30 is used for detecting the liquid level of the cleaning liquid in the ultrasonic cleaner 1, when the liquid level of the cleaning liquid in the ultrasonic cleaner 1 drops, the cleaning liquid in the water tank 28 can be pumped into the ultrasonic cleaner 1 by the water pump II 29 to supplement the cleaning liquid.
A large amount of cleaning liquid may be added to the tank 28 as a reservoir prior to use; when the ultrasonic cleaning machine is used, the liquid level sensor 30 is arranged, so that the liquid level sensor 30 can detect the liquid level of the cleaning liquid in the ultrasonic cleaning machine 1, when the liquid level sensor 30 detects that the liquid level of the cleaning liquid in the ultrasonic cleaning machine 1 is lower than a preset value, the liquid level sensor 30 can send out a signal, the control panel 2 can control the water pump II 29 to start after receiving the signal, and the water pump II 29 pumps the cleaning liquid in the water tank 28 into the ultrasonic cleaning machine 1 for liquid supplementing; when the liquid level sensor 30 detects that the liquid level of the cleaning liquid in the ultrasonic cleaner 1 is higher than a preset value, the liquid level sensor 30 sends a signal, and the control panel 2 controls the water pump II 29 to be turned off after receiving the signal, so that the liquid level of the cleaning liquid in the ultrasonic cleaner 1 is within a certain preset value, and the influence on the cleaning of the silicon wafer 401 caused by the too low liquid level of the cleaning liquid in the ultrasonic cleaner 1 is avoided.
The embodiments described above are intended to provide those skilled in the art with a means for making or using the present invention, and those skilled in the art may make various modifications or alterations to the above embodiments without departing from the inventive concept of the present invention, and thus the scope of the present invention is not limited to the above embodiments.
Claims (5)
1. The silicon wafer cleaning machine with the silicon wafer adjusting function comprises an ultrasonic cleaning machine (1), a control panel (2), a cover plate (3) and a placing frame (4), and is characterized by further comprising a driving mechanism, a pressing mechanism and a replacing mechanism, wherein a plurality of connecting frames (5) are symmetrically connected in the ultrasonic cleaning machine (1), an electric push rod (6) is connected to the connecting frames (5), a rotating rod (7) is rotationally connected to a telescopic rod of the electric push rod (6), a plurality of alignment wheels I (8) are connected to the rotating rod (7) at intervals, the electric push rod (6) drives the alignment wheels I (8) to jack up a silicon wafer (401), so that the silicon wafer (401) is separated from the placing frame (4), the reflux pipe I (9) is communicated with the ultrasonic cleaner (1), the splicing pipe (10) is detachably arranged on the reflux pipe I (9), the splicing pipe (10) is internally provided with a filter material (1001), one end of the reflux pipe II (11) is detachably connected with the splicing pipe (10), the other end of the reflux pipe II (11) is connected with the water pump I (12), the reflux pipe III (13) is communicated between the water pump I (12) and the ultrasonic cleaner (1), the reflux pipe I (9), the reflux pipe II (11) and the reflux pipe III (13) can circulate water to the cleaning liquid in the ultrasonic cleaner (1), and the filter material (1001) in the splicing pipe (10) can filter out particulate impurities in the cleaning liquid, the device comprises a drive mechanism, a compressing mechanism, a positioning wheel I (8), a rotating rod (7), a cleaning dead zone, a filter material (1001) and a replacement mechanism, wherein the drive mechanism is used for driving the rotating rod (7) to rotate, the compressing mechanism is used for compressing and limiting a silicon wafer (401), the positioning wheel I (8) can drive the silicon wafer (401) to rotate and adjust when the positioning wheel I (8) synchronously rotates along with the rotating rod (7), so that the silicon wafer (401) can clean the cleaning dead zone through rotation and adjustment, and the replacement mechanism is used for replacing the filter material (1001) in the splicing pipe (10); the driving mechanism comprises a servo motor (14) and a gear box (15), wherein the servo motor (14) is connected to a telescopic rod of the electric push rod (6), and two ends of the gear box (15) are respectively connected to an output shaft of the servo motor (14) and the rotating rod (7), so that the servo motor (14) can drive the rotating rod (7) to rotate through the gear box (15); the compressing mechanism comprises a hollow cylinder (16), a sliding rod (17), a spring (18), a fixed rod (19) and an aligning wheel II (20), wherein the hollow cylinder (16) is connected to the cover plate (3), the sliding rod (17) is connected to the hollow cylinder (16) in a sliding manner, two ends of the spring (18) are respectively connected to the hollow cylinder (16) and the sliding rod (17), the fixed rod (19) is connected to the sliding rod (17), the aligning wheels II (20) are rotationally connected to the fixed rod (19), and when the aligning wheels II (20) are in contact with the silicon wafer (401), the aligning wheel II (20) can compress and limit the silicon wafer (401); the replacement mechanism comprises a threaded sleeve (21) and a valve (22), wherein the threaded sleeve (21) is connected to the return pipe I (9) and the return pipe II (11) in a threaded manner, the threaded sleeve (21) on the return pipe I (9) and the return pipe II (11) is connected with the splicing pipe (10) in a threaded manner, the threaded sleeve (21) fixes the splicing pipe (10) between the return pipe I (9) and the return pipe II (11), the valve (22) is arranged on the return pipe I (9) and the return pipe II (11), the flow in the return pipe I (9) and the return pipe II (11) is cut off through the valve (22), the splicing pipe (10) is released and fixed through the threaded sleeve (21), the splice tube (10) can be removed and the filter medium (1001) can be replaced.
2. The silicon wafer cleaning machine with the silicon wafer adjusting function according to claim 1, further comprising thermopile sensors (23), wherein the thermopile sensors (23) are connected to the cover plate (3) at intervals, and the thermopile sensors (23) are used for detecting the temperature of the silicon wafer (401).
3. The silicon wafer cleaning machine with the silicon wafer adjusting function according to claim 2, further comprising an oil-water separation mechanism, wherein the oil-water separation mechanism comprises an oil-water separator (24) and a connecting pipe (25), the oil-water separator (24) is communicated with the ultrasonic cleaning machine (1), the oil-water separator (24) is used for oil-water separation of cleaning liquid, and two ends of the connecting pipe (25) are respectively communicated with a water outlet of the oil-water separator (24) and a return pipe II (11).
4. A silicon wafer cleaning machine with silicon wafer adjusting function as claimed in claim 3, characterized by further comprising a heating mechanism comprising a temperature sensor (26) and a heater (27), wherein the temperature sensor (26) is mounted on the return pipe iii (13), the temperature sensor (26) is used for detecting the temperature of the cleaning liquid in the return pipe iii (13), the heater (27) is mounted on the return pipe iii (13), and the heater (27) is used for heating the cleaning liquid in the return pipe iii (13).
5. The silicon wafer cleaning machine with the silicon wafer adjusting function according to claim 4, further comprising a liquid supplementing mechanism, wherein the liquid supplementing mechanism comprises a water tank (28), a water pump II (29) and a liquid level sensor (30), the water tank (28) is connected to the ultrasonic cleaning machine (1), two ends of the water pump II (29) are respectively communicated with the water tank (28) and a return pipe II (11), the liquid level sensor (30) is arranged in the ultrasonic cleaning machine (1), and the liquid level sensor (30) is used for carrying out liquid level detection on cleaning liquid in the ultrasonic cleaning machine (1), so that the water pump II (29) can pump the cleaning liquid in the water tank (28) into the ultrasonic cleaning machine (1) for supplementing liquid.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107999458A (en) * | 2017-11-30 | 2018-05-08 | 北京南轩兴达电子科技有限公司 | Full-automatic silicon wafer cleaning machine |
| CN108568427A (en) * | 2018-06-22 | 2018-09-25 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon chip |
| CN218730860U (en) * | 2022-08-24 | 2023-03-24 | 江苏润阳光伏科技有限公司 | Silicon wafer cleaning machine |
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| US20040055621A1 (en) * | 2002-09-24 | 2004-03-25 | Air Products And Chemicals, Inc. | Processing of semiconductor components with dense processing fluids and ultrasonic energy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999458A (en) * | 2017-11-30 | 2018-05-08 | 北京南轩兴达电子科技有限公司 | Full-automatic silicon wafer cleaning machine |
| CN108568427A (en) * | 2018-06-22 | 2018-09-25 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon chip |
| CN218730860U (en) * | 2022-08-24 | 2023-03-24 | 江苏润阳光伏科技有限公司 | Silicon wafer cleaning machine |
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