CN220717012U - Crystal support cleaning device and crystal support separation production line - Google Patents

Abstract

The embodiment of the application provides a crystal support belt cleaning device and crystal support separation production line, belongs to crystal support technical field. The crystal support cleaning device comprises an ultrasonic cleaning tank, an ultrasonic generator and a heating component, wherein the ultrasonic cleaning tank is used for containing cleaning media, the ultrasonic generator is arranged in the ultrasonic cleaning tank and comprises an ultrasonic vibrator, the ultrasonic vibrator is used for providing vibration waves for the cleaning media in the ultrasonic cleaning tank so as to carry out ultrasonic cleaning on a crystal supporting plate positioned in the ultrasonic cleaning tank, the heating component is positioned in the ultrasonic cleaning tank, and the heating component is used for heating and controlling the temperature of the cleaning media in the ultrasonic cleaning tank. The crystal support cleaning device can carry out ultrasonic cleaning on the crystal support plate after the glue cleaning pretreatment, and has a good cleaning effect.

Description

Crystal support cleaning device and crystal support separation production line

Technical Field

The application relates to the technical field of crystal support, in particular to a crystal support cleaning device and a crystal support separation production line.

Background

At present, in the cutting process in the field of silicon wafer manufacturing, a silicon rod is required to be adhered to one surface of a resin plate or a plastic plate by using bi-component glue before the steel wire cutting is carried out on the crystal rod, the other surface of the plate is adhered to a crystal support by using another bi-component glue, the crystal support, the plate and the silicon rod are obtained by overlapping from top to bottom in sequence, different glues are respectively used for adhering the crystal support and the silicon rod and between the plate and the crystal support, and the crystal support is adhered to form a whole convenient silicon rod slice. After cutting, the silicon wafer, the plate and the wafer supporting plate are required to be separated to obtain a semi-finished product of the silicon wafer, and the wafer supporting plate is required to be reused.

However, the glue degumming temperature between the plate and the crystal supporting plate is higher, the degumming method in the prior art generally carries out degumming by a water boiling mode, and glue or silicon mud and the like still adhere to the crystal supporting plate after degumming, so that the problems of limited degumming effect and insufficient degumming exist.

Disclosure of Invention

The embodiment of the application provides a crystal support belt cleaning device and crystal support separation production line, can carry out ultrasonic cleaning to the crystal layer board after clear glue preliminary treatment, and cleaning effect is good.

The embodiment of the application provides a crystal support cleaning device, the crystal support cleaning device includes ultrasonic cleaning pond, ultrasonic generator and heating element, and ultrasonic cleaning pond is used for holding cleaning medium, and ultrasonic generator sets up in ultrasonic cleaning pond, and ultrasonic generator includes the ultrasonic vibrator, and the ultrasonic vibrator is used for providing the vibration wave to the cleaning medium in the ultrasonic cleaning pond to carry out ultrasonic cleaning to the crystal layer board that is located in the ultrasonic cleaning pond; the heating part is arranged in the ultrasonic cleaning tank and is used for heating and controlling the temperature of the cleaning medium in the ultrasonic cleaning tank.

In this scheme, owing to still adhere to residual gum and silicon mud on the brilliant layer board behind brilliant layer board and the backing plate separation, through providing ultrasonic cleaning pond, splendid attire has the cleaning medium in ultrasonic cleaning pond, installs ultrasonic vibrator on the ultrasonic cleaning pond, and ultrasonic vibrator can produce the ultrasonic wave, and heating element can carry out heating accuse temperature to the cleaning medium in ultrasonic cleaning pond, maintains the cleaning medium and is in suitable temperature, can not influence the cleaning performance of brilliant layer board because of outside temperature environment. When the crystal supporting plate is cleaned, vibration is transmitted to the crystal supporting plate by using a cleaning medium as a transmission medium, and the residual dirt on the crystal supporting plate is directly or indirectly acted, so that a dirt layer on the crystal supporting plate is dispersed, emulsified and stripped to achieve the cleaning purpose, the cleaning effect is good, the cleanliness of the cleaned crystal supporting plate is higher, and the subsequent repeated use of the crystal supporting plate is facilitated.

In some embodiments, the ultrasonic cleaning tank includes a bottom wall and a side wall disposed at an outer peripheral edge of the bottom wall and extending upward, and the ultrasonic vibrator is disposed at the bottom wall and/or the side wall of the ultrasonic cleaning tank.

In some embodiments, the side walls include a first side wall and a second side wall facing each other and spaced apart, and the ultrasonic vibrator is disposed at the first side wall, the second side wall, and the bottom wall.

Among the above-mentioned technical scheme, through setting up ultrasonic vibrator in first lateral wall, second lateral wall and diapire, when guaranteeing to brilliant layer board cleaning performance, reasonable control cost.

In some embodiments, a side of the ultrasonic cleaning tank along the first direction is provided with a secondary tank body, the ultrasonic cleaning tank is provided with a first liquid outlet, the secondary tank body is provided with a first liquid inlet, and the first liquid inlet is communicated with the first liquid outlet; be provided with the second leakage fluid dram on the vice cell body, be provided with first liquid return mouth on the ultrasonic cleaning pond, the second leakage fluid dram passes through filter and first liquid return mouth intercommunication, is provided with the clean line between second leakage fluid dram and the first liquid return mouth, is provided with filter and water pump on the clean line.

In the above technical scheme, because the cleaning medium in the ultrasonic cleaning tank cleans impurities such as silicon mud on the crystal support plate, the impurities can remain in the ultrasonic cleaning tank to influence the water quality of the cleaning medium. Through being provided with vice cell body in one side of ultrasonic cleaning pond, the water in the ultrasonic cleaning pond can flow into in vice cell body through first leakage fluid dram, be connected with the clean line between vice cell body and the ultrasonic cleaning pond, be provided with filter and water pump on the clean line, utilize the water pump to take out the cleaning medium in the vice cell body and introduce in the filter, the filter can be to in the ultrasonic cleaning pond with cleaning medium discharge in after filtering cleaning medium, accomplish cleaning medium's circulation, the quality of water condition of cleaning medium in the ultrasonic cleaning pond has been improved.

In some embodiments, the side of the ultrasonic cleaning tank facing away from the auxiliary tank body faces the auxiliary tank body, and the inner surface of the bottom wall of the ultrasonic cleaning tank is provided with a downward inclined guide inclined surface, and the guide inclined surface is configured to guide impurities deposited in the ultrasonic cleaning tank to move towards the first liquid inlet of the auxiliary tank body.

In the above technical scheme, because the ultrasonic cleaning pond is to after impurity such as silicon mud on the brilliant layer board washs, impurity can stay in the ultrasonic cleaning pond, through having the decurrent direction inclined plane of slope at the diapire internal surface in ultrasonic cleaning pond, the direction inclined plane can guide the impurity of ultrasonic cleaning in the pond deposit to the direction removal of the drain of vice cell body under the effect of slope for impurity gathers in vice cell body, does benefit to follow-up together discharge impurity through the drain, when the impurity in the clearance ultrasonic cleaning pond like this, does not need to change the cleaning medium in the whole ultrasonic cleaning pond completely.

In some embodiments, the angle between the guide ramp and the horizontal is α, satisfying: alpha is more than or equal to 1 degree and less than or equal to 10 degrees.

In some embodiments, be provided with the blocking portion in the vice cell body, the blocking portion sets up on the diapire of vice cell body and extends towards the top, with the inner chamber of vice cell body separate into first cavity and second cavity, the cavity height in the blocking portion is less than vice cell body is high so that the upside area of first cavity and the upside area intercommunication of second cavity, the height of first inlet is less than the height of blocking portion, clean pipe way and second cavity intercommunication, the bottom of first cavity is provided with first drain, the end of first drain is provided with first blowoff valve.

Among the above-mentioned technical scheme, because clean line and vice cell body intercommunication, in order to avoid the water pump to draw together in the filter with the impurity in the vice cell body and aggravate the filtration burden of filter, through being provided with the blocking portion in vice cell body, blocking portion separates the inner chamber of vice cell body into first cavity and second cavity, and the high cavity height that is less than in the vice cell body of blocking portion makes the upside area of first cavity and the upside area intercommunication of second cavity, like this first cavity can block a part impurity and stay in first cavity, avoid a large amount of impurity to cross blocking portion and get into after the second cavity and then in the filter, cause the filter trouble. Only the first drain valve is required to be opened regularly, and impurities remained in the first cavity are discharged by utilizing the first drain outlet.

In some embodiments, a second drain is provided at the bottom of the second cavity, and a second drain valve is provided at the end of the second drain.

In the above technical scheme, still have a part impurity to get into in the second cavity through blocking portion in the first cavity, through being provided with the second drain in the bottom of second cavity, open the second blowoff valve, can utilize the impurity in the second drain discharge second cavity.

In some embodiments, the wafer carrier cleaning apparatus further comprises a workpiece lifting assembly comprising a carriage for holding the wafer carrier, the carriage being disposed within the ultrasonic cleaning tank or the carriage being selectively movable up and down within the ultrasonic cleaning tank to submerge the wafer carrier in the cleaning medium or to emerge from the cleaning medium.

Among the above-mentioned technical scheme, through being provided with the bracket in ultrasonic cleaning pond, the bracket can play the bearing effect to the brilliant layer board, does benefit to the ultrasonic cleaning of cleaning medium to the brilliant layer board, perhaps can utilize the reciprocates of bracket, makes the brilliant layer board submergence at the cleaning medium or expose from the cleaning medium, can satisfy the transfer demand of follow-up brilliant layer board.

In some embodiments, the carrier includes a support portion and a support column disposed vertically on the support portion, the support column for supporting the wafer pallet for spacing a bottom of the wafer pallet from the support portion.

In the above technical scheme, through being provided with the support column on the bracket, the support column can be so that the bottom and the supporting portion of brilliant layer board are spaced apart to make the brilliant layer board can be more abundant with cleaning medium contact, do benefit to the cleaning effect of guaranteeing the brilliant layer board, reduce and wash the blind area.

In some embodiments, the bracket further comprises a connecting part, the connecting part is connected with the bearing part, and the upper end of the connecting part extends out of the ultrasonic cleaning tank; the workpiece lifting assembly further comprises a lifting driving piece, and the driving end of the lifting driving piece is in driving connection with the upper end of the connecting portion and used for driving the bearing portion to move in the vertical direction.

In the above technical scheme, the connecting part through the bracket can outwards extend from the ultrasonic cleaning tank, and the driving end of the lifting driving piece is in driving connection with the upper end of the connecting part, so that the bearing part can be driven to move along the vertical direction, the up-down lifting of the bracket is realized, and the transfer requirement of the crystal supporting plate is met.

In some embodiments, the two connecting portions are respectively disposed at two ends of the supporting portion in the length direction.

In the above technical scheme, through setting up connecting portion into two, connecting portion department corresponds and is provided with lifts the driving piece for the both ends of the length direction of bracket realize oscilaltion in step, compare in one lifts the driving piece, stability is higher, avoids appearing the phenomenon that the brilliant layer board dropped because of the bracket slope.

In some embodiments, the bearing part is provided with a cleaning position and a position to be grabbed in the vertical direction, and the lifting driving piece drives the bearing part to move so as to enable the bearing part to move between the cleaning position and the position to be grabbed; when the bearing part is positioned at the cleaning position, the bearing part is positioned in the ultrasonic cleaning tank so that the crystal supporting plate on the bearing part is immersed by the cleaning medium; when the bearing part is at the position to be grasped, the crystal supporting plate on the bearing part is exposed from the cleaning medium.

In some embodiments, the workpiece lift assembly is configured in plurality, and the plurality of workpiece lift assemblies are spaced apart in the first direction.

Among the above-mentioned technical scheme, through setting up the work piece with the subassembly of lifting to a plurality of, be provided with a plurality of stations of lifting in ultrasonic cleaning pond promptly, and every work piece lifts the subassembly independent operation, can satisfy and wash the while of carrying out a plurality of brilliant layer boards, improve the cleaning efficiency to brilliant layer board.

In some embodiments, the wafer support cleaning device further comprises a frame and a cleaning conveying line, wherein the frame is provided with a cleaning area and a conveying area distributed along a first direction, and the ultrasonic cleaning pool is arranged in the cleaning area; the cleaning conveying line is arranged in the conveying area and is used for conveying the crystal supporting plates subjected to the gel cleaning treatment along the second direction, and the second direction, the first direction and the vertical direction are perpendicular to each other.

Among the above-mentioned technical scheme, the frame divide into two regions of washing district and conveying area, and ultrasonic cleaning pond sets up in the washing district, and utilizes the washing transfer chain can carry the brilliant layer board after clear gluey processing voluntarily, does not need the manual work to carry the brilliant layer board, and the conveying efficiency of brilliant layer board is higher.

In some embodiments, the wafer carrier cleaning device further comprises a grabbing unit, wherein the grabbing unit is arranged on the frame and used for moving between the conveying area and the cleaning area so as to transfer the wafer carrier on the cleaning conveying line to a bracket of the ultrasonic cleaning pool; or transferring the crystal supporting plate after the cleaning in the ultrasonic cleaning tank to a cleaning conveying line.

According to the technical scheme, the grabbing unit is arranged on the frame and can move between the conveying area and the cleaning area, and the grabbing unit can be used for transferring the crystal support plates on the cleaning conveying line to the bracket of the ultrasonic cleaning pool; or, transfer the crystal support plate after the completion of cleaning in the ultrasonic cleaning pond to the cleaning conveying line, do not need the human participation to improve the cleaning efficiency of crystal support belt cleaning device, degree of automation is higher.

In some embodiments, the grabbing unit comprises a guide rail, a transverse moving plate, a grabbing part, a transverse moving driving unit and a lifting driving unit, wherein the guide rail is arranged on the frame in a extending manner along a first direction; the transverse moving plate is provided with a sliding block, and is in sliding fit with the guide rail through the sliding block; the grabbing part is arranged on the transverse moving plate and used for grabbing and cleaning a crystal supporting plate on the conveying line or a crystal supporting plate on the workpiece lifting assembly; the driving end of the transverse moving driving unit is in driving connection with the transverse moving plate, and the transverse moving driving unit is used for driving the transverse moving plate to move along the first direction on the frame; the lifting driving unit is arranged on the transverse moving plate and is used for driving the grabbing part to move along the vertical direction.

Among the above-mentioned technical scheme, through being provided with the unit of snatching, the effect of snatching the unit is snatched and is shifted the brilliant layer board, and sideslip drive unit and lift drive unit both cooperate, and sideslip drive unit can drive the sideslip board and remove along first direction in the frame to make the portion of snatching can remove between conveying district and washing district, and lift drive unit can drive the portion of snatching and follow vertical direction and go up and down, thereby realize snatching the brilliant layer board.

In some embodiments, the grabbing portion includes a guide shaft, a fixing plate and a magnetic absorption member, the guide shaft is connected with the driving end of the lifting driving unit, the fixing plate is mounted at the tail end of the guide shaft, the magnetic absorption member is mounted on the fixing plate, the magnetic absorption member absorbs the crystal supporting plate through magnetic force, the proximity switch is arranged on the fixing plate, and the proximity switch is used for judging whether the grabbing portion absorbs the crystal supporting plate.

Among the above-mentioned technical scheme, because brilliant layer board is the metal material, through adopting the grabbing portion as magnetism absorbing member, magnetism absorbing member adsorbs brilliant layer board through magnetic force, and then realizes firmly snatching brilliant layer board, through being provided with proximity switch on the fixed plate, proximity switch can play discernment judgement effect to guarantee that grabbing portion effectively snatchs brilliant layer board.

In a second aspect, an embodiment of the present application further provides a crystal support separation production line, where the crystal support separation production line includes the foregoing crystal support cleaning device.

Additional features and advantages of the present application will be set forth in the detailed description which follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an ultrasonic cleaning tank in a wafer carrier cleaning device according to some embodiments of the present disclosure;

FIG. 2 is a schematic view showing a structure in which the ultrasonic vibrator of FIG. 1 is installed in an ultrasonic cleaning tank;

FIG. 3 is a schematic view illustrating another angle of a wafer carrier cleaning apparatus according to some embodiments of the present disclosure;

FIG. 4 is a front cross-sectional view of an ultrasonic cleaning tank provided in some embodiments of the present application;

fig. 5 is a schematic structural diagram of a secondary tank provided in some embodiments of the present application;

FIG. 6 is a schematic diagram of a workpiece lift assembly according to some embodiments of the present application;

FIG. 7 is a schematic diagram of a wafer pallet according to some embodiments of the present disclosure;

FIG. 8 is a schematic diagram illustrating a structure of a wafer carrier cleaning apparatus according to some embodiments of the present disclosure;

fig. 9 is a schematic structural diagram of a cleaning conveyor line in a wafer carrier cleaning device according to some embodiments of the present disclosure;

FIG. 10 is a schematic diagram illustrating a frame of a crystal tray cleaning apparatus according to some embodiments of the present disclosure;

FIG. 11 is a schematic view of the frame of FIG. 10 after being covered with a baffle;

fig. 12 is a schematic structural diagram of a gripping unit in a wafer carrier cleaning device according to some embodiments of the present disclosure;

FIG. 13 is a schematic view of the mating of the traversing plate and rail of FIG. 12;

FIG. 14 is a schematic view of the traverse driving unit in FIG. 12;

FIG. 15 is a schematic view of the elevating driving unit in FIG. 12;

fig. 16 is a schematic view of the structure of the gripping portion in fig. 12.

Icon: 500-a crystal support cleaning device; 510-a frame; 511-an upper frame; 512-lower frame; 513-baffle; 514-support bars; 515-supporting feet; 520-an ultrasonic cleaning tank; 521-a bottom wall; 522-sidewalls; 5220-a first sidewall; 5221-second side wall; 523-ultrasonic vibrator; 524-heating means; 525-a first liquid return port; 526-a guide ramp; 530-a secondary tank; 531-a first liquid inlet; 533-purge line; 534-a filter; 535-a water pump; 536-a barrier; 537-a first chamber; 5370-a first drain; 5371-a first blow-down valve; 538-a second cavity; 5380-a second drain; 5381 a second blowdown valve; 539-a liquid level sensor; 5391-a water make-up line; 540-a workpiece lift assembly; 541-brackets; 5411-a support; 5412-support columns; 5413-connection; 5414-lifting the drive; 5416-first linear bearing; 550-cleaning a conveying line; 551-a water receiving box; 552-a drain; 553, a water baffle; 560-a gripping unit; 561-rail; 562-traversing plates; 563-slider; 564-a traverse driving unit; 5640-a first servomotor; 5641-speed reducer; 5642-gear; 5643-rack; 565-a lifting drive unit; 5650-a second servomotor; 5651-elevator; 5652-screw; 5653-a protective sleeve; 5654-a connection flange; 566-a grip; 5660-guide shaft; 5661-fixing plate; 5662-magnetic absorbing member; 5663-a spring; 5664-spring shaft; 5665-a second linear bearing; 5666-proximity switch; 570-an axial flow fan; 580-touch screen; 81-crystal supporting plates; x-a first direction; y-a second direction; z-vertical direction.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the embodiments of the present application, it should be noted that, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is conventionally put in use of the product of the application, only for convenience of description and simplification of the description, and is not indicative or implying that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present application, it should also be noted that, unless explicitly stated and limited otherwise, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

Examples

The embodiment of the application provides a crystal support separation production line, crystal support separation transfer chain are used for separating crystal layer board and backing plate, and crystal support belt cleaning device that crystal support separation production line included is used for wasing through the cull or the silica mud after clear up in advance on the crystal layer board after separating with the backing plate to crystal support belt cleaning device.

Specifically, referring to fig. 1 to 3, the wafer carrier cleaning apparatus 500 includes an ultrasonic cleaning tank 520, an ultrasonic generator and a heating component 524, the ultrasonic cleaning tank 520 is used for accommodating a cleaning medium, the ultrasonic generator is disposed in the ultrasonic cleaning tank 520, the ultrasonic generator includes an ultrasonic vibrator 523, the ultrasonic vibrator 523 is used for providing a vibration wave to the cleaning medium in the ultrasonic cleaning tank 520 so as to ultrasonically clean the wafer carrier 81 located in the ultrasonic cleaning tank 520, the heating component 524 is disposed in the ultrasonic cleaning tank 520, and the heating component 524 is used for heating and controlling the temperature of the cleaning medium in the ultrasonic cleaning tank 520.

In this scheme, because crystal layer board 81 and backing plate separation back still have adhesive residue and silicon mud on the crystal layer board 81, through providing ultrasonic cleaning pond 520, splendid attire has the cleaning medium in ultrasonic cleaning pond 520, installs ultrasonic vibrator 523 on the ultrasonic cleaning pond 520, and ultrasonic vibrator 523 can produce the ultrasonic wave, and heating element 524 can carry out heating accuse temperature to the cleaning medium of ultrasonic cleaning pond 520, keeps the cleaning medium to be in suitable temperature, can not influence the cleaning performance of crystal layer board 81 because of outside temperature environment. When the crystal supporting plate 81 is cleaned, vibration is transmitted to the crystal supporting plate 81 by using a cleaning medium as a transmission medium, and the residual dirt on the crystal supporting plate 81 is directly or indirectly acted, so that a dirt layer on the crystal supporting plate 81 is dispersed, emulsified and peeled off to achieve the cleaning purpose, the cleaning effect is good, the cleaned crystal supporting plate 81 has higher cleanliness, and the crystal supporting plate 81 is beneficial to subsequent repeated use.

The cleaning medium may be various, for example, water or a cleaning solution formed by mixing a cleaning liquid with water. In this embodiment, the cleaning medium is water; the heating component 524 may have various structures, the heating component 524 may be a heating pipe, and steam may be introduced into the heating pipe, and of course, the heating component 524 may also be an electric heating wire or a heater.

In some embodiments, the ultrasonic cleaning tank 520 includes a bottom wall 521 and a side wall 522 provided along the outer periphery of the bottom wall 521 and extending upward, and the ultrasonic vibrator 523 is provided to the bottom wall 521 and/or the side wall 522 of the ultrasonic cleaning tank 520.

It will be appreciated that the ultrasonic vibrator 523 may be reasonably disposed in the ultrasonic cleaning tank 520 according to practical situations, and the ultrasonic vibrator 523 may have various arrangements on the ultrasonic cleaning tank 520, for example, the ultrasonic vibrator 523 may be disposed on one or more side walls 522 of the ultrasonic cleaning tank 520 or may be disposed on a bottom wall 521 of the ultrasonic cleaning tank 520, and of course, the side walls 522 and the bottom wall 521 of the ultrasonic cleaning tank 520 are provided with the ultrasonic vibrator 523.

In some embodiments, as shown in fig. 2, the side wall 522 includes a first side wall 5220 and a second side wall 5221 facing each other and spaced apart, and the ultrasonic vibrator is provided at the first side wall 5220, the second side wall 5221 and the bottom wall 521. By arranging the ultrasonic vibrator on the first side wall 5220, the second side wall 5221 and the bottom wall 521, the cleaning effect of the wafer pallet 81 is ensured and the cost is reasonably controlled.

Specifically, the total power of the plurality of ultrasonic vibrators 523 is 15Kw-25Kw, the single vibrator power is 40w-70w, and the plurality of ultrasonic vibrators 523 are uniformly arranged on the first side wall 5220, the second side wall 5221 and the bottom wall 521 of the ultrasonic cleaning tank 520. In some embodiments of the present application, the bottom wall 521 has 300 ultrasound transducers 523 in total; the first side wall 5220 and the second side wall 5221 are provided with 50 ultrasonic vibrators 523, respectively.

The rated frequency of the single ultrasonic vibrator 523 is 25KHz-35KHz, and the vibration is transmitted to the crystal support by using water as a transmission medium, so that the silicon mud is cleaned. The ultrasonic vibrator 523 is a purchased product and is connected to the ultrasonic cleaning tank 520 by a special sealant.

In some embodiments, referring to fig. 3 and 5, a side of the ultrasonic cleaning tank 520 along the first direction X is provided with a secondary tank 530, the ultrasonic cleaning tank 520 is provided with a first liquid outlet, the secondary tank 530 is provided with a first liquid inlet 531, and the first liquid inlet 531 is communicated with the first liquid outlet; be provided with the second leakage fluid dram on the vice cell body 530, be provided with first liquid return port 525 on the ultrasonic cleaning pond 520, the second leakage fluid dram passes through filter 534 and first liquid return port 525 intercommunication, is provided with the clean line 533 between second leakage fluid dram and the first liquid return port 525, is provided with filter 534 and water pump 535 on the clean line 533. After the cleaning medium in the ultrasonic cleaning tank 520 cleans impurities such as silicon mud on the wafer pallet 81, the impurities remain in the ultrasonic cleaning tank 520, which affects the water quality of the cleaning medium. Through being provided with vice cell body 530 in one side of ultrasonic cleaning pond 520, the water in the ultrasonic cleaning pond 520 can flow into in vice cell body 530 through first leakage fluid dram, be connected with the clean line 533 through between vice cell body 530 and the ultrasonic cleaning pond 520, be provided with filter 534 and water pump 535 on the clean line 533, utilize water pump 535 to take out the cleaning medium in the vice cell body 530 and introduce in filter 534, filter 534 can be to in ultrasonic cleaning pond 520 with the cleaning medium discharge after filtering, accomplish the circulation of cleaning medium, the quality of water condition of the cleaning medium in the ultrasonic cleaning pond 520 has been improved.

The filter 534 may be a basket filter, and the first liquid return port 525 may be distributed in multiple points on the ultrasonic tank. In addition, because the impurity in the ultrasonic cleaning tank 520 is required to be cleaned regularly, so that the amount of cleaning medium in the ultrasonic cleaning is reduced, a liquid level sensor 539 can be arranged in the auxiliary tank body 530, the liquid level sensor 539 is used for monitoring the liquid level of the cleaning medium in the auxiliary tank body 530, the ultrasonic cleaning tank 520 is also connected with a water supplementing pipeline 5391, and when the liquid level monitored by the liquid level sensor 539 is lower than a threshold value, the water supplementing pipeline 5391 automatically supplements the cleaning medium in the ultrasonic cleaning tank 520, so that the storage amount of the cleaning medium in the ultrasonic cleaning tank 520 meets the requirement.

In some embodiments, referring to fig. 4, the ultrasonic cleaning tank 520 has a bottom wall 521 with an inner surface having a downwardly sloped guiding slope 526 in a direction away from the side of the sub-tank 530 toward the sub-tank 530, the guiding slope 526 being configured to guide impurities deposited in the ultrasonic cleaning tank 520 to move toward the first liquid inlet 531 of the sub-tank 530. Because the ultrasonic cleaning tank 520 cleans impurities such as silicon mud on the crystal support plate 81, the impurities can stay in the ultrasonic cleaning tank 520, the inner surface of the bottom wall 521 of the ultrasonic cleaning tank 520 is provided with the inclined downward guide inclined plane 526, the guide inclined plane 526 can guide the impurities deposited in the ultrasonic cleaning tank 520 to move towards the direction of the drain outlet of the auxiliary tank 530 under the action of the gradient, so that the impurities are converged in the auxiliary tank 530, and can be discharged together through the drain outlet, thus the cleaning medium in the whole ultrasonic cleaning tank 520 does not need to be completely replaced when the impurities in the ultrasonic cleaning tank 520 are cleaned.

The tank body of the ultrasonic cleaning tank 520 may be made of various materials, such as steel, iron, or masonry structure. In this embodiment, the tank is made of stainless steel 304.

In some embodiments, the angle α between the guiding ramp 526 and the horizontal is such that: alpha is more than or equal to 1 degree and less than or equal to 10 degrees.

Illustratively, the following are satisfied: alpha is more than or equal to 2 degrees and less than or equal to 5 degrees. For example, α may be 2 °, 3 °, 4 °, or 5 °. When the angle between the guide slope 526 and the horizontal plane satisfies the above condition, the impurities at the bottom of the tank can be moved to the sub-tank 530 by the gravity, and the dimension of the ultrasonic cleaning tank 520 in the thickness direction is not excessively large because the guide slope 526 is excessively inclined.

In this embodiment, α has a value of 3 °, and impurities such as silicon mud at the bottom of the ultrasonic cleaning tank 520 can be made to flow into the sub tank 530 by a slope.

In some embodiments, referring to fig. 5, a blocking portion 536 is disposed in the auxiliary tank 530, the blocking portion 536 is disposed on the bottom wall 521 of the auxiliary tank 530 and extends upward to divide the inner cavity of the auxiliary tank 530 into a first cavity 537 and a second cavity 538, the height of the blocking portion 536 is smaller than the height of the cavity in the auxiliary tank 530 so that the upper region of the first cavity 537 and the upper region of the second cavity 538 are communicated, the height of the first liquid inlet 531 is smaller than the height of the blocking portion 536, the purifying pipeline 533 is communicated with the second cavity 538, the bottom of the first cavity 537 is provided with a first sewage outlet 5370, and the end of the first sewage outlet 5370 is provided with a first sewage drain valve 5371. Because the purifying pipeline 533 is communicated with the auxiliary tank 530, in order to avoid that the water pump 535 pumps impurities in the auxiliary tank 530 into the filter 534 together to increase the filtering burden of the filter 534, the blocking part 536 is arranged in the auxiliary tank 530, the inner cavity of the auxiliary tank 530 is divided into the first cavity 537 and the second cavity 538 by the blocking part 536, and the height of the blocking part 536 is smaller than that of the cavity in the auxiliary tank 530 so as to enable the upper side area of the first cavity 537 to be communicated with the upper side area of the second cavity 538, thus the first cavity 537 can block a part of impurities from staying in the first cavity 537, and a large amount of impurities are prevented from entering the second cavity 538 and then entering the filter 534 after passing through the blocking part 536, thereby causing the filter 534 to be failed. Only the first drain valve 5371 needs to be opened periodically, and impurities remained in the first chamber 537 are discharged by the first drain outlet 5370.

In some embodiments, a bottom of the second cavity 538 is provided with a second drain 5380, and a terminal end of the second drain 5380 is provided with a second drain valve 5381. Still there is some impurity in the first chamber 537 and enters the second chamber 538 through the blocking portion 536, and by providing the second drain 5380 at the bottom of the second chamber 538 and opening the second drain valve 5381, the impurity in the second chamber 538 can be discharged through the second drain 5380.

In some embodiments, referring to fig. 6 and 7, the wafer carrier cleaning apparatus further includes a workpiece lifting assembly 540, the workpiece lifting assembly 540 includes a bracket 541 for supporting the wafer carrier 81, and the bracket 541 is disposed in the ultrasonic cleaning tank 520 or the bracket 541 is selectively movable up and down in the ultrasonic cleaning tank 520 to submerge the wafer carrier 81 in the cleaning medium or to be exposed from the cleaning medium. Through being provided with bracket 541 in ultrasonic cleaning pond 520, bracket 541 can play the bearing effect to brilliant layer board 81, does benefit to the ultrasonic cleaning of cleaning medium to brilliant layer board 81, perhaps can utilize the reciprocates of bracket 541, makes brilliant layer board 81 submergence in the cleaning medium or expose from the cleaning medium, can satisfy the transfer demand of follow-up brilliant layer board 81.

In some embodiments, the bracket 541 includes a support 5411 and a support column 5412, the support column 5412 being vertically disposed on the support 5411, the support column 5412 for supporting the wafer pallet 81 for spacing a bottom of the wafer pallet 81 from the support 5411. Through being provided with support column 5412 on the bracket 541, support column 5412 can make the bottom and the supporting portion 5411 of brilliant layer board 81 spaced apart to make brilliant layer board 81 can be more abundant with cleaning medium contact, do benefit to the cleaning performance of guaranteeing brilliant layer board 81, reduce the washing blind area.

In this embodiment, the number of the support columns 5412 is four, and the four support columns 5412 are disposed at intervals along the second direction Y in the supporting portion 5411, so as to meet the supporting requirements of different types of wafer supporting plates 81.

In some embodiments, the bracket 541 further includes a connection portion 5413, where the connection portion 5413 is connected to the support portion 5411, and an upper end of the connection portion 5413 protrudes from the ultrasonic cleaning tank 520; the workpiece lifting assembly 540 further includes a lifting driving member 5414, wherein a driving end of the lifting driving member 5414 is in driving connection with an upper end of the connecting portion 5413, so as to drive the supporting portion 5411 to move along the vertical direction Z. The connecting part 5413 of the bracket 541 can extend outwards from the ultrasonic cleaning tank 520, and the driving end of the lifting driving piece 5414 is in driving connection with the upper end of the connecting part 5413, so that the supporting part 5411 can be driven to move along the vertical direction Z, and the bracket 541 can be lifted up and down to meet the transfer requirement of the wafer supporting plate 81.

The lifting driving member 5414 may be a variety of driving mechanisms, for example, the lifting driving member 5414 may be a cylinder, a hydraulic cylinder, an electric push rod, a screw 5652 nut pair mechanism, a gear 5642 rack 5643 mechanism, or the like, and in this embodiment, the lifting driving member 5414 is a cylinder. The connection portion 5413 includes a vertical section and a horizontal section, and is L-shaped; the lower extreme of vertical section is connected in supporting portion 5411, and the upper end of vertical section is connected in the horizontal segment, and the horizontal segment is connected with the drive end of lifting drive piece 5414.

Of course, in the case where the lifting driving member 5414 is an air cylinder, in order to better ensure the stability of the lifting of the bracket 541, the workpiece lifting assembly 540 may further include a guide member including a first linear bearing 5416 and a guide rod extending in the vertical direction Z, and the end of the horizontal segment is slidably engaged with the guide rod through the first linear bearing 5416. By utilizing the sliding fit of the first linear bearing 5416 and the guide rod, the guide bracket 541 can be guided to rise and fall upwards and downwards in a directional manner, so that the stability is higher, the rising and falling of the crystal supporting plate 81 are more stable, and the phenomenon that the crystal supporting plate 81 falls is avoided. The bracket 541 may be a stainless steel square pipe 40mm×40mm, so as to prevent the influence of water vapor in the water tank.

In some embodiments, the connecting portions 5413 are two and are respectively disposed at two ends of the supporting portion 5411 in the length direction. Through setting up connecting portion 5413 into two, connecting portion 5413 department corresponds and is provided with lifts driving piece 5414 for the synchronous realization of the both ends of the length direction of bracket 541 goes up and down, compares in one lifts driving piece 5414, and stability is higher, avoids appearing the phenomenon that crystal support plate 81 dropped because of the bracket 541 slope.

Accordingly, in the case where the lift driving member 5414 is selected as the air cylinder, the number of air cylinders is two, and the two air cylinders are respectively connected to the two connection portions 5413 at both ends of the bracket 541 in the length direction, so as to drive the bracket 541 to lift up and down in the vertical direction Z.

In some embodiments, the support 5411 has a cleaning position and a position to be grasped in the vertical direction Z, and the lift driver 5414 drives the support 5411 to move so as to move the support 5411 between the cleaning position and the position to be grasped; when the supporting portion 5411 is at the cleaning position, the supporting portion 5411 is positioned in the ultrasonic cleaning tank 520 so that the wafer pallet 81 on the supporting portion 5411 is immersed by the cleaning medium; when the supporting portion 5411 is at the position to be grasped, the wafer pallet 81 on the supporting portion 5411 is exposed from the cleaning medium.

It can be appreciated that when the supporting portion 5411 is at the cleaning position, that is, the supporting portion 5411 is located in the ultrasonic cleaning tank 520, if the supporting portion 5411 has the crystal supporting plate 81 thereon, then the crystal supporting plate 81 is immersed in the cleaning medium, after the crystal supporting plate 81 is cleaned, the lifting driving member 5414 lifts the supporting portion 5411 from the cleaning position to the position to be gripped, so that the crystal supporting plate 81 on the supporting portion 5411 is exposed from the cleaning medium, and the subsequent crystal supporting plate 81 is conveniently gripped and transferred, and of course, if the supporting portion 5411 is at the position to be gripped, and the supporting portion 5411 has no crystal supporting plate 81 thereon, the subsequent gripping unit 560 is also conveniently placed on the supporting portion 5411 with the crystal supporting plate 81 to be cleaned.

In some embodiments, referring to fig. 8, the workpiece lift assembly 540 is configured in plurality, and the plurality of workpiece lift assemblies 540 are spaced apart in the first direction X. Through setting up the work piece with the work piece lift subassembly 540 to a plurality ofly, be provided with a plurality of stations of lifting in ultrasonic cleaning pond 520 promptly, and every work piece lift subassembly 540 independent operation can satisfy and wash the while of carrying out a plurality of brilliant layer boards 81, improves the cleaning efficiency to brilliant layer board 81.

In some embodiments, referring to fig. 8 and 9, the susceptor cleaning apparatus further includes a frame 510 and a cleaning conveyor line 550, the frame 510 having a cleaning area and a conveying area distributed along a first direction X, the ultrasonic cleaning tank 520 being disposed in the cleaning area; the cleaning conveying line 550 is disposed in the conveying area, and the cleaning conveying line 550 is used for conveying the crystal supporting plates 81 after the photoresist cleaning treatment along the second direction Y, and the second direction Y, the first direction X and the vertical direction Z are perpendicular to each other. The frame 510 is divided into a cleaning area and a conveying area, the ultrasonic cleaning tank 520 is arranged in the cleaning area, and the wafer supporting plate 81 after the photoresist treatment can be automatically conveyed by utilizing the cleaning conveying line 550, so that the wafer supporting plate 81 does not need to be manually conveyed, and the conveying efficiency of the wafer supporting plate 81 is higher.

Wherein, the cleaning conveying line 550 adopts a special conveying belt mode of a chain plate type, the conveying speed is controlled by using a frequency converter, the load is 200mm/s, the chain plate and the frame 510 are made of stainless steel, and the effective size (length L multiplied by width W multiplied by height H) of the cleaning conveying line 550 is 1860mm multiplied by 240mm multiplied by 800mm.

Because the cleaning conveyor line 550 is used for conveying the crystal supporting plate 81 after the gel cleaning treatment, and the crystal supporting plate 81 after the gel cleaning treatment possibly adheres to moisture and the like, in order to ensure the cleanliness of the device, a water receiving box 551 is arranged below the cleaning conveyor line 550, the water receiving box 551 can be used for receiving the residual water on the crystal supporting plate 81 on the cleaning conveyor line 550, the water is collected, the cleanliness of the device is improved, and the water receiving box 551 is discharged to a sewage tank through a drain pipe 552.

In addition, referring to fig. 3, the ultrasonic cleaning tank 520 and the cleaning conveyor line 550 are at least partially spaced apart to form a gap, and a water baffle 553 covering the gap is disposed on the ultrasonic cleaning tank 520 and/or the cleaning conveyor line 550, and the water baffle 553 can prevent moisture on the wafer pallet 81 from dropping into the gap between the ultrasonic cleaning tank 520 and the cleaning conveyor line 550 during the process of transferring the wafer pallet 81 from the cleaning conveyor line 550 to the ultrasonic cleaning tank 520.

In some embodiments, referring to fig. 8, the wafer carrier cleaning apparatus further includes a gripping unit 560, where the gripping unit 560 is disposed on the frame 510, and the gripping unit 560 is configured to move between a conveying area and a cleaning area to transfer the wafer carrier 81 on the cleaning conveying line 550 to the carrier 541 of the ultrasonic cleaning tank 520; or, the wafer pallet 81 after the completion of the cleaning in the ultrasonic cleaning bath 520 is transferred to the cleaning conveyor line 550. By providing the gripping unit 560 on the frame 510, the gripping unit 560 can be moved between the conveying area and the cleaning area, and the wafer pallet 81 on the cleaning conveyor line 550 can be transferred onto the carriage 541 of the ultrasonic cleaning tank 520 by the gripping unit 560; or, the wafer supporting plate 81 after the cleaning in the ultrasonic cleaning tank 520 is transferred to the cleaning conveying line 550 without human participation, so that the cleaning efficiency of the wafer supporting and cleaning device is improved, and the degree of automation is higher.

The working flow is as follows: the wafer pallet 81 to be cleaned is conveyed to a designated position by using the cleaning conveying line 550, the in-place sensor is triggered, the grabbing unit 560 grabs the wafer pallet 81 to be cleaned onto the bracket 541, then the cleaned wafer pallet 81 on the bracket 541 is transferred and placed on the cleaning conveying line 550, the cleaned wafer pallet is conveyed out of the device by using the cleaning conveying line 550, then the next wafer pallet 81 to be cleaned is conveyed to the designated position by using the cleaning conveying line 550, and the procedures are repeated.

For the frame 510, referring to fig. 10 and 11, a plurality of supporting feet 515 are provided at the bottom of the frame 510, and mounting holes are provided on the supporting feet 515, so that the frame 510 can be fixed on the bottom surface by penetrating bolts. The frame 510 is a rectangular frame structure, and the rectangular frame structure comprises a plurality of rectangular pipes and/or square pipes, wherein the types of the rectangular pipes can be 80mm multiplied by 80mm or 60mm multiplied by 40mm, the square pipes can be 80mm multiplied by 80mm or 40mm multiplied by 40mm, and two adjacent pipe fittings are welded and fixed. The frame 510 is divided into an upper layer and a lower layer in the vertical direction Z, the upper layer frame 511 is mainly provided for the grasping unit 560 to be arranged, and the lower layer frame 512 is provided for the cleaning conveyor line 550 and the ultrasonic cleaning tank 520 to be arranged. The lower frame 512 is provided with a plurality of support bars 514 for mounting the lift driving members 5414 on both sides of the ultrasonic cleaning tank 520 in the second direction Y, and the air cylinders are mounted on the support bars 514. In addition, the cleaning conveyor line 550 is disposed along the second direction Y and extends through the frame 510, the outer peripheral side of the frame 510 is covered with a baffle 513 except for the cleaning conveyor line 550, an axial flow fan 570 is disposed at the top of the frame 510, and the axial flow fan 570 generates negative pressure to pump out water vapor generated in the ultrasonic cleaning tank 520. A touch screen 580 is disposed on one side of the frame 510, and the touch screen 580 can set preset parameters of the wafer carrier cleaning device.

In some embodiments, referring to fig. 12 to 16, the gripping unit 560 includes a guide rail 561, a traverse plate 562, a gripping portion 566, a traverse driving unit 564, and a lifting driving unit 565, where the guide rail 561 is extended along a first direction X and disposed on the frame 510; the traversing plate 562 has a slider 563, and the traversing plate 562 is slidably engaged with the guide rail 561 through the slider 563; the grabbing portion 566 is disposed on the traverse plate 562, and the grabbing portion 566 is used for grabbing the wafer pallet 81 on the cleaning conveyor line 550 or the wafer pallet 81 on the workpiece lifting assembly 540; the driving end of the transverse moving driving unit 564 is in driving connection with the transverse moving plate 562, and the transverse moving driving unit 564 is used for driving the transverse moving plate 562 to move along the first direction X in the frame 510; the lifting driving unit 565 is disposed on the lateral sliding plate 562, and the lifting driving unit 565 is configured to drive the gripping portion 566 to move along the vertical direction Z. By being provided with the grabbing unit 560, the grabbing unit 560 is used for grabbing and transferring the wafer carrier 81, and the traversing driving unit 564 and the lifting driving unit 565 are matched, the traversing driving unit 564 can drive the traversing plate 562 to move along the first direction X on the frame 510, so that the grabbing portion 566 can move between the conveying area and the cleaning area, and the lifting driving unit 565 can drive the grabbing portion 566 to lift up and down along the vertical direction Z, so that grabbing of the wafer carrier 81 is achieved.

Wherein, the traversing plate 562 is mounted on the stand 510 through the guide rails 561, the number of the guide rails 561 is two, the two guide rails 561 are arranged at two opposite sides of the stand 510 along the second direction Y at intervals, and similarly, the two sides of the traversing plate 562 along the second direction Y are provided with the sliding blocks 563, so that the traversing plate 562 is in sliding fit with the guide rails 561. The traversing plate 562 is made of stainless steel, so that the influence of water vapor in the ultrasonic cleaning tank 520 is prevented, the traversing plate 562 is connected with the sliding blocks 563 through screws, the number of the sliding blocks 563 is 4, the sliding blocks 563 are bilaterally symmetrical, the sliding blocks 563 move along the guide rail 561, and the guide rail 561 is a heavy-load type ball linear guide 561; the number of the guide rails 561 is 2, and the guide rails are symmetrically arranged on the frame 510.

The traversing driving unit 564 provides a driving function for the traversing plate 562 to drive the traversing plate 562 to move along the first direction X, the traversing driving unit 564 may be a plurality of driving mechanisms, for example, the traversing driving unit 564 may be an air cylinder, a hydraulic cylinder, an electric push rod, a screw rod 5652 nut pair mechanism or a motor gear 5642 rack 5643 mechanism, in this embodiment, the traversing driving unit 564 adopts a motor gear 5642 rack 5643 driving mechanism, the traversing driving unit 564 includes a first servo motor 5640, a speed reducer 5641, a gear 5642 and a rack 5643, the rack 5643 is disposed on the upper frame 511 of the stand 510 along the first direction X, the first servo motor 5640 and the speed reducer are mounted on the traversing plate 562, the driving end of the speed reducer 5641 is meshed with the gear 5642, the gear 5642 is meshed with the rack 5643, and the gear 5642.5 modulus gear 5642 is meshed with the rack 5643 to realize the movement along the X axis direction, and the traversing driving function of the servo motor can drive the traversing plate 562 along the first direction X on the stand 510.

Similarly, the lifting driving unit 565 may be a plurality of driving mechanisms, which will not be described here again, and in this embodiment, the lifting driving unit 565 adopts a mode of driving the screw 5652. The lifting driving unit 565 comprises a lifting machine 5651, a servo motor and a screw rod 5652, wherein the lifting machine 5651 adopts a locking inverted WSH series worm gear lifting machine 5651, a driving source is a second servo motor 5650, a transmission mode of the lifting machine 5651 is screw rod transmission, so that movement in the vertical direction Z is achieved, a connecting flange 5654 is arranged at the lower end of the screw rod 5652, the connecting flange 5654 is connected with a fixing plate 5661 in the grabbing portion 566 through screws, a protective sleeve 5653 is arranged at the upper section of the screw rod 5652, and the protective sleeve 5653 provides a protective effect on the upper portion of the screw rod 5652, and human damage and sundries interference are avoided.

In some embodiments, the gripping portion 566 includes a guide shaft 5660, a fixing plate 5661, and a magnetic attraction member 5662, the guide shaft 5660 is connected to the driving end of the elevation driving unit 565, the fixing plate 5661 is mounted at the end of the guide shaft 5660, the magnetic attraction member 5662 is mounted on the fixing plate 5661, the magnetic attraction member 5662 attracts the wafer support plate 81 by magnetic force, a proximity switch 5666 is provided on the fixing plate 5661, and the proximity switch 5666 is used to determine whether the gripping portion 566 attracts the wafer support plate 81. Because the crystal support plate 81 is made of metal, the grabbing portion 566 is made of the magnetic adsorption piece 5662, the magnetic adsorption piece 5662 adsorbs the crystal support plate 81 through magnetic force, and then firm grabbing of the crystal support plate 81 is achieved, and the proximity switch 5666 is arranged on the fixing plate 5661, so that the proximity switch 5666 can play a role in identification and judgment, and effective grabbing of the crystal support plate 81 by the grabbing portion 566 is ensured.

Wherein, dodging holes are arranged on the traversing plate 562 at positions corresponding to the guide shafts 5660, the upper ends of the guide shafts 5660 penetrate through the traversing plate 562, and the guide shafts 5660 can guide the lifting of the grabbing parts 566. The number of guide shafts 5660 is two, and the two guide shafts 5660 are provided on both sides of the mounting plate. Similarly, the number of the magnetic attraction pieces 5662 in the grasping portion 566 is two, the magnetic attraction pieces 5662 are magnets, and the magnets are power-off holding magnets to bear high load and continuously work. A spring shaft 5664 and a spring 5663 can be arranged between the magnet and the fixed plate 5661, the upper end of the spring shaft 5664 is penetrated through the fixed plate 5661 and is connected with a second linear bearing 5665, the spring 5663 is sleeved on the spring shaft 5664 and is positioned between the magnet and the bottom of the fixed plate 5661, and the spring 5663 can provide a buffer effect for the magnet to adsorb the crystal support plate 81 so as to avoid damaging or scraping the crystal support plate 81.

The number of the gripping portions 566 is two, and the two gripping portions 566 are mounted on the traverse plate 562 at intervals, and the traverse driving unit 564 and the elevating driving unit 565 are also two. The two sets of gripping portions 566 may cooperate together to grip two wafer carriers 81, respectively, in a batch.

It should be noted that, without conflict, features in the embodiments of the present application may be combined with each other.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (19)

1. The utility model provides a crystal plate belt cleaning device which characterized in that includes:

the ultrasonic cleaning tank is used for accommodating cleaning mediums;

the ultrasonic generator is arranged in the ultrasonic cleaning tank and comprises an ultrasonic vibrator, and the ultrasonic vibrator is used for providing vibration waves for a cleaning medium in the ultrasonic cleaning tank so as to ultrasonically clean a crystal supporting plate in the ultrasonic cleaning tank;

the heating component is positioned in the ultrasonic cleaning tank and is used for heating and controlling the temperature of the cleaning medium in the ultrasonic cleaning tank.

2. The crystal support washing apparatus according to claim 1, wherein the ultrasonic washing tank includes a bottom wall and a side wall provided on an outer peripheral edge of the bottom wall and extending upward, and the ultrasonic vibrator is provided on the bottom wall and/or the side wall of the ultrasonic washing tank.

3. The tray cleaning apparatus of claim 2, wherein the side walls comprise first and second side walls facing each other and spaced apart, the ultrasonic vibrator being disposed on the first side wall, the second side wall, and the bottom wall.

4. The crystal support cleaning device according to claim 1, wherein a side of the ultrasonic cleaning tank along the first direction is provided with a secondary tank body, the ultrasonic cleaning tank is provided with a first liquid outlet, the secondary tank body is provided with a first liquid inlet, and the first liquid inlet is communicated with the first liquid outlet;

be provided with the second leakage fluid dram on the vice cell body, be provided with first liquid return mouth on the ultrasonic cleaning pond, the second leakage fluid dram pass through the filter with first liquid return mouth intercommunication, the second leakage fluid dram with be provided with the purification pipeline between the first liquid return mouth, be provided with on the purification pipeline filter and water pump.

5. The tray cleaning apparatus according to claim 4, wherein an inner surface of a bottom wall of the ultrasonic cleaning tank has a guide slope inclined downward from a side of the ultrasonic cleaning tank facing away from the sub tank toward the sub tank, the guide slope being configured to guide impurities deposited in the ultrasonic cleaning tank to move toward the first liquid inlet of the sub tank.

6. The tray cleaning apparatus of claim 5, wherein the angle between the guide ramp and the horizontal plane is α, satisfying: alpha is more than or equal to 1 degree and less than or equal to 10 degrees.

7. The wafer carrier cleaning device according to claim 5, wherein a blocking portion is disposed in the auxiliary tank body, the blocking portion is disposed on the bottom wall of the auxiliary tank body and extends upward to divide the inner cavity of the auxiliary tank body into a first cavity and a second cavity, the height of the blocking portion is smaller than the height of the cavity in the auxiliary tank body so that the upper side area of the first cavity is communicated with the upper side area of the second cavity, the height of the first liquid inlet is smaller than the height of the blocking portion, the purifying pipeline is communicated with the second cavity, a first drain outlet is disposed at the bottom of the first cavity, and a first drain valve is disposed at the tail end of the first drain outlet.

8. The wafer carrier cleaning apparatus of claim 7, wherein a second drain is provided at a bottom of the second chamber, and a second drain valve is provided at a distal end of the second drain.

9. The tray cleaning apparatus of any one of claims 1-8, further comprising: the workpiece lifting assembly comprises a bracket, wherein the bracket is used for supporting the crystal supporting plate, and the bracket can be selectively moved up and down in the ultrasonic cleaning tank or in the ultrasonic cleaning tank so as to enable the crystal supporting plate to be immersed in the cleaning medium or to be exposed from the cleaning medium.

10. The wafer carrier washing apparatus of claim 9, wherein the carrier includes a support portion and a support column vertically disposed on the support portion, the support column for supporting the wafer carrier for spacing a bottom of the wafer carrier from the support portion.

11. The crystal support cleaning apparatus as claimed in claim 10, wherein the bracket further comprises a connecting portion connected to the supporting portion, and an upper end of the connecting portion protrudes from the ultrasonic cleaning tank;

the workpiece lifting assembly further comprises a lifting driving piece, and the driving end of the lifting driving piece is in driving connection with the upper end of the connecting portion, so that the supporting portion is driven to move in the vertical direction.

12. The tray cleaning apparatus according to claim 11, wherein the number of the connecting portions is two and the connecting portions are respectively disposed at two ends of the supporting portion in the length direction.

13. The tray cleaning apparatus according to claim 11, wherein the supporting portion has a cleaning position and a position to be grasped in the vertical direction, and the lift driving member drives the supporting portion to move so as to move the supporting portion between the cleaning position and the position to be grasped; when the bearing part is positioned at the cleaning position, the bearing part is positioned in the ultrasonic cleaning tank so that the crystal supporting plate on the bearing part is immersed by a cleaning medium; when the bearing part is positioned at the position to be grasped, the crystal supporting plate on the bearing part is exposed from the cleaning medium.

14. The wafer cleaning apparatus of claim 9, wherein the workpiece lift assembly is configured in plurality and the plurality of workpiece lift assemblies are spaced apart in a first direction.

15. The tray cleaning apparatus of claim 9, further comprising:

the ultrasonic cleaning device comprises a rack, a plurality of ultrasonic cleaning tanks and a plurality of ultrasonic cleaning tanks, wherein the rack is provided with cleaning areas and conveying areas distributed along a first direction;

the cleaning conveying line is arranged in the conveying area and is used for conveying the crystal supporting plates subjected to glue cleaning treatment along a second direction, and the second direction, the first direction and the vertical direction are perpendicular to each other.

16. The tray cleaning device of claim 15, further comprising: the grabbing unit is arranged on the frame and used for moving between the conveying area and the cleaning area so as to transfer the crystal support plates on the cleaning conveying line to the bracket of the ultrasonic cleaning pool; or transferring the crystal supporting plate after the cleaning in the ultrasonic cleaning tank to the cleaning conveying line.

17. The tray cleaning apparatus of claim 16, wherein the gripping unit comprises:

The guide rail is arranged on the rack in an extending mode along the first direction;

the transverse moving plate is provided with a sliding block, and the transverse moving plate is in sliding fit with the guide rail through the sliding block;

the grabbing part is arranged on the transverse moving plate and is used for grabbing a crystal supporting plate on the cleaning conveying line or a crystal supporting plate on the workpiece lifting assembly;

the driving end of the transverse moving driving unit is in driving connection with the transverse moving plate, and the transverse moving driving unit is used for driving the transverse moving plate to move along the first direction on the frame;

and the lifting driving unit is arranged on the transverse moving plate and is used for driving the grabbing part to move along the vertical direction.

18. The crystal support cleaning apparatus of claim 17, wherein the grasping portion comprises a guide shaft, a fixing plate and a magnetic absorption member, the guide shaft is connected with the driving end of the lifting driving unit, the fixing plate is mounted at the tail end of the guide shaft, the magnetic absorption member is mounted at the fixing plate, the magnetic absorption member absorbs the crystal support plate through magnetic force, a proximity switch is arranged on the fixing plate, and the proximity switch is used for judging whether the grasping portion absorbs the crystal support plate.

19. A tray separation line comprising a tray cleaning device according to any one of claims 1 to 18.