CN211217793U - Cleaning device for cleaning large-size quartz wafers - Google Patents
Cleaning device for cleaning large-size quartz wafers Download PDFInfo
- Publication number
- CN211217793U CN211217793U CN201921305159.9U CN201921305159U CN211217793U CN 211217793 U CN211217793 U CN 211217793U CN 201921305159 U CN201921305159 U CN 201921305159U CN 211217793 U CN211217793 U CN 211217793U
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- Prior art keywords
- cleaning
- cavity
- main shaft
- connecting rod
- liquid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000010453 quartz Substances 0.000 title claims abstract description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 235000012431 wafers Nutrition 0.000 title claims description 22
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003344 environmental pollutant Substances 0.000 abstract description 4
- 231100000719 pollutant Toxicity 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 abstract description 2
- 230000006378 damage Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 206010020718 hyperplasia Diseases 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wash belt cleaning device of jumbo size quartz wafer, including organism and base, the cavity has been seted up to the inside of organism, the cavity is connected with the cover, the cover below is equipped with the brush dish, fixedly connected with ultrasonic transmitter in the cavity, the cavity in-connection has the liquid stream device, the centre of gyration of cover runs through and is equipped with the main shaft, be connected with rotating device on the main shaft. The utility model discloses press the rotation that turns into the brush dish downwards of main shaft, realize the preliminary cleaning work to the quartz crystal surface, simultaneously through copper core and wire, make solenoid valve conducting circuit and let in HF etching solution and start supersonic generator simultaneously under piezoelectric effect's effect, form the efflux, the acoustic current, little efflux and little acoustic current, can destroy the pollutant, detach or weaken the dirty layer in border, increase the stirring, the diffusion, dissolve with higher speed soluble filler and the non-dissolubility particle drop, strengthen the cleaning action of liquid, realize cubic cleaning performance.
Description
Technical Field
The utility model relates to a quartz crystal washs technical field, especially relates to a wash jumbo size quartz wafer's belt cleaning device.
Background
For a quartz element in a high-power laser, when a substrate is subjected to early processing, scratches, holes and other defects are generated on the surface of the substrate due to grinding and cutting, and in the later polishing process, some pollutants such as polishing powder, glass debris and the like are filled in the quartz element; in addition, an adhesion layer (re-deposition layer) is also arranged on the surface of the processed quartz substrate, and polishing powder and SiO are contained in the adhesion layer2Particles and other contaminants, and the like.
And generally use ultrasonic cleaner to go on to quartz wafer's among the prior art cleaning method, and because the existence of adhesion layer for quartz wafer under being filled is washed not high-efficiently enough, and conventional HF etching law can only realize exposing quartz defect through corroding the adhesion layer, can't carry out effective processing to the mar after exposing, on this basis, the utility model relates to a wash jumbo size quartz wafer's belt cleaning device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a cleaning device for cleaning a large-size quartz wafer.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a wash washing device of jumbo size quartz wafer, includes organism and base, the cavity has been seted up to the inside of organism, cavity top sealing connection has the cover, the cover below is equipped with the brush dish, the cavity is located brush dish below and is equipped with the striker plate, establish to inclined plane structure and fixedly connected with ultrasonic transmitter the cavity bottom, the cavity in-connection has the liquid stream device, the centre of gyration of cover runs through and is equipped with the main shaft, be connected with control brush dish pivoted rotating device on the main shaft.
Preferably, the liquid flow device comprises a liquid inlet pipe, the liquid inlet pipe is arranged at the bottom of the cavity and is located at a high point of the slope structure, a liquid outlet pipe is connected to a low point of the slope structure at the bottom of the cavity in a sealing manner, and the liquid outlet pipe penetrates through the inner wall of the machine body and is connected with a sealing valve outside the machine body in a sealing manner.
Preferably, rotating device includes the connecting rod, the holding tank has been seted up to the part that the main shaft is close to the connecting rod, connecting rod sliding connection is in the holding tank, the one end welding that the connecting rod is located the holding tank has the piston, the diameter of piston is greater than the holding tank diameter of opening on the main shaft, the spring has been cup jointed on the connecting rod, the stiff end of spring welds the opening part that the bottom and the main shaft that are located the holding tank at the piston respectively, helical drive is connected between piston and the holding tank inner wall, connecting rod and brush dish top welding.
Preferably, a handle is sleeved on the part of the main shaft outside the machine body, and the handle is in threaded connection with the main shaft.
Preferably, a plurality of liquid inlet holes are formed in the striker plate in a penetrating mode, and the liquid inlet holes are arrayed on the striker plate in a square mode.
Preferably, the centre of rotation of brush dish is connected with the iron core through the bearing rotation, the brush hair parallel and level on iron core and the brush dish, be connected with the solenoid valve on the feed liquor pipe, the iron core passes through the wire and is connected with the solenoid valve electricity, let in the HF etching solution in the feed liquor pipe.
Compared with the prior art, the utility model has the advantages of:
1. this use novel setting rotating device, handle and connecting rod are connected respectively at the both ends of main shaft, and the piston on main shaft and the connecting rod passes through threaded connection and realizes screw drive, and the piston diameter is greater than holding tank opening diameter on the main shaft, make the piston remove and rotate simultaneously all the time under the effect of spring, when the piston drives the connecting rod and the brush dish moves when treating to wash quartz crystal surface, under the effect of pressure, the brush hair on the brush dish will be rotatory all the time, make the effect of tentatively clearing up to the destruction layer on quartz crystal surface.
2. The utility model discloses simultaneously locate to set up the copper core at the centre of gyration of brush dish, when the brush hair of brush dish was in the state of brushing quartz crystal surface under, the copper core will have a pressure effect to quartz crystal, and because quartz crystal has piezoelectricity, can produce electric current under the pressurized promptly for the copper core switches on the solenoid valve circuit through the wire, is that the solenoid valve opens and flows in HF etching liquid from the feed liquor pipe, under the effect of etching liquid, has played the cleaning process to quartz crystal surface second time.
3. After etching liquid is filled in the cavity, the surface of the quartz crystal is subjected to ultrasonic cleaning action by starting the ultrasonic emitter, positive and negative alternating sound pressure can be generated when the quartz crystal is transmitted in a liquid medium to form jet flow, meanwhile, sound flow and micro sound flow can be generated due to nonlinear effect, and ultrasonic cavitation can also generate high-speed micro jet flow on a solid and liquid interface, all the actions can damage pollutants, remove or weaken a boundary pollutant layer, increase stirring and diffusion actions, accelerate the dissolution of soluble fillers and the falling of non-soluble particles, strengthen the cleaning action of the liquid, and realize three-time cleaning effect.
Drawings
FIG. 1 is a schematic structural view of a cleaning apparatus for cleaning large-sized quartz wafers according to the present invention;
FIG. 2 is an enlarged schematic view of part A of a cleaning apparatus for cleaning large-sized quartz wafers according to the present invention;
FIG. 3 is a sectional top view of a brush plate of a cleaning apparatus for cleaning large-sized quartz wafers according to the present invention;
fig. 4 is a front cross-sectional view of a brush plate in a cleaning device for cleaning large-sized quartz wafers according to the present invention.
In the figure: the device comprises a machine body 1, a base 2, a machine cover 3, a main shaft 4, a brush disc 5, a material baffle 6, an ultrasonic transmitter 7, a handle 8, a liquid inlet pipe 9, a liquid outlet pipe 10, a sealing valve 11, a liquid inlet hole 12, a connecting rod 13, an accommodating groove 14, a piston 15, a spring 16, an iron core 17 and an electromagnetic valve 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Examples
Referring to fig. 1-4, a cleaning device for cleaning large-size quartz wafers comprises a machine body 1 and a base 2, wherein a cavity is formed in the machine body 1, the top of the cavity is hermetically connected with a cover 3, a brush disc 5 is arranged below the cover 3, a baffle plate 6 is arranged below the brush disc in the cavity, the bottom of the cavity is arranged to be an inclined plane structure and is fixedly connected with an ultrasonic transmitter 7, a liquid flow device is connected in the cavity, a main shaft 4 penetrates through the rotation center of the cover 3, and a rotating device for controlling the brush disc 5 to rotate is connected to the main shaft 4.
The liquid flow device comprises a liquid inlet pipe 9, the liquid inlet pipe 9 is arranged at the bottom of the cavity and is positioned at a high point of the slope structure, a liquid outlet pipe 10 is connected at a low point of the slope structure at the bottom of the cavity in a sealing mode, the liquid outlet pipe 10 penetrates through the inner wall of the machine body 1 and is connected with a sealing valve 11 outside the machine body 1 in a sealing mode, and the slope structure enables liquid to enter the liquid outlet pipe 10 due to self gravity and be discharged when the sealing valve 11 is opened.
The rotating device comprises a connecting rod 13, a containing groove 14 is formed in the part, close to the connecting rod 13, of the main shaft 4, the connecting rod 13 is connected in the containing groove 14 in a sliding mode, a piston 15 is welded at one end, located in the containing groove 14, of the connecting rod 13, the diameter of the piston 15 is larger than that of an opening, located in the main shaft 4, of the containing groove 14, a spring 16 is sleeved on the connecting rod 13, the fixed end of the spring 16 is welded at the bottom of the piston 15 and at the opening, located in the containing groove 14, of the main shaft 4 respectively, the piston 15 is in spiral transmission connection with the inner wall of the containing groove 14, the connecting rod 13 is welded with the top of the brush disc 5, so that when the connecting rod 13 rotates, bristles fixedly connected to the brush disc 5 and bristles on the brush disc 6 rotate simultaneously, a handle 8 is sleeved on the part, located outside the machine body, the connecting rod 13 can continue to move under the action of the spring 16, and the brush disc 5 rotates on the quartz wafer at the moment, so that the bristles continuously perform primary cleaning operation on the convex damaged layer on the surface of the quartz wafer.
Run through on the striker plate 6 and seted up a plurality of feed liquor holes 12, the square array in feed liquor hole 12 is on striker plate 6, the centre of rotation of brush dish 5 is rotated through the bearing and is connected with iron core 17, the brush hair parallel and level on iron core 17 and the brush dish 5, be connected with solenoid valve 18 on the feed liquor pipe 9, iron core 17 passes through the wire and is connected with solenoid valve 18 electricity, let in the HF etching solution in the feed liquor pipe 9, when iron core 17 offsets with quartz wafer, can produce electric current under the effect of piezoelectric effect, will make solenoid valve 18 open through the wire, make the device have from the opening performance, cavity bottom ultrasonic transmitter 7 is also connected to the wire simultaneously, make the entering of liquid and ultrasonic wave carry out work simultaneously.
The utility model discloses in, at first carry out preliminary scrubbing work through the destruction layer and the hyperplasia layer of brush hair on the brush dish 5 to quartz crystal surface unevenness department, the ware main objective makes the SiO that breaks away from more easily2And the polishing powder material is scrubbed, thus make the quartz crystal surface at this moment in a relatively flat state, then make solenoid valve 18 and ultrasonic emitter 7 electrified and begin to work simultaneously through the pressure of iron core 17 to the quartz crystal, continue to press handle 8 through the manual top, make the continuous pressure on the quartz crystal can supply power steadily, and after withdrawing from the pressure that exerts on handle 8, then the inside will cut off the power supply and finish working of device, have the effect of self-switch, make and control the cleaning process at any time, and strengthen the abluent effect of cubic through the brush hair.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a wash washing device of jumbo size quartz wafer, includes organism (1) and base (2), its characterized in that, the cavity has been seted up to the inside of organism (1), cavity top sealing connection has cover (3), cover (3) below is equipped with brush dish (5), the cavity is located brush dish below and is equipped with striker plate (6), establish to inclined plane structure and fixedly connected with ultrasonic transmitter (7) cavity bottom, the cavity in-connection has the liquid stream device, the centre of rotation of cover (3) runs through and is equipped with main shaft (4), be connected with control brush dish (5) pivoted rotating device on main shaft (4).
2. A cleaning apparatus for cleaning large-size quartz wafers as claimed in claim 1, wherein said liquid flow means comprises a liquid inlet pipe (9), said liquid inlet pipe (9) is opened at the bottom of the cavity at the high point of the slope structure, the low point of the slope structure at the bottom of the cavity is connected with a liquid outlet pipe (10) in a sealing way, said liquid outlet pipe (10) penetrates through the inner wall of the machine body (1) and is connected with a sealing valve (11) outside the machine body (1) in a sealing way.
3. A cleaning apparatus for cleaning a large-sized quartz wafer according to claim 1, the rotating device comprises a connecting rod (13), a part of the main shaft (4) close to the connecting rod (13) is provided with an accommodating groove (14), the connecting rod (13) is connected in the accommodating groove (14) in a sliding manner, a piston (15) is welded at one end of the connecting rod (13) positioned in the accommodating groove (14), the diameter of the piston (15) is larger than the diameter of the opening of the accommodating groove (14) on the main shaft (4), the connecting rod (13) is sleeved with a spring (16), the fixed end of the spring (16) is respectively welded at the bottom of the piston (15) and the opening of the main shaft (4) positioned in the accommodating groove (14), the piston (15) is in spiral transmission connection with the inner wall of the accommodating groove (14), and the connecting rod (13) is welded to the top of the brush disc (5).
4. A cleaning device for cleaning large-size quartz wafers as claimed in claim 1, characterized in that the part of the main shaft (4) outside the machine body (1) is sleeved with a handle (8), and the handle (8) is in threaded connection with the main shaft (4).
5. The cleaning device for cleaning the large-size quartz wafers as claimed in claim 1, wherein a plurality of liquid inlet holes (12) are formed through the baffle plate (6), and the liquid inlet holes (12) are arrayed on the baffle plate (6) in a square shape.
6. The cleaning device for cleaning the large-size quartz wafers as claimed in claim 2, wherein the center of rotation of the brush plate (5) is rotatably connected with an iron core (17) through a bearing, the iron core (17) is flush with the bristles on the brush plate (5), the liquid inlet pipe (9) is connected with an electromagnetic valve (18), the iron core (17) is electrically connected with the electromagnetic valve (18) through a wire, and HF etching liquid is introduced into the liquid inlet pipe (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921305159.9U CN211217793U (en) | 2019-08-13 | 2019-08-13 | Cleaning device for cleaning large-size quartz wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921305159.9U CN211217793U (en) | 2019-08-13 | 2019-08-13 | Cleaning device for cleaning large-size quartz wafers |
Publications (1)
Publication Number | Publication Date |
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CN211217793U true CN211217793U (en) | 2020-08-11 |
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CN201921305159.9U Expired - Fee Related CN211217793U (en) | 2019-08-13 | 2019-08-13 | Cleaning device for cleaning large-size quartz wafers |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114799622A (en) * | 2022-03-10 | 2022-07-29 | 江苏奥斯力特电子科技有限公司 | Sealing and welding device for quartz crystal resonator wafer |
-
2019
- 2019-08-13 CN CN201921305159.9U patent/CN211217793U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114799622A (en) * | 2022-03-10 | 2022-07-29 | 江苏奥斯力特电子科技有限公司 | Sealing and welding device for quartz crystal resonator wafer |
CN114799622B (en) * | 2022-03-10 | 2024-04-05 | 徐州华达融达信息科技有限公司 | Sealing device for quartz crystal resonator wafer |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200811 |