CN108493142B - A kind of semiconductor components and devices sealed in unit - Google Patents
A kind of semiconductor components and devices sealed in unit Download PDFInfo
- Publication number
- CN108493142B CN108493142B CN201810511304.2A CN201810511304A CN108493142B CN 108493142 B CN108493142 B CN 108493142B CN 201810511304 A CN201810511304 A CN 201810511304A CN 108493142 B CN108493142 B CN 108493142B
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- semiconductor
- positioning
- feeding
- material cup
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The present invention relates to technical field of semiconductors.A kind of semiconductor components and devices sealed in unit, semiconductor feeding device, semiconductor positioning device, conveying robot unit and automatic packing apparatus including rack components and thereon；Semiconductor feeding device for realizing semiconductor to be packaged feeding function；Semiconductor positioning device is mutually connected with semiconductor feeding device, and semiconductor positioning device is for positioning semiconductor to be packaged；Carrying of the conveying robot unit for semiconductor workpiece between semiconductor feeding device, semiconductor positioning device and automatic packing apparatus；Automatic packing apparatus is mutually connected with semiconductor positioning device, heat-sealing of the automatic packing apparatus for the feeding of material cup, the feeding and heat-sealing film and material cup of heat-sealing film.The advantages of semiconductor components and devices sealed in unit is the encapsulation that can be automatically finished the feeding of semiconductor element device, material cup and heat-sealing film, and complete semiconductor element device, high in machining efficiency.
Description
Technical field
The present invention relates to the production equipments of technical field of semiconductors, especially semiconductor components and devices.
Background technique
Semiconductor components and devices production and detection are put into insulation material cup so after completing it is necessary to pass through semiconductor components and devices
It is sealed afterwards with heat-sealing film.Existing packaged type is as follows: it is mobile by manipulator, semiconductor components and devices is put into position one by one and is consolidated
In the feeding chamber of fixed insulation material cup, material cup be it is regularly arranged multiple, the insulate feeding chamber of material cup of a row piles semiconductor element
After device, insulation material cup is moved to below hot pressing film device, hot pressing film closes feeding chamber, completes the envelope of semiconductor components and devices
Dress.Deficiency existing for existing semiconductor components and devices sealed in unit is that processing efficiency is low.
Summary of the invention
The object of the present invention is to provide a kind of full-automatic semiconductor components and devices sealed in unit high in machining efficiency.
To achieve the goals above, the technical solution used in the present invention is: a kind of semiconductor components and devices sealed in unit, packet
Including rack component and semiconductor feeding device, semiconductor positioning device, conveying robot unit and automatic packing apparatus thereon；
Semiconductor feeding device for realizing semiconductor to be packaged feeding function；Semiconductor positioning device and semiconductor feeding device phase
Linking, semiconductor positioning device is for positioning semiconductor to be packaged；Conveying robot unit is used for semiconductor feeding device, partly leads
The carrying of semiconductor workpiece between body positioning device and automatic packing apparatus；Automatic packing apparatus is mutually held in the mouth with semiconductor positioning device
It connects, heat-sealing of the automatic packing apparatus for the feeding of material cup, the feeding and heat-sealing film and material cup of heat-sealing film；
Semiconductor positioning device includes fixed bracket, the second motor, shaft mounting base, positioning rotating shaft, positioning rotor, limit
Card slot, positioning plate, positioning side plate, locating piece and the second infrared sensor；Fixed bracket is fixed in rack components, is turned
On fixed bracket, locating piece is mounted in shaft mounting base the setting of axis mounting base, and the second motor is installed by motor mount
In shaft mounting base；Positioning rotating shaft is mounted in shaft mounting base, and positioning rotor is arranged on positioning rotating shaft, and positioning rotating shaft is left
The second motor output shaft of end connection, positioning rotating shaft right end are fixedly connected with limit card slot, and positioning rotating shaft is in below positioning plate；
Arc groove e is provided in limit card slot, arc groove e is matched with shaft mounting base right end pillar f；Positioning plate setting is pacified in shaft
It filling on seat, positioning side plate is mounted on positioning plate, and positioning side plate one end is against on locating piece, and positioning side plate is two pieces of left and right,
Two blocks of positioning side plates are mounted on positioning plate by adjusting screw, and material passing passage is formed between two blocks of positioning side plates, and two pieces fixed
Feeding chamber is formed between position side plate and locating piece, material passing passage is connected to feeding chamber, adjusts two blocks of positioning side plates by adjusting screw
Between material passing passage size；Second infrared sensor is mounted on locating piece, and the second infrared sensor position corresponds to feeding chamber；
Position and the matched through-hole of material passing passage are respectively equipped in shaft mounting base and positioning plate, it is logical that positioning rotor position corresponds to punishment in advance
Road, positioning rotor are used for the piece-holder in feeding chamber at it between locating piece.
Preferably, automatic packing apparatus includes packaging rack, material cup feeding receiving mechanism, heat-sealing film feeding mechanism, half
Conductor feeding port component, flanging component, material cup guide rod, material cup Zou Liao mechanism and press mold guide rail；Packaging rack is fixed at machine
On frame component, the setting of material cup feeding receiving mechanism is in packaging rack；The setting of heat-sealing film feeding mechanism is in packaging rack, heat-sealing
Film feeding mechanism is located above press mold guide rail；Semiconductor feeding port component and flanging module position correspond to the material in press mold guide rail
Cup；Material cup guide rod is fixed in packaging rack, and material cup guide rod is located at below press mold guide rail, the corresponding material in material cup guide rod position
Cup, material cup guide rod is for keeping material cup horizontal；Material cup Zou Liao mechanism is mounted below press mold guide rail, and material cup Zou Liao mechanism is used for will
Material cup realizes step-by-step movement feed motion；Along material cup direction of feed feeding port component, heat-sealing film feeding mechanism, flanging component successively
Arrangement.
Using a kind of semiconductor components and devices sealed in unit of above-mentioned technical proposal, semiconductor feeding device for realizing to
The feeding function of semiconductor is packed, semiconductor positioning device is for positioning semiconductor to be packaged, and conveying robot unit is for half
The carrying of semiconductor workpiece between conductor feeding device, semiconductor positioning device and automatic packing apparatus, automatic packing apparatus are used
In the heat-sealing of the feeding of material cup, the feeding of heat-sealing film and heat-sealing film and material cup.A kind of semiconductor components and devices sealed in unit
Advantage is the feeding that can be automatically finished semiconductor element device, material cup and heat-sealing film, and completes the encapsulation of semiconductor element device, processing
It is high-efficient.
Detailed description of the invention
Fig. 1 is the configuration schematic diagram of the embodiment of the present invention.
Fig. 2 is the configuration schematic diagram of the semiconductor feeding device of the embodiment of the present invention.
Fig. 3 is the configuration schematic diagram of the endless apron mechanism of the embodiment of the present invention.
Fig. 4 is the semiconductor schematic diagram to be packaged of the embodiment of the present invention.
Fig. 5 is the configuration schematic diagram of the material folding channel parts of the embodiment of the present invention.
Fig. 6 is the configuration schematic diagram of the semiconductor positioning device of the embodiment of the present invention.
Fig. 7 is the configuration schematic diagram of the conveying robot unit of the embodiment of the present invention.
Fig. 8 is the first of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Fig. 9 is the second of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Figure 10 is the configuration schematic diagram of the automatic packing apparatus of the embodiment of the present invention.
Figure 11 is the configuration schematic diagram of the material cup feeding receiving mechanism of the embodiment of the present invention.
Figure 12 is the configuration schematic diagram of the heat-sealing film feeding mechanism of the embodiment of the present invention.
Figure 13 is the configuration schematic diagram of the semiconductor feeding port component of the embodiment of the present invention.
Figure 14 is the configuration schematic diagram of the flanging component of the embodiment of the present invention.
Figure 15 is the structural schematic diagram of the material cup Zou Liao mechanism of the embodiment of the present invention.
Figure 16 is the configuration schematic diagram of the press mold guide rail of the embodiment of the present invention.
Specific embodiment
The present invention is described further with embodiment with reference to the accompanying drawings of the specification.
A kind of semiconductor components and devices sealed in unit as shown in Fig. 1-Figure 16, semiconductor including rack components 1 and thereon
Feeding device 2, semiconductor positioning device 3, conveying robot unit 4 and automatic packing apparatus 5；Semiconductor feeding device 2 is fixed
Be arranged in rack components 1, semiconductor feeding device 2 for realizing semiconductor to be packaged feeding function.Semiconductor positioning dress
It sets 3 to be connected with 2 phase of semiconductor feeding device, semiconductor positioning device 3 improves the accurate of clamping for positioning semiconductor to be packaged
Degree.Conveying robot unit 4 between semiconductor feeding device 2, semiconductor positioning device 3 and automatic packing apparatus 5 for partly leading
The carrying of body workpiece.Automatic packing apparatus 5 is connected with 3 phase of semiconductor positioning device, and automatic packing apparatus 5 is for material cup
The heat-sealing of material, the feeding of heat-sealing film and heat-sealing film and material cup.
As shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, semiconductor feeding device 2 include mounting rack, first motor 22, gear set and
Endless apron mechanism 25 and guide wheel tension assembly 26；Mounting rack 21 include two pieces of installation risers 211 and connecting rod 212, two pieces
Installation riser 211 is fixedly connected by connecting rod 212；Gear set includes the first gear 23 and second gear 24 of engagement connection；
Installation riser 211 is fixed in rack components 1, and first motor 22 is fixed on mounting rack by motor mounting rack, and first
Motor 22 connects endless apron mechanism 25 by gear set；Endless apron mechanism 25 and guide wheel tension assembly 26 are mounted on
It shelves on 21, guide wheel tension assembly 26 connects endless apron mechanism 25；Endless apron mechanism 25 includes the first drive roll
251, the second drive roll 252, first conveyer belt 253, the second conveyer belt 254, tensioning guide wheel 255, blanking slope 256, side block
Plate 257, end baffle 258, end fixed block 259, entrance shrink slanted bar 2510, entrance positioning strip 2512 and material folding channel parts
2511；First drive roll 251 and the second drive roll 252 are mounted in installation riser 211 by bearing.
Material folding channel parts 2511 are in the top of 254 one end of the second conveyer belt, and end baffle 258 is in the second conveyer belt
The top of 254 other ends, the top of 256 first conveyer belt of blanking slope, 253 one end, end baffle 258 are in first conveyer belt
The top of 253 other ends, blanking slope 256 are in the lower section of material folding channel parts 2511；The connection of first gear 23 first is actively rolled
Cylinder 251, second gear 24 connect the second drive roll 252, and first gear 23 and second gear 24 form external toothing, and transmission ratio is
1:1, so that the first drive roll 251 and 252 constant speed of the second drive roll rotate backward；First conveyer belt 253 is wrapped in first
On drive roll 251, the second conveyer belt 254 is wrapped on the second drive roll 252, first conveyer belt 253 and the second conveyer belt
254 direction of motion is on the contrary, the direction of motion of first conveyer belt 253 is diagram c to the direction of motion of the second conveyer belt 254 is
Illustrate b to.
Blanking slope 256 is mounted between two pieces of installation risers 211, and blanking slope 256 is located on the second conveyer belt 254
Side, blanking slope 256 is for accepting the workpiece fallen from first conveyer belt 253；Side baffle 257 is fixed at installation riser
On 211, the position of side baffle 257 is matched with the second conveyer belt 254, and side baffle 257 is for the work on regular second conveyer belt 254
Part；End baffle 258 is fixed between two pieces of installation risers 211 by end fixed block 259, and end baffle 258 is located at
First conveyer belt 253 and the top of the second conveyer belt 254, it is defeated that the workpiece shelves in first conveyer belt 253 are entered second by end baffle 258
It send in band 254.
The end baffle 258 of the top of second conveyer belt 254 is equipped with from first conveyer belt 253 to 254 side of the second conveyer belt
To inclined folded plate, folded plate enters the workpiece shelves in first conveyer belt 253 in second conveyer belt 254, and the second conveyer belt 254 is in b
To when movement, the workpiece on the second conveyer belt 254 is fallen in first conveyer belt 253 after reaching end baffle 258.
Entrance shrinks slanted bar 2510 and entrance positioning strip 2512 is respectively at the two sides of the second conveyer belt 254, and entrance is shunk
Slanted bar 2510 is located at 253 top of first conveyer belt, and entrance shrinks 2510 one end of slanted bar and is mounted in material folding channel parts 2511, entrance
2510 other end of slanted bar is shunk towards end baffle 258, and slanted bar 2510 is shunk by inclined entrance and adjusts entrance contraction slanted bar
The workpiece direction on the second conveyer belt 254 between 2510 and entrance positioning strip 2512, and prevent workpiece is premature from falling into first
On conveyer belt 253；There are blanking port between entrance positioning strip 2512 and material folding channel parts 2511, blanking port is in blanking slope
256 surface；
254 position of the second conveyer belt at blanking port is higher than 253 position of first conveyer belt at blanking slope 256, close
254 position of the second conveyer belt at end baffle 258 is lower than 253 position of first conveyer belt at end baffle 258.
The connection tensioning guide wheel 255 of guide wheel tension assembly 26, tensioning guide wheel 255 is two, and two tensioning guide wheels 255 connect respectively
First conveyer belt 253 and the second conveyer belt 254 are connect, it is defeated that guide wheel tension assembly 26 is tensioned circulation by adjusting tensioning guide wheel 255
First conveyer belt 253 and the second conveyer belt 254 on tape-feed 25.
Material folding channel parts 2511 include left fixed plate 25111, right fixed plate 25110, left guide pad 25112, right guide pad
25117, the first infrared sensor 25113, cylinder guide rod 25114, left spring 25115, right spring 25119, left adjusting screw
25116 and right adjusting screw 25118；Left fixed plate 25111 and right fixed plate 25110 are separately mounted to one piece of installation riser 211
On；Left guide pad 25112 is connected with right guide pad 25117 by cylinder guide rod 25114, left guide pad 25112 and right guide pad
Feed zone is equipped between 25117 and charge region, feed zone pass through for workpiece, charge region is parked for workpiece, the
One infrared sensor, 25113 position corresponds to charge region, and the first infrared sensor 25113 is for confirming whether charge region has work
Part, convenient for clamping workpiece so as to conveying robot unit 4；Left fixed plate 25111 connects left guide by left adjusting screw 25116
Block 25112 is arranged with left spring 25115 on the cylinder guide rod 25114 between left fixed plate 25111 and left guide pad 25112, right
Fixed plate 25110 connects right guide pad 25117, right fixed plate 25110 and right guide pad 25117 by right adjusting screw 25118
Between cylinder guide rod 25114 on be arranged with right spring 25119, pass through and rotate left adjusting screw 25116 and right adjusting screw
Position between the left guide pad 25112 of 25118 adjustment and right guide pad 25117, that is, pass through left adjusting screw 25116 and right adjusting
Screw 25118 adjusts the size of feed zone, to adapt to various sizes of workpiece.
Semiconductor a shape to be packaged is as shown in Figure 4.Semiconductor feeding device 2 is in use, the driving warp of first motor 22
After external gear pump transmission, first conveyer belt 253 and the second conveyer belt 254 is driven reversely to move at the uniform velocity, in first conveyer belt 253
Workpiece c to moving to left, pass through the posture that entrance shrinks slanted bar 2510 and entrance positioning strip 2512 adjusts workpiece, the work of vertical posture
Part a enters just in material folding channel parts 2511, and the inappropriate workpiece of posture is shunk the constraint of slanted bar 2510 from entrance by entrance
It is fallen at blanking port between positioning strip 2512 and material folding channel parts 2511, workpiece falls into blanking slope 256, subsequently into second
Conveyer belt 254, workpiece moves right along b, until falling on the second conveyer belt 254 after contact end baffle 258, so that workpiece is following
25 shuttling movement of endless conveying belt mechanism, the workpiece of some vertical states, which enters, waits clamping in material folding channel parts 2511, improper
Workpiece continues cycling through, until entering material folding channel parts 2511；Endless apron mechanism 25 drives semiconductor for recycling, and will partly lead
Body is transported to suitable position and clamping is waited to carry.
As shown in fig. 6, semiconductor positioning device 3 includes fixed bracket 31, the second motor 32, shaft mounting base 33, positioning
Shaft 34, positioning rotor 35, limit card slot 36, positioning plate 37, positioning side plate 38, locating piece 30 and the second infrared sensor
39；Fixed bracket 31 is fixed in rack components 1, and the setting of shaft mounting base 33 on fixed bracket 31, pacify by locating piece 30
In shaft mounting base 33, the second motor 32 is mounted in shaft mounting base 33 by motor mount；Positioning rotating shaft 34 is pacified
In shaft mounting base 33, positioning rotor 35 is arranged on positioning rotating shaft 34, and 34 left end of positioning rotating shaft connects the second motor 32
Output shaft, 34 right end of positioning rotating shaft are fixedly connected with limit card slot 36, and positioning rotating shaft 34 is in 37 lower section of positioning plate；Limiting card
Arc groove e is provided on slot 36, arc groove e is matched with 33 right end pillar f of shaft mounting base, so that 36 rotation amplitude of limit card slot
It is restricted, to control the corner of positioning rotor 35；Positioning plate 37 is arranged in shaft mounting base 33, and positioning side plate 38 is pacified
On positioning plate 37, positioning 38 one end of side plate is against on locating piece 30, and positioning side plate 38 is two pieces of left and right, two pieces of oriented sides
Plate 38 is mounted on positioning plate 37 by adjusting screw, forms material passing passage, two pieces of oriented sides between two blocks of positioning side plates 38
Feeding chamber is formed between plate 38 and locating piece 30, material passing passage is connected to feeding chamber, adjusts two blocks of positioning side plates by adjusting screw
The size of material passing passage between 38, to adapt to various sizes of workpiece；Second infrared sensor 39 is mounted on locating piece 30, the
Two infrared sensors, 39 position corresponds to feeding chamber, and the second infrared sensor 39 is for confirming in feeding chamber whether there is workpiece；Shaft
Position and the matched through-hole of material passing passage are respectively equipped in mounting base 33 and positioning plate 37, positioning 35 position of rotor corresponds to punishment in advance
Channel, positioning rotor 35 are used for the piece-holder in feeding chamber at it between locating piece 30.
Semiconductor positioning device 3 in use, conveying robot unit 4 by workpiece handling between two blocks of positioning side plates 38
In feeding chamber, the second motor 32 is driven to rotate after being detected by the second infrared sensor 39, so that positioning rotor 35 is driven to rotate,
Positioning rotor 35 passes through the through-hole in shaft mounting base 33 and positioning plate 37 and workpiece a is clamped in positioning rotor 35 and locating piece
Between 30,
Realize workpiece positioning.Positioning rotor 35 rotate amplitude controlled by limit card slot 36, when 36 turns of limit card slot it is motionless
Afterwards, reset is rotated backward.
As shown in Figure 7, Figure 8 and Figure 9, conveying robot unit 4 includes first movement component 41, traversing mounting plate 42, limit
Bit detector 43, first pipette manipulator 44, second pipette manipulator 45, gantry fixed frame 46 and traversing slide 47；First moves
Dynamic 41 level of component is fixedly mounted on gantry fixed frame 46, and gantry fixed frame 46 is fixed in rack components 1, and first moves
Dynamic component 41 is located at 5 top of semiconductor feeding device 2, semiconductor positioning device 3 and automatic packing apparatus.
Third motor 48 drives traversing slide 47 to move on first movement component 41, and traversing mounting plate 42 is arranged traversing
On slide 47, limit detector 43, second pipette manipulator 45 and first and pipette manipulator 44 and be mounted on traversing mounting plate 42,
Limit detector 43 is used to control the second distance for pipetting the decline of manipulator 45；First, which pipettes manipulator 44, is used for workpiece from partly
Conductor feeding device 2 is transported in semiconductor positioning device 3, and second pipettes manipulator 45 fills for positioning workpiece from semiconductor
3 are set to be transported in automatic packing apparatus 5.
Conveying robot unit 4 is in use, first movement component 41 is driven by third motor 48, through feed screw nut's auxiliary driving
After drive traversing slide 47 to move horizontally, moving distance can be controlled by limit sensors；Manipulator 44 is pipetted by work by first
Part is transported in semiconductor positioning device 3 from semiconductor feeding device 2, pipettes manipulator 45 for workpiece from semiconductor by second
Positioning device 3 is transported in automatic packing apparatus 5.
First, which pipettes manipulator 44, includes the first cylinder 441, the first cylinder fixed seat 442, the first linear guide rail assembly
443, the second cylinder mounting base 444, contact switch 445, the second cylinder 446 and movable chuck 447；The fixation of first cylinder 441 is set
It sets in the first cylinder fixed seat 442, the first cylinder fixed seat 442 is fixed in the first cylinder fixed seat 442, the second gas
Cylinder mounting base 444 is mounted in the first cylinder fixed seat 442 by the first linear guide rail assembly 443；Contact switch 445 is mounted on
In second cylinder mounting base 444, contact switch 445 is used to control the minimum allowable distance of the second cylinder mounting base 444 decline；Second gas
446 fixing end of cylinder is vertically arranged in the second cylinder mounting base 444, and two movable chucks 447 are fixed at the second cylinder 446
Lower end.
First pipettes manipulator 44 in use, the second cylinder 446 control movable chuck 447 moves, to realize clamping work
Workpiece is transported to semiconductor positioning dress from semiconductor feeding device 2 by the first cylinder 441 and 48 collective effect of third motor by part
It sets in 3.
Second pipette manipulator 45 include the 4th motor 451, vertical bearing seat 452, lead screw 453, feed screw nut seat 454,
Second linear guide rail assembly 455, third cylinder 456 and pneumatic chuck 457；4th motor 451 is arranged on traversing mounting plate 42,
456 output shaft of third cylinder is connect with lead screw 453 by shaft coupling；453 upper end of lead screw is mounted in vertical bearing seat 452, silk
453 lower end of thick stick is mounted in traversing mounting plate 42；Feed screw nut seat 454 is fitted in lead screw 453 by screw pair；
Second linear guide rail assembly 455 includes sliding rail and slide, and the two forms prismatic pair connection, and sliding rail is fixed at traversing mounting plate
In 42, slide is fixedly connected with 454 phase of feed screw nut seat；Third cylinder 456 is fixed on feed screw nut seat 454, third
Collet 458 is arranged in the output axis connection pneumatic chuck 457 of cylinder 456,457 bottom end of pneumatic chuck；
Second pipettes manipulator 45 in use, driving feed screw nut seat 454 to move up and down by screw nut driven, moves
Dynamic distance is controlled by the limit detector 43 being arranged on traversing mounting plate 42；It is pneumatic by the control of 456 inflation/deflation of third cylinder
Pick-and-place to workpiece is realized in the folding of 457 upper grip 458 of collet, is lifted after workpiece is clamped in the decline of pneumatic chuck 457, by the
The workpiece clamped is transported to automatic packing apparatus from semiconductor positioning device 3 by three motors 48 and 451 collective effect of the 4th motor
In 5.
As shown in Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15 and Figure 16, automatic packing apparatus 5 includes packaging rack
51, material cup feeding receiving mechanism 52, heat-sealing film feeding mechanism 53, semiconductor feeding port component 54, flanging component 55, material cup guide rod
56, material cup Zou Liao mechanism 57 and press mold guide rail 58；Packaging rack 51 is fixed in rack components 1, material cup feeding collecting machine
The setting of structure 52 is in packaging rack 51；The setting of heat-sealing film feeding mechanism 53 is in packaging rack 51, and heat-sealing film feeding mechanism 53
Above press mold guide rail 58, heat-sealing film feeding mechanism 53 for realizing heat-sealing film feeding；Semiconductor feeding port component 54 and pressure
Component 55 position in side corresponds to the material cup in press mold guide rail 58, and conveying robot unit 4 is placed at material mouth component 54 on the semiconductor
Workpiece to be packaged, workpiece slide from feeding port component 54 to falling into material cup；Flanging component 55 is used to heat-sealing film being pressed on material
On cup；Material cup guide rod 56 is fixed in packaging rack 51, and material cup guide rod 56 is located at 58 lower section of press mold guide rail, material cup guide rod 56
Position corresponds to material cup, and material cup guide rod 56 is for keeping material cup horizontal；Material cup Zou Liao mechanism 57 is mounted on 58 lower section of press mold guide rail, material
Bei Zouliao mechanism 57 is used to material cup realizing step-by-step movement feed motion；Along direction of feed feeding port component 54, the heat-sealing film of material cup
Feeding mechanism 53, flanging component 55 are arranged successively；
Automatic packing apparatus 5 in use, material cup feeding receiving mechanism 52 and material cup Zou Liao mechanism 57 realize the feeding of material cup,
Realize that the feeding of heat-sealing film, material cup and heat-sealing film realize that synchro-feed, workpiece are expected on the semiconductor by heat-sealing film feeding mechanism 53
Material cup is put at mouth component 54, each material cup places a semiconductor, by realizing heat sealed package after flanging component 55, packs
Workpiece afterwards is completed to collect in left end material cup feeding receiving mechanism 52；
Press mold guide rail 58 includes the first pressure rail 581 and the second pressure rail 582, and the first pressure rail 581 and the second pressure rail 582 are mounted on
It packs in rack 51, there are the material cup channels that supply cup passes through between the first pressure rail 581 and the second pressure rail 582；
First pressure rail 581 includes that rail and first is pressed to push rail on first, and the second pressure rail 582 includes that rail and second is pressed on second
Rail is pushed, presses rail and the inner end of the second pushing rail to be equipped with inwardly projecting flanging 583 on second, material cup is under flanging 583
Side, the heat-sealing film g exported from heat-sealing film feeding mechanism 53 are pressed in the material cup between two pieces of flanging.
Material cup feeding receiving mechanism 52 includes the 5th motor 520, loading plate 521, loading plate pillar 522, rewinding disk pillar
523, the first rotation seat 524, the second rotation seat 525, the first idler wheel 526, the second idler wheel 527, third idler wheel 528, rubber strip 529
With rewinding disk 5210；Loading plate 521 is mounted in the shaft 5211 of loading plate pillar 522, and loading plate pillar 522 is fixed at
On the one end for packing rack 51；Rewinding disk pillar 523 is fixed on the other end of packaging rack 51, the first rotation seat 524
523 two sides of rewinding disk pillar are separately positioned on the second rotation seat 525；5th motor 520 exports the first idler wheel of axis connection 526,
In packaging rack 51, the second idler wheel 527 is mounted on the first rotation seat 524 setting of 5th motor 520, and third idler wheel 528 is pacified
On the second rotation seat 525；It is realized between first idler wheel 526, the second idler wheel 527 and third idler wheel 528 by rubber strip 529
Synchronous Transmission；Rewinding disk 5210 is arranged on the central axis of the second rotation seat 525；Heat-sealing film feeding mechanism 53, semiconductor feeding
Mouth component 54, flanging component 55, material cup guide rod 56, material cup Zou Liao mechanism 57 and press mold guide rail 58 are in loading plate 521 and rewinding
Between disk 5210；
52 left end portions of material cup feeding receiving mechanism, that is, rewinding disk 5210 workpiece good for collecting packing, material cup feeding are received
Right end portion, that is, loading plate 521 of material mechanism 52 is for sending out material cup to be packaged.Material cup feeding receiving mechanism 52 in use, on
It is sky material cup in charging tray 521, is packaged material cup in rewinding disk 5210, is driven by the 5th motor 520, through rubber strip 529
Transmission drives rewinding disk 5210 to rotate, so that rows of material cup moves.
Heat-sealing film feeding mechanism 53 includes hold-down support 531, heat-sealing film material tray 532, fixing seat 533, compresses adjusting screw
534, guide roller 535, swing idler wheel 536 and adjusting block 537；Hold-down support 531 and the setting of fixing seat 533 are in packaging rack 51
On, heat-sealing film material tray 532 is mounted on 531 upper end of hold-down support；Adjusting block 537 and fixing seat 533 are turned by guide roller 535
Axis forms revolute pair connection, swings idler wheel 536 and is mounted on adjusting block 537；Adjusting screw 534 is compressed to be mounted on by screw pair
In fixing seat 533, compresses adjusting 534 lower end of screw and contacted with adjusting block 537；Guide roller 535 and swing idler wheel 536 are located at pressure
58 top of film guide rail；
Heat-sealing film feeding mechanism 53 adjusts screw 534 in use, compressing by rotation, so that adjusting block 537 is to the bottom, from
And change the angle for swinging idler wheel 536, and heat-sealing film g is wrapped in guide roller 535 and swings on idler wheel 536, so that heat-sealing film g
Be pressed on material cup upper limb, the frictional force that heat-sealing film and material cup generate and drive heat-sealing film g feeding.
Semiconductor feeding port component 54 includes blanking track 541 and blanking guiding block 542；The setting of blanking track 541 is being wrapped
Install frame 51 on, blanking track 541 be equipped with the matched horizontal concrete chute 5411 of workpiece shapes and blanking sliding slot 5412, blanking is led
Draw block 542 to be connected on the outlet end of blanking track 541, blanking guiding block 542 is equipped with and the matched guidance of workpiece shapes
Sliding slot, and guiding chute position is matched with blanking sliding slot 5412, workpiece passes through blanking sliding slot and blanking guiding block 542 from blanking rail
It is slid into the horizontal concrete chute in road 541 in the accommodating chamber of material cup.
Semiconductor feeding port component 54 is in use, workpiece passes through blanking sliding slot and blanking guiding block 542 from blanking track 541
Horizontal concrete chute in slide into material cup accommodating chamber in, wait heat-sealing be packaged；
Flanging component 55 includes flanging fixing seat 551, flanging frame 552 and flanging idler wheel 553；Flanging fixing seat 551 is fixed
Setting is in packaging rack 51, and flanging frame 552 forms revolute pair with flanging fixing seat 551 by pin shaft and connect, on flanging frame 552
End is connect by screw 554 with flanging fixing seat 551；Flanging idler wheel 553 is mounted on flanging frame 552,553 position of flanging idler wheel
Right above material cup channel；The height of flanging idler wheel 553 is adjusted by screw 554.
Screw 554 adjusts the height of flanging idler wheel 553, and flanging idler wheel 553 contacts heat-sealing film g, while flanging idler wheel 553 has
Heat-sealing film is bonded in material cup by certain temperature, when rolling.
Material cup Zou Liao mechanism 57 includes bearing block 571, indexing drive disk 572 and third infrared sensor 573；5th motor
520 output shaft passes through the connection indexing drive disk 572 of bearing block 571；Indexing 572 outer ring of drive disk is provided with pillar, and pillar is straight
Diameter is adapted with the circular hole on material cup h, and the circular arc distance of two neighboring pillar is equidistant with adjacent circular holes on material cup h,
So that pillar is inserted in circular hole, rotated by indexing drive disk 572, so that material cup h makees straight-line feed movement；The infrared biography of third
Sensor 573 is fixed in packaging rack 51, corresponding with the indexing graduated disk of 572 end of drive disk, third infrared sensor
573 for controlling indexing 572 stepwise motion of drive disk；
Material cup Zou Liao mechanism 57 in use, indexing 572 circumference of drive disk on pillar be inserted in the circular hole of charging tray, drive
Material cup h makees straight-line feed movement；5th motor 520 drives the transmission of the first idler wheel 526, realizes the fortune of material cup feeding receiving mechanism 52
Dynamic, the two holding moves synchronously.
In use, semiconductor feeding device 2 carries out circulation feeding to workpiece, then pass through conveying robot unit 4 for work
Part is transported to semiconductor positioning device 3 and is positioned, and then again positions workpiece from semiconductor by conveying robot unit 4 and fills
It sets and is transported in 3 in automatic packing apparatus 5, the automatic charging of material cup and heat-sealing film is realized in automatic packing apparatus 5, when partly leading
After body falls into material cup, the process that heat-sealing is packaged is realized, then automatic coiling is collected, and completes the packing work to semiconductor.
Claims (2)
1. a kind of semiconductor components and devices sealed in unit, it is characterised in that semiconductor including rack components (1) and thereon feeds dress
Set (2), semiconductor positioning device (3), conveying robot unit (4) and automatic packing apparatus (5)；Semiconductor feeding device (2)
For realizing the feeding function of semiconductor to be packaged；Semiconductor positioning device (3) is mutually connected with semiconductor feeding device (2), and half
Conductor positioning device (3) is for positioning semiconductor to be packaged；Conveying robot unit (4) is for semiconductor feeding device (2), half
The carrying of semiconductor workpiece between conductor positioning device (3) and automatic packing apparatus (5)；Automatic packing apparatus (5) and semiconductor
Positioning device (3) is mutually connected, and automatic packing apparatus (5) is for the feeding of material cup, the feeding of heat-sealing film and heat-sealing film and material cup
Heat-sealing；
Semiconductor positioning device (3) includes fixed bracket (31), the second motor (32), shaft mounting base (33), positioning rotating shaft
(34), it is infrared that rotor (35), limit card slot (36), positioning plate (37), positioning side plate (38), locating piece (30) and second are positioned
Sensor (39)；Fixed bracket (31) are fixed on rack components (1), and shaft mounting base (33) setting is in fixed bracket
(31) on, locating piece (30) is mounted on shaft mounting base (33), and the second motor (32) is mounted on shaft by motor mount
In mounting base (33)；Positioning rotating shaft (34) is mounted on shaft mounting base (33), and positioning rotor (35) is arranged in positioning rotating shaft
(34) on, positioning rotating shaft (34) left end connects the second motor (32) output shaft, positioning rotating shaft (34) right end and limit card slot (36)
It is fixedly connected, positioning rotating shaft (34) is in below positioning plate (37)；Be provided with arc groove e in limit card slot (36), arc groove e with
Shaft mounting base (33) right end pillar f is matched；Positioning plate (37) is arranged on shaft mounting base (33), positions side plate (38)
It being mounted on positioning plate (37), positioning side plate (38) one end is against on locating piece (30), and positioning side plate (38) is two pieces of left and right,
Two pieces of positioning side plates (38) are mounted on positioning plate (37) by adjusting screw, form punishment in advance between two pieces of positioning side plates (38)
Channel forms feeding chamber between two pieces of positioning side plates (38) and locating piece (30), material passing passage is connected to feeding chamber, by adjusting spiral shell
The size of material passing passage between two pieces of positioning side plate (38) of nail adjustment；Second infrared sensor (39) is mounted on locating piece (30)
On, the second infrared sensor (39) position corresponds to feeding chamber；Position is respectively equipped on shaft mounting base (33) and positioning plate (37)
It sets and corresponds to material passing passage with the matched through-hole of material passing passage, positioning rotor (35) position, positioning rotor (35) is used for feeding chamber
In piece-holder at it between locating piece.
2. a kind of semiconductor components and devices sealed in unit according to claim 1, it is characterised in that automatic packing apparatus (5) packet
Include packaging rack (51), material cup feeding receiving mechanism (52), heat-sealing film feeding mechanism (53), semiconductor feeding port component (54),
Flanging component (55), material cup guide rod (56), material cup Zou Liao mechanism (57) and press mold guide rail (58)；Pack rack (51) fixed setting
On rack components (1), material cup feeding receiving mechanism (52) setting is in packaging rack (51)；Heat-sealing film feeding mechanism (53) is set
It sets in packaging rack (51), heat-sealing film feeding mechanism (53) is located above press mold guide rail (58)；Semiconductor feeding port component
(54) material cup in press mold guide rail (58) is corresponded to flanging component (55) position；Material cup guide rod (56) is fixed at packaging rack
(51) on, material cup guide rod (56) is located at below press mold guide rail (58), and material cup guide rod (56) position corresponds to material cup, material cup guide rod (56)
For keeping material cup horizontal；Material cup Zou Liao mechanism (57) is mounted below press mold guide rail (58), and material cup Zou Liao mechanism (57) is used for
Material cup is realized into step-by-step movement feed motion；Along the direction of feed feeding port component (54) of material cup, heat-sealing film feeding mechanism (53), pressure
Side component (55) is arranged successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511304.2A CN108493142B (en) | 2018-05-25 | 2018-05-25 | A kind of semiconductor components and devices sealed in unit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511304.2A CN108493142B (en) | 2018-05-25 | 2018-05-25 | A kind of semiconductor components and devices sealed in unit |
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| CN108493142A CN108493142A (en) | 2018-09-04 |
| CN108493142B true CN108493142B (en) | 2019-09-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109159988B (en) * | 2018-09-29 | 2020-12-04 | 平阳县美达金银制品有限公司 | Micro-gap switch equipment for packing |
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| CN102142381A (en) * | 2011-02-14 | 2011-08-03 | 南通富士通微电子股份有限公司 | Automatic charging system of semiconductor packaging equipment |
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| CN106956163A (en) * | 2017-04-07 | 2017-07-18 | 广东南大机器人有限公司 | A kind of fully automatic feeding equipment |
| CN107116832A (en) * | 2017-06-07 | 2017-09-01 | 广州鸿琪光学仪器科技有限公司 | Card press machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064624B (en) * | 2014-05-29 | 2016-05-25 | 苏州菱欧自动化设备有限公司 | Full-automatic battery side machining production line |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102142381A (en) * | 2011-02-14 | 2011-08-03 | 南通富士通微电子股份有限公司 | Automatic charging system of semiconductor packaging equipment |
| CN104015454A (en) * | 2014-05-16 | 2014-09-03 | 深圳市深科达气动设备有限公司 | Full-automatic fitting assembling intelligent production line |
| CN203895482U (en) * | 2014-05-29 | 2014-10-22 | 苏州菱欧自动化设备有限公司 | Automatic battery side edge machining production line |
| CN106002606A (en) * | 2016-05-16 | 2016-10-12 | 苏州辰轩光电科技有限公司 | Polishing and wax pasting machine for sapphire substrate |
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| CN108493142A (en) | 2018-09-04 |
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Effective date of registration: 20190820 Address after: 225300 No. 76 Fenghuang East Road, Hailing District, Taizhou City, Jiangsu Province Applicant after: Taizhou Yuxin Microelectronics Co., Ltd. Address before: 315301 No. 1600 West Third Ring Road, Zonghan Street, Cixi City, Ningbo City, Zhejiang Province Applicant before: Wang Jiahai |
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