CN108598024A - Chip package machine - Google Patents
Chip package machine Download PDFInfo
- Publication number
- CN108598024A CN108598024A CN201810511313.1A CN201810511313A CN108598024A CN 108598024 A CN108598024 A CN 108598024A CN 201810511313 A CN201810511313 A CN 201810511313A CN 108598024 A CN108598024 A CN 108598024A
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- CN
- China
- Prior art keywords
- chip
- material cup
- flanging
- heat
- idler wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The present invention relates to technical field of semiconductors.Chip package machine, including rack components and chip feeding equipment, chip positioning device, conveying robot unit and automatic packing apparatus thereon；Chip feeding equipment for realizing chip to be packaged feeding function；Chip positioning device is mutually connected with chip feeding equipment, and chip positioning device is for positioning chip to be packaged；Carrying of the conveying robot unit for chip workpiece between chip feeding equipment, chip positioning device and automatic packing apparatus；Automatic packing apparatus is mutually connected with chip positioning device, heat-sealing of the automatic packing apparatus for the feeding of material cup, the feeding and heat-sealing film and material cup of heat-sealing film.The advantages of chip package machine is the encapsulation that can be automatically finished the feeding of semiconductor element device, material cup and heat-sealing film, and complete semiconductor element device, high in machining efficiency.
Description
Technical field
The present invention relates to the production equipments of chip technology field, especially chip.
Background technology
Chip production and detection complete after it is necessary to by chip by be put into insulation material cup in then sealed with heat-sealing film.
Existing packaged type is as follows：It is moved, chip is put into one by one in the feeding chamber of the fixed insulation material cup in position by manipulator,
Material cup be it is regularly arranged multiple, a row insulate material cup feeding chamber pile chip after, insulation material cup is moved to hot pressing film and is set
Standby lower section, hot pressing film close feeding chamber, complete the encapsulation of chip.Deficiency existing for existing chip encapsulating device is processing efficiency
It is low.
Invention content
The object of the present invention is to provide a kind of full-automatic chip package machines high in machining efficiency.
To achieve the goals above, the technical solution used in the present invention is：Chip package machine, including rack components and its
On chip feeding equipment, chip positioning device, conveying robot unit and automatic packing apparatus；Chip feeding equipment is for real
The feeding function of existing chip to be packaged；Chip positioning device is mutually connected with chip feeding equipment, and chip positioning device is for positioning
Chip to be packaged；Conveying robot unit is for chip between chip feeding equipment, chip positioning device and automatic packing apparatus
The carrying of workpiece；Automatic packing apparatus is mutually connected with chip positioning device, and automatic packing apparatus is used for feeding, the heat-sealing film of material cup
Feeding and heat-sealing film and material cup heat-sealing；
Automatic packing apparatus include packaging rack, material cup feeding receiving mechanism, heat-sealing film feed mechanism, chip feeding port component,
Flanging component, material cup guide rod, material cup Zou Liao mechanisms and press mold guide rail；Packaging rack is fixed in rack components, in material cup
Expect receiving mechanism setting in packaging rack；In packaging rack, heat-sealing film feed mechanism is located at the setting of heat-sealing film feed mechanism
Above press mold guide rail；Chip feeding port component and flanging module position correspond to the material cup in press mold guide rail；The fixation of material cup guide rod is set
It sets in packaging rack, material cup guide rod is located at below press mold guide rail, and material cup guide rod position corresponds to material cup, and material cup guide rod is for keeping
Material cup is horizontal；Material cup Zou Liao mechanisms are mounted below press mold guide rail, and material cup Zou Liao mechanisms are used to material cup realizing step-by-step movement feeding
Movement；Direction of feed feeding port component, heat-sealing film feed mechanism, flanging component along material cup are arranged in order.
Preferably, press mold guide rail includes the first pressure rail and the second pressure rail, the first pressure rail and the second pressure rail are mounted on packaging
In rack, there are the material cup channels that supply cup passes through between the first pressure rail and the second pressure rail；First pressure rail includes pressing rail on first
With the first pushing rail, the second pressure rail includes pressure rail and the second pushing rail on second, presses rail and second to push the inner end of rail on second
It is equipped with inwardly projecting flanging, material cup is in below flanging, and the heat-sealing film g exported from heat-sealing film feed mechanism is pressed on two
In material cup between block flanging.
Preferably, material cup feeding receiving mechanism includes the 5th motor, loading plate, loading plate pillar, rewinding disk pillar, the
One rotation seat, the second rotation seat, the first idler wheel, the second idler wheel, third idler wheel, rubber strip and rewinding disk；Loading plate is mounted on upper
In the shaft of charging tray pillar, loading plate pillar is fixed on one end of packaging rack；Rewinding disk pillar is fixed at packet
It installs on the other end of frame, the first rotation seat and the second rotation seat are separately positioned on rewinding disk pillar both sides；5th motor exports
The first idler wheel of axis connection, in packaging rack, the second idler wheel is mounted on the first rotation seat the setting of the 5th motor, third idler wheel peace
On the second rotation seat；Synchronous Transmission is realized by rubber strip between first idler wheel, the second idler wheel and third idler wheel；Rewinding disk
It is arranged on the central shaft of the second rotation seat；Heat-sealing film feed mechanism, chip feeding port component, flanging component, material cup guide rod, material
Bei Zouliao mechanisms and press mold guide rail are between loading plate and rewinding disk.
Preferably, heat-sealing film feed mechanism includes hold-down support, heat-sealing film material tray, fixed seat, compresses adjusting screw, leads
Way roller swings idler wheel and adjusting block；In packaging rack, heat-sealing film material tray, which is mounted on, fixes for hold-down support and fixed seat setting
Bearing upper end；Adjusting block forms revolute pair by the shaft of guide roller with fixed seat and connect, and swings idler wheel and is mounted on adjusting block
On；It compresses adjusting screw to be mounted in fixed seat by screw pair, compresses adjusting screw lower end and contacted with adjusting block；Guide roller
It is located above press mold guide rail with idler wheel is swung.
Preferably, chip feeding port component includes blanking track and blanking guiding block；Blanking track is arranged in packing machine
On frame, blanking track is equipped with is connected to blanking rail with the matched horizontal concrete chute of workpiece shapes and blanking sliding slot, blanking guiding block
On the outlet end in road, blanking guiding block is equipped with and the matched guiding chute of workpiece shapes, and guiding chute position and blanking
Sliding slot matches, and workpiece slides into the accommodating chamber of material cup by blanking sliding slot and blanking guiding block from the horizontal concrete chute of blanking track
In.
Preferably, flanging component includes flanging fixed seat, flanging frame and flanging idler wheel；Flanging fixed seat is fixed at
It packs in rack, flanging frame forms revolute pair with flanging fixed seat by axis pin and connect, and flanging frame upper end passes through screw and flanging
Fixed seat connects；Flanging idler wheel is mounted on flanging frame, and flanging scroll wheel positions are in right over material cup channel；It is adjusted by screw
The height of flanging idler wheel.
Preferably, material cup Zou Liao mechanisms include bearing block, indexing drive disk and third infrared sensor；5th motor
Output shaft passes through bearing block connection indexing drive disk；Indexing drive disk outer ring is provided with pillar, pillar diameter and the circle on material cup h
Hole is adapted, by indexing drive disk rotation so that material cup h makees straight-line feed movement；Third infrared sensor is fixed at
It packs in rack, corresponding with the graduated disk of indexing drive disk end, third infrared sensor is for controlling indexing drive disk stepping
Formula moves.
Preferably, chip feeding equipment includes mounting bracket, first motor, gear set and endless apron mechanism and guide wheel
Tension assembly；Mounting bracket includes two pieces of installation risers and connecting rod, and two pieces of installation risers are fixed by the connecting rod connection；Gear set
Include the first gear and second gear of engagement connection；Installation riser is fixed in rack components, and first motor passes through gear set
Connect endless apron mechanism；Endless apron mechanism and guide wheel tension assembly are mounted on mounting bracket, and guide wheel tension assembly connects
Meet endless apron mechanism；Endless apron mechanism includes the first drive roll, the second drive roll, first conveyer belt, second
Conveyer belt, tensioning guide wheel, blanking slope, side shield, end baffle, end fixed block, entrance shrink slanted bar, entrance positioning strip and
Material folding channel parts；First drive roll and the second drive roll are mounted on by bearing in installation riser.
Use the chip package machine of above-mentioned technical proposal, chip feeding equipment for realizing chip to be packaged feeding work(
Can, chip positioning device is for positioning chip to be packaged, and conveying robot unit is for chip feeding equipment, chip positioning device
The carrying of chip workpiece between automatic packing apparatus, automatic packing apparatus for the feeding of material cup, heat-sealing film feeding and
The heat-sealing of heat-sealing film and material cup.The advantages of chip package machine, can be automatically finished chip member device, material cup and heat-sealing film
Feeding, and the encapsulation of chip member device is completed, it is high in machining efficiency.
Description of the drawings
Fig. 1 is the configuration schematic diagram of the embodiment of the present invention.
Fig. 2 is the configuration schematic diagram of the chip feeding equipment of the embodiment of the present invention.
Fig. 3 is the configuration schematic diagram of the endless apron mechanism of the embodiment of the present invention.
Fig. 4 is the configuration schematic diagram of the material folding channel parts of the embodiment of the present invention.
Fig. 5 is the configuration schematic diagram of the chip positioning device of the embodiment of the present invention.
Fig. 6 is the configuration schematic diagram of the conveying robot unit of the embodiment of the present invention.
Fig. 7 is the first of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Fig. 8 is the second of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Fig. 9 is the configuration schematic diagram of the automatic packing apparatus of the embodiment of the present invention.
Figure 10 is the configuration schematic diagram of the material cup feeding receiving mechanism of the embodiment of the present invention.
Figure 11 is the configuration schematic diagram of the heat-sealing film feed mechanism of the embodiment of the present invention.
Figure 12 is the configuration schematic diagram of the chip feeding port component of the embodiment of the present invention.
Figure 13 is the configuration schematic diagram of the flanging component of the embodiment of the present invention.
Figure 14 is the structural schematic diagram of the material cup Zou Liao mechanisms of the embodiment of the present invention.
Figure 15 is the configuration schematic diagram of the press mold guide rail of the embodiment of the present invention.
Specific implementation mode
The present invention is described further with embodiment with reference to the accompanying drawings of the specification.
Such as Fig. 1-chip package machines shown in figure 15, including rack components 1 and chip feeding equipment 2, chip thereon it is fixed
Position device 3, conveying robot unit 4 and automatic packing apparatus 5；Chip feeding equipment 2 is fixed in rack components 1, core
Piece feeding equipment 2 for realizing chip to be packaged feeding function.Chip positioning device 3 is connected with 2 phase of chip feeding equipment, core
Piece positioning device 3 improves the accuracy of gripping for positioning chip to be packaged.Conveying robot unit 4 is for chip charging dress
Set the carrying of chip workpiece between 2, chip positioning device 3 and automatic packing apparatus 5.Automatic packing apparatus 5 is filled with chip positioning
Set the linking of 3 phases, heat-sealing of the automatic packing apparatus 5 for the feeding of material cup, the feeding and heat-sealing film and material cup of heat-sealing film.
As shown in Figure 2, Figure 3 and Figure 4, chip feeding equipment 2 includes that mounting bracket, first motor 22, gear set and cycle are defeated
Tape-feed 25 and guide wheel tension assembly 26；Mounting bracket 21 includes two pieces of installation risers 211 and connecting rod 212, and two pieces of installations are vertical
Plate 211 is fixedly connected by connecting rod 212；Gear set includes the first gear 23 and second gear 24 of engagement connection；Installation is vertical
Plate 211 is fixed in rack components 1, and first motor 22 is fixed at by motor mounting rack on mounting bracket, first motor 22
Endless apron mechanism 25 is connected by gear set；Endless apron mechanism 25 and guide wheel tension assembly 26 are mounted on mounting bracket 21
On, guide wheel tension assembly 26 connects endless apron mechanism 25；Endless apron mechanism 25 includes the first drive roll 251, the
Two drive rolls 252, first conveyer belt 253, the second conveyer belt 254, tensioning guide wheel 255, blanking slope 256, side shield 257,
End baffle 258, end fixed block 259, entrance shrink slanted bar 2510, entrance positioning strip 2512 and material folding channel parts 2511；The
One drive roll 251 and the second drive roll 252 are mounted on by bearing in installation riser 211.
Material folding channel parts 2511 are in the top of 254 one end of the second conveyer belt, and end baffle 258 is in the second conveyer belt
The top of 254 other ends, the top of 256 first conveyer belt of blanking slope, 253 one end, end baffle 258 are in first conveyer belt
The top of 253 other ends, blanking slope 256 are in the lower section of material folding channel parts 2511；The connection of first gear 23 first is actively rolled
Cylinder 251, second gear 24 connect the second drive roll 252, and first gear 23 and second gear 24 form external toothing, and transmission ratio is
1:1 so that the first drive roll 251 and 252 constant speed of the second drive roll rotate backward；First conveyer belt 253 is wrapped in first
On drive roll 251, the second conveyer belt 254 is wrapped on the second drive roll 252, first conveyer belt 253 and the second conveyer belt
254 direction of motion is on the contrary, the direction of motion of first conveyer belt 253 is to illustrate c to the direction of motion of the second conveyer belt 254 is
Illustrate b to.
Blanking slope 256 is mounted between two pieces of installation risers 211, and blanking slope 256 is located on the second conveyer belt 254
Side, blanking slope 256 is for accepting the workpiece fallen from first conveyer belt 253；Side shield 257 is fixed at installation riser
On 211, the position of side shield 257 is matched with the second conveyer belt 254, and side shield 257 is for the work on regular second conveyer belt 254
Part；Between end baffle 258 is fixed at two pieces of installation risers 211 by end fixed block 259, end baffle 258 is located at
First conveyer belt 253 and the top of the second conveyer belt 254, it is defeated that the workpiece shelves in first conveyer belt 253 are entered second by end baffle 258
It send in band 254.
The end baffle 258 of the top of second conveyer belt 254 is equipped with from first conveyer belt 253 to 254 side of the second conveyer belt
To inclined folded plate, folded plate enters the workpiece shelves in first conveyer belt 253 in second conveyer belt 254, and the second conveyer belt 254 is in b
To when movement, the workpiece on the second conveyer belt 254 is fallen on after reaching end baffle 258 in first conveyer belt 253.
Entrance shrinks slanted bar 2510 and entrance positioning strip 2512 is respectively at the both sides of the second conveyer belt 254, and entrance is shunk
Slanted bar 2510 is located at 253 top of first conveyer belt, and entrance shrinks 2510 one end of slanted bar and is mounted in material folding channel parts 2511, entrance
2510 other end of slanted bar is shunk towards end baffle 258, and slanted bar 2510 is shunk by inclined entrance and adjusts entrance contraction slanted bar
The workpiece direction on the second conveyer belt 254 between 2510 and entrance positioning strip 2512, and prevent workpiece is premature from falling into first
On conveyer belt 253；There are blanking ports, blanking port to be in blanking slope between entrance positioning strip 2512 and material folding channel parts 2511
256 surface；
Close end is leaned in 254 position of the second conveyer belt at blanking port higher than 253 position of first conveyer belt at blanking slope 256
254 position of the second conveyer belt at baffle 258 is less than 253 position of first conveyer belt at end baffle 258.
The connection tensioning guide wheel 255 of guide wheel tension assembly 26, tensioning guide wheel 255 is two, and two tensioning guide wheels 255 connect respectively
First conveyer belt 253 and the second conveyer belt 254 are connect, it is defeated that guide wheel tension assembly 26 is tensioned cycle by adjusting tensioning guide wheel 255
First conveyer belt 253 on tape-feed 25 and the second conveyer belt 254.
Material folding channel parts 2511 include left fixed plate 25111, right fixed plate 25110, left guide pad 25112, right guide pad
25117, the first infrared sensor 25113, cylinder guide rod 25114, left spring 25115, right spring 25119, left adjusting screw
25116 and right adjusting screw 25118；Left fixed plate 25111 and right fixed plate 25110 are separately mounted to one piece of installation riser 211
On；Left guide pad 25112 is connected with right guide pad 25117 by cylinder guide rod 25114, left guide pad 25112 and right guide pad
It being equipped with feed zone between 25117 and charge region, feed zone pass through for workpiece, charge region is parked for workpiece, the
One infrared sensor, 25113 position corresponds to charge region, and the first infrared sensor 25113 is for confirming whether charge region has work
Part, convenient for gripping workpiece so as to conveying robot unit 4；Left fixed plate 25111 connects left guide by left adjusting screw 25116
Block 25112 is arranged with left spring 25115 on the cylinder guide rod 25114 between left fixed plate 25111 and left guide pad 25112, right
Fixed plate 25110 connects right guide pad 25117, right fixed plate 25110 and right guide pad 25117 by right adjusting screw 25118
Between cylinder guide rod 25114 on be arranged with right spring 25119, pass through and rotate left adjusting screw 25116 and right adjusting screw
Position between the left guide pad 25112 of 25118 adjustment and right guide pad 25117, that is, pass through left adjusting screw 25116 and right adjusting
Screw 25118 adjusts the size of feed zone, to adapt to various sizes of workpiece.
Chip feeding equipment 2 is in use, the driving of first motor 22 drives first conveyer belt after external gear pump is driven
253 and the second reversely movement at the uniform velocity of conveyer belt 254, the workpiece c in first conveyer belt 253 shrinks slanted bar to moving to left by entrance
2510 and entrance positioning strip 2512 adjust the posture of workpiece, the workpiece of vertical posture enters in material folding channel parts 2511 just, appearance
The inappropriate workpiece of state is shunk the constraint of slanted bar 2510 between entrance positioning strip 2512 and material folding channel parts 2511 by entrance
Blanking port at fall, workpiece falls into blanking slope 256, and subsequently into the second conveyer belt 254, workpiece moves right along b, until connect
It is fallen after contacting end portion baffle 258 on the second conveyer belt 254 so that for workpiece in 25 shuttling movement of endless apron mechanism, some are perpendicular
The workpiece of straight state, which enters, waits for gripping, improper workpiece to continue cycling through in material folding channel parts 2511, until entering material folding groove portion
Part 2511；Endless apron mechanism 25 drives chip for recycling, and chip, which is transported to suitable position, waits for gripping to carry.
As shown in figure 5, chip positioning device 3 includes fixing bracket 31, the second motor 32, shaft mounting base 33, positioning turn
Axis 34, positioning rotor 35, limit card slot 36, positioning plate 37, positioning side plate 38, locating piece 30 and the second infrared sensor 39；
Fixing bracket 31 is fixed in rack components 1, and shaft mounting base 33 is arranged on fixing bracket 31, and locating piece 30 is mounted on
In shaft mounting base 33, the second motor 32 is mounted on by motor mount in shaft mounting base 33；Positioning rotating shaft 34 is mounted on
In shaft mounting base 33, positioning rotor 35 is arranged on positioning rotating shaft 34, and 34 left end of positioning rotating shaft connects the output of the second motor 32
Axis, 34 right end of positioning rotating shaft are fixedly connected with limit card slot 36, and positioning rotating shaft 34 is in 37 lower section of positioning plate；Limit card slot 36
On be provided with arc groove e, arc groove e is matched with 33 right end pillar f of shaft mounting base so that 36 rotation amplitude of limit card slot by
Limitation, to control the corner of positioning rotor 35；Positioning plate 37 is arranged in shaft mounting base 33, and positioning side plate 38 is mounted on
On positioning plate 37,38 one end of positioning side plate is against on locating piece 30, and positioning side plate 38 is two pieces of left and right, two blocks of positioning side plates 38
It is mounted on positioning plate 37 by adjusting screw, forms material passing passage, two blocks of positioning side plates 38 between two blocks of positioning side plates 38
Form feeding chamber between locating piece 30, material passing passage is connected to feeding chamber, by adjusting screw adjust two blocks of positioning side plates 38 it
Between material passing passage size, to adapt to various sizes of workpiece；Second infrared sensor 39 is mounted on locating piece 30, and second is red
39 position of outer sensor corresponds to feeding chamber, and the second infrared sensor 39 is for confirming in feeding chamber whether there is workpiece；Shaft is installed
Position and the matched through-hole of material passing passage are respectively equipped on seat 33 and positioning plate 37, it is logical that 35 position of positioning rotor corresponds to punishment in advance
Road, positioning rotor 35 are used for the piece-holder in feeding chamber at it between locating piece 30.
Chip positioning device 3 is in use, the Sheng that conveying robot unit 4 positions workpiece handling between side plates 38 to two pieces
Expect in chamber, the second motor 32 is driven to rotate after being detected by the second infrared sensor 39, it is fixed to drive positioning rotor 35 to rotate
Position rotor 35 passes through the through-hole in shaft mounting base 33 and positioning plate 37 by piece-holder in positioning rotor 35 and locating piece 30
Between,
Realize workpiece positioning.The amplitude that positioning rotor 35 rotates is controlled by limit card slot 36, after 36 turns of limit card slot is motionless, instead
It is resetted to rotation.
As shown in Fig. 6, Fig. 7 and Fig. 8, conveying robot unit 4 includes first movement component 41, traversing mounting plate 42, limit
Bit detector 43, first pipette manipulator 44, second pipette manipulator 45, gantry fixed frame 46 and traversing slide 47；First moves
Dynamic 41 level of component is fixedly mounted on gantry fixed frame 46, and gantry fixed frame 46 is fixed in rack components 1, and first moves
Dynamic component 41 is located at 5 top of chip feeding equipment 2, chip positioning device 3 and automatic packing apparatus.
Third motor 48 drives traversing slide 47 to be moved on first movement component 41, and traversing mounting plate 42 is arranged traversing
On slide 47, limit detector 43, second pipette manipulator 45 and first and pipette manipulator 44 on traversing mounting plate 42,
Limit detector 43 is used to control the second distance for pipetting the decline of manipulator 45；First pipette manipulator 44 for by workpiece from core
Piece feeding equipment 2 is transported in chip positioning device 3, and second pipettes manipulator 45 for removing workpiece from chip positioning device 3
It transports in automatic packing apparatus 5.
Conveying robot unit 4 is in use, first movement component 41 is driven by third motor 48, through feed screw nut's auxiliary driving
After drive traversing slide 47 to move horizontally, displacement distance can be controlled by limit sensors；Manipulator 44 is pipetted by work by first
Part is transported to from chip feeding equipment 2 in chip positioning device 3, and pipetting manipulator 45 by second fills workpiece from chip positioning
3 are set to be transported in automatic packing apparatus 5.
First, which pipettes manipulator 44, includes the first cylinder 441, the first cylinder fixed seat 442, the first linear guide rail assembly
443, the second cylinder mounting base 444, contact switch 445, the second cylinder 446 and movable chuck 447；The fixation of first cylinder 441 is set
It sets in the first cylinder fixed seat 442, the first cylinder fixed seat 442 is fixed in the first cylinder fixed seat 442, the second gas
Cylinder mounting base 444 is mounted on by the first linear guide rail assembly 443 in the first cylinder fixed seat 442；Contact switch 445 is mounted on
In second cylinder mounting base 444, contact switch 445 is used to control the minimum allowable distance of the second cylinder mounting base 444 decline；Second gas
446 fixing end of cylinder is vertically arranged in the second cylinder mounting base 444, and two movable chucks 447 are fixed at the second cylinder 446
Lower end.
First pipettes manipulator 44 in use, the second cylinder 446 control movable chuck 447 moves, to realize clamping work
Workpiece is transported to chip positioning device 3 by part by the first cylinder 441 and 48 collective effect of third motor from chip feeding equipment 2
In.
Second pipette manipulator 45 include the 4th motor 451, vertical shaft bearing 452, leading screw 453, feed screw nut seat 454,
Second linear guide rail assembly 455, third cylinder 456 and pneumatic chuck 457；4th motor 451 is arranged on traversing mounting plate 42,
456 output shaft of third cylinder is connect with leading screw 453 by shaft coupling；453 upper end of leading screw is mounted in vertical shaft bearing 452, silk
453 lower end of thick stick is mounted in traversing mounting plate 42；Feed screw nut seat 454 is fitted to by screw pair in leading screw 453；
Second linear guide rail assembly 455 includes sliding rail and slide, and the two forms prismatic pair connection, and sliding rail is fixed at traversing mounting plate
In 42, slide is fixedly connected with 454 phase of feed screw nut seat；Third cylinder 456 is fixed on feed screw nut seat 454, third
Collet 458 is arranged in the output axis connection pneumatic chuck 457 of cylinder 456,457 bottom end of pneumatic chuck；
Second pipettes manipulator 45 in use, by screw nut driven, and feed screw nut seat 454 is driven to move up and down, it is mobile away from
It is controlled from the limit detector 43 by being arranged on traversing mounting plate 42；Pneumatic chuck is controlled by 456 inflation/deflation of third cylinder
The folding of 457 upper grips 458, realization pick and place workpiece, are lifted after workpiece is clamped in the decline of pneumatic chuck 457, by third electricity
The workpiece clamped is transported to from chip positioning device 3 in automatic packing apparatus 5 by 451 collective effect of machine 48 and the 4th motor.
As shown in Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14 and Figure 15, automatic packing apparatus 5 include packaging rack 51,
Material cup feeding receiving mechanism 52, heat-sealing film feed mechanism 53, chip feeding port component 54, flanging component 55, material cup guide rod 56, material
Bei Zouliao mechanisms 57 and press mold guide rail 58；Packaging rack 51 is fixed in rack components 1, and material cup feeding receiving mechanism 52 is set
It sets in packaging rack 51；For the setting of heat-sealing film feed mechanism 53 in packaging rack 51, heat-sealing film feed mechanism 53 is located at press mold
The top of guide rail 58, heat-sealing film feed mechanism 53 for realizing heat-sealing film feeding；Chip feeding port component 54 and flanging component 55
Position corresponds to the material cup in press mold guide rail 58, and conveying robot unit 4 places work to be packaged at chip feeding port component 54
Part, workpiece slide from feeding port component 54 to falling into material cup；Flanging component 55 is used to heat-sealing film being pressed on material cup；Material cup is led
Bar 56 is fixed in packaging rack 51, and material cup guide rod 56 is located at 58 lower section of press mold guide rail, and 56 position of material cup guide rod corresponds to material
Cup, material cup guide rod 56 is for keeping material cup horizontal；Material cup Zou Liao mechanisms 57 are mounted on 58 lower section of press mold guide rail, material cup Zou Liao mechanisms
57 by material cup for realizing step-by-step movement feed motion；Along the direction of feed feeding port component 54 of material cup, heat-sealing film feed mechanism 53,
Flanging component 55 is arranged in order；
Automatic packing apparatus 5 is in use, material cup feeding receiving mechanism 52 and material cup Zou Liao mechanisms 57 realize the feeding of material cup, by heat
Sealer feed mechanism 53 realizes that the feeding of heat-sealing film, material cup and heat-sealing film realize synchro-feed, and workpiece is in chip feeding port component
Material cup is put at 54, each material cup places a chip, by realizing heat sealed package after flanging component 55, the workpiece after packaging
It completes to collect in left end material cup feeding receiving mechanism 52；
Press mold guide rail 58 includes that the first pressure rail 581 and second presses rail 582, the first pressure rail 581 and second that rail 582 is pressed to be mounted on packaging
In rack 51, there are the material cup channels that supply cup passes through between the first pressure pressure rail 582 of rail 581 and second；
First pressure rail 581 includes that rail and first is pressed to push rail on first, and the second pressure rail 582 includes pressure rail and the second pushing on second
Rail, the inner end of pressure rail and the second pushing rail is equipped with inwardly projecting flanging 583 on second, and material cup be in below flanging 583, from
The heat-sealing film g exported on heat-sealing film feed mechanism 53 is pressed in the material cup between two pieces of flanging.
Material cup feeding receiving mechanism 52 includes the 5th motor 520, loading plate 521, loading plate pillar 522, rewinding disk pillar
523, the first rotation seat 524, the second rotation seat 525, the first idler wheel 526, the second idler wheel 527, third idler wheel 528, rubber strip 529
With rewinding disk 5210；Loading plate 521 is mounted in the shaft 5211 of loading plate pillar 522, and loading plate pillar 522 is fixed at
On the one end for packing rack 51；Rewinding disk pillar 523 is fixed on the other end of packaging rack 51, the first rotation seat 524
It is separately positioned on 523 both sides of rewinding disk pillar with the second rotation seat 525；5th motor 520 exports the first idler wheel of axis connection 526,
In packaging rack 51, the second idler wheel 527 is mounted on the first rotation seat 524 setting of 5th motor 520, and third idler wheel 528 is pacified
On the second rotation seat 525；It is realized by rubber strip 529 between first idler wheel 526, the second idler wheel 527 and third idler wheel 528
Synchronous Transmission；Rewinding disk 5210 is arranged on the central shaft of the second rotation seat 525；Heat-sealing film feed mechanism 53, chip feeding port
Component 54, flanging component 55, material cup guide rod 56, material cup Zou Liao mechanisms 57 and press mold guide rail 58 are in loading plate 521 and rewinding disk
Between 5210；
52 left end portions of material cup feeding receiving mechanism, that is, rewinding disk 5210 workpiece good for collecting packing, material cup feeding collecting machine
Right end portion, that is, loading plate 521 of structure 52 is for sending out material cup to be packaged.Material cup feeding receiving mechanism 52 is in use, loading plate
It is sky material cup in 521, is packaged material cup in rewinding disk 5210, is driven by the 5th motor 520, the transmission through rubber strip 529,
Rewinding disk 5210 is driven to rotate so that rows of material cup movement.
Heat-sealing film feed mechanism 53 includes hold-down support 531, heat-sealing film material tray 532, fixed seat 533, compresses adjusting screw
534, guide roller 535, swing idler wheel 536 and adjusting block 537；Hold-down support 531 and the setting of fixed seat 533 are in packaging rack 51
On, heat-sealing film material tray 532 is mounted on 531 upper end of hold-down support；Adjusting block 537 is turned with fixed seat 533 by guide roller 535
Axis forms revolute pair connection, swings idler wheel 536 and is mounted on adjusting block 537；Adjusting screw 534 is compressed to be mounted on by screw pair
In fixed seat 533, compresses 534 lower end of adjusting screw and contacted with adjusting block 537；Guide roller 535 and swing idler wheel 536 are located at pressure
58 top of film guide rail；
Heat-sealing film feed mechanism 53 by rotation in use, compress adjusting screw 534 so that adjusting block 537 is to the bottom, to change
Become the angle for swinging idler wheel 536, and heat-sealing film g is wrapped in guide roller 535 and swings on idler wheel 536 so that heat-sealing film g is compressed
In material cup upper limb, heat-sealing film and the frictional force that material cup generates and drive heat-sealing film g feedings.
Chip feeding port component 54 includes blanking track 541 and blanking guiding block 542；The setting of blanking track 541 is being packed
In rack 51, blanking track 541 is equipped with and the matched horizontal concrete chute 5411 of workpiece shapes and blanking sliding slot 5412, blanking guiding
Block 542 is connected on the outlet end of blanking track 541, and blanking guiding block 542 is equipped with to be slided with the matched guiding of workpiece shapes
Slot, and guiding chute position is matched with blanking sliding slot 5412, workpiece is by blanking sliding slot and blanking guiding block 542 from blanking track
It is slid into the accommodating chamber of material cup in 541 horizontal concrete chute.
Chip feeding port component 54 in use, workpiece by blanking sliding slot and blanking guiding block 542 from blanking track 541
It is slid into the accommodating chamber of material cup in horizontal concrete chute, heat-sealing is waited for be packaged；
Flanging component 55 includes flanging fixed seat 551, flanging frame 552 and flanging idler wheel 553；Flanging fixed seat 551 is fixedly installed
In packaging rack 51, flanging frame 552 forms revolute pair with flanging fixed seat 551 by axis pin and connect, and 552 upper end of flanging frame is logical
Screw 554 is crossed to connect with flanging fixed seat 551；Flanging idler wheel 553 is mounted on flanging frame 552, and 553 position of flanging idler wheel is in
Right over material cup channel；The height of flanging idler wheel 553 is adjusted by screw 554.
Screw 554 adjusts the height of flanging idler wheel 553, and flanging idler wheel 553 contacts heat-sealing film g, while flanging idler wheel 553 has
Heat-sealing film is bonded in material cup by certain temperature, when rolling.
Material cup Zou Liao mechanisms 57 include bearing block 571, indexing drive disk 572 and third infrared sensor 573；5th motor
520 output shaft passes through the connection indexing drive disk 572 of bearing block 571；572 outer ring of indexing drive disk is provided with pillar, and pillar is straight
Diameter is adapted with the circular hole on material cup h, and the circular arc distance of two neighboring pillar on material cup h at a distance from adjacent circular holes it is equal,
So that pillar is inserted in circular hole, rotated by indexing drive disk 572 so that material cup h makees straight-line feed movement；The infrared biography of third
Sensor 573 is fixed in packaging rack 51, corresponding with the graduated disk of 572 end of indexing drive disk, third infrared sensor
573 for controlling indexing 572 stepwise motion of drive disk；
Material cup Zou Liao mechanisms 57 in use, indexing 572 circumference of drive disk on pillar be inserted in the circular hole of charging tray, drive material cup
H makees straight-line feed movement；5th motor 520 drives the transmission of the first idler wheel 526, realizes the movement of material cup feeding receiving mechanism 52,
The two holding moves synchronously.
In use, chip feeding equipment 2 carries out cycle feeding to workpiece, then by conveying robot unit 4 by workpiece
Chip positioning device 3 is transported to be positioned, then again by conveying robot unit 4 by workpiece from chip positioning device 3
It is transported in automatic packing apparatus 5, the automatic charging of material cup and heat-sealing film is realized in automatic packing apparatus 5, when chip is fallen into
After material cup, the process that heat-sealing is packaged is realized, then automatic coiling is collected, and completes the packing work to chip.
Claims (8)
1. chip package machine, it is characterised in that including rack components（1）And chip feeding equipment thereon（2）, chip positioning dress
It sets（3）, conveying robot unit（4）And automatic packing apparatus（5）；Chip feeding equipment（2）For realizing chip to be packaged
Feeding function；Chip positioning device（3）With chip feeding equipment（2）Mutually it is connected, chip positioning device（3）It is to be packaged for positioning
Chip；Conveying robot unit（4）For chip feeding equipment（2）, chip positioning device（3）And automatic packing apparatus（5）It
Between chip workpiece carrying；Automatic packing apparatus（5）With chip positioning device（3）Mutually it is connected, automatic packing apparatus（5）For expecting
The heat-sealing of the feeding of cup, the feeding and heat-sealing film and material cup of heat-sealing film；
Automatic packing apparatus（5）Including packing rack（51）, material cup feeding receiving mechanism（52）, heat-sealing film feed mechanism（53）、
Chip feeding port component（54）, flanging component（55）, material cup guide rod（56）, material cup Zou Liao mechanisms（57）With press mold guide rail（58）；
Pack rack（51）It is fixed at rack components（1）On, material cup feeding receiving mechanism（52）Setting is in packaging rack（51）On；
Heat-sealing film feed mechanism（53）Setting is in packaging rack（51）On, heat-sealing film feed mechanism（53）Positioned at press mold guide rail（58）On
Side；Chip feeding port component（54）With flanging component（55）Position corresponds to press mold guide rail（58）Interior material cup；Material cup guide rod（56）
It is fixed at packaging rack（51）On, material cup guide rod（56）Positioned at press mold guide rail（58）Lower section, material cup guide rod（56）Position pair
Answer material cup, material cup guide rod（56）For keeping material cup horizontal；Material cup Zou Liao mechanisms（57）Mounted on press mold guide rail（58）Lower section, material
Bei Zouliao mechanisms（57）For material cup to be realized step-by-step movement feed motion；Along the direction of feed feeding port component of material cup（54）, heat
Sealer feed mechanism（53）, flanging component（55）It is arranged in order.
2. chip package machine according to claim 1, it is characterised in that press mold guide rail（58）Including the first pressure rail（581）With
Second pressure rail（582）, the first pressure rail（581）With the second pressure rail（582）Mounted on packaging rack（51）On, the first pressure rail（581）
With the second pressure rail（582）Between there are the material cup channels that supply cup passes through；First pressure rail（581）Including pressing rail and first on first
Push rail, the second pressure rail（582）Push rail including pressure rail on second and second, on second pressure rail and second push rail inner end it is equal
Equipped with inwardly projecting flanging（583）, material cup is in flanging（583）Lower section, from heat-sealing film feed mechanism（53）The heat of upper output
Sealer g is pressed in the material cup between two pieces of flanging.
3. chip package machine according to claim 2, it is characterised in that material cup feeding receiving mechanism（52）Including the 5th electricity
Machine（520）, loading plate（521）, loading plate pillar（522）, rewinding disk pillar（523）, the first rotation seat（524）, second rotation
Seat（525）, the first idler wheel（526）, the second idler wheel（527）, third idler wheel（528）, rubber strip（529）With rewinding disk（5210）；
Loading plate（521）Mounted on loading plate pillar（522）Shaft（5211）On, loading plate pillar（522）It is fixed at packaging
Rack（51）One end on；Rewinding disk pillar（523）It is fixed at packaging rack（51）The other end on, the first rotation seat
（524）With the second rotation seat（525）It is separately positioned on rewinding disk pillar（523）Both sides；5th motor（520）Export axis connection the
One idler wheel（526）, the 5th motor（520）Setting is in packaging rack（51）On, the second idler wheel（527）Mounted on the first rotation seat
（524）On, third idler wheel（528）Mounted on the second rotation seat（525）On；First idler wheel（526）, the second idler wheel（527）With
Three idler wheels（528）Between pass through rubber strip（529）Realize Synchronous Transmission；Rewinding disk（5210）It is arranged in the second rotation seat（525）
Central shaft on；Heat-sealing film feed mechanism（53）, chip feeding port component（54）, flanging component（55）, material cup guide rod（56）, material
Bei Zouliao mechanisms（57）With press mold guide rail（58）In loading plate（521）With rewinding disk（5210）Between.
4. chip package machine according to claim 2, it is characterised in that heat-sealing film feed mechanism（53）Including hold-down support
（531）, heat-sealing film material tray（532）, fixed seat（533）, compress adjusting screw（534）, guide roller（535）, swing idler wheel
（536）And adjusting block（537）；Hold-down support（531）And fixed seat（533）Setting is in packaging rack（51）On, seal film material tray
（532）Mounted on hold-down support（531）Upper end；Adjusting block（537）With fixed seat（533）Pass through guide roller（535）Shaft
Revolute pair connection is formed, idler wheel is swung（536）Mounted on adjusting block（537）On；Compress adjusting screw（534）Pacified by screw pair
Mounted in fixed seat（533）On, compress adjusting screw（534）Lower end and adjusting block（537）Contact；Guide roller（535）And swing
Idler wheel（536）Positioned at press mold guide rail（58）Top.
5. chip package machine according to claim 1, it is characterised in that chip feeding port component（54）Including blanking track
（541）With blanking guiding block（542）；Blanking track（541）Setting is in packaging rack（51）On, blanking track（541）It is equipped with
With the matched horizontal concrete chute of workpiece shapes（5411）With blanking sliding slot（5412）, blanking guiding block（542）It is connected to blanking track
（541）Outlet end on, blanking guiding block（542）It is equipped with and the matched guiding chute of workpiece shapes, and guiding chute position
It sets and blanking sliding slot（5412）Matching, workpiece pass through blanking sliding slot and blanking guiding block（542）From blanking track（541）Transverse direction
It is slid into the accommodating chamber of material cup in sliding slot.
6. chip package machine according to claim 1, it is characterised in that flanging component（55）Including flanging fixed seat
（551）, flanging frame（552）With flanging idler wheel（553）；Flanging fixed seat（551）It is fixed at packaging rack（51）On, flanging
Frame（552）Pass through axis pin and flanging fixed seat（551）Form revolute pair connection, flanging frame（552）Upper end passes through screw（554）With
Flanging fixed seat（551）Connection；Flanging idler wheel（553）Mounted on flanging frame（552）On, flanging idler wheel（553）Position is in material
Right over cup channel；Pass through screw（554）Adjust flanging idler wheel（553）Height.
7. chip package machine according to claim 1, it is characterised in that material cup Zou Liao mechanisms（57）Including bearing block
（571）, indexing drive disk（572）With third infrared sensor（573）；5th motor（520）Output shaft pass through bearing block
（571）Connection indexing drive disk（572）；Index drive disk（572）Outer ring is provided with pillar, pillar diameter and the circle on material cup h
Hole is adapted, by indexing drive disk（572）Rotation so that material cup h makees straight-line feed movement；Third infrared sensor（573）
It is fixed at packaging rack（51）On, with indexing drive disk（572）The graduated disk of end corresponds to, third infrared sensor
（573）Drive disk is indexed for controlling（572）Stepwise motion.
8. chip package machine according to claim 1, it is characterised in that chip feeding equipment（2）Including mounting bracket, first
Motor（22）, gear set and endless apron mechanism（25）With guide wheel tension assembly（26）；Mounting bracket（21）It is installed including two pieces
Riser（211）And connecting rod（212）, two pieces of installation risers（211）Pass through connecting rod（212）It is fixedly connected；Gear set includes nibbling
Close the first gear of connection（23）And second gear（24）；Installation riser（211）It is fixed on rack components（1）On, first motor
（22）Endless apron mechanism is connected by gear set（25）；Endless apron mechanism（25）With guide wheel tension assembly（26）Installation
In mounting bracket（21）On, guide wheel tension assembly（26）Connect endless apron mechanism（25）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511313.1A CN108598024A (en) | 2018-05-25 | 2018-05-25 | Chip package machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511313.1A CN108598024A (en) | 2018-05-25 | 2018-05-25 | Chip package machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108598024A true CN108598024A (en) | 2018-09-28 |
Family
ID=63629142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810511313.1A Withdrawn CN108598024A (en) | 2018-05-25 | 2018-05-25 | Chip package machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108598024A (en) |
-
2018
- 2018-05-25 CN CN201810511313.1A patent/CN108598024A/en not_active Withdrawn
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Application publication date: 20180928 |
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