CN213635935U

CN213635935U - Semiconductor packaging all-in-one machine

Info

Publication number: CN213635935U
Application number: CN202023141105.9U
Authority: CN
Inventors: 梁志宏
Original assignee: Shenzhen Xinyichang Technology Co Ltd
Current assignee: Shenzhen Xinyichang Technology Co Ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-07-06
Anticipated expiration: 2030-12-23

Abstract

The application provides a semiconductor packaging all-in-one machine, which comprises a frame; a first feeding mechanism for supplying the first rack; the glue dispensing mechanism is used for dispensing glue to the first support; the crystal supply mechanism is used for supplying chips; the die bonding mechanism is used for fixedly arranging the chip on the first support; the second feeding mechanism is used for supplying a second support; the sheet combining mechanism is used for combining the second support and the first support to form a combined sheet body; and the reflow soldering mechanism is used for performing reflow soldering treatment on the sheet body. This application can set firmly the chip on first support through some mechanism of gluing, confession brilliant mechanism and solid brilliant mechanism, closes piece mechanism and can form the piece body with second support and first support laminating, and reflow soldering mechanism can carry out reflow soldering to the piece body and handle. Therefore, the semiconductor packaging all-in-one machine can realize the automatic attachment of the second support and the first support and the automatic reflow soldering treatment of the involution sheet body, and has the advantages of high integration level, high automation degree, high efficiency and the like.

Description

Semiconductor packaging all-in-one machine

Technical Field

The application belongs to the technical field of automation equipment, and more specifically relates to a semiconductor packaging all-in-one machine.

Background

The semiconductor packaging is a process of processing a support with solidified welding spots through a tested wafer according to the product model and the functional requirements after reflow soldering to obtain an independent chip. With the maturity of semiconductor packaging technology, higher requirements are placed on the integration level and reliability of semiconductor packaging equipment.

In the semiconductor packaging process, the first support needs to be subjected to glue dispensing, the chip is fixed on the first support, then the second support and the first support are attached, and finally the attached support is transported to reflow soldering equipment for reflow soldering treatment, so that the semiconductor is packaged. However, in the conventional semiconductor packaging device, the second support is usually attached to the first support manually in steps, and the attached second support is manually transported to the reflow soldering device, which results in poor integration, low automation and low efficiency of the semiconductor packaging device.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a semiconductor packaging all-in-one machine, so as to solve the problems of poor integration level, low automation degree and low efficiency of semiconductor packaging equipment in the related art.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

provided is a semiconductor packaging all-in-one machine, including:

a frame;

the first feeding mechanism is arranged on the rack and used for supplying a first support;

the glue dispensing mechanism is arranged on the rack, is connected with the first feeding mechanism and is used for dispensing glue on the first support;

the crystal supply mechanism is arranged on the rack and used for supplying chips;

the die bonding mechanism is arranged on the rack, is respectively connected with the dispensing mechanism and the die supplying mechanism, and is used for fixedly arranging the chip on the first support;

the second feeding mechanism is arranged on the rack and used for supplying a second support;

the sheet combining mechanism is arranged on the rack, is connected with the second feeding mechanism and is used for combining the second support and the first support to form a combined sheet;

and the reflow soldering mechanism is arranged on the rack, is connected with the sheet combining mechanism and is used for performing reflow soldering treatment on the sheet combining body.

In one embodiment, the first feeding mechanism comprises a feeding frame mounted on the rack, a material frame for accommodating the first support, a belt feeding unit for transferring the first support to the glue dispensing mechanism, a material taking unit for transferring the first support in the material frame to the belt feeding unit, and a feeding driving unit for driving the material taking unit to move; the material frame, the belt feeding unit, the material taking unit and the material loading driving unit are respectively installed on the material loading frame, and the material loading driving unit is connected with the material taking unit.

In one embodiment, the glue dispensing mechanism comprises a clamping unit for clamping the first support, a clamping transverse moving unit for driving the clamping unit to move transversely, a clamping longitudinal moving unit for driving the clamping unit to move longitudinally, a glue dispensing unit for dispensing glue on the first support on the clamping unit, and a glue dispensing transverse moving unit for driving the glue dispensing unit to move transversely; the material clamping and transverse moving unit is arranged on the rack, the material clamping unit is connected with the material clamping and longitudinal moving unit, the material clamping and longitudinal moving unit is connected with the material clamping and transverse moving unit, the glue dispensing and transverse moving unit is arranged on the rack, and the glue dispensing and transverse moving unit is connected with the glue dispensing unit.

In one embodiment, the crystal supply mechanism comprises a rocking disc for containing the chip, a magazine for containing the rocking disc, a magazine lifting unit for driving the magazine to lift, a carrying clamp for clamping the rocking disc, a crystal supply longitudinal moving unit for driving the carrying clamp to move longitudinally, a crystal supply lifting unit for driving the carrying clamp to lift, a carrying platform for supporting the rocking disc conveyed by the carrying clamp, and a platform longitudinal moving unit for driving the carrying platform to move longitudinally; the material box lifting unit is arranged on the rack and connected with the material box; the crystal supply longitudinal moving unit is arranged on the rack, the crystal supply lifting unit is arranged on the crystal supply longitudinal moving unit, and the crystal supply lifting unit is connected with the carrying clamp; the platform longitudinal moving unit is installed on the rack, and the loading platform is installed on the platform longitudinal moving unit.

In one embodiment, the die bonding mechanism comprises a positioning unit for fixing the first support, a die bonding suction nozzle for moving the chip from the die supply mechanism to the first support, a die bonding motor for driving the die bonding suction nozzle to rotate, and a die bonding support for supporting the die bonding motor; the positioning unit and the die bonding support are respectively arranged on the rack, and the die bonding motor is connected with the die bonding suction nozzle.

In one embodiment, the sheet combining mechanism comprises a sheet combining carrier for clamping the sheet combining body, a carrier transverse moving unit for supporting and driving the sheet combining carrier to move transversely, a sheet combining bracket crossing the carrier transverse moving unit, a supporting unit for supporting the first bracket, a first moving unit for moving the first bracket to the sheet combining carrier and a second moving unit for moving the second bracket to the sheet combining carrier; the sheet combining carrier comprises a base and a cover plate, and the sheet combining mechanism further comprises a discharging clamping jaw for clamping and releasing the cover plate; the carrier transverse moving unit, the sheet combining support and the supporting unit are respectively installed on the rack, and the first moving unit, the second moving unit and the discharging clamping jaw are respectively movably installed on the sheet combining support.

In one embodiment, the reflow soldering mechanism comprises a reflow soldering support arranged on the rack, a feeding conveying roller set arranged at one end of the reflow soldering support, a discharging conveying roller set arranged at the other end of the reflow soldering support, and a heating unit and a cooling unit which are respectively arranged on the reflow soldering support; the heating unit and the cooling unit are sequentially arranged along the direction of the feeding conveying roller group towards the discharging conveying roller group, and the feeding end of the feeding conveying roller group is connected with the discharging end of the sheet combining mechanism.

In one embodiment, the reflow soldering mechanism further comprises a separation unit for separating the laminated body from the laminated carrier, a first material receiving unit for recovering the laminated body, and a second material receiving unit for recovering the laminated carrier; the separation unit, the first material receiving unit and the second material receiving unit are respectively installed on the rack.

In one embodiment, the first material receiving unit comprises a material receiving box for storing the laminated sheets and a belt-driven material receiving group for transferring the laminated sheets into the material receiving box; the material receiving box and the belt transmission material receiving component are respectively arranged on the rack.

In one embodiment, the second receiving unit comprises a receiving roller group installed on the rack, a carrier box used for storing the sheet combination carrier and a carrier loading unit used for transferring the sheet combination carrier to the sheet combination mechanism; the carrier box and the carrier feeding unit are respectively arranged on the rack.

One or more technical solutions in the embodiments of the present application have at least one of the following technical effects: this application is through with first feed mechanism, point gum machine constructs, supplies brilliant mechanism, solid brilliant mechanism, second feed mechanism, close piece mechanism and reflow soldering mechanism integration in the frame, and point gum machine constructs, supplies brilliant mechanism and solid brilliant mechanism to set firmly the chip on first support, closes piece mechanism and can laminate second support and first support and form and close the piece body, and reflow soldering mechanism can carry out reflow soldering to closing the piece body and handling. Therefore, the semiconductor packaging all-in-one machine can realize the automatic attachment of the second support and the first support and the automatic reflow soldering treatment of the butt-joint sheet body, and has the advantages of high integration level, high automation degree, high efficiency, low labor cost and the like compared with the traditional manual operation mode.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor packaging all-in-one machine provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a first feeding mechanism provided in the embodiment of the present application;

fig. 3 is a schematic structural diagram of a dispensing mechanism according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a crystal supply mechanism provided in the embodiment of the present application;

fig. 5 is a schematic structural diagram of a die bonding mechanism provided in the embodiment of the present application;

fig. 6 is a schematic structural diagram of a positioning unit according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a sheet combining mechanism provided in the embodiment of the present application;

fig. 8 is a schematic structural diagram of a supporting unit according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a first mobile unit according to an embodiment of the present application;

fig. 10 is a schematic structural view of a discharge clamping jaw provided in the embodiment of the present application;

fig. 11 is a schematic structural diagram of a reflow soldering mechanism mounted on a rack according to an embodiment of the present application;

fig. 12 is a first partial schematic structural diagram of a reflow soldering mechanism provided in an embodiment of the present application;

fig. 13 is a second partial schematic structural diagram of a reflow soldering mechanism according to an embodiment of the present application;

FIG. 14 is a schematic structural view of the connection between the separating unit and the belt-driven material receiving group according to the embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

100-a frame;

1-a first feeding mechanism; 11-a feeding frame; 12-a material frame; 13-a belt feeding unit; 14-a take-off unit; 141-a material taking bracket; 142-a material pick-up nozzle; 143-a material taking cylinder; 15-a feeding driving unit; 16-a feeding lifting unit; 17-a pushing plate; 18-a waste bin;

2-glue dispensing mechanism; 21-a material clamping unit; 22-a material clamping traversing unit; 23-material clamping and longitudinal moving unit; 24-a dispensing unit; 241-dispensing a lens; 25-a glue-dispensing traversing unit;

3-a crystal supply mechanism; 31-a rocking disc; 32-a cartridge; 33-a magazine lifting unit; 34-a carrying clamp; 35-a platform longitudinal moving unit; 36-a crystal supply longitudinal moving unit; 37-a crystal supply lifting unit; 38-a carrier platform;

4-a die bonding mechanism; 41-a positioning unit; 411-a positioning bracket; 412-a rotating wheel; 413-a transmission belt; 414-positioning motor; 415-cylinder guide shaft; 416-positioning the traverse unit; 417-positioning longitudinal moving unit; 42-die bonding suction nozzle; 43-die bond motor; 44-die bond support; 45-die bond lens; 46-taking a crystal lens;

5-a second feeding mechanism; 51-material rack;

6-a sheet combining mechanism; 60-a carrier material moving unit; 61-a laminating carrier; 62-a carrier traversing unit; 63-a sheet combining bracket; 631 — a first sled linear motor; 632-a second sliding table linear motor; 64-a support unit; 641-a support base; 642-a roller; 643-connecting straps; 644-support drive motor; 65-a first mobile unit; 651-base; 652-base frame; 653-a material moving suction nozzle; 654-a material moving motor; 66-a second mobile unit; 67-discharge clamping jaw; 671-a first base; 672-a second base; 673-first jaw lifting motor; 674-fixed seat; 675-a second jaw lift motor; 676-a material taking clamping jaw; 677-jaw drive motor; 68-first detection lens; 69-second detection lens;

7-reflow soldering mechanism; 71-reflow soldering support; 72-a set of feed transfer rollers; 73-a set of outfeed transport rollers; 74-a heating unit; 741-a low temperature zone heating module; 742-high temperature zone heating module; 75-a cooling unit; 76-a separation unit; 761-a separation frame; 762-a mounting seat; 763-separating clip; 764-a split motor; 765-separating the driving unit; 77-a first receiving unit; 771-collecting box; 772-belt transmission material receiving group; 78-a second receiving unit; 781-collecting roller group; 7811-barrier strip; 782-carrier box; 783-carrier loading unit; 7831-Carrier Loading clip; 7832-carrier loading motor; 7833-a carrier loading power module; 784-cassette lifting Unit.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1, a semiconductor packaging integrated machine according to an embodiment of the present application will be described. The semiconductor packaging all-in-one machine comprises a rack 100, a first feeding mechanism 1 for supplying a first support, a dispensing mechanism 2 for dispensing glue on the first support, a wafer supplying mechanism 3 for supplying a chip, a wafer fixing mechanism 4 for fixedly arranging the chip on the first support, a second feeding mechanism 5 for supplying a second support, a sheet combining mechanism 6 for combining the second support and the first support to form a combined sheet body, and a reflow soldering mechanism 7 for performing reflow soldering treatment on the combined sheet body; the first feeding mechanism 1, the glue dispensing mechanism 2, the crystal supply mechanism 3, the die bonding mechanism 4, the second feeding mechanism 5, the sheet combining mechanism 6 and the reflow soldering mechanism 7 are respectively installed on the rack 100.

In one embodiment, referring to fig. 1, the number of the dispensing mechanisms 2, the number of the die supply mechanisms 3, and the number of the die bonding mechanisms 4 are plural, the number of the die supply mechanisms 3 corresponds to the number of the die bonding mechanisms 4, and the dispensing mechanisms 2 are respectively disposed on two sides of the die bonding mechanisms 4. Two point gum machine constructs 2, a confession brilliant mechanism 3 and a solid brilliant mechanism 4 makes up into some glue solid brilliant module, can be provided with a plurality of some glue solid brilliant modules between first feed mechanism 1 and the mechanism 6 of laminating. According to the structure, each point glue die-bonding module can respectively carry out glue dispensing die-bonding operation on different positions of the first support, so that glue dispensing, die-bonding and glue dispensing modes can be realized, the precision is improved, the glue dispensing module can be matched at will according to actual capacity requirements, and the efficiency is improved.

In one embodiment, referring to fig. 2, the first feeding mechanism 1 includes a feeding frame 11 mounted on the frame 100, a material frame 12 for accommodating the first rack, a belt feeding unit 13 for transferring the first rack to the dispensing mechanism 2, a material taking unit 14 for transferring the first rack in the material frame 12 to the belt feeding unit 13, and a feeding driving unit 15 for driving the material taking unit 14 to move; the material frame 12, the belt feeding unit 13, the material taking unit 14 and the material loading driving unit 15 are respectively installed on the material loading frame 11, and the material loading driving unit 15 is connected with the material taking unit 14. With the structure, under the driving action of the feeding driving unit 15, the feeding unit 14 can move the first support in the material frame 12 to the belt feeding unit 13, and the belt feeding unit 13 can transfer the first support to the dispensing position of the dispensing mechanism 2, thereby realizing the automatic feeding of the first support. The feeding driving unit 15 may be a screw rod transmission mechanism, a sliding table linear motor, an air cylinder transmission mechanism, etc., and is not limited herein.

In one embodiment, referring to fig. 2, the material taking unit 14 may include a material taking bracket 141, a plurality of material taking nozzles 142 mounted on the material taking bracket 141, and a material taking cylinder 143 for driving the material taking bracket 141 to ascend and descend, wherein the material taking cylinder 143 is mounted on the feeding driving unit 15, and the material taking cylinder 143 is connected to the material taking bracket 141. With this configuration, the first rack can be sucked by the plurality of material pickup nozzles 142; can drive through getting material cylinder 143 and get material support 141 and realize going up and down, and then adjust the height of first support.

In an embodiment, referring to fig. 2, the first feeding mechanism 1 may further include a pushing plate 17 installed at the bottom of the material frame 12, and a feeding lifting unit 16 for driving the pushing plate 17 to lift, wherein the feeding lifting unit 16 is installed on the feeding frame 11, and the feeding lifting unit 16 is connected to the pushing plate 17. The pushing plate 17 is driven to ascend and descend by the loading ascending and descending unit 16, so that the plurality of first supports in the material frame 12 can be lifted, and the material taking unit 14 can pick up the first supports conveniently. The feeding lifting unit 16 may be a screw rod transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism, etc., and is not limited herein.

In one embodiment, referring to fig. 2, the first feeding mechanism 1 may further include a waste box 18 mounted on the feeding frame 11, and the waste box 18 may recover the waste first rack. The material frame 12, the belt feeding unit 13 and the waste box 18 can be sequentially arranged along the moving direction of the material taking unit 14, so that the material taking unit 14 can absorb the first support in the material frame 12 onto the belt feeding unit 13 conveniently, the waste first support is absorbed into the waste box 18 conveniently, the moving stroke of the material taking unit 14 can be reduced, and further the efficiency is improved.

In one embodiment, referring to fig. 3, the dispensing mechanism 2 includes a material clamping unit 21 for clamping the first support, a material clamping traverse unit 22 for driving the material clamping unit 21 to move transversely, a material clamping longitudinal movement unit 23 for driving the material clamping unit 21 to move longitudinally, a dispensing unit 24 for dispensing the first support on the material clamping unit 21, and a dispensing traverse unit 25 for driving the dispensing unit 24 to move transversely; the clamping material transverse moving unit 22 is installed on the rack 100, the clamping material unit 21 is connected with the clamping material longitudinal moving unit 23, the clamping material longitudinal moving unit 23 is connected with the clamping material transverse moving unit 22, the dispensing transverse moving unit 25 is installed on the rack 100, and the dispensing transverse moving unit 25 is connected with the dispensing unit 24. In this structure, the first rack transferred by the belt feeding unit 13 can be clamped and fixed by the clamping unit 21, and the position of the clamping unit 21 in the horizontal plane can be adjusted by the clamping traverse unit 22 and the clamping longitudinal moving unit 23, so as to transfer the first rack to the dispensing position of the dispensing unit 24. The dispensing traversing unit 25 can adjust the position of the dispensing unit 24, and the dispensing operation on the first support is realized through the dispensing unit 24. The dispensing unit 24 is provided with a dispensing lens 241, so that the dispensing accuracy can be improved. The material clamping unit 21 and the dispensing unit 24 may be both conventional structures in the art, and are not described herein again. The material clamping and traversing unit 22, the material clamping and longitudinally moving unit 23, and the glue traversing unit 25 may be all screw rod transmission mechanisms, sliding table linear motors, cylinder transmission mechanisms, etc., and are not limited herein.

In one embodiment, referring to fig. 4, the wafer supply mechanism 3 includes a rocking disc 31 for holding chips, a magazine 32 for holding the rocking disc 31, a magazine lifting unit 33 for driving the magazine 32 to lift, a carrying clamp 34 for clamping the rocking disc 31, a wafer supply longitudinal movement unit 36 for driving the carrying clamp 34 to move longitudinally, a wafer supply lifting unit 37 for driving the carrying clamp 34 to lift, a carrying platform 38 for supporting the rocking disc 31 conveyed by the carrying clamp 34, and a platform longitudinal movement unit 35 for driving the carrying platform 38 to move longitudinally; the material box lifting unit 33 is arranged on the frame 100, and the material box lifting unit 33 is connected with the material box 32; the crystal supply longitudinal moving unit 36 is arranged on the frame 100, the crystal supply lifting unit 37 is arranged on the crystal supply longitudinal moving unit 36, and the crystal supply lifting unit 37 is connected with the conveying clamp 34; the platform translation unit 35 is mounted on the frame 100, and the loading platform 38 is mounted on the platform translation unit 35. With this structure, the rocking plate 31 in the magazine 32 can be transferred to the stage 38 by the cooperation of the wafer supply vertical transfer unit 36, the wafer supply lifting unit 37 and the transfer clamp 34. The rocking tray 31 on the carrier platform 38 can be moved to a designated position by the platform translation unit 35. The material box lifting unit 33, the crystal supply longitudinal moving unit 36, the crystal supply lifting unit 37 and the platform longitudinal moving unit 35 may be a screw rod transmission mechanism, a sliding platform linear motor, a cylinder transmission mechanism, etc., and are not described herein again. The carrying clamp 34 may be a pneumatic clamp driven by an air cylinder, an electric cylinder, or the like, so as to realize the taking and placing of the rocking disc 31.

In one embodiment, referring to fig. 5, the die bonding mechanism 4 includes a positioning unit 41 for fixing the first support, a die bonding suction nozzle 42 for moving the chip from the die supply mechanism 3 to the first support, a die bonding motor 43 for driving the die bonding suction nozzle 42 to rotate, and a die bonding support 44 for supporting the die bonding motor 43; the positioning unit 41 and the die bonding bracket 44 are respectively mounted on the frame 100, and the die bonding motor 43 is connected with the die bonding suction nozzle 42. With the structure, after the dispensing mechanism 2 finishes dispensing the first support, the first support is transferred to the positioning unit 41 by the material clamping unit 21, and the positioning unit 41 can clamp and fix the first support, so that die bonding is facilitated. The die bonding suction nozzle 42 can transfer the chip supplied to the die supply position by the die supply mechanism 3 to the first support, so as to realize die bonding operation. The die bonding motor 43 can drive the die bonding suction nozzle 42 to rotate, so that the die bonding suction nozzle 42 can pass through the die supply position and the die bonding position in a reciprocating mode, and repeated die bonding operation is achieved.

In one embodiment, referring to fig. 6, the positioning unit 41 may include a positioning bracket 411, a plurality of rotating wheels 412 rotatably mounted on the positioning bracket 411, a transmission belt 413 connected to the plurality of rotating wheels 412, a positioning motor 414 for driving the plurality of rotating wheels 412 to rotate to drive the transmission belt 413 to rotate, a cylinder guide shaft 415 for supporting and positioning the first bracket, a positioning traverse unit 416 for driving the positioning bracket 411 to move laterally, and a positioning traverse unit 417 for driving the positioning bracket 411 to move longitudinally; the positioning motor 414 is mounted on the positioning bracket 411, the positioning motor 414 is connected with a rotating wheel 412, the cylinder guide shaft 415 is mounted on the positioning bracket 411, the positioning bracket 411 is mounted on the positioning traverse unit 416, and the positioning traverse unit 416 is mounted on the positioning traverse unit 417. With this structure, the first rack transferred from the material clamping unit 21 can be supported by the belt 413, and the belt 413 is driven by the positioning motor 414 to rotate, so that the first rack can be transferred to the die bonding position. The cylinder guide shaft 415 can push the first support against the support plate to be fixed in an adsorption manner, so that the position of the first support is prevented from being deviated. After the die bonding of the first support is completed, the first support can be transferred to the next station by the transmission belt 413. The positioning traverse unit 416 and the positioning longitudinal moving unit 417 may be a screw rod transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism, etc., and are not described herein again.

In one embodiment, referring to fig. 5, the number of the die bonding nozzles 42 may be two, and the two die bonding nozzles 42 are located on the same straight line. The die bonding mechanism 4 further comprises a die bonding lens 45 and a die taking lens 46 which are respectively arranged on the die bonding bracket 44, wherein the die bonding lens 45 is arranged right above the die bonding position, and the die taking lens 46 is arranged right above the die supplying position. With the structure, the die bonding motor 43 can drive the two die bonding suction nozzles 42 to synchronously rotate, and when one die bonding suction nozzle 42 is positioned at the die taking position, the other die bonding suction nozzle 42 is positioned at the die bonding position, so that the synchronous operation of die taking and die bonding is realized, and the die bonding efficiency is improved. The die pick-up lens 46 can calibrate the position of the chip sucked by one die attach nozzle 42, and the die attach lens 45 can calibrate the position of the chip sucked by the other die attach nozzle 42 with the first support. When the position of the chip deviates, the position of the chip can be adjusted through the rotation of the die bonding suction nozzle 42, and the die bonding precision is further improved.

In one embodiment, referring to fig. 1, the second feeding mechanism 5 may include a material rack 51 for accommodating the second rack and a rack lifting unit (not shown) for driving the material rack 51 to lift and lower, the rack lifting unit being mounted on the frame 100, and the rack lifting unit being connected to the material rack 51. This structure, through the lift of support body lift unit can drive material frame 51, is convenient for adjust the height of second support, conveniently closes picking up of piece mechanism 6 to the second support. The frame body lifting unit can be a screw rod transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism and the like, and is not limited uniquely.

In one embodiment, referring to fig. 7, the sheet combining mechanism 6 includes a sheet combining carrier 61 for holding the sheet combining body, a carrier traverse unit 62 for supporting and driving the sheet combining carrier 61 to move laterally, a sheet combining bracket 63 crossing over the carrier traverse unit 62, a supporting unit 64 for supporting the first bracket, a first moving unit 65 for moving the first bracket to the sheet combining carrier 61, and a second moving unit 66 for moving the second bracket to the sheet combining carrier 61; the sheet combining carrier 61 comprises a base and a cover plate, and the sheet combining mechanism 6 further comprises a discharging clamping jaw 67 for clamping and releasing the cover plate; the carrier transverse moving unit 62, the sheet combining bracket 63 and the supporting unit 64 are respectively installed on the rack 100, and the first moving unit 65, the second moving unit 66 and the discharging clamping jaw 67 are respectively movably installed on the sheet combining bracket 63. In the structure, firstly, when the carrier transverse moving unit 62 drives the sheet combining carrier 61 to move to the position right below the material placing clamping jaw 67, the material placing clamping jaw 67 descends and clamps the cover plate and then ascends; subsequently, the carrier traversing unit 62 continues to drive the sheet combining carrier 61 to move between the supporting unit 64 and the second feeding mechanism 5, the first moving unit 65 moves the first support on the supporting unit 64 to the base of the sheet combining carrier 61, and the second moving unit 66 moves the second support in the second feeding mechanism 5 to the first support; finally, the carrier transverse moving unit 62 drives the sheet combining carrier 61 to move to the position right below the placing clamping jaw 67 again, the placing clamping jaw 67 releases the cover plate, the first support and the second support can be pressed to form a combined sheet body through clamping of the cover plate and the base, the combined sheet body and the sheet combining carrier 61 form a packaging body, and the packaging body is transferred to the next station through the carrier transverse moving unit 62. The carrier traversing unit 62 may be a screw rod transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism, etc., and is not described in detail herein.

In one embodiment, referring to fig. 7, the film combining mechanism 6 further includes a first detecting lens 68 and a second detecting lens 69 respectively mounted on the film combining bracket 63. When the second moving unit 66 moves the second support to the first support, the carrier traversing unit 62 drives the carrier combination body 61 to return to a position right below the first detection lens 68, and the first detection lens 68 is used for assisting the first support and the second support on the carrier traversing unit 62 to move to the designated positions and feeding back information to the control system for adjustment and correction. The carrier transverse moving unit 62 continues to drive the sheet combining carrier 61 to move to a position right below the second detection lens 69, and the second detection lens 69 realizes secondary detection and verification of the attaching degree of the first support and the second support. The first detection lens 68 and the second detection lens 69 can improve the fitting precision of the first support and the second support, and the product quality is improved.

In one embodiment, referring to fig. 8, the supporting unit 64 may include a supporting base 641 installed on the frame 100, a plurality of rollers 642 rotatably installed on the supporting base 641, a connecting belt 643 connecting the plurality of rollers 642, and a supporting driving motor 644 for driving the plurality of rollers 642 to rotate; a support driving motor 644 is installed on the support seat 641 and connected to one of the rollers 642. In this structure, the first bracket after die bonding can be supported by the connection belt 643, and the connection belt 643 is driven to rotate by the support driving motor 644, so as to move the first bracket to a designated position.

In one embodiment, referring to fig. 7, a first sliding table linear motor 631 and a second sliding table linear motor 632 are respectively installed at two ends of the sheet combining support 63, and a first moving unit 65 and a second moving unit 66 are respectively installed on the first sliding table linear motor 631 and can be driven to move by the first sliding table linear motor 631; the discharging clamping jaw 67 is mounted on the second sliding table linear motor 632 and can be driven by the second sliding table linear motor 632 to move. The carrier traverse unit 62 may be disposed between the supporting unit 64 and the second feeding mechanism 5, so as to reduce the stroke of the first moving unit 65 and the second moving unit 66, and further improve the sheet combining efficiency.

In one embodiment, referring to fig. 9, the first mobile unit 65 and the second mobile unit 66 have the same structure, and only the structure of the first mobile unit 65 will be described. The first moving unit 65 may include a base 651 mounted on the first sliding table linear motor 631, a base frame 652 mounted on the base 651, a plurality of material transfer nozzles 653 mounted on the base frame 652, and a material transfer motor 654 for driving the base frame 652 to ascend and descend; the material moving motor 654 is installed on the base 651, and the material moving motor 654 is connected with the rack 100. With this structure, the first rack can be picked and placed by the plurality of material transfer nozzles 653, so that the first rack can be moved from the support unit 64 to the sheet combining carrier 61. Similarly, the second rack can be picked and placed by the plurality of material moving nozzles 653, so that the second rack can be moved from the second feeding mechanism 5 to the sheet combining carrier 61. The base frame 652 can be driven to ascend and descend by the material moving motor 654, and then the heights of the first support and the second support can be adjusted.

In one embodiment, referring to fig. 10, the material placing clamping jaw 67 may include a first base 671 mounted on the second sliding table linear motor 632, a second base 672 mounted on the first base 671, a first clamping jaw lifting motor 673 for driving the second base 672 to lift, a fixing base 674 mounted on the second base 672, a second clamping jaw lifting motor 675 for driving the fixing base 674 to lift, material taking clamping jaws 676 mounted at two ends of the fixing base 674, and a clamping jaw driving motor 677 for driving the two material taking clamping jaws 676 to approach or move away from each other; the first clamping jaw lifting motor 673 is installed on the first base 671 and connected with the second base 672, the second clamping jaw lifting motor 675 is installed on the second base 672 and connected with the fixed seat 674, and the clamping jaw driving motor 677 is installed on the fixed seat 674 and connected with one of the material taking clamping jaws 676. This structure, through two material clamping jaws 676 mutual approaching or keep away from of clamping jaw driving motor 677 drive to realize two and get the clamp or the release of material clamping jaw 676 to the apron. The height of the two take-out jaws 676 can be adjusted by the first jaw lift motor 673 and the second jaw lift motor 675.

In one embodiment, referring to fig. 7, the laminating mechanism 6 further includes a carrier moving unit 60 installed on the second sliding table linear motor 632, so that the laminating carrier 61 can be removed from the reflow soldering mechanism 7, and the laminating carrier 61 can be reused.

In one embodiment, referring to fig. 11 and 12, the reflow soldering mechanism 7 includes a reflow soldering stand 71 mounted on the rack 100, a feeding transport roller set 72 mounted at one end of the reflow soldering stand 71, a discharging transport roller set 73 mounted at the other end of the reflow soldering stand 71, and a heating unit 74 and a cooling unit 75 mounted on the reflow soldering stand 71, respectively; the heating unit 74 and the cooling unit 75 are arranged in sequence along the feeding conveying roller group 72 towards the discharging conveying roller group 73, and the feeding end of the feeding conveying roller group 72 is connected with the discharging end of the sheet combining mechanism 6. With this structure, the carrier traverse unit 62 can transfer the packages onto the feeding transport roller set 72, and the packages sequentially pass through the heating unit 74 and the cooling unit 75 under the driving of the feeding transport roller set 72 to realize reflow soldering, and finally are discharged after being moved onto the discharging transport roller set 73. Moreover, the whole packaging body is fed, the feeding mode of the combined sheet body is replaced, and the problems of clamping plates, damage and the like can be avoided. Wherein, the heating unit 74 can be heated by a module consisting of a heat insulation board, a heating block, an electric heating pipe and a heating conduction block; the cooling unit 75 may be a module consisting of a heat-insulating plate, a refrigerating block, and a cooling water conducting block to perform cooling. The heating unit 74 may include a high-temperature heating module 742 and a low-temperature heating module 741, and the high-temperature heating module 742 is disposed between the low-temperature heating module 741 and the cooling unit 75. The package is preheated by the low temperature region heating module 741 for a period of time, and then enters the high temperature region heating module 742 for continuous heating, so as to avoid the influence on the soldering caused by the excessive temperature variation. The package processed by the high temperature region heating module 742 is cooled by the cooling unit 75, which is helpful for improving the soldering effect.

In one embodiment, referring to fig. 11, the reflow soldering mechanism 7 further includes a separating unit 76 for separating the laminated body from the laminated carrier 61, a first material collecting unit 77 for collecting the laminated body, and a second material collecting unit 78 for collecting the laminated carrier 61; the separation unit 76, the first receiving unit 77, and the second receiving unit 78 are respectively installed on the rack 100. With this structure, the sheet combining body can be separated from the sheet combining carrier 61 by the separation unit 76, thereby realizing the recovery of the sheet combining carrier 61. The first material receiving unit 77 can automatically receive the material of the laminated sheet, and the second material receiving unit 78 can automatically receive the material of the laminated sheet carrier 61, so that the automatic operation is realized.

In one embodiment, referring to fig. 14, the separating unit 76 may include a separating frame 761 installed on the rack 100, a mounting seat 762 installed on the separating frame 761, a plurality of separating clips 763 installed on the mounting seat 762, a separating motor 764 for controlling the opening and closing of the plurality of separating clips 763, and a separating driving unit 765 for driving the mounting seat 762 to move; the separation motor 764 is mounted on the mounting seat 762, the separation motor 764 is respectively connected to the plurality of separation clips 763, the separation driving unit 765 is mounted on the separation frame 761, and the separation driving unit 765 is connected to the mounting seat 762. In the structure, the separating motor 764 drives the separating clamp 763 to clamp the cover plate and the sheet combining body of the packaging body, and the base of the packaging body is left on the discharging conveying roller set 73; the separating nip 763 is moved to the position right above the first material receiving unit 77 through the separating driving unit 765, the sheet combining body is released on the first material receiving unit 77 through the separating nip 763, and the cover plate is remained on the separating nip 763; the separation driving unit 765 moves the separation nip 763 to a position right above the base, and transfers the sheet combining carrier 61 formed by combining the cover plate and the base to the second material receiving unit 78. The separation driving unit 765 may be a screw driving mechanism, a sliding table linear motor, an air cylinder pushing mechanism, etc., and is not limited herein.

In one embodiment, referring to fig. 11 and 14, the first material receiving unit 77 includes a material receiving box 771 for storing the combined sheet bodies and a belt-driven material receiving set 772 for transferring the combined sheet bodies into the material receiving box 771; the material receiving box 771 and the belt transmission material receiving group 772 are respectively arranged on the machine frame 100. With the structure, the sheet-combining bodies transferred by the separating clamp 763 are placed on the belt-driven material receiving group 772, and the belt-driven material receiving group 772 can transfer the sheet-combining bodies to the material receiving box 771 for storage, so that automatic material receiving operation is realized.

In one embodiment, referring to fig. 13, the second material receiving unit 78 includes a material receiving roller set 781 installed on the rack 100, a carrier box 782 for storing the sheet combining carrier 61, and a carrier material loading unit 783 for transferring the sheet combining carrier 61 to the sheet combining mechanism 6; the carrier box 782 and the carrier loading unit 783 are respectively mounted on the rack 100. In the structure, the sheet combining carrier 61 clamped by the separating clamp 763 is placed on the material receiving roller set 781, and the sheet combining carrier 61 is driven by the material receiving roller set 781 to be transferred to the carrier box 782 for storage. The sheet combining carrier 61 in the carrier box 782 can be moved to the sheet combining mechanism 6 through the carrier loading unit 783, so that the sheet combining carrier 61 can be reused. A plurality of baffle strips 7811 are arranged on the material receiving roller set 781 at intervals, a sheet combining carrier 61 can be arranged between every two adjacent baffle strips 7811, the sheet combining carrier 61 can be resisted, and the stability of the material receiving roller set is improved.

In one embodiment, referring to fig. 13, the second material receiving unit 78 further includes a box lifting unit 784 for driving the carrier box 782 to be lifted, and the box lifting unit 784 is mounted on the frame 100 and connected to the carrier box 782. According to the structure, a plurality of sheet combining carriers 61 can be stacked in the carrier box 782 through the box body lifting unit 784, so that the storage and the picking of the carrier feeding unit 783 are facilitated. The box body lifting unit 784 may be a screw rod transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism, and the like, and is not limited herein.

In one embodiment, referring to fig. 13, the carrier loading unit 783 includes a carrier loading clamp 7831 for clamping the sheet-combining carrier 61, a carrier loading motor 7832 for controlling opening and closing of the carrier loading clamp 7831, and a carrier loading power module 7833 for driving the carrier loading clamp 7831 to move; carrier material loading motor 7832 is installed on carrier material loading power module 7833, carrier material loading motor 7832 is connected with carrier material loading clamp 7831, and carrier material loading power module 7833 is installed on frame 100. In the structure, the opening and closing of the carrier feeding clamp 7831 are controlled by the carrier feeding motor 7832, so that the clamping and the releasing of the sheet combination carrier 61 can be realized; the position of the carrier feeding clamp 7831 can be adjusted by the carrier feeding power module 7833, so that the sheet combining carrier 61 in the carrier box 782 can be transferred to the sheet combining mechanism 6, and the reuse of the sheet combining carrier 61 is realized. The carrier feeding power module 7833 may be a screw transmission mechanism, a sliding table linear motor, a cylinder transmission mechanism, etc., and is not limited herein.

The semiconductor packaging all-in-one machine provided by the application comprises the following working steps:

1. the first feeding mechanism 1 supplies a first support to the glue dispensing mechanism 2;

2. after the dispensing mechanism 2 performs dispensing operation on the first support, the dispensed first support is transferred to a die bonding position of a die bonding mechanism 4;

3. the die bonding mechanism 4 sucks the chip on the die supply position of the die supply mechanism 3 to the die bonding position, and fixes the chip on the first support to complete the die bonding operation.

When a plurality of dispensing die-bonding modules are arranged, the first bracket can be respectively dispensed by the dispensing mechanism 2 in the front half part and the rear half part, namely dispensing is carried out in multiple steps. Similarly, the plurality of die bonding mechanisms 4 can respectively perform die bonding operation on the front half part and the rear half part of the first bracket, that is, die bonding is performed in multiple steps.

4. The first support after die bonding is transferred to the sheet combining mechanism 6, and the sheet combining mechanism 6 attaches the second support and the first support in the second feeding mechanism 5 to form a combined sheet (i.e. an assembly of the first support and the second support). In this process, the bonded body can be clamped and fixed by the bonded carrier 61 to form a package (i.e., an assembly of the bonded body and the bonded carrier 61).

5. The package is transferred to the reflow mechanism 7 and subjected to a reflow process. The separation unit 76 in the reflow soldering mechanism 7 can separate the laminated body from the laminated carrier 61, the laminated body is recovered by the first material receiving unit 77, the laminated carrier 61 is recovered by the second material receiving unit 78, and can be transferred to the laminated mechanism 6 again, so that the recycling of the laminated carrier 61 is realized.

It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. Semiconductor packaging all-in-one machine, its characterized in that includes:

a frame (100);

the first feeding mechanism (1) is arranged on the rack (100) and is used for supplying a first support;

the glue dispensing mechanism (2) is arranged on the rack (100), is connected with the first feeding mechanism (1) and is used for dispensing glue on the first support;

the crystal supply mechanism (3) is arranged on the frame (100) and is used for supplying chips;

the die bonding mechanism (4) is arranged on the rack (100), is respectively connected with the dispensing mechanism (2) and the die supply mechanism (3), and is used for fixedly arranging the chip on the first support;

the second feeding mechanism (5) is arranged on the rack (100) and is used for supplying a second support;

the sheet combining mechanism (6) is arranged on the rack (100), is connected with the second feeding mechanism (5), and is used for combining the second support and the first support to form a sheet combining body;

and the reflow soldering mechanism (7) is arranged on the rack (100), is connected with the sheet combining mechanism (6) and is used for performing reflow soldering treatment on the sheet combining body.

2. The semiconductor packaging kiosk of claim 1 wherein: the first feeding mechanism (1) comprises a feeding frame (11) arranged on the rack (100), a material frame (12) used for containing the first support, a belt feeding unit (13) used for transferring the first support to the glue dispensing mechanism (2), a material taking unit (14) used for transferring the first support in the material frame (12) to the belt feeding unit (13), and a feeding driving unit (15) used for driving the material taking unit (14) to move; the material frame (12), the belt feeding unit (13), the material taking unit (14) and the feeding driving unit (15) are respectively installed on the material feeding frame (11), and the feeding driving unit (15) is connected with the material taking unit (14).

3. The semiconductor packaging kiosk of claim 1 wherein: the dispensing mechanism (2) comprises a clamping unit (21) for clamping the first support, a clamping transverse moving unit (22) for driving the clamping unit (21) to transversely move, a clamping longitudinal moving unit (23) for driving the clamping unit (21) to longitudinally move, a dispensing unit (24) for dispensing the first support on the clamping unit (21), and a dispensing transverse moving unit (25) for driving the dispensing unit (24) to transversely move; the material clamping and transverse moving unit (22) is installed on the rack (100), the material clamping unit (21) is connected with the material clamping and longitudinal moving unit (23), the material clamping and longitudinal moving unit (23) is connected with the material clamping and transverse moving unit (22), the glue dispensing and transverse moving unit (25) is installed on the rack (100), and the glue dispensing and transverse moving unit (25) is connected with the glue dispensing unit (24).

4. The semiconductor packaging kiosk of claim 1 wherein: the crystal supply mechanism (3) comprises a rocking disc (31) for containing the chips, a material box (32) for containing the rocking disc (31), a material box lifting unit (33) for driving the material box (32) to lift, a carrying clamp (34) for clamping the rocking disc (31), a crystal supply longitudinal movement unit (36) for driving the carrying clamp (34) to move longitudinally, a crystal supply lifting unit (37) for driving the carrying clamp (34) to lift, a carrying platform (38) for supporting the rocking disc (31) conveyed by the carrying clamp (34) and a platform longitudinal movement unit (35) for driving the carrying platform (38) to move longitudinally; the material box lifting unit (33) is arranged on the rack (100), and the material box lifting unit (33) is connected with the material box (32); the crystal supply longitudinal moving unit (36) is arranged on the rack (100), the crystal supply lifting unit (37) is arranged on the crystal supply longitudinal moving unit (36), and the crystal supply lifting unit (37) is connected with the conveying clamp (34); the platform longitudinal moving unit (35) is installed on the rack (100), and the carrying platform (38) is installed on the platform longitudinal moving unit (35).

5. The semiconductor packaging kiosk of claim 1 wherein: the die bonding mechanism (4) comprises a positioning unit (41) for fixing the first support, a die bonding suction nozzle (42) for moving the chip from the die supply mechanism (3) to the first support, a die bonding motor (43) for driving the die bonding suction nozzle (42) to rotate and a die bonding support (44) for supporting the die bonding motor (43); the positioning unit (41) and the die bonding support (44) are respectively arranged on the rack (100), and the die bonding motor (43) is connected with the die bonding suction nozzle (42).

6. The semiconductor packaging kiosk of claim 1 wherein: the sheet combining mechanism (6) comprises a sheet combining carrier (61) for clamping the sheet combining body, a carrier transverse moving unit (62) for supporting and driving the sheet combining carrier (61) to move transversely, a sheet combining support (63) crossing the carrier transverse moving unit (62), a supporting unit (64) for supporting the first support, a first moving unit (65) for moving the first support to the sheet combining carrier (61) and a second moving unit (66) for moving the second support to the sheet combining carrier (61); the sheet combining carrier (61) comprises a base and a cover plate, and the sheet combining mechanism (6) further comprises a discharging clamping jaw (67) for clamping and releasing the cover plate; the carrier transverse moving unit (62), the sheet combining bracket (63) and the supporting unit (64) are respectively installed on the rack (100), and the first moving unit (65), the second moving unit (66) and the discharging clamping jaw (67) are respectively and movably installed on the sheet combining bracket (63).

7. The semiconductor packaging kiosk of claim 6 wherein: the reflow soldering mechanism (7) comprises a reflow soldering bracket (71) arranged on the rack (100), a feeding conveying roller set (72) arranged at one end of the reflow soldering bracket (71), a discharging conveying roller set (73) arranged at the other end of the reflow soldering bracket (71), and a heating unit (74) and a cooling unit (75) which are respectively arranged on the reflow soldering bracket (71); the heating unit (74) and the cooling unit (75) are sequentially arranged along the feeding conveying roller group (72) towards the discharging conveying roller group (73), and the feeding end of the feeding conveying roller group (72) is connected with the discharging end of the sheet combining mechanism (6).

8. The semiconductor packaging kiosk of claim 7 wherein: the reflow soldering mechanism (7) further comprises a separation unit (76) for separating the laminated body from the laminated carrier (61), a first material receiving unit (77) for recovering the laminated body and a second material receiving unit (78) for recovering the laminated carrier (61); the separation unit (76), the first receiving unit (77) and the second receiving unit (78) are respectively mounted on the rack (100).

9. The semiconductor packaging kiosk of claim 8 wherein: the first material receiving unit (77) comprises a material receiving box (771) for storing the combined sheet bodies and a belt transmission material receiving group (772) for transferring the combined sheet bodies into the material receiving box (771); the material receiving box (771) and the belt transmission material receiving group (772) are respectively arranged on the rack (100).

10. The semiconductor packaging kiosk of claim 8 wherein: the second material receiving unit (78) comprises a material receiving roller set (781) arranged on the rack (100), a carrier box (782) used for storing the sheet combining carrier (61) and a carrier feeding unit (783) used for transferring the sheet combining carrier (61) to the sheet combining mechanism (6); the carrier box (782) and the carrier loading unit (783) are respectively mounted on the rack (100).