CN113670729B - Semiconductor module detection equipment for waste collection - Google Patents
Semiconductor module detection equipment for waste collection Download PDFInfo
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- CN113670729B CN113670729B CN202111176165.0A CN202111176165A CN113670729B CN 113670729 B CN113670729 B CN 113670729B CN 202111176165 A CN202111176165 A CN 202111176165A CN 113670729 B CN113670729 B CN 113670729B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention belongs to the technical field of intelligent machinery, and particularly relates to waste collection semiconductor module detection equipment, which comprises: the adsorption device is arranged on the platform and is suitable for adsorbing and fixing the semiconductor module on the platform so that the limiting bulge on the semiconductor module falls off; the collecting device is arranged on one side of the platform and suitable for collecting falling limiting bulges, so that the uniform collection of the limiting bulges is realized, and the influence of the falling limiting bulges on the detection of the semiconductor module is avoided.
Description
Technical Field
The invention belongs to the technical field of intelligent machinery, and particularly relates to waste collection semiconductor module detection equipment.
Background
In the testing process of semiconductor module, the spacing arch for fixing a position semiconductor module can drop, and the spacing arch volume that drops is less, if not carry out unified collection to spacing arch, spacing arch is dropped the back and is influenced semiconductor module's detection easily everywhere to because spacing protruding volume is less want to collect again also very difficult.
Therefore, it is necessary to design a new inspection apparatus for semiconductor modules based on the above-mentioned technical problems.
Disclosure of Invention
The invention aims to provide a semiconductor module detection device for collecting waste materials.
In order to solve the above technical problem, the present invention provides a semiconductor module inspection apparatus for collecting waste materials, comprising:
a platform, a plurality of movable plates and a plurality of movable plates,
the adsorption device is arranged on the platform and is suitable for adsorbing and fixing the semiconductor module on the platform and sucking out the limiting bulges falling off from the semiconductor module;
the collecting device is arranged on one side of the platform and is suitable for collecting the falling limiting bulges.
Further, the collecting device includes: a collection mechanism and a restriction mechanism;
the limiting mechanism is arranged on the bottom plate and is arranged on one side of the platform;
the collecting mechanism is clamped with the limiting mechanism to be fixed on the bottom plate.
Further, the collection mechanism includes: a base and a coaming;
the base is clamped with the limiting mechanism to be fixed on the bottom plate;
the base is communicated with the coaming;
the coaming is provided with a limiting hole;
an air pipe of the adsorption device penetrates through the limiting hole and then is connected with the air vent on the platform, and the limiting bulge falls into the base from the air pipe;
the trachea is adapted to move within a range of the restrictive orifice.
Furthermore, a plurality of fixing columns are arranged on the outer wall of the enclosing plate;
the fixed column is connected with the side wall of the platform so as to fix the enclosing plate and the platform.
Further, the collecting device further comprises: a limiting plate;
the limiting plate is arranged on the inner wall of the enclosing plate and covers the limiting hole;
the air pipe of the adsorption device penetrates through and is fixed on the limiting plate;
when the trachea moves in the scope of making the hole, drive the restriction board and remove, restriction board keeps covering restriction hole all the time this moment.
Further, the restricting mechanism includes: a clamping seat;
the clamping seat is arranged on the bottom plate;
the side wall of the clamping seat is provided with a notch;
the base passes through the breach with joint seat joint.
Further, the limiting mechanism further includes: a bearing plate;
the bearing plate is arranged on the clamping seat;
the bearing plate is arranged around the base;
the side wall of the bearing plate is provided with a notch communicated with the notch of the clamping seat, and the two notches are vertically arranged;
the bearing plate is suitable for bearing the limiting protrusion falling out of the collecting mechanism.
Further, the semiconductor module inspection apparatus for waste collection further includes:
a transportation device disposed at one side of the platform, the transportation device being adapted to transport a semiconductor module;
a carrying device disposed at one side of the stage in a transport direction, the carrying device being adapted to carry the semiconductor module transported by the transport device onto the stage;
the pressing device is arranged above the platform and is suitable for pressing the upper shell and the lower shell of the semiconductor module together and enabling the limiting bulges to fall off from the semiconductor module;
the detection device is arranged above the platform and is suitable for detecting the pressure resistance of the semiconductor module after pressing;
after the carrying device carries the semiconductor modules transported by the transporting device to the platform, the semiconductor modules are adsorbed on the platform by the adsorbing device, the upper shell and the lower shell of the adsorbed semiconductor modules are pressed by the pressing device, the limiting bulges fall off and the fallen limiting bulges are collected by the collecting device, the fallen limiting bulges are sucked out by the adsorbing device, the semiconductor modules are carried to the lower part of the detecting device by the carrying device after pressing, and the pressure resistance of the semiconductor modules is detected by the detecting device.
Further, the adsorption device includes: an air tube;
the air pipe is communicated with the vent hole and is connected with the air suction pump;
the air suction pump sucks air in the ventilation grooves and the ventilation holes through the air pipes, so that the semiconductor module is tightly attached to the top surface of the platform, namely the semiconductor module is adsorbed on the top surface of the platform.
Furthermore, the inner wall of the air pipe is relatively provided with a lug;
a limiting groove and a limiting edge are formed in one side wall of the lug;
a chamfer is arranged on the edge of the other side wall of the lug;
a slideway is arranged on the top surface of the lug;
the upper bottom surface of the lug is provided with a through hole;
the slide way is arranged between the limiting groove and the through hole;
when the air pipe is not deformed, the limiting edges of the two lugs are contacted, the limiting grooves of the two lugs are matched to form a limiting hole matched with the limiting bulge in shape, and the size of the limiting hole is smaller than that of the limiting bulge;
the air pump pumps air to enable the limiting protrusions to enter the air pipe and then block the limiting holes, the air pump continuously pumps air to reduce air pressure in the air pipe, the air pipe deforms to drive the two bumps to approach until the chamfers of the two bumps are attached, the two limiting edges are separated at the moment, the shape of the limiting holes is enlarged, the limiting protrusions move to the through holes along the slide ways to be discharged, the chamfers are attached to the through holes, the air pressure in the air pipe between the bumps and the air holes is gradually recovered, and the limiting protrusions fall out of the air pipe from the through holes;
after the limiting bulge falls out of the air pipe, the air pipe of the air pump is closed to gradually recover deformation and stop adsorption.
The semiconductor module adsorption device has the advantages that the adsorption device is arranged on the platform through the platform and the adsorption device, and the adsorption device is suitable for adsorbing and fixing the semiconductor module on the platform and sucking out the falling limiting bulges on the semiconductor module; the collecting device is arranged on one side of the platform and suitable for collecting falling limiting bulges, so that the uniform collection of the limiting bulges is realized, and the influence of the falling limiting bulges on the detection of the semiconductor module is avoided.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of the construction of a collecting device according to the present invention;
FIG. 2 is a schematic view showing the structure of a semiconductor module inspection apparatus for waste collection according to the present invention;
FIG. 3 is a schematic view of the construction of a transport device according to the present invention;
FIG. 4 is a schematic structural view of a spacing mechanism according to the present invention;
FIG. 5 is a schematic view showing a part of the constitution of a semiconductor module inspection apparatus for waste collection according to the present invention;
fig. 6 is a schematic structural view of a semiconductor module according to the present invention;
FIG. 7 is a schematic structural diagram of a platform in accordance with the present invention;
fig. 8 is a schematic structural view of a bump according to the present invention;
FIG. 9 is a schematic view of a first state according to the present invention;
fig. 10 is a second state diagram according to the present invention.
In the figure:
1 is a platform, 11 is a ventilation groove, 12 is a ventilation hole, 13 is a limit chute, and 14 is a chute groove;
2 is an adsorption device, 21 is an air pipe, 211 is a bump, 2111 is a limit groove, 2112 is a limit edge, 2113 is a chamfer, 2114 is a slideway, 2115 is a through hole;
3 is a carrying device, 31 is a first cylinder, 32 is a first slide rail, 33 is a first slide block, 34 is a second cylinder, 35 is a second slide block, 36 is a second slide rail, 37 is a connecting plate, 381 is a thumb cylinder, 382 is a clamping jaw, 383 is a fourth cylinder;
4, a pressing device, 41, a first bracket, 42, a third cylinder, 43, a third slide block, 44, a third slide rail and 45, wherein the pressing device is a pressing device;
5 is a detection device, 51 is a second bracket, 52 is a first driving motor, 53 is a fourth sliding block, 54 is a fourth sliding rail, 55 is a detection mechanism, and 56 is a second pressure head;
6 is a semiconductor module, 61 is an upper shell, 62 is a lower shell, and 63 is a limiting bulge;
7 is a conveying device, 71 is a supporting mechanism, 711 is a third supporting frame, 712 is a supporting block, 72 is a driving mechanism, 721 is a second driving motor, 722 is a first rotating wheel, 723 is a second rotating wheel, 73 is a conveying mechanism, 731 is a belt, 732 is a limiting plate, 74 is a limiting mechanism, 741 is a first groove, 742 is a second groove, 743 is a limiting block, 7431 is a long arm, 7432 is a short arm, 7433 is a limiting block, 744 is a spring;
8 is a collecting device, 81 is a collecting mechanism, 811 is a base, 812 is a coaming, 813 is a limiting hole, 814 is a fixing column, 821 is a clamping seat, 822 is a receiving plate, and 83 is a limiting plate;
and 9 is a bottom plate.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provides a semiconductor module inspection apparatus for garbage collection, including: the semiconductor module fixing device comprises a platform 1 and an adsorption device 2, wherein the adsorption device 2 is arranged on the platform 1, and the adsorption device 2 is suitable for adsorbing and fixing a semiconductor module 6 on the platform 1, so that a limiting bulge 63 on the semiconductor module 6 falls off, and the falling limiting bulge 63 on the semiconductor module 6 is sucked out; collection device 8, collection device 8 sets up one side of platform 1, collection device 8 is suitable for collecting the spacing arch 63 that drops, has realized the unified collection to spacing arch 63, avoids spacing arch 63 to drop everywhere to produce the influence to semiconductor module 6's detection.
Collecting device 8
In the present embodiment, the collecting device 8 includes: a collection mechanism 81 and a restriction mechanism; the limiting mechanism is arranged on the bottom plate 9 and is arranged on one side of the platform 1; the collecting mechanism 81 is clamped with the limiting mechanism so as to be fixed on the bottom plate 9; with collecting mechanism 81 and limiting mechanism joint, can collect convenient dismantling collecting mechanism 81 after mechanism 81 collects spacing arch 63, pour spacing arch 63 in collecting mechanism 81 to with spacing arch 63 joint on limiting mechanism again.
In the present embodiment, the collection mechanism 81 includes: a base 811 and a shroud 812; the base 811 is clamped with the limiting mechanism to be fixed on the bottom plate 9; the base 811 is in communication with the shroud 812; the surrounding plate 812 is provided with a limiting hole 813; the air pipe 21 of the adsorption device 2 passes through the limiting hole 813 and then is connected with the vent hole 12 on the platform 1, and the limiting bulge 63 falls into the base 811 from the air pipe 21 (the through hole 2115 of the lug 211 in the air pipe 21 is in the range surrounded by the enclosing plate 812); the air tube 21 is adapted to move within the range of the restricting hole 813; the base 811 and the surrounding plate 812 are separately arranged, the connection between the base 811 and the surrounding plate 812 is only that the bottom surface of the surrounding plate 812 is aligned with the upper surface of the base 811, so as to ensure that the limiting protrusion 63 falls into the base 811, the base 811 can be directly moved out of the limiting mechanism after being fully connected with the limiting protrusion 63, and the limiting protrusion 63 in the base 811 can be poured out; the shroud 812 may have a horn shape, and the smaller cross-sectional side of the shroud 812 is connected to the base 811.
In this embodiment, a plurality of fixing posts 814 are disposed on an outer wall of the surrounding plate 812; the fixing columns 814 are connected with the side wall of the platform 1 so as to fix the enclosing plate 812 with the platform 1; after the enclosure 812 is fixed with the platform 1, the base 811 is only required to be placed below the enclosure 812, so as to ensure that the upper surface of the base 811 is aligned with and then contacted with the lower bottom surface of the enclosure 812.
In this embodiment, the collecting device 8 further includes: a limiting plate 83; the restricting plate 83 is provided on the inner wall of the surrounding plate 812 and covers the restricting hole 813; the air pipe 21 of the adsorption device 2 passes through and is fixed on the limiting plate 83; when the air pipe 21 moves in the hole forming range, the limiting plate 83 is driven to move, and at the moment, the limiting plate 83 always covers the limiting hole 813, so that the limiting protrusion 63 is prevented from falling out of the limiting hole 813; the air suction pump working chamber can generate vibration to cause the air pipe 21 to move, the air pipe 21 always moves in the range of the limiting hole 813, and the limiting plate 83 always covers the limiting hole 813 to prevent the limiting protrusion 63 from falling out of the limiting hole 813 when the air pipe 21 moves.
In the present embodiment, the restricting mechanism includes: a snap seat 821; the clamping seat 821 is arranged on the bottom plate 9; a gap is arranged on the side wall of the clamping seat 821; the base 811 is clamped with the clamping seat 821 through a gap; the base 811 enters the area surrounded by the engaging seat 821 through the gap, and is engaged in the area, and the upper surface of the base 811 is aligned with and contacts the lower bottom surface of the surrounding plate 812.
In this embodiment, the restricting mechanism further includes: a receiving plate 822; the receiving plate 822 is disposed on the fastening seat 821; the bearing plate 822 is arranged around the base 811; the side wall of the bearing plate 822 is provided with a notch communicated with the notch of the clamping seat 821, and the two notches are vertically arranged; the receiving plate 822 is suitable for receiving the limiting protrusion 63 falling out of the collecting mechanism 81; the notches of the receiving plate 822 and the clamping seat 821 are communicated and are in the same vertical direction, so that the base 811 can be clamped inside the receiving plate 822 and the base 811 conveniently, and the bottom edge of the receiving plate 822 is in tight contact with the base 811 when the base 811 is clamped so as to receive the limiting protrusion 63 accidentally dropped from the collecting mechanism 81.
In this embodiment, the semiconductor module inspection apparatus for waste collection further includes: a transport device provided at one side of the platform 1, the transport device being adapted to transport semiconductor modules 6; a handling device 3, said handling device 3 being arranged at one side of said platform 1 in the transport direction, said handling device 3 being adapted to handle semiconductor modules 6 transported by the transport device onto said platform 1; the pressing device 4 is arranged above the platform 1, and the pressing device 4 is suitable for pressing the upper shell and the lower shell of the semiconductor module 6 and enabling the limiting bulge 63 to fall off from the semiconductor module 6; the detection device 5 is arranged above the platform 1, and the detection device 5 is suitable for detecting the pressure resistance of the semiconductor module 6 after pressing; after the carrying device 3 carries the semiconductor module 6 transported by the transporting device to the platform 1, the adsorption device 2 adsorbs the semiconductor module 6 on the platform 1, the pressing device 4 presses the upper shell and the lower shell of the adsorbed semiconductor module 6 and enables the limiting bulges 63 to fall off, the falling limiting bulges 63 are collected through the collecting device 8, the falling limiting bulges 63 are sucked out through the adsorption device 2, the carrying device 3 carries the semiconductor module 6 to the lower part of the detecting device 5 after pressing, and the detecting device 5 detects the pressure resistance of the semiconductor module 6.
In the present embodiment, the transportation device 7 includes: a supporting mechanism 71, a driving mechanism 72, a conveying mechanism and a limiting mechanism 74; the supporting mechanism 71 is arranged on one side of the platform 1; the driving mechanism 72 is arranged on the supporting mechanism 71; the transportation mechanism is arranged on the supporting mechanism 71; the limiting mechanism 74 is arranged on the conveying mechanism; the driving mechanism 72 is connected with the transportation mechanism; the driving mechanism 72 is adapted to drive the transporting mechanism to transport the semiconductor module 6; when the clamping jaws 382 in the carrying device 3 clamp the semiconductor modules 6 on the conveying mechanism, the limiting mechanism 74 is adapted to limit the clamping jaws 382 to clamp only one semiconductor module 6, and only one semiconductor module 6 is grabbed in each carrying process, so that the situation that a plurality of semiconductor modules 6 are conveyed at a time at a single station and the station cannot be detected is avoided.
In the present embodiment, the support mechanism 71 includes: a third supporting bracket 711 and a supporting block 712; the third supporting frame 711 is arranged at one side of the platform 1; the supporting block 712 is disposed on the third supporting frame 711; the drive mechanism 72 and the transport mechanism are disposed on the support block 712.
In the present embodiment, the driving mechanism 72 includes: a second driving motor 721, a first pulley, and a second pulley; the second driving motor 721 is disposed on the third supporting frame 711; the first rotating wheel is arranged on the third supporting frame 711; the second runner is disposed on the support block 712; the second driving motor 721 is connected to the first wheel; the first rotating wheel and the second rotating wheel are connected through a belt in the conveying mechanism; the second driving motor 721 is adapted to drive the first wheel to rotate to drive the belt to move, so that the second wheel rotates to transport the semiconductor module 6 through the flat belt; the first wheel and the second wheel can be rotated synchronously by the transmission of the belt to transport the semiconductor module 6.
In this embodiment, the transport mechanism includes: a limiting plate; the limiting mechanism 74 is arranged on the limiting plate; the limiting plates are symmetrically arranged on two sides of the belt along the length direction of the belt; the limit plate is arranged on the supporting block 712; the limiting plates extend along the width direction of the belt, so that a channel for the semiconductor module 6 to pass through is formed between the two limiting plates; the semiconductor module 6 conveyed by the belt is conveyed along a channel formed between the two limiting plates; the semiconductor modules 6 can be transported in a fixed area while being restricted by the two restriction plates (i.e., the semiconductor modules 6 are restricted from being transported in a passage, which may have a width of the semiconductor modules 6, so that only one semiconductor module 6 can be transported in the same width).
In this embodiment, the limiting mechanism 74 includes: a first groove 741, a second groove 742, and a stopper 743; the first groove 741 is arranged on a limiting plate; the second groove 742 is disposed on the other limiting plate, and the first groove 741 and the second groove 742 are disposed opposite to each other; the limiting block 743 is arranged in the first groove 741; the long arm 7431 of the limiting block 743 extends out of the first groove 741 and extends to the second groove 742 along the width direction of the belt; a short arm 7432 of the limiting block 743 is positioned in the first groove 741, and a spring 744 is connected between the short arm 7432 and the inner wall of the first groove 741; after the long arm 7431 of the limiting block 743 extends out of the first groove 741, the semiconductor module 6 on the belt is blocked from moving continuously; the clamping jaw 382 of the carrying device 3 drives the long arm 7431 to move towards the second groove 742 and extend into the second groove 742, drives the short arm 7432 to extend out of the first groove 741 and extend into the space between two adjacent semiconductor modules 6, so as to separate the two adjacent semiconductor modules 6, at this time, the semiconductor module 6 which is forward along the moving direction of the belt is located between the long arm 7431 and the short arm 7432, and the clamping jaw 382 clamps the semiconductor module 6; after the clamping jaw 382 clamps the semiconductor module 6, the clamping jaw 382 is far away from the belt, and at this time, the extended spring 744 recovers deformation to drive the limiting block 743 to contract back into the first groove 741; when the clamping jaw 382 is far away from the belt, the clamping jaw 382 no longer drives the long arm 7431, and the spring 744 recovers deformation at the moment and drives the limiting block 743 to contract back to the first groove 741 to return to the initial state; the end of the long arm 7431 extending into the second groove 742 may be provided with a bar-shaped block for guiding to ensure that the long arm 7431 extends into the second groove 742.
In this embodiment, the long arm 7431 of the limiting block 743 is provided with a limiting stopper 7433; a fourth air cylinder 384 is arranged on one side of the clamping jaw 382, the fourth air cylinder 384 is arranged on the connecting plate, the fourth air cylinder 384 can replace a thumb air cylinder to move towards the semiconductor module 6 along the width direction of the belt, the clamping jaw 382 is driven to abut against the limit stop 7433 and then continuously move, the long arm 7431 is driven to move towards the second groove 742 and extend into the second groove 742, meanwhile, the short arm 7432 is driven to extend out of the first groove 741 and extend into a space between two adjacent semiconductor modules 6, and the clamping jaw 382 clamps the semiconductor module 6; the broken end of the short arm 7432 may be provided in a pointed shape so as to extend between the two semiconductor modules 6 to separate the two semiconductor modules 6, and the semiconductor module 6 at the front is positioned between the long arm 7431 and the short arm 7432 and between the two clamping jaws 382 of one clamping jaw mechanism so as to facilitate the clamping jaw mechanism to clamp the semiconductor module 6.
In this embodiment, the semiconductor module inspection apparatus for efficient handling further includes: the adsorption device 2 is arranged on the platform 1, and the adsorption device 2 is suitable for adsorbing and fixing the semiconductor module 6 on the platform 1; the pressing device 4 is arranged above the platform 1, and the pressing device 4 is suitable for pressing the upper shell and the lower shell of the semiconductor module 6 and enabling the limiting bulges to fall off from the semiconductor module 6; the detection device 5 is arranged above the platform 1, and the detection device 5 is suitable for detecting the pressure resistance of the semiconductor module 6 after pressing; after the carrying device 3 carries the semiconductor module 6 transported by the transporting device 7 to the platform 1, the adsorption device 2 adsorbs the semiconductor module 6 on the platform 1, the pressing device 4 presses the upper shell and the lower shell of the adsorbed semiconductor module 6 and enables the limiting bulge to fall off, the falling limiting bulge is sucked out through the adsorption device 2, the carrying device 3 carries the semiconductor module 6 to the position below the detection device 5 after pressing, and the detection device 5 detects the pressure resistance of the semiconductor module 6.
In the present embodiment, the top surface of the platform 1 is provided with a ventilation groove 11, and the size of the ventilation groove 11 is smaller than the lower shell 62 of the semiconductor module 6; the side wall of the platform 1 is provided with a vent hole 12; a limiting chute 13 is arranged on the top surface of the platform 1, and the limiting chute 13 is arranged on the edge of the ventilation groove 11; the vent hole 12 is communicated with the vent groove 11, and the vent hole 12 is connected with the adsorption device 2; the carrying device 3 carries the semiconductor module 6 to the platform 1, the limiting bulge 63 on the bottom surface of the lower shell 62 of the semiconductor module 6 is abutted against the inner wall of the limiting chute 13 to limit the semiconductor module 6, and at the moment, the adsorption device 2 adsorbs the semiconductor module 6 on the platform 1 through the ventilation groove 11 and the ventilation hole 12; the semiconductor module 6 is placed on the ventilation groove 11, and the limit protrusion 63 contacts the limit chute 13; when the adsorption device 2 adsorbs the semiconductor module 6 on the platform 1, the stitching device 4 stitches the upper shell 61 and the lower shell 62 of the semiconductor module 6, at this time, the limiting bulge 63 moves along the limiting inclined groove 13, so that the limiting bulge 63 falls in the ventilation groove 11 from the lower shell 62 and is sucked out of the ventilation groove 11 by the adsorption device 2; as the air pump starts to pump air (meanwhile, the stitching device 4 stitches the upper shell 61 and the lower shell 62 of the semiconductor module 6), the limiting protrusion 63 moves along the limiting chute 13, so that the limiting protrusion 63 falls off, at the moment, the lower shell 62 completely covers the ventilation groove 11 and the limiting chute 13, as the air pump continues to pump air, the air pressure between the ventilation groove 11 and the ventilation hole 12 is gradually reduced, and the semiconductor module 6 is pressed by the external atmospheric pressure of the semiconductor module 6, so that the semiconductor module 6 is adsorbed on the platform 1; the separation of the limiting protrusion 63 can be accelerated by the simultaneous working of the pressing device 4 and the air pump.
In this embodiment, the edge of the limiting chute 13 is provided with a chute groove 14; after the upper shell 61 and the lower shell 62 of the semiconductor module 6 are pressed, the carrying device 3 enables the semiconductor module 6 to move to the position below the detection device 5 on the top surface of the platform 1, so that burrs formed after the limiting bulges 63 fall off pass through the inclined knife groove 14, and the burrs fall off; the limiting protrusion 63 leaves burrs on the bottom surface of the lower shell 62 after falling, and the bottom surface of the lower shell 62 is tightly attached to the top surface of the platform 1 when the semiconductor module 6 is carried, so that the burrs fall off through the inclined knife groove 14, and the quality of the semiconductor module 6 is ensured.
In the present embodiment, the adsorption device 2 includes: an air tube 21; the air pipe 21 is communicated with the vent hole 12, and the air pipe 21 is connected with a suction pump; the air pump sucks air in the ventilation grooves 11 and the ventilation holes 12 through the air pipe 21, so that the semiconductor module 6 is tightly attached to the top surface of the platform 1, namely the semiconductor module 6 is adsorbed on the top surface of the platform 1; the air pipe 21 is made of flexible material, the pressure in the air pipe 21 is reduced through air pumping of the air pump, and the air pipe 21 is extruded by external atmospheric pressure to deform inwards.
In this embodiment, the inner wall of the air tube 21 is relatively provided with a protrusion 211; a limiting groove 2111 and a limiting edge 2112 are formed in one side wall of the bump 211; a chamfer 2113 is arranged on the edge of the other side wall of the lug 211; a slideway 2114 is arranged on the top surface of the lug 211; a through hole 2115 is formed in the upper bottom surface of the bump 211; the air extraction efficiency of the air extraction pump is greater than the air inlet efficiency of the two through holes 2115; the slideway 2114 is arranged between the limiting groove 2111 and the through hole 2115; when the air pipe 21 is not deformed, the limiting edges 2112 of the two lugs 211 are contacted, the limiting grooves 2111 of the two lugs 211 are matched to form a limiting hole matched with the limiting bulge 63 in shape, and the size of the limiting hole is smaller than that of the limiting bulge 63; the air pump pumps air to enable the limiting protrusion 63 to enter the air pipe 21 and then block the limiting hole, the air pump continuously pumps air to reduce air pressure in the air pipe 21, the air pipe 21 deforms to drive the two bumps 211 to approach until the chamfers 2113 of the two bumps 211 are tightly attached, at the moment, the two limiting edges 2112 are separated, the shape of the limiting hole is enlarged, the limiting protrusion 63 moves to the through hole 2115 along the slide way 2114 to go out, and as the chamfers 2113 are tightly attached to and pass through the through hole 2115, the air pressure in the air pipe 21 between the bumps 211 and the vent holes 12 is gradually recovered, the limiting protrusion 63 falls out of the air pipe 21 from the through hole 2115 and falls into the base 811; after the limiting bulge 63 falls out of the air pipe 21, the air pump pipe 21 is closed to gradually recover deformation and stop adsorption; the limiting bulge 63 is pumped into the air pipe 21 by the air pump and then abuts against the limiting hole, because the limiting edges 2112 of the two lugs 211 are contacted, the air pump pumps air to reduce the pressure inside the air pipe 21 between the limiting bulge 63 and the air pump, the air pipe 21 begins to deform, the two lugs 211 are close to each other, as the distance between the two limiting grooves 2111 close to the lugs 211 is increased, the limiting bulge 63 begins to move towards the through hole 2115 along the slide rail 2114, and as the two lugs 211 are close to each other, the chamfers 2113 of the two lugs 211 are contacted and sealed, a pipeline between the chamfer 2113 and the ventilation groove 11 is not influenced by the air pump and gradually recovers to the atmospheric pressure through the through hole 2115, so that the limiting bulge 63 falls out of the air pipe 21 from the through hole 2115 under the influence of gravity, at the moment, the air pump is turned off to gradually recover the pressure in the air pipe 21 to the atmospheric pressure, and the air pipe 21 recovers to deform.
Conveying device 3
In the present embodiment, the carrying device 3 includes: the device comprises a first air cylinder 31, a first slide rail 32, a first slide block 33, a second air cylinder 34, a second slide block 35, a second slide rail 36, a connecting plate 37 and a plurality of clamping jaw mechanisms; the first slide rail 32 is transversely arranged on the side wall of the platform 1; the first cylinder 31 is arranged on the side wall of the platform 1; the first slide rail 32 is matched with the first slide block 33; the first cylinder 31 is connected with the first slide block 33; the second air cylinder 34 is arranged on the first sliding block 33; the second slide rail 36 is longitudinally arranged on the first slide block 33; the second slide rail 36 is adapted to the second slide block 35; the second cylinder 34 is connected with the second slide block 35; the connecting plate 37 is disposed on the second slider 35; the clamping jaw mechanism is arranged on the connecting plate 37; the clamping jaw mechanism is suitable for clamping the semiconductor module 6; the second cylinder 34 is adapted to drive the second slider 35 to move along the second slide rail 36, so as to adjust the relative height between the clamping jaw mechanism and the semiconductor module 6, so as to clamp the semiconductor module 6 at any height, when the clamping jaw mechanism and the semiconductor module 6 are at the same height, the clamping jaw mechanism clamps the semiconductor module 6, and after clamping the semiconductor module 6, the second cylinder 34 is adapted to drive the second slider 35 to move along the second slide rail 36, so as to move the lowest point of the semiconductor module 6 to the same height as the top surface of the platform 1, so as to transport the semiconductor module 6 to the platform 1; after the clamping jaw mechanism clamps the semiconductor module 6, the first air cylinder 31 drives the first sliding block 33 to move along the first sliding rail 32, the clamping jaw mechanism is driven to move the semiconductor module 6 to the platform 1, the limiting protrusion 63 on the bottom surface of the lower shell 62 of the semiconductor module 6 is abutted against the inner wall of the limiting chute 13, and the clamping mechanism is added to release the air pump of the semiconductor module 6 to begin to suck and adsorb the semiconductor module 6; after the semiconductor module 6 is adsorbed, the semiconductor module 6 is pressed by the pressing device 4, after the pressing, the adsorption is stopped, the semiconductor module 6 is clamped by the clamping jaw mechanism, the first cylinder 31 drives the first sliding block 33 to move along the first sliding rail 32, so that the semiconductor module 6 moves to the position below the detection device 5 on the top surface of the platform 1, and burrs formed after the limiting protrusions 63 fall off pass through the inclined knife grooves 14, so that the burrs fall off; after the semiconductor module 6 moves below the inspection device 5, the gripper mechanism releases the semiconductor module 6, and the inspection device 5 inspects the pressure resistance of the semiconductor module 6.
In this embodiment, the gripper mechanism includes: a thumb cylinder 381 and an oppositely disposed clamping jaw 382; the thumb cylinder 381 is arranged on the connecting plate 37; the thumb cylinder 381 is connected with the clamping jaw 382; the thumb cylinder 381 is suitable for driving the clamping jaw 382 to approach the semiconductor module 6 so as to clamp the semiconductor module 6; the thumb cylinder 381 is adapted to move the clamping jaw 382 away from the semiconductor module 6 to release the semiconductor module 6; when the clamping jaw mechanism clamps the semiconductor module 6, the clamping jaw 382 moves toward the semiconductor module 6 to clamp the semiconductor module 6; when the chuck mechanism releases the semiconductor module 6, the chuck 382 moves away from the semiconductor module 6 to release the semiconductor module 6.
Pressing device 4
In this embodiment, the stitching device 4 includes: a first bracket 41, a third air cylinder 42, a third slide block 43, a third slide rail 44 and a first pressure head 45; the first bracket 41 is positioned at one side of the platform 1; the third cylinder 42 is arranged on the first bracket 41; the third slide rail 44 is longitudinally arranged on the first bracket 41; the third sliding block 43 is matched with the third sliding rail 44; the third air cylinder 42 is connected with the third slide block 43; the first ram 45 is arranged on the third slider 43; when the suction pump sucks and adsorbs the semiconductor module 6, the third cylinder 42 drives the third slider 43 to move along the third slide rail 44, and drives the first pressing head 45 to approach the semiconductor module 6, so that the first pressing head 45 presses the upper shell 61 and the lower shell 62 of the semiconductor module 6, and drives the first pressing head 45 to be far away from the semiconductor module 6 after pressing; the upper case 61 and the lower case 62 can increase the mass of the semiconductor module 6 after being closely attached.
In the present embodiment, the detection device 5 includes: a second bracket 51, a first driving motor 52, a fourth slider 53, a fourth slide rail 54, a detection mechanism 55 and a second ram 56; the detecting mechanism 55 is a pressure detecting mechanism 55, and a probe of the pressure detecting mechanism 55 can be connected with the second pressing head 56 to detect the pressure applied by the second pressing head 56 in real time, namely the pressure received by the semiconductor module 6 in real time; the second bracket 51 is arranged at one side of the platform 1; the first driving motor 52 is disposed on the second bracket 51; the fourth sliding rail 54 is longitudinally arranged on the second bracket 51; the fourth sliding block 53 is matched with the fourth sliding rail 54; the fourth slider 53 is connected with the first driving motor 52; the second ram 56 is arranged on the fourth slider 53; the detection mechanism 55 is connected with the second pressing head 56; the first driving motor 52 is adapted to drive the fourth slider 53 to move along the fourth slide rail 54, so as to drive the second pressing head 56 to approach or depart from the pressed semiconductor module 6, and when the second pressing head 56 presses on the pressed semiconductor module 6, the detection mechanism 55 detects the pressure resistance of the pressed semiconductor module 6; when the second ram 56 presses the semiconductor module 6, the detection mechanism 55 detects the pressure received by the semiconductor module 6 in real time, and when the pressure applied by the second ram 56 reaches a preset pressure (at which the semiconductor module 6 needs to maintain a function), the pressing is stopped, and at this time, the semiconductor module 6 is not damaged, and the compression resistance of the semiconductor module 6 is qualified.
The first cylinder 31 drives the first sliding block 33 to move along the first sliding rail 32 to drive the clamping jaw mechanism to move to the belt, the fourth cylinder 383 pushes the clamping jaw 382 to move towards the semiconductor module 6 on the belt 731 to drive the clamping jaw 382 to abut against the limit stop 7433 and then move continuously to drive the long arm 7431 to move towards the second groove 742 and extend into the second groove 742, and simultaneously drives the short arm 7432 to extend out of the first groove 741 and extend between two adjacent semiconductor modules 6, the clamping jaw 382 clamps the semiconductor module 6, and the first cylinder 31 drives the first sliding block 33 to move along the first sliding rail 32 to drive the clamping jaw mechanism to move to the platform; the second cylinder 34 is adapted to drive the second slider 35 to move along the second slide rail 36, so as to adjust the relative height between the clamping jaw mechanism and the semiconductor module 6, so as to clamp the semiconductor module 6 at any height, when the clamping jaw mechanism and the semiconductor module 6 are at the same height, the clamping jaw mechanism clamps the semiconductor module 6, and after clamping the semiconductor module 6, the second cylinder 34 is adapted to drive the second slider 35 to move along the second slide rail 36, so as to move the lowest point of the semiconductor module 6 to the same height as the top surface of the platform 1, the first cylinder 31 drives the first slider 33 to move along the first slide rail 32, so as to drive the clamping jaw mechanism to move the semiconductor module 6 to the ventilation groove 11 of the platform 1, the limiting protrusion 63 contacts the limiting chute 13, and as the air pump starts to pump air, the limiting protrusion 63 moves along the limiting chute 13, so as to cause the limiting protrusion 63 to fall off, at this time, the semiconductor module 6 completely covers the ventilation groove 11 and the limiting chute 13, and is adsorbed, when the suction pump sucks and adsorbs the semiconductor module 6, the third cylinder 42 drives the third slider 43 to move along the third slide rail 44, and drives the first pressing head 45 to approach the semiconductor module 6, so that the first pressing head 45 presses the upper shell 61 and the lower shell 62 of the semiconductor module 6, and drives the first pressing head 45 to be far away from the semiconductor module 6 after pressing; after the limiting protrusion 63 enters the air pipe 21, the limiting hole is blocked, the air pump continuously pumps air to reduce the air pressure in the air pipe 21, the air pipe 21 deforms to drive the two protrusions 211 to approach until the chamfers 2113 of the two protrusions 211 are tightly attached, at the moment, the two limiting edges 2112 are separated, the shape of the limiting hole is enlarged, the limiting protrusion 63 moves to the through hole 2115 along the slide way 2114 to be discharged, the air pressure in the air pipe 21 between the protrusions 211 and the vent holes 12 is gradually restored because the chamfers 2113 are tightly attached to and pass through the through hole 2115, the limiting protrusion 63 falls out of the air pipe 21 from the through hole 2115, and after the limiting protrusion 63 falls out of the air pipe 21, the air pump 21 is closed to gradually restore deformation and stop adsorption; the rear clamping jaw mechanism is pressed to clamp the semiconductor module 6, the first air cylinder 31 drives the first sliding block 33 to move along the first sliding rail 32, so that the semiconductor module 6 moves to the position below the detection device 5 on the top surface of the platform 1, and burrs formed after the limiting protrusions 63 fall off pass through the inclined cutter grooves 14, so that the burrs fall off; after the semiconductor module 6 is conveyed below the second pressing head 56, the first driving motor 52 is adapted to drive the fourth sliding block 53 to move along the fourth sliding rail 54, so as to drive the second pressing head 56 to move closer to or away from the semiconductor module 6 after being pressed, and when the second pressing head 56 presses on the semiconductor module 6 after being pressed, the detecting mechanism 55 detects the pressure resistance of the semiconductor module 6 after being pressed.
In summary, the invention uses the platform 1 and the adsorption device 2, the adsorption device 2 is arranged on the platform 1, and the adsorption device 2 is suitable for adsorbing and fixing the semiconductor module 6 on the platform 1, so that the limiting protrusion 63 on the semiconductor module 6 falls off; collection device 8, collection device 8 sets up one side of platform 1, collection device 8 is suitable for collecting the spacing arch 63 that drops, has realized the unified collection to spacing arch 63, avoids spacing arch 63 to drop everywhere to produce the influence to semiconductor module 6's detection.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation. Moreover, the software programs referred to in the present application are all prior art, and the present application does not refer to any improvement of the software programs.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (8)
1. A scrap collecting semiconductor module inspection apparatus, comprising:
a platform, a plurality of movable plates and a plurality of movable plates,
the adsorption device is arranged on the platform and is suitable for adsorbing and fixing the semiconductor module on the platform and sucking out the limiting bulges falling off from the semiconductor module;
the collecting device is arranged on one side of the platform and is suitable for collecting the falling limiting bulges;
the collecting device comprises: a collection mechanism and a restriction mechanism;
the limiting mechanism is arranged on the bottom plate and is arranged on one side of the platform;
the collecting mechanism is clamped with the limiting mechanism so as to be fixed on the bottom plate;
the collection mechanism includes: a base and a coaming;
the base is clamped with the limiting mechanism to be fixed on the bottom plate;
the base is communicated with the coaming;
the coaming is provided with a limiting hole;
an air pipe of the adsorption device penetrates through the limiting hole and then is connected with the air vent on the platform, and the limiting bulge falls into the base from the air pipe;
the trachea is adapted to move within a range of the restrictive orifice.
2. The scrap collecting semiconductor module inspection apparatus of claim 1,
a plurality of fixing columns are arranged on the outer wall of the enclosing plate;
the fixed column is connected with the side wall of the platform so as to fix the enclosing plate and the platform.
3. The scrap collecting semiconductor module inspection apparatus of claim 2,
the collecting device further comprises: a limiting plate;
the limiting plate is arranged on the inner wall of the enclosing plate and covers the limiting hole;
the air pipe of the adsorption device penetrates through and is fixed on the limiting plate;
when the trachea moves in the scope of making the hole, drive the restriction board and remove, restriction board keeps covering restriction hole all the time this moment.
4. The scrap collection semiconductor module inspection apparatus of claim 3,
the limiting mechanism includes: a clamping seat;
the clamping seat is arranged on the bottom plate;
the side wall of the clamping seat is provided with a notch;
the base passes through the breach with joint seat joint.
5. The scrap collection semiconductor module inspection apparatus of claim 4,
the limiting mechanism further comprises: a bearing plate;
the bearing plate is arranged on the clamping seat;
the bearing plate is arranged around the base;
the side wall of the bearing plate is provided with a notch communicated with the notch of the clamping seat, and the two notches are vertically arranged;
the bearing plate is suitable for bearing the limiting protrusion falling out of the collecting mechanism.
6. The scrap collecting semiconductor module inspection apparatus of claim 1,
the semiconductor module inspection apparatus for waste collection further includes:
a transportation device disposed at one side of the platform, the transportation device being adapted to transport a semiconductor module;
a carrying device disposed at one side of the stage in a transport direction, the carrying device being adapted to carry the semiconductor module transported by the transport device onto the stage;
the pressing device is arranged above the platform and is suitable for pressing the upper shell and the lower shell of the semiconductor module together and enabling the limiting bulges to fall off from the semiconductor module;
the detection device is arranged above the platform and is suitable for detecting the pressure resistance of the semiconductor module after pressing;
after the carrying device carries the semiconductor modules transported by the transporting device to the platform, the semiconductor modules are adsorbed on the platform by the adsorbing device, the upper shell and the lower shell of the adsorbed semiconductor modules are pressed by the pressing device, the limiting bulges fall off and the fallen limiting bulges are collected by the collecting device, the fallen limiting bulges are sucked out by the adsorbing device, the semiconductor modules are carried to the lower part of the detecting device by the carrying device after pressing, and the pressure resistance of the semiconductor modules is detected by the detecting device.
7. The scrap collection semiconductor module inspection apparatus of claim 6,
the adsorption device includes: an air tube;
the air pipe is communicated with the vent hole and is connected with the air suction pump;
the air suction pump sucks air in the ventilation grooves and the ventilation holes through the air pipes, so that the semiconductor module is tightly attached to the top surface of the platform, namely the semiconductor module is adsorbed on the top surface of the platform.
8. The scrap collection semiconductor module inspection apparatus of claim 7,
the inner wall of the air pipe is relatively provided with a convex block;
a limiting groove and a limiting edge are formed in one side wall of the lug;
a chamfer is arranged on the edge of the other side wall of the lug;
a slideway is arranged on the top surface of the lug;
the upper bottom surface of the lug is provided with a through hole;
the slide way is arranged between the limiting groove and the through hole;
when the air pipe is not deformed, the limiting edges of the two lugs are contacted, the limiting grooves of the two lugs are matched to form a limiting hole matched with the limiting bulge in shape, and the size of the limiting hole is smaller than that of the limiting bulge;
the air pump pumps air to enable the limiting protrusions to enter the air pipe and then block the limiting holes, the air pump continuously pumps air to reduce air pressure in the air pipe, the air pipe deforms to drive the two bumps to approach until the chamfers of the two bumps are attached, the two limiting edges are separated at the moment, the shape of the limiting holes is enlarged, the limiting protrusions move to the through holes along the slide ways to be discharged, the chamfers are attached to the through holes, the air pressure in the air pipe between the bumps and the air holes is gradually recovered, and the limiting protrusions fall out of the air pipe from the through holes;
after the limiting bulge falls out of the air pipe, the air pipe of the air pump is closed to gradually recover deformation and stop adsorption.
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| CN113670729B true CN113670729B (en) | 2022-02-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110634772A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江同满机械设计有限公司 | Thin wafer front-end processing equipment |
| CN112748014A (en) * | 2020-12-24 | 2021-05-04 | 王立东 | A quick testing arrangement for semiconductor original paper |
| CN213635935U (en) * | 2020-12-23 | 2021-07-06 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN113401651A (en) * | 2021-06-25 | 2021-09-17 | 广东歌得智能装备有限公司 | Automatic feeding and testing device for semiconductor element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2018174244A (en) * | 2017-03-31 | 2018-11-08 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634772A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江同满机械设计有限公司 | Thin wafer front-end processing equipment |
| CN213635935U (en) * | 2020-12-23 | 2021-07-06 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN112748014A (en) * | 2020-12-24 | 2021-05-04 | 王立东 | A quick testing arrangement for semiconductor original paper |
| CN113401651A (en) * | 2021-06-25 | 2021-09-17 | 广东歌得智能装备有限公司 | Automatic feeding and testing device for semiconductor element |
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