CN108472908B - 用于焊接印刷电路的热感应压力机和执行焊接印刷电路的方法 - Google Patents
用于焊接印刷电路的热感应压力机和执行焊接印刷电路的方法 Download PDFInfo
- Publication number
- CN108472908B CN108472908B CN201680076871.9A CN201680076871A CN108472908B CN 108472908 B CN108472908 B CN 108472908B CN 201680076871 A CN201680076871 A CN 201680076871A CN 108472908 B CN108472908 B CN 108472908B
- Authority
- CN
- China
- Prior art keywords
- brazing
- multilayer stack
- press
- stack
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
- B30B1/42—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by magnetic means, e.g. electromagnetic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0812—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using induction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Induction Heating (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUB2015A009600A ITUB20159600A1 (it) | 2015-12-28 | 2015-12-28 | Pressa a termo induzione per la saldatura di circuiti stampati e metodo attuato da tale pressa |
IT102015000088139 | 2015-12-28 | ||
PCT/IB2016/057357 WO2017115178A1 (en) | 2015-12-28 | 2016-12-05 | Thermo induction press for welding printed circuits and method carried out thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108472908A CN108472908A (zh) | 2018-08-31 |
CN108472908B true CN108472908B (zh) | 2021-08-10 |
Family
ID=55806593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680076871.9A Active CN108472908B (zh) | 2015-12-28 | 2016-12-05 | 用于焊接印刷电路的热感应压力机和执行焊接印刷电路的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11148384B2 (zh) |
CN (1) | CN108472908B (zh) |
IT (1) | ITUB20159600A1 (zh) |
TW (1) | TWI772283B (zh) |
WO (1) | WO2017115178A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110238567A (zh) * | 2019-06-14 | 2019-09-17 | 大连亚太电子有限公司 | 一种多层电路板的自动焊接方法 |
CN111491452B (zh) * | 2020-04-28 | 2021-05-25 | 深圳市信维通信股份有限公司 | Lcp柔性电路板及其制作方法 |
Family Cites Families (43)
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GB1321305A (en) | 1970-05-13 | 1973-06-27 | Cupro Sapphire Ltd | Method of laminating assemblies which include plastics material |
GB2119710A (en) | 1982-05-05 | 1983-11-23 | Smith H R | Producing thermoplastics material laminates, foams and articles |
JPS58197017A (ja) | 1982-05-11 | 1983-11-16 | Masuhiro Mitsuyama | プラスチックシートのマチ付重合体の接着方法 |
JPS59185600A (ja) | 1983-04-08 | 1984-10-22 | Hitachi Ltd | 多段形ホツトプレス |
US4650947A (en) | 1985-02-18 | 1987-03-17 | Hutton Roger L | Induction tacking method and apparatus |
DE3507568A1 (de) | 1985-03-04 | 1986-09-25 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zum verpressen von prepregs in einer etagenpresse mit einer rutschsicherung |
US4681649A (en) * | 1985-04-15 | 1987-07-21 | Fazlin Fazal A | Multi-layer printed circuit board vacuum lamination method |
DE3539990A1 (de) | 1985-11-12 | 1987-05-14 | Lauffer Maschf | Laminierpresse mit heizplatten |
JPH01255526A (ja) | 1988-04-05 | 1989-10-12 | Matsushita Electric Works Ltd | 積層板の製造方法 |
DE4001835A1 (de) | 1990-01-23 | 1991-07-25 | Schmidlin Geb Schifferle | Verfahren und anlage zur herstellung von sandwich-elementen |
US5176839A (en) * | 1991-03-28 | 1993-01-05 | General Electric Company | Multilayered mold structure for hot surface molding in a short cycle time |
CA2085556A1 (en) * | 1991-12-18 | 1993-06-19 | Marc J. Smet | Quick connect pipe coupling |
US5338497A (en) * | 1992-04-03 | 1994-08-16 | Ford Motor Company | Induction heating method for forming composite articles |
DE69214463T2 (de) | 1992-05-05 | 1997-05-22 | Cedal Srl | Verfahren zur herstellung von plastiklaminaten mit metallschichten insbesondere für gedruckte schaltungen |
IT1271942B (it) | 1993-02-10 | 1997-06-10 | Cedal Srl | Procedimento per la produzione di laminati plastici con lamine metalliche in spcie per circuiti stampanti con lamine a doppio nastro. |
IT1272106B (it) * | 1993-03-18 | 1997-06-11 | Cedal Srl | Sistema per il collegamento automatico tra la fonte di corrente elettricaica e le pile di pacchetti per laminati plastici, nel riscaldamento endotermico. |
US5483043A (en) * | 1993-11-29 | 1996-01-09 | General Electric Company | Induction heating of polymer matrix composites in a mold press |
WO1999007550A1 (fr) | 1997-08-06 | 1999-02-18 | Nitta Corporation | Procede de prechauffage de stratifie, et procede et appareil de fabrication de stratifie |
JPH11188744A (ja) | 1997-12-26 | 1999-07-13 | Kobe Steel Ltd | 積層体の加硫装置及びその方法 |
US6139777A (en) * | 1998-05-08 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
TW411732B (en) * | 1999-03-20 | 2000-11-11 | Wus Printed Circuit Co Ltd | Bonding apparatus for printed circuit board and manufacture of the same |
ES2219174B1 (es) * | 2003-03-27 | 2006-02-01 | Chemplate Materials, S.L. | "procedimiento para la fabricacion de placas para circuitos impresos y maquina para el mismo". |
US7148776B2 (en) * | 2003-04-28 | 2006-12-12 | The Boeing Company | Electromagnetic clamp and method for clamping a structure |
ITMI20030967A1 (it) | 2003-05-15 | 2004-11-16 | Cedal Equipment S R L | Procedimento per la produzione di circuiti elettronici stampati anche multistrato mediante riscaldamento endotermico ad induzione. |
EP1800829A1 (en) * | 2005-12-22 | 2007-06-27 | Thermal Cyclic Technologies TCTech i Stockholm AB | Injection mould with induction heating means and method of injection moulding including an induction heating step. |
JP4640170B2 (ja) * | 2005-12-28 | 2011-03-02 | 株式会社豊田自動織機 | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
US8884155B2 (en) * | 2006-04-13 | 2014-11-11 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
EP1925421B1 (en) * | 2006-11-21 | 2011-05-11 | Thermal Cyclic Technologies TCTech i Stockholm AB | Injection-mould with inductive heating and injection moulding method |
DE102006058198C5 (de) * | 2006-12-07 | 2018-01-18 | Fibretemp Gmbh & Co. Kg | Elektrisch beheizbares Formwerkzeug in Kunststoffbauweise |
US8021135B2 (en) | 2007-06-08 | 2011-09-20 | Sabic Innovative Plastics Ip B.V. | Mold apparatus for forming polymer and method |
US8865050B2 (en) * | 2010-03-16 | 2014-10-21 | The Boeing Company | Method for curing a composite part layup |
US8434909B2 (en) * | 2007-10-09 | 2013-05-07 | Flex Lighting Ii, Llc | Light emitting display with light mixing within a film |
US7618846B1 (en) * | 2008-06-16 | 2009-11-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device |
US20100096754A1 (en) * | 2008-10-17 | 2010-04-22 | Samsung Electronics Co., Ltd. | Semiconductor package, semiconductor module, and method for fabricating the semiconductor package |
TWI415729B (zh) * | 2009-02-27 | 2013-11-21 | 私立中原大學 | Mold with the uniform heating and cooling structure |
US8855786B2 (en) * | 2009-03-09 | 2014-10-07 | Nucurrent, Inc. | System and method for wireless power transfer in implantable medical devices |
US8268226B2 (en) * | 2009-07-07 | 2012-09-18 | The Boeing Company | Curing system and method using electromagnetic force and conductive heat transfer |
TWI411732B (zh) | 2010-12-03 | 2013-10-11 | Univ Nat Formosa | A non - circular gear with a moving mechanism |
DK2726263T3 (en) * | 2011-06-28 | 2018-05-07 | Tctech Sweden Ab | Device and method for heating a mold or tool |
US9662812B2 (en) * | 2012-02-14 | 2017-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for molding integrated circuits |
EP3479981B1 (en) * | 2012-12-27 | 2022-07-27 | TC TECH Sweden AB (publ) | Device and method for heating a mould or tool |
US10618213B2 (en) * | 2017-02-17 | 2020-04-14 | The Boeing Company | Method and apparatus for continuously fabricating a composite sandwich structure |
US11032953B2 (en) * | 2019-04-25 | 2021-06-08 | Microsoft Technology Licensing, Llc | Mutually shielded printed circuit board assembly |
-
2015
- 2015-12-28 IT ITUB2015A009600A patent/ITUB20159600A1/it unknown
-
2016
- 2016-12-05 WO PCT/IB2016/057357 patent/WO2017115178A1/en active Application Filing
- 2016-12-05 US US16/066,784 patent/US11148384B2/en active Active
- 2016-12-05 CN CN201680076871.9A patent/CN108472908B/zh active Active
- 2016-12-27 TW TW105143345A patent/TWI772283B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN108472908A (zh) | 2018-08-31 |
US11148384B2 (en) | 2021-10-19 |
ITUB20159600A1 (it) | 2017-06-28 |
TW201729971A (zh) | 2017-09-01 |
TWI772283B (zh) | 2022-08-01 |
WO2017115178A1 (en) | 2017-07-06 |
US20190016080A1 (en) | 2019-01-17 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200122 Address after: Milan Italy Applicant after: CEDAL EQUIPMENT S.R.L. Address before: Italy Varese Applicant before: VELATECH S.R.L. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200413 Address after: Haruma Applicant after: Seidel Equipment Co., Ltd Address before: Milan Italy Applicant before: CEDAL EQUIPMENT S.R.L. |
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GR01 | Patent grant | ||
GR01 | Patent grant |