411732 五、發明說明（1) 【發明領域】 本發明係關於一種印刷電路板壓合裝置及方法，其特別 有關於印刷電路板壓合裝置之鋼板加熱方法。 【先前技術】 習用印刷電路板壓合方法及裝置如第一圖所示，該印刷 電路板壓合裝置包括一第一加壓平台10、一第二加壓平心 u及數個鋼板12，該第一加壓平台1〇與第二加壓平台】】之 間置數個鋼板1 2，而數個印刷電路板丨3則疊置於二鋼板工2 之間形成鋼板1 2隔開印刷電路板丨3，將鋼板〗2加熱至適告 溫度進行壓合印刷電路板13。習用該加熱方法有兩種，: 種為利用熱煤油循環加熱，另一種為利用熱雷阻絲加熱。 熱煤油循環加熱系統利用外部之煤油加熱機將煤油加&枱 ，以循環泵浦送至加壓平臺1〇、u内之循環管，埶煤油'411732 V. Description of the invention (1) [Field of the invention] The present invention relates to a printed circuit board pressing device and method, and particularly relates to a method for heating a steel plate of a printed circuit board pressing device. [Prior art] Conventional printed circuit board pressing method and device are shown in the first figure. The printed circuit board pressing device includes a first pressing platform 10, a second pressing center u, and several steel plates 12, The first pressing platform 10 and the second pressing platform] are provided with a plurality of steel plates 12 and a plurality of printed circuit boards 3 are stacked between two steel plates 2 to form a steel plate 12 to be separated and printed. Circuit board 丨 3, heating the steel plate 2 to a suitable temperature to press the printed circuit board 13. There are two kinds of heating methods that are used conventionally: one is to use hot kerosene circulation heating, and the other is to use thermal lightning resistance wire heating. The hot kerosene circulation heating system uses an external kerosene heater to add kerosene to the circulation pump to the circulation pipe in the pressurized platform 10.
=度經由加壓平台10、11及鋼板12傳導至各層印刷電路J 生=:油加熱及循環系統佔用空間並透過整 J 浪費能源之缺點。電阻絲加熱系統係將加U 阻:糸J置於加壓平台10、η内，將電流通過該加：： 板13時，先通板3内銅層，然後於壓合該印刷電路 電路板13内銅層，£…得泽至鋼板12及印刷 經由加壓平to卩鋼板12及印刷電路板13所產生的熱量 麗合。然而，該妖煤：f ’使ί:鋼板12及印刷電路板13 、：Π經各層鋼板g w由循％加”，、系統將熱量由加壓平台10 13時，在加壓刷電=傳導至各層印刷電路板 十。10、11、鋼板12及印刷電路板13之間產= Degrees are transmitted to the printed circuits of each layer through the pressurized platforms 10, 11 and the steel plate 12. = The disadvantage of the oil heating and circulation system occupying space and wasting energy through the whole J. The resistance wire heating system will add U resistance: 糸 J to the pressurized platform 10, η, and pass the current through :: board 13, first pass through the inner copper layer of board 3, and then press the printed circuit board 13 inner copper layer, £ ... Deze to steel plate 12 and printing heat generated by pressing flat to steel plate 12 and printed circuit board 13. However, the demon coal: f 'makes: the steel plate 12 and the printed circuit board 13 :: Π is added by the% of the steel plate gw from each layer ", when the system transfers heat from the pressurized platform 10 13, the pressurized brushing = conduction To each layer of printed circuit board 10. 10, 11, steel plate 12 and printed circuit board 13
第4頁 411732 五，發明說明（2) 生一溫度梯度而 導至各層印刷電 浪費時間之缺點 電阻絲將熱傳導 加壓平台10、11 梯度而造成溫度 印刷電路板1 3内 費時間之缺點。 【發明概要】 本發明主要目 其以一時變磁場 及印刷電路板内 具有構造簡單、 造成溫度不均勻，且由加壓平台1〇、 路板13需要傳導時間，因此，其製 。此外，電阻絲加熱系統以通電加敎：： 至鋼板I2及印刷電路板u内銅層’因 、鋼板12及印刷電路板13之間產生— 不均句，且由加壓平台1〇、n傳導至 銅層需要傳導時間，因此，其製程具有浪 的係提供一種印刷電路板壓合裝置及法， f應加壓平台、鋼板、印刷電路板内銅層 尚分子聚合物產生熱量同時產生熱量其 溫度分佈均勻及減少製程加熱時間之功效 根據本發明之印刷電路板壓合方法，其係以一時變磁場 感應加壓平台及鋼板，使該加壓平台、鋼板、印刷電路板 内銅層及印刷電路板内高分子聚合物產生熱量， 加 平台、鋼板、印刷電路板内銅層及印刷電路板内高分子聚 合物同時產生熱量’再以該加壓平台進行加壓於鋼板及印 刷電路板。本發明之印刷電路板壓合裝置，其主要包含一 第一加壓平台、一第二加壓平台及數個鋼板，該第一加壓 平台與第二加歷平台之間置數個鋼板，而該第一加壓平台 與第—加壓平台内部則分別設有—第—線圈及一第二線圈 ’由該第一線圈及第二線圈產生—時變域場時，使該加壓Page 4 411732 V. Description of the invention (2) The disadvantage of wasting time by generating a temperature gradient to each layer of printed electricity The resistance wire conducts heat and pressurizes the gradient of the platforms 10 and 11 to cause the temperature. The disadvantage of the printed circuit board 1 3 is the time-consuming disadvantage. [Summary of the invention] The main purpose of the present invention is to make the time-varying magnetic field and the printed circuit board have a simple structure, cause uneven temperature, and require a conduction time from the pressurized platform 10 and the circuit board 13. In addition, the resistance wire heating system is energized by: to the steel plate I2 and the copper layer 'in the printed circuit board u, caused between the steel plate 12 and the printed circuit board 13 — an uneven sentence, and the pressure platform 10, n Conduction to the copper layer requires conduction time. Therefore, its process has a wave system that provides a printed circuit board pressing device and method. F The platform, steel plate, and copper layer in the printed circuit board should be pressurized to generate heat while generating heat. The effect of uniform temperature distribution and reducing process heating time According to the printed circuit board pressing method of the present invention, a time-varying magnetic field is used to induce a pressurized platform and steel plate, so that the pressurized platform, steel plate, copper layer in the printed circuit board, and The polymer in the printed circuit board generates heat, and the platform, the steel plate, the copper layer in the printed circuit board, and the polymer in the printed circuit board generate heat at the same time, and then the pressurized platform is used to pressurize the steel plate and the printed circuit board. . The printed circuit board pressing device of the present invention mainly includes a first pressing platform, a second pressing platform, and a plurality of steel plates, and a plurality of steel plates are placed between the first pressing platform and the second calendar platform. The first pressure platform and the first pressure platform are respectively provided with a first coil and a second coil, which are generated by the first coil and the second coil.
411732 五、發明說明（3) 平 台 > 鋼 板 印 刷 電 路 板 内 銅 層 及 印 刷 電 路 板 内 南 分 子 聚 合 物 同 時 產 生 熱 量 > 再 以 該 加 壓 平 台 進 行 加 壓 於 鋼 板 及 印 刷 電 路 板 使 位 於 二 鋼 板 間 之 印 刷 電 路 板被 加 熱 壓 合 〇 C 圖 式 說 明 ] 為 了 讓 本 發 明 之 上 述 和 其 他 的 > 特 徵 和 優 點 能 更 明 確 被 了 解 下 文 將 特 舉本 發 明 較 佳 實 施 例 並 配 合 所 附 圖 式 > 作 詳 細 說 明 如 下 0 第 1 圖 * 習 用 印 刷 電 路 板壓 合 製 程 裝 置 之 側 視 圖 ； 及 第 2 圖 ♦ * 本 發 明 較 佳 實 施 例 印 刷 電 路 板 壓 合 裝 置 之 側 視 圖 〇 1 圖 號 說 明 ] 10 第 嶙1 — 加 壓 平 台 11 第 二 加 壓 平 台 12 鋼 板 13 印 刷 電 路 板 20 第 - 加 壓 平 台 21 第 二 加 壓 平 台 c 22 鋼 板 23 印 刷 電 路 板 V \ 24 第 一 線 圈 25 第 二 線 圈 1 發 明 說 明 ] 本發 明 之 印 刷 電 路 板 壓 合 方 法 係 將 印 刷 電 路 板 置 於 二 鋼 板 間 以 一 時 變 磁 場 感 應 加 壓 平 台 Ή 鋼 板 及 印 刷 電 路 板 内 銅 層 j 使 該 加 壓 平 台 Λ 鋼 板 内 及 印 刷 電 路 板 内 銅 層 同 時 產 生磁滯損失現象及時變感應電流，由該磁滯損失現象及時 變感應電流使該加壓平台、鋼板及印刷電路板内銅層產生 熱量，或以一磁控管〔一種於極高頻及極高頻波帶能產生 高能輸出的電子管，其帶有電場之線路元件於穿越穩定之411732 V. Description of the invention (3) Platform > The copper layer in the printed circuit board and the molecular polymer in the printed circuit board generate heat at the same time > The pressurized platform is used to pressurize the steel plate and the printed circuit board so that The printed circuit board between steel plates is heated and pressed. Schematic description] In order to make the above and other features and advantages of the present invention more clearly understood, the preferred embodiments of the present invention will be enumerated below in conjunction with the accompanying drawings. Formula > Detailed description is as follows: 0. Fig. 1 * Side view of conventional printed circuit board pressing process device; and Fig. 2 * * Side view of printed circuit board pressing device of preferred embodiment of the present invention. ] 10th 嶙 1 — Pressure platform 11 Second pressure platform 12 Steel plate 13 Printed circuit board 20 Section- Pressure platform 21 Second pressure platform c 22 Steel plate 23 Printed circuit board V \ 24 First coil 25 Second coil 1 Description of the invention] The method for pressing a printed circuit board of the present invention is to place the printed circuit board between two steel plates to A time-varying magnetic field induction pressurization platformΉ The copper layer in the steel plate and the printed circuit board makes the pressurization platform Λ the copper layer in the steel plate and the printed circuit board simultaneously generate a hysteresis loss phenomenon and change the induced current in time. Variable induction current causes the pressurized platform, steel plate, and the copper layer inside the printed circuit board to generate heat, or a magnetron [an electronic tube that can generate high-energy output at very high frequency and very high frequency bands, and circuit elements with electric fields Traversing stability
第6頁 411732 五、發明說明（4) 電場及磁場時’即能產生交變輸出電能〕產生—高頻時變 磁場使印刷電路板内高分子聚合物產生熱量後，再以該加 壓平台進行加壓於鋼板及印刷電路板。 本發明實施例包含以一大型線圈包覆印刷電路板壓合裝 置，以二線圈置於印刷電路板壓合裝置二側及以數個小型 線圈圍繞印刷電路板壓合裝置，而本發明較佳實施例則將 二線圈置於印刷電路板壓合裝置之加壓平台内。 請參照第二圖所示，本發明較佳實施例之印刷電路板廢 合裝置’其主要包含一第一加壓平台20、一第二加壓平台 21及數個鋼板22 ’該第一加壓平台2〇與第二加壓平台？！之 間平行置入數個鋼板22 ’而該第一加壓平台2〇與第二加壓 平台21内部則分別設有一第一線圈24及一第二線圈25。二 鋼板22間供一印刷電路板23置入，再由該第一加壓平台2〇 及第二加壓平台21進行加熱壓合。當該第—加壓平台2〇與 第二加壓平台21之第一線圈24及第二線圈25產生時變磁場、 時’位於該第一線圈24及第二線圈25之間之該第一加壓平 台20、第二加壓平台21及數個鋼板22在垂直於該時變磁場 平面上產生磁滯損失現象及一渦電流，將該第一加壓平台 20、第二加壓平台21、數個鋼板22及印刷電路板23内銅層 之磁滞損失及内部電阻而電能被轉換成熱量，而進行加熱 該第一加壓平台20、第二加壓平台21及數個鋼板22。再以 該第一加壓平台20及第二加壓平台21進行加壓於鋼板22及 印刷電路板2 3，使位於二鋼板2 2間之印刷電路板2 3被加熱 壓合。此時’位於該印刷電路板23兩側之二鋼板22直接將Page 6 411732 V. Description of the invention (4) In the electric and magnetic fields, 'that can produce alternating output electric energy] generation-high-frequency time-varying magnetic field causes the polymer in the printed circuit board to generate heat, and then uses the pressure platform It is pressurized to a steel plate and a printed circuit board. The embodiment of the present invention includes a printed circuit board pressing device covered with a large coil, two coils placed on two sides of the printed circuit board pressing device, and several small coils surrounding the printed circuit board pressing device. In the embodiment, the two coils are placed in a pressurized platform of a printed circuit board pressing device. Please refer to the second figure, a printed circuit board scrapping device according to a preferred embodiment of the present invention, which mainly includes a first pressurized platform 20, a second pressurized platform 21, and several steel plates 22. Pressure platform 20 and the second pressure platform? !! A plurality of steel plates 22 'are placed in parallel therebetween, and a first coil 24 and a second coil 25 are provided inside the first pressure platform 20 and the second pressure platform 21, respectively. A printed circuit board 23 is inserted between the two steel plates 22, and the first pressing platform 20 and the second pressing platform 21 are heated and pressed. When the first coil 24 and the second coil 25 of the first and second pressure platforms 20 and 21 generate a time-varying magnetic field, the first coil 24 and the second coil 25 are located between the first coil 24 and the second coil 25. The pressure platform 20, the second pressure platform 21, and several steel plates 22 generate a hysteresis loss phenomenon and an eddy current on a plane perpendicular to the time-varying magnetic field. The first pressure platform 20, the second pressure platform 21 The electric energy is converted into heat by the hysteresis loss and internal resistance of the copper layers in the several steel plates 22 and the printed circuit board 23, and the first pressure platform 20, the second pressure platform 21, and the plurality of steel plates 22 are heated. Then, the first pressing platform 20 and the second pressing platform 21 are pressed against the steel plate 22 and the printed circuit board 23, so that the printed circuit board 23 located between the two steel plates 22 is heated and pressed. At this time, the two steel plates 22 on both sides of the printed circuit board 23
411732 五、發明說明（5) 熱量傳導至該印 兩側之二鋼板2 2 亦產生熱量，因 度相同及該印刷 之功效。此外， 加壓平台21内設 平台20及第二加 板2 2產生磁滞損 請再參照第一 二加壓平台1 1必 熱系統，使其具 缺點。此外，二 板13進行熱傳導 間延長之缺點。 台20、21、數個 量，而具有構造 失的熱量及減少 雖然本發明已 定本發明，任何 範圍内，當可作 圍當視後附之申 刷電路板23上， 有一溫度梯度， 此’每一該印刷 感應電 示，習 煤油循 雜及在 10、11 溫度梯 發明以 印刷電 度均勻 時間之 佳實施 藝者， 動與修 圍所界 電路板2 3内銅層產生熱量 本發明亦可由只在第一加 有線圈產生一時變磁場， 壓平台2 1 —側產生一時變 失現象或 及二圖所 須設有熱 有構造複 加壓平台 而具有一 反觀，本 鋼板22及 簡單、溫 製程加熱 以前述較 熟習此技 各種之更 請專利範 而不會在 而該印刷 電路板23 流而加熱 用第一加 環加熱系 熱傳導時 之間受鋼 度，使其 時變磁場 路板2 3内 、減少熱 功效。 例揭示， 在不脫離 改，因此 定者為準 該印刷電 電路板23 兩側所受 而具有溫 壓平台20 或在該第 磁場方式 該鋼板22 壓平台10 統或熱電 產生損失 板1 2及印 具有加熱 直接使二 銅層同時 傳導過程 然其並非 本發明之 本發明之 路板23 内銅層 到的溫 度均勻 或第二 一加壓 ，使鋼 及一第 阻絲加 熱量之 刷電路 傳導時 加壓平 產生熱 長而損 <r 用以限 精神和 保護範411732 V. Description of the invention (5) The heat is transmitted to the two steel plates 2 2 on both sides of the seal, which also generates heat due to the same factor and the effect of the printing. In addition, the hysteresis loss is caused by the built-in platform 20 and the second plate 22 in the pressurized platform 21. Please refer to the first and second pressurized platform 1 1 for the thermal system, which has disadvantages. In addition, the second plate 13 has the disadvantage of extending the heat conduction between the two plates. The number of units 20, 21, and several has the amount of heat lost in the structure and the reduction. Although the present invention has established the present invention, there can be a temperature gradient on the brushed circuit board 23 attached to the scope of the present invention. Each of these printed induction electric indications is a good performer who learns about kerosene circulation and invents at 10 and 11 temperature ladders with a uniform printing time. Moving and repairing the inner copper layer of the circuit board 2 3 generates heat. The present invention also A time-varying magnetic field can be generated only when the first coil is added, a time-lapse phenomenon occurs on the side of the pressing platform 21, or a thermally structured complex pressurizing platform must be provided in the second figure. This steel plate 22 and simple, The temperature process heating is based on the above-mentioned more familiar with this technology. It is not patented, and it will not be subjected to steel between the printed circuit board 23 and the first ring heating system during heat conduction, making it a time-varying magnetic field circuit board. 2 3, reducing thermal efficacy. The example reveals that without change, it is determined that the printed electrical circuit board 23 has both a temperature and pressure platform 20 on the two sides, or the steel plate 22 pressure platform 10 system or a thermoelectric generation loss board 12 and The printing has the process of directly conducting the two copper layers at the same time, but it is not the temperature of the inner copper layer of the road board 23 of the present invention is uniform or the second is pressurized, so that the brush circuit of the heating amount of steel and a first resistance wire is conducted. Time compression level produces heat damage and < r to limit spirit and protection