CN108376662A - 工艺腔、工艺腔的加热控制方法及装置 - Google Patents
工艺腔、工艺腔的加热控制方法及装置 Download PDFInfo
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- CN108376662A CN108376662A CN201810367695.5A CN201810367695A CN108376662A CN 108376662 A CN108376662 A CN 108376662A CN 201810367695 A CN201810367695 A CN 201810367695A CN 108376662 A CN108376662 A CN 108376662A
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- heating
- temperature
- temperature sensor
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- heater element
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 411
- 238000000034 method Methods 0.000 title claims abstract description 167
- 230000008569 process Effects 0.000 title claims abstract description 109
- 239000011521 glass Substances 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 230000006698 induction Effects 0.000 description 11
- 238000001514 detection method Methods 0.000 description 5
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
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- 230000008901 benefit Effects 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000010259 detection of temperature stimulus Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
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- 238000012216 screening Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Control Of Resistance Heating (AREA)
Abstract
Description
Claims (17)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810367695.5A CN108376662A (zh) | 2018-04-23 | 2018-04-23 | 工艺腔、工艺腔的加热控制方法及装置 |
PCT/CN2019/083885 WO2019206137A1 (zh) | 2018-04-23 | 2019-04-23 | 工艺腔、工艺腔的加热控制方法及装置 |
Applications Claiming Priority (1)
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---|---|---|---|
CN201810367695.5A CN108376662A (zh) | 2018-04-23 | 2018-04-23 | 工艺腔、工艺腔的加热控制方法及装置 |
Publications (1)
Publication Number | Publication Date |
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CN108376662A true CN108376662A (zh) | 2018-08-07 |
Family
ID=63032707
Family Applications (1)
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CN201810367695.5A Pending CN108376662A (zh) | 2018-04-23 | 2018-04-23 | 工艺腔、工艺腔的加热控制方法及装置 |
Country Status (2)
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CN (1) | CN108376662A (zh) |
WO (1) | WO2019206137A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019206137A1 (zh) * | 2018-04-23 | 2019-10-31 | 北京铂阳顶荣光伏科技有限公司 | 工艺腔、工艺腔的加热控制方法及装置 |
CN111367328A (zh) * | 2018-12-26 | 2020-07-03 | 北京铂阳顶荣光伏科技有限公司 | 共蒸发设备和温度监控方法 |
CN111459204A (zh) * | 2020-03-31 | 2020-07-28 | 潍柴动力股份有限公司 | 车辆的温度控制方法、装置、设备、存储介质和车辆 |
CN111840624A (zh) * | 2020-07-13 | 2020-10-30 | 珠海格力电器股份有限公司 | 空气消毒器、消毒方法、装置、系统及可读存储介质 |
CN112490148A (zh) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | 加热装置及加热方法、半导体工艺设备 |
CN112663026A (zh) * | 2020-11-25 | 2021-04-16 | 北京北方华创微电子装备有限公司 | 工艺腔室、半导体工艺设备及加热控制方法 |
CN112859969A (zh) * | 2021-01-07 | 2021-05-28 | 巨尔(昆山)光电照明有限公司 | 用于喷涂产线的红外辐射温度控制方法 |
CN115079750A (zh) * | 2022-08-11 | 2022-09-20 | 中国核动力研究设计院 | 焊接设备的加热控制方法、设备及计算机可读存储介质 |
WO2023000901A1 (zh) * | 2021-07-21 | 2023-01-26 | 青岛海尔生物医疗科技有限公司 | 用于二氧化碳培养箱功率分配的方法、装置及二氧化碳培养箱 |
CN116889342A (zh) * | 2023-09-05 | 2023-10-17 | 佛山市适度工业设计有限公司 | 电煮锅及其控制方法、装置、存储介质 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185959A (ja) * | 2004-12-24 | 2006-07-13 | Mitsui Eng & Shipbuild Co Ltd | 成膜装置及び成膜方法 |
CN102598217A (zh) * | 2009-10-28 | 2012-07-18 | 丽佳达普株式会社 | 金属有机化学汽相淀积设备及其温度控制方法 |
CN104362076A (zh) * | 2014-09-23 | 2015-02-18 | 北京七星华创电子股份有限公司 | 半导体设备的温度控制装置、控制系统及其控制方法 |
KR101744201B1 (ko) * | 2015-12-28 | 2017-06-12 | 주식회사 유진테크 | 기판 처리 장치 |
CN107145174A (zh) * | 2017-04-27 | 2017-09-08 | 江苏石川岛丰东真空技术有限公司 | 一种热处理用真空炉分区温度控制系统 |
CN208478290U (zh) * | 2018-04-23 | 2019-02-05 | 北京铂阳顶荣光伏科技有限公司 | 工艺腔 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202380087U (zh) * | 2011-12-19 | 2012-08-15 | 汉能科技有限公司 | 一种加热腔保温系统 |
CN103374698A (zh) * | 2012-04-23 | 2013-10-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 加热腔室以及等离子体加工设备 |
CN105441899B (zh) * | 2014-07-15 | 2018-11-06 | 北京北方华创微电子装备有限公司 | 一种加热腔室及半导体加工设备 |
KR101605079B1 (ko) * | 2015-05-20 | 2016-03-22 | (주)울텍 | 급속 열처리 장치 |
CN108376662A (zh) * | 2018-04-23 | 2018-08-07 | 北京铂阳顶荣光伏科技有限公司 | 工艺腔、工艺腔的加热控制方法及装置 |
-
2018
- 2018-04-23 CN CN201810367695.5A patent/CN108376662A/zh active Pending
-
2019
- 2019-04-23 WO PCT/CN2019/083885 patent/WO2019206137A1/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185959A (ja) * | 2004-12-24 | 2006-07-13 | Mitsui Eng & Shipbuild Co Ltd | 成膜装置及び成膜方法 |
CN102598217A (zh) * | 2009-10-28 | 2012-07-18 | 丽佳达普株式会社 | 金属有机化学汽相淀积设备及其温度控制方法 |
US20120221138A1 (en) * | 2009-10-28 | 2012-08-30 | Ligadp Co., Ltd. | Metal organic chemical vapor deposition device and temperature control method therefor |
CN104362076A (zh) * | 2014-09-23 | 2015-02-18 | 北京七星华创电子股份有限公司 | 半导体设备的温度控制装置、控制系统及其控制方法 |
KR101744201B1 (ko) * | 2015-12-28 | 2017-06-12 | 주식회사 유진테크 | 기판 처리 장치 |
CN107145174A (zh) * | 2017-04-27 | 2017-09-08 | 江苏石川岛丰东真空技术有限公司 | 一种热处理用真空炉分区温度控制系统 |
CN208478290U (zh) * | 2018-04-23 | 2019-02-05 | 北京铂阳顶荣光伏科技有限公司 | 工艺腔 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019206137A1 (zh) * | 2018-04-23 | 2019-10-31 | 北京铂阳顶荣光伏科技有限公司 | 工艺腔、工艺腔的加热控制方法及装置 |
CN111367328A (zh) * | 2018-12-26 | 2020-07-03 | 北京铂阳顶荣光伏科技有限公司 | 共蒸发设备和温度监控方法 |
CN111459204A (zh) * | 2020-03-31 | 2020-07-28 | 潍柴动力股份有限公司 | 车辆的温度控制方法、装置、设备、存储介质和车辆 |
CN111459204B (zh) * | 2020-03-31 | 2021-08-20 | 潍柴动力股份有限公司 | 车辆的温度控制方法、装置、设备、存储介质和车辆 |
CN111840624A (zh) * | 2020-07-13 | 2020-10-30 | 珠海格力电器股份有限公司 | 空气消毒器、消毒方法、装置、系统及可读存储介质 |
CN112490148A (zh) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | 加热装置及加热方法、半导体工艺设备 |
CN112490148B (zh) * | 2020-11-13 | 2024-03-26 | 北京北方华创微电子装备有限公司 | 加热装置及加热方法、半导体工艺设备 |
CN112663026B (zh) * | 2020-11-25 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 工艺腔室、半导体工艺设备及加热控制方法 |
CN112663026A (zh) * | 2020-11-25 | 2021-04-16 | 北京北方华创微电子装备有限公司 | 工艺腔室、半导体工艺设备及加热控制方法 |
CN112859969A (zh) * | 2021-01-07 | 2021-05-28 | 巨尔(昆山)光电照明有限公司 | 用于喷涂产线的红外辐射温度控制方法 |
CN112859969B (zh) * | 2021-01-07 | 2021-12-07 | 巨尔(昆山)光电照明有限公司 | 用于喷涂产线的红外辐射温度控制方法 |
WO2023000901A1 (zh) * | 2021-07-21 | 2023-01-26 | 青岛海尔生物医疗科技有限公司 | 用于二氧化碳培养箱功率分配的方法、装置及二氧化碳培养箱 |
CN115079750A (zh) * | 2022-08-11 | 2022-09-20 | 中国核动力研究设计院 | 焊接设备的加热控制方法、设备及计算机可读存储介质 |
CN116889342A (zh) * | 2023-09-05 | 2023-10-17 | 佛山市适度工业设计有限公司 | 电煮锅及其控制方法、装置、存储介质 |
CN116889342B (zh) * | 2023-09-05 | 2023-12-12 | 佛山市适度工业设计有限公司 | 电煮锅及其控制方法、装置、存储介质 |
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