CN108336212A - A kind of small-sized deep ultraviolet LED inorganic encapsulated structures - Google Patents
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures Download PDFInfo
- Publication number
- CN108336212A CN108336212A CN201810217443.4A CN201810217443A CN108336212A CN 108336212 A CN108336212 A CN 108336212A CN 201810217443 A CN201810217443 A CN 201810217443A CN 108336212 A CN108336212 A CN 108336212A
- Authority
- CN
- China
- Prior art keywords
- hole
- groove
- small
- mounting base
- deep ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000004020 luminiscence type Methods 0.000 claims abstract description 14
- 239000011230 binding agent Substances 0.000 claims abstract description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 2
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 2
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to LED device technical fields, more particularly to a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation glass cover, the surface of package floor is provided with the first groove, and mounting base is provided on the surface of the package floor in the first groove；The second groove is provided on the surface of mounting base, the madial wall of second groove is connected with the second through-hole is respectively arranged on lateral wall with the inner cavity of first through hole and first through hole with the inner cavity of the second through-hole, packaged glass lid is fixed on by inorganic binder in the first groove and the second groove with installation glass cover, packaged glass plate is made with installation glass plate of unorganic glass, improves the anti-ultraviolet property of entirety of the invention；First metal heat sink can also be fixed LED luminescence chips while heat loss through conduction with the second metal heat sink, enhance the anti-seismic performance of entirety of the invention.
Description
Technical field
The present invention relates to LED device technical fields, and in particular to a kind of small-sized deep ultraviolet LED inorganic encapsulated structures.
Background technology
The research of UV LED is gradually paid attention to by industry, is more considered as LED another new after white light
Continent, foreground be very optimistic, while being reported in the coming years according to the industry development of yole, UV LED industry
Will with the speed of annual compound growth rate 46% develop, unquestionable UV LED by be LED industry revolution next time.
Ultraviolet LED refers generally to centre of luminescence wavelength in 400nm LED below, but sometimes by emission wavelength be more than 380nm when
Referred to as near ultraviolet LED, and referred to as deep ultraviolet LED when shorter than 300nm, because the bactericidal effect of short wavelength light is high, therefore ultraviolet LED
It is relatively broad to be usually used in purposes, the purposes such as the sterilization and deodorization of refrigerator and household electrical appliances etc..
At this stage, the packaged type of ultraviolet LED mainly continues to use the packaged type of white light LEDs, but white-light LED encapsulation is current
The all different degrees of organic material for using resin one kind of almost all of packaged type is packaged, may be because of ultraviolet
Light radiation leads to colloid yellow, reduces light emitting diode service life.
Invention content
In view of the deficiencies of the prior art, the invention discloses a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, for solving
The organic material for using resin one kind is packaged, and colloid yellow may be caused because of ultraviolet radiation, reduces luminous two
The problems such as pole pipe service life；The present invention is achieved by the following technical programs：
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation
The surface of glass cover, the package floor is provided with the first groove, and is equably provided on the madial wall of first groove
The inner cavity of one through-hole, first groove is communicated with the outside by the first through hole, the envelope in first groove
It fills and is provided with mounting base on the surface of bottom plate；
It is provided with the second groove on the surface of the mounting base, distinguishes on the madial wall and lateral wall of second groove
It is provided with the second through-hole with the inner cavity of the first through hole and the first through hole with the inner cavity of second through-hole to be connected, institute
The inner cavity for stating the second groove is connected by second through-hole with the inner cavity of first groove, the institute in second groove
It states and LED luminescence chips is installed on the surface of mounting base, on the surface of the mounting base below the LED luminescence chips
It is provided with wiring through-hole and the wiring through-hole extends to the bottom of the package floor；
It is provided with the first card slot on surface on the outside of the package floor, is provided on the surface on the outside of the mounting base
Second card slot；
It is embedded with the first metal heat sink in the first through hole, the second metal heat sink, institute are embedded in second through-hole
Packaged glass lid is stated to be fixed in first groove and described second by inorganic binder respectively with the installation glass cover
In groove.
Preferably, first groove and second groove are rectangular configuration.
Preferably, the pore size of the first through hole is 0.90 to 0.12mm.
Preferably, the pore size of second through-hole is 0.50 to 0.80mm.
Preferably, described first be connected on the first groove madial wall is run through in one end of first metal heat sink
In through-hole, the other end, which runs through, to be connected in the first through hole on the second groove lateral wall.
Preferably, one end of second metal heat sink is fixedly connected in second through-hole, and the other end is connected to institute
State the surface of LED luminescence chips.
Preferably, the packaged glass lid is made with the installation glass cover of inorganic glass materials.
Beneficial effects of the present invention are：
Packaged glass lid is fixed on by inorganic binder in the first groove and the second groove with installation glass cover, is encapsulated
Glass plate is made with installation glass plate of unorganic glass, improves the anti-ultraviolet property of entirety of the invention；First metal fever
It is heavy LED luminescence chips to be fixed while heat loss through conduction with the second metal heat sink, it enhances of the invention whole
Anti-seismic performance.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the stereogram of the present invention；
Fig. 2 is the sectional view of mounting base of the present invention；
Fig. 3 is the sectional view of mounting base of the present invention；
Fig. 4 is the sectional view of package floor of the present invention；
Fig. 5 is the structural schematic diagram of packaged glass lid of the present invention；
Fig. 6 is the structural schematic diagram of present invention installation glass cover.
In figure：1, package floor；2, mounting base；3, packaged glass lid；4, glass cover is installed；5, the first groove；6,
One through-hole；7, the second groove；8, the second through-hole；9, LED luminescence chips；10, wiring through-hole；11, the first card slot；12, the second card
Slot；13, the first metal heat sink；14, the second metal heat sink.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor 1, mounting base 2, packaged glass lid 3 and peace
The surface of glaze lid 4, package floor 1 is provided with the first groove 5, and first is equably provided on the madial wall of the first groove 5
The inner cavity of through-hole 6, the first groove 5 is communicated with the outside by first through hole 6, on the surface of the package floor 1 in the first groove 5
It is provided with mounting base 2；
It is provided with the second groove 7 on the surface of mounting base 2, is respectively set on the madial wall and lateral wall of the second groove 7
There is the second through-hole 8 to be connected with the inner cavity of first through hole 6 and first through hole 6 with the inner cavity of the second through-hole 8, the second groove 7 it is interior
Chamber is connected by the second through-hole 8 with the inner cavity of the first groove 5, is equipped on the surface of the mounting base 2 in the second groove 7
LED luminescence chips 9 are provided with wiring through-hole 10 and wiring through-hole 10 on the surface of the mounting base 2 of the lower section of LED luminescence chips 9
Extend to the bottom of package floor 1；
It is provided with the first card slot 11 on the surface in 1 outside of package floor, second is provided on the surface in 2 outside of mounting base
Card slot 12；
It is embedded with the first metal heat sink 13 in first through hole 6, the second metal heat sink 14 is embedded in the second through-hole 8, encapsulates
Glass cover 3 is fixed on by inorganic binder in the first groove 5 and in the second groove 7 respectively with installation glass cover 4.
First groove 5 and the second groove 7 are rectangular configuration, and the pore size of first through hole 6 is 0.90 to 0.12mm, the
The pore size of two through-holes 8 is 0.50 to 0.80mm, and one end of the first metal heat sink 13, which is run through, is connected to 5 madial wall of the first groove
On first through hole 6 in, the other end is through being connected in the first through hole 6 on 7 lateral wall of the second groove, the second metal heat sink 14
One end be fixedly connected in the second through-hole 8, the other end is connected to the surface of LED luminescence chips 9, packaged glass lid 3 and installation
Glass cover 4 is made of inorganic glass materials.
When in use, packaged glass lid 3 is fixed on the first groove 5 and the with installation glass cover 4 by inorganic binder
In two grooves 7, packaged glass plate is made with installation glass plate of unorganic glass, improves the uviolresistance of entirety of the invention
Energy.
First metal heat sink 13 and the second metal heat sink 14 while heat loss through conduction can also to LED luminescence chips 9 into
Row is fixed, and the anti-seismic performance of entirety of the invention is enhanced.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to aforementioned each implementation
Technical solution recorded in example is modified or equivalent replacement of some of the technical features；And these modification or
It replaces, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (7)
1. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation glass
Glass lid, it is characterised in that：The surface of the package floor is provided with the first groove, on the madial wall of first groove equably
It is provided with first through hole, the inner cavity of first groove is communicated with the outside by the first through hole, in first groove
The package floor surface on be provided with mounting base；
It is provided with the second groove on the surface of the mounting base, is respectively set on the madial wall and lateral wall of second groove
There is the second through-hole to be connected with the inner cavity of the first through hole and the first through hole with the inner cavity of second through-hole, described
The inner cavity of two grooves is connected by second through-hole with the inner cavity of first groove, the peace in second groove
It fills and LED luminescence chips is installed on the surface of bottom plate, be arranged on the surface of the mounting base below the LED luminescence chips
There is wiring through-hole and the wiring through-hole extends to the bottom of the package floor；
It is provided with the first card slot on surface on the outside of the package floor, second is provided on the surface on the outside of the mounting base
Card slot；
It is embedded with the first metal heat sink in the first through hole, the second metal heat sink, the envelope are embedded in second through-hole
Glaze lid is fixed in first groove and second groove by inorganic binder respectively with the installation glass cover
It is interior.
2. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described first is recessed
Slot and second groove are rectangular configuration.
3. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described first is logical
The pore size in hole is 0.90 to 0.12mm.
4. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described second is logical
The pore size in hole is 0.50 to 0.80mm.
5. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：First gold medal
The one end for belonging to heat sink, which is run through, to be connected in the first through hole on the first groove madial wall, and the other end, which runs through, is connected to institute
It states in the first through hole on the second groove lateral wall.
6. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Second gold medal
The one end for belonging to heat sink is fixedly connected in second through-hole, and the other end is connected to the surface of the LED luminescence chips.
7. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：The encapsulation glass
Glass lid is made with the installation glass cover of inorganic glass materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810217443.4A CN108336212A (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810217443.4A CN108336212A (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108336212A true CN108336212A (en) | 2018-07-27 |
Family
ID=62930851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810217443.4A Pending CN108336212A (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108336212A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01168045A (en) * | 1987-12-23 | 1989-07-03 | Tokuyama Soda Co Ltd | Hermetically sealed circuit device |
| JP2011082264A (en) * | 2009-10-05 | 2011-04-21 | Kantatsu Co Ltd | Led package |
| CN202084573U (en) * | 2011-02-15 | 2011-12-21 | 晶诚（郑州）科技有限公司 | High-power LED package structure |
| CN203910858U (en) * | 2014-07-02 | 2014-10-29 | 厦门多彩光电子科技有限公司 | Fully-inorganic surface-mount LED packaging structure |
| CN105845814A (en) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | Ultraviolet LED packaging structure and manufacturing method thereof |
| CN208014732U (en) * | 2018-03-16 | 2018-10-26 | 江苏鸿利国泽光电科技有限公司 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
-
2018
- 2018-03-16 CN CN201810217443.4A patent/CN108336212A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01168045A (en) * | 1987-12-23 | 1989-07-03 | Tokuyama Soda Co Ltd | Hermetically sealed circuit device |
| JP2011082264A (en) * | 2009-10-05 | 2011-04-21 | Kantatsu Co Ltd | Led package |
| CN202084573U (en) * | 2011-02-15 | 2011-12-21 | 晶诚（郑州）科技有限公司 | High-power LED package structure |
| CN203910858U (en) * | 2014-07-02 | 2014-10-29 | 厦门多彩光电子科技有限公司 | Fully-inorganic surface-mount LED packaging structure |
| CN105845814A (en) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | Ultraviolet LED packaging structure and manufacturing method thereof |
| CN208014732U (en) * | 2018-03-16 | 2018-10-26 | 江苏鸿利国泽光电科技有限公司 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010212679A (en) | Light-emitting diode package | |
| KR20090017346A (en) | Led package with diffusion means | |
| CN208014732U (en) | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures | |
| CN102709454A (en) | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof | |
| CN108336212A (en) | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures | |
| CN105336831A (en) | Liquid-filled LED lamp | |
| CN201964364U (en) | Soaking heat dissipation structure of light-emitting diode (LED) integrated module | |
| CN104112806A (en) | Light emitting diode and packaging structure thereof | |
| CN102751425A (en) | Light-emitting diode packaging structure and bearing piece thereof | |
| CN205508884U (en) | Good LED packaging structure of colour temperature uniform heat dissipation nature | |
| TW200717854A (en) | Surface mount light emitting diode package | |
| CN211789088U (en) | Household 3V/1W warm white light emitting diode | |
| CN211208475U (en) | UVC L ED packaging structure | |
| CN202205809U (en) | Plug-in type LED lamp bead | |
| CN201601149U (en) | LED packaging structure | |
| CN206293466U (en) | A kind of charactron heat-dissipation packaging structure | |
| CN204857721U (en) | High -power LED encapsulation paster | |
| CN209607756U (en) | Based on the high voltage LED chip encapsulating structure connected in multi-chip | |
| CN204083867U (en) | Led fluorescent lamp tube | |
| CN205542888U (en) | LED packaging structure that big colour temperature of illumination zone is even | |
| CN203398158U (en) | LED packaging structure | |
| CN203733849U (en) | LED illuminating light source having sulfuration-proof function | |
| CN203628572U (en) | High-power high-radiation LED bead | |
| CN202423373U (en) | Novel light emitting diode structure | |
| CN206574746U (en) | A kind of radiator structure of light emitting diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |